热熔胶黏剂的日本市场评估:各类型树脂，各用途，各地区，机会，预测(2019年度～2033年度)

日本热熔胶市场预计将从 2025 年的 6.0211 亿美元成长到 2033 年的 8.5168 亿美元，在 2026 年至 2033 年的预测期内，复合年增长率为 4.43%。这是由于包装行业的扩张，受电子商务和永续发展计划的推动，该行业严重依赖热熔胶来实现安全密封和防篡改解决方案。此外，汽车产业也是一个主要贡献者，黏合剂在黏合轻质材料和抗震方面发挥关键作用，这与提高燃油效率和生产电动车的动力相吻合。此外，电子业还依赖热熔胶对复杂组件进行精确黏合，从而提高先进设备的可靠性。

汽车製造业的成长将推动对电动车组装中使用的轻质材料、抗振黏合剂和胶黏剂的需求。根据国际汽车製造商组织（OICA）的调查，预计2023年日本汽车产量将达到899万辆，较2021年成长15%。

本报告提供日本的热熔胶黏剂市场相关调查分析，提供市场规模与预测，市场动态，主要企业形势等资讯。

目录

第1章 计划的范围和定义

第2章 调查手法

第3章 美国的关税的影响

第4章 摘要整理

第5章 客户的迴响

• 受访者的人口统计
• 决定购买时应该考虑的要素
• 品牌认知度
• 未满足需求

第6章 日本的热熔胶黏剂市场预测(2019年度～2033年度)

• 市场规模分析与预测
  • 金额
  • 数量
• 市场占有率的分析与预测
  • 各类型树脂
    • 乙烯醋酸乙烯酯
    • 苯乙烯嵌段共聚物
    • 聚氨酯
    • 聚酰胺
    • 聚烯
    • 其他
  • 各用途
    • 包装
    • 电子
    • 汽车
    • 建筑·建设
    • 鞋子
    • 家具·床垫
    • 其他
  • 各地区
    • 北部(北海道·东北)
    • 中部(关东·中部)
    • 南部(关西，中国，四国，九州·冲绳)
  • 各企业的市场占有率分析(前五名公司和其他 - 金额，2025年度)
• 市场地图分析(2025年度)
  • 各类型树脂
  • 各用途
  • 各地区

第7章 波特的五力分析

第8章 大环境分析

第9章 市场动态

• 推动市场要素
• 市场课题

第10章 市场趋势与发展

第11章 案例研究

第12章 竞争情形

• 前五名市场领导公司的竞争矩阵
• 主要前十大企业的形势
  • Bostik-Nitta Co., Ltd.
  • Henkel Japan Ltd.
  • Resonac Corporation
  • 3M Japan Limited
  • Akzo Nobel Coatings K.K.
  • Yasuhara Chemical Co., Ltd
  • Moresco Corporation
  • Oshika Corporation
  • Asahi Chemical Synthetic Co., Ltd.
  • Sekisui-Fuller Co., Ltd.

第13章 策略性建议

第14章 关于调查公司·免责声明

Japan hot-melt adhesives market is projected to witness a CAGR of 4.43% during the forecast period FY2026-FY2033, growing from USD 602.11 million in FY2025 to USD 851.68 million in FY2033F, driven by expanding packaging industry, fueled by e-commerce and sustainability initiatives, heavily relies on hot melt adhesives for secure sealing and tamper-evident solutions. Additionally, the automotive sector is another major contributor, with adhesives playing a vital role in lightweight material bonding and vibration resistance, aligning with the push for fuel efficiency as well as electric vehicle production. Furthermore, the electronics industry also leverages hot melt adhesives for precise bonding of intricate components, enhancing reliability in advanced devices.

Increased automotive manufacturing drives demand for adhesives used in lightweight materials, vibration-resistant bonding, and electric vehicle assembly. According to the survey by the International Organization of Motor Vehicle Manufacturers (OICA), Japan's vehicle production reached 8.99 million units in 2023, reflecting a 15% growth since 2021.

Growth in Packaging Sector Supporting Market Expansion

The packaging industry in Japan is a major driver for the hot melt adhesives market, fueled by the rapid growth of e-commerce and sustainability initiatives. Hot melt adhesives are widely used in packaging applications for their fast-setting properties, cost-effectiveness, and ability to create tamper-evident seals. The rise of online shopping has increased demand for secure and durable packaging solutions, while sustainability efforts have driven the adoption of eco-friendly adhesives. Hot melt adhesives are particularly well suited to high-speed packaging lines and bring efficiency and consistency. Japan is prioritizing recyclable and reusable packaging material which continues to fuel the requirement for hot melt adhesives further, the flexibility of hot melt adhesives as a result of development in adhesive formulating has also made them workable with other packaging materials, thus increasing appeal across industries.

In March 2022, Toyo-Morton Ltd., Japan's leading laminating adhesives manufacturer updated its laminating adhesive portfolio with food-safe products, free of epoxy silanes and organic tin compounds. The renewed lineup includes solvent-based TOMOFLEX(TM) and solvent-free ECOAD(TM), suitable for multilayer flexible packaging applications such as dry food, liquid pouch, and high-performance retort. These products conform to global food contact regulations.

Automotive Industry Driving Adhesive Demand

Japan's automotive sector is a significant contributor to the hot melt adhesives market, driven by the shift toward lightweight materials and electric vehicles (EVs). Hot melt adhesives are essential for bonding lightweight components, providing vibration resistance, and enhancing vehicle durability. With the growing focus on fuel efficiency and EV production, the demand for advanced adhesive solutions has surged. These adhesives offer strong bonding capabilities without adding weight, making them ideal for modern automotive manufacturing. Additionally, technological advancements in adhesive formulations have improved their temperature resistance and performance, aligning with the stringent quality standards of Japan's automotive industry. The integration of hot melt adhesives in hybrid and electric vehicle assembly is particularly noteworthy, as they help in achieving the required structural integrity and safety standards.

In January 2025, the National Institute of Advanced Industrial Science and Technology (AIST) and Japanese chemical company Asahi Kasei have developed a stronger, reusable, and environmentally friendly adhesive from Euglena, a plankton. The adhesive, created by adding fatty acids to paramylon, is easy to remove with heat and could be used in automotive manufacturing, making lightweight vehicle parts easier to disassemble and reuse.

Electronics Sector Boosting Adhesive Applications

The expansion of electronics industry in Japan driving the growth of the hot melt adhesives market, as these adhesives are widely used for precise bonding of intricate components in advanced electronic devices, ensuring durability and reliability. Additionally, the development of high-performance and miniature electronics has raised the demand for specialty adhesives that can withstand heat stress and establish durable and long-lasting bonds. Hot melt adhesives also play a crucial role in assembling components such as circuit boards, displays, and housing. As Japan continues to lead in electronics innovation, the demand for versatile and high-performance adhesive solutions is expected to rise significantly. Furthermore, the development of new adhesive formulation technologies in the adhesive industry through ground-breaking collaborations within the prominent players to enhanced their thermal conductivity and electrical insulation properties is supporting the growth of advanced electronics applications, such as smartphones and automotive electronics.

In April 2024, Shin-Etsu Chemical acquired a dry adhesive technology developed by Setex Technologies, Inc., which uses biomimicry to provide strong friction and adhesion to materials. The company aims to develop a new market, focusing on the corporate market and the consumer market, by combining Setex's technology with Shin-Etsu Chemical's optimized materials.

Polyurethane (PU) Based Hot Melt Adhesives are Experiencing Significant Growth in Japan

The hot melt adhesives derived from polyurethane resins witnessing robust growth due to their versatile applications across industries such as automotive, packaging, electronics, and construction. In the automobile sector, PU adhesives are used for lightweight material joining and vibration-dampening assembly, which is suitable for Japan's focus on fuel economy and electric vehicle production. In the packaging market, PU adhesives are used for secure sealing and tamper-evident packaging, which is suitable for Japan's environmental regulations. Furthermore, technological advancements in bio-based PU adhesive products address growing consumer demand for sustainable materials. In electronic manufacturing, PU adhesives are used in precise bonding of intricate components with long-term insulation and thermal stress resistance. In building, PU adhesives are used in panel bonding and insulation.

In August 2023, Mitsui Chemicals announced that it was expanding its production capacity for polyurethane dispersions (PUDs) at Shimizu Factory to meet rising demand for mono-material food packaging due to sustainability concerns. The company plans to double its domestic production capacity, focusing on TAKELAC(TM) PUDs, water-based resins with excellent heat resistance and high-temperature gas barrier performance. These products aim to cater for the from end-user sectors, including paint, coatings, adhesives, binders, resin modifiers, and textile processing.

Future Market Scenario (FY2026-FY2023F)

The growth in e-commerce and the automotive industry's shift towards lightweight materials will continue to drive demand for hot melt adhesives. These adhesives are crucial for efficient packaging solutions and vibration-resistant bonding in vehicles, aligning with Japan's focus on fuel efficiency and electric vehicle production.

Further development of adhesive formulations will enhance performance attributes such as heat stability and strength of bonding, leading to wider applications across industries.

In addition, the shift towards low-VOC, environmentally friendly adhesives is also in accordance with the regulatory framework in Japan regarding the environment and consumers' desire for green products.

The electronics sector will continue to leverage hot melt adhesives for precise bonding of intricate components, enhancing durability and reliability in advanced devices.

Meanwhile, the construction industry's increasing use of hot melt adhesives for insulation and panel bonding will further drive market growth.

Key Players Landscape and Outlook

The Japan hot melt adhesives market is marked by the presence of both domestic and international players who are driving innovation and sustainability in the industry. These players are focusing on developing advanced adhesive formulations to meet the diverse needs of sectors such as packaging, automotive, electronics, and construction. The shift toward eco-friendly solutions is a key trend, with companies investing in bio-based and low-VOC adhesives to align with Japan's stringent environmental regulations and carbon neutrality goals. Additionally, technological innovations represent a primary focus as the prominent manufacturers working for enhancing performance of adhesives in terms of heat stability, flexibility, and bonding strength. Technological developments especially relate to applications of high reliability in the automobile and electronics industry, where accuracy and reliability are paramount. Moreover, the increase in demand for light-weight materials in electric cars and complex bonding solutions in high-end electronics is stimulating the manufacture of specialist adhesives.

In April 2023, Oshika Corporation, a leading manufacturer of wood adhesives and construction materials, expanded its business into non-housing industries and focuses on wood and wood-based technologies. The company believes in the regeneration of wood and its eco-friendly benefits, such as carbon storage in wood.

Table of Contents

1. Project Scope and Definitions

2. Research Methodology

3. Impact of U.S. Tariffs

4. Executive Summary

5. Voice of Customers

• 5.1. Respondent Demographics
• 5.2. Factors Consider in Purchase Decision
• 5.3. Brand Awareness
• 5.4. Unmet Needs

6. Japan Hot-melt Adhesives Market Outlook, FY2019-FY2033F

• 6.1. Market Size Analysis & Forecast
  • 6.1.1. By Value
  • 6.1.2. By Volume
• 6.2. Market Share Analysis & Forecast
  • 6.2.1. By Resin Type
    • 6.2.1.1. Ethylene Vinyl Acetate
    • 6.2.1.2. Styrene Block Copolymers
    • 6.2.1.3. Polyurethane
    • 6.2.1.4. Polyamide
    • 6.2.1.5. Polyolefins
    • 6.2.1.6. Others
  • 6.2.2. By Application
    • 6.2.2.1. Packaging
    • 6.2.2.2. Electronics
    • 6.2.2.3. Automotive
    • 6.2.2.4. Building and Construction
    • 6.2.2.5. Footwear
    • 6.2.2.6. Furniture and Mattress
    • 6.2.2.7. Others
  • 6.2.3. By Region
    • 6.2.3.1. North [Hokkaido and Tohoku]
    • 6.2.3.2. Central [Kanto and Chubu]
    • 6.2.3.3. South [Kansai, Chugoku, Shikoku, and Kyushu & Okinawa]
  • 6.2.4. By Company Market Share Analysis (Top 5 Companies and Others - By Value, FY2025)
• 6.3. Market Map Analysis, FY2025
  • 6.3.1. By Resin Type
  • 6.3.2. By Application
  • 6.3.3. By Region

All segments will be provided for all regions covered

7. Porter's Five Forces Analysis

8. PESTLE Analysis

9. Market Dynamics

• 9.1. Market Drivers
• 9.2. Market Challenges

10. Market Trends and Developments

11. Case Studies

12. Competitive Landscape

• 12.1. Competition Matrix of Top 5 Market Leaders
• 12.2. Key Players Landscape for Top 10 Market Players
  • 12.2.1. Bostik-Nitta Co., Ltd.
    • 12.2.1.1. Company Details
    • 12.2.1.2. Key Management Personnel
    • 12.2.1.3. Key Products Offered
    • 12.2.1.4. Key Financials (As Reported)
    • 12.2.1.5. Key Market Focus and Geographical Presence
    • 12.2.1.6. Recent Developments/Collaborations/Partnerships/Mergers and Acquisition
    • 12.2.1.7. SWOT Analysis for Top 5 Players
  • 12.2.2. Henkel Japan Ltd.
  • 12.2.3. Resonac Corporation
  • 12.2.4. 3M Japan Limited
  • 12.2.5. Akzo Nobel Coatings K.K.
  • 12.2.6. Yasuhara Chemical Co., Ltd
  • 12.2.7. Moresco Corporation
  • 12.2.8. Oshika Corporation
  • 12.2.9. Asahi Chemical Synthetic Co., Ltd.
  • 12.2.10. Sekisui-Fuller Co., Ltd.

Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.

13. Strategic Recommendations

14. About Us and Disclaimer

List of Tables

• Table 1. Competition Matrix of Top 5 Market Leaders
• Table 2. Mergers & Acquisitions/ Joint Ventures (If Applicable)
• Table 3. About Us - Regions and Countries Where We Have Executed Client Projects

List of Figures

• Figure 1. Japan Hot-melt Adhesives Market, By Value, In USD Million, FY2019-FY2033F
• Figure 2. Japan Hot-melt Adhesives Market, By Volume, In Thousand Tons, FY2019-FY2033F
• Figure 3. Japan Hot-melt Adhesives Market Share (%), By Resin Type, FY2019-FY2033F
• Figure 4. Japan Hot-melt Adhesives Market Share (%), By Application, FY2019-FY2033F
• Figure 5. Japan Hot-melt Adhesives Market Share (%), By Region, FY2019-FY2033F
• Figure 6. By Resin Type Map-Market Size (USD Million) & Growth Rate (%), FY2025
• Figure 7. By Application Map-Market Size (USD Million) & Growth Rate (%), FY2025
• Figure 8. By Region Map-Market Size (USD Million) & Growth Rate (%), FY2025