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全球智慧功率模组市场2024-2031Global Intelligent Power Module Market 2024-2031 |
预计在预测期内(2024-2031年),全球智慧功率模组市场将以10.7%的CAGR成长。随着各行业终端用户的不断增加,智慧功率模组的采用不断增加,是支持全球市场成长的关键因素。汽车行业製造商越来越多地应用智慧功率模组,使用MOSFET满足汽车行业严格的品质和可靠性标准。市场参与者也致力于推出智慧功率模组解决方案,以进一步促进市场成长。例如,2023 年 10 月,Littelfuse, Inc. 推出了功率模组 IXTY2P50PA,这是首款汽车级 PolarP(TM) P 通道功率 MOSFET。产品设计满足汽车应用的严格要求,提供卓越的性能和可靠性。
全球智慧功率模组市场按功率元件、电压等级和垂直领域进行细分。根据功率元件,市场分为 IGBT 和 MOSFET。根据电压额定值,市场分为 0 V 至 599 V、600 V 至 1,199 V 以及 1,200 V 及以上。此外,根据垂直领域,市场细分为消费性电子、ICT、汽车、工业和其他(航空航太)。在功率元件中,由于半导体模组的使用越来越多,这些半导体模组将运行智慧功率模组所需的所有电路整合到单一封装中,预计 IGBT 细分市场将占据相当大的市场份额。
在垂直产业中,消费电子细分领域预计将在全球智慧功率模组市场中占据相当大的份额。此细分市场的成长归因于消费性电子产品中越来越多地使用智慧电源模组来提高电源效率、尺寸和重量更小、更轻、可靠性更高以及电路设计更容易。智慧电源模组非常适合建构智慧计量、智慧照明和智慧追踪设备。例如,2023 年 11 月,Eoxys System 推出了超低功耗 NB-IoT ML SOM 模组,用于建构智慧、安全的物联网设备。客户可以利用 XENO+ NB-IoT ML SOM 的智慧运算和蜂窝连接功能更快地开发物联网智慧计量和智慧追踪解决方案。
全球智慧功率模组市场根据地理位置进一步细分,包括北美(美国和加拿大)、欧洲(英国、义大利、西班牙、德国、法国和欧洲其他地区)、亚太地区(印度、中国、日本、韩国和亚洲其他地区)以及世界其他地区(中东和非洲以及拉丁美洲)。其中,亚太地区预计将在全球市场中占据显着份额,因为采用 SiC MOSFET 模组的智慧功率模组(电动车功率模组的创新材料)越来越多地被采用,中国的电动车製造商也利用这项技术。
在所有地区中,北美地区预计在预测期内将以相当大的CAGR成长。区域成长归因于对智慧功率模组的需求不断增长,以实现节能和降低产品营运成本。市场参与者专注于推出整合式智慧功率模组,该模组提供过电流保护、欠压保护和温度感测等保护功能。例如,2023年9月,理想电源公司推出了SymCool(TM) IQ智慧电源模组。 SymCool(TM) IQ 基于双向 B-TRAN(TM) 多晶片封装设计,整合了针对双向操作而最佳化的智慧型驱动器。 SymCool(TM) IQ 的额定电压为 1200V 和 160A,与 IGBT 模组相比具有显着优势,包括更低的损耗和固有的双向性。
服务全球智慧功率模组市场的主要公司包括英飞凌科技股份公司、三菱电机公司、瑞萨电子公司、Semiconductor Components Industries, LLC、东芝公司等。市场参与者透过各种策略(包括併购、合作、合作、融资和新产品发布),为市场成长做出了巨大贡献,以保持市场竞争力。例如,2023 年 4 月,赛米控丹佛斯和罗姆半导体合作在功率模组内部实施碳化硅 (SiC)。 Semikron Danfoss 将 ROHM 的新型 1200V RGA IGBT 加入其低功率模组系列中。 ROHM 的新型 1200V RGA IGBT 旨在取代工业环境中最新的第 7 代 IGBT 装置。
Global Intelligent Power Module Market Size, Share & Trends Analysis Report by Power Device (Insulated-Gate Bipolar Transistor (IGBT) and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)), by Voltage Rating (0 V to 599 V, 600 V to 1,199 V, and 1,200 V and Above), and by Vertical (Consumer Electronics, Information and Communication Technology (ICT), Automotive, Industrial, and Others) Forecast Period (2024-2031)
The global intelligent power module market is anticipated to grow at a CAGR of 10.7% during the forecast period (2024-2031). The growing adoption of intelligent power modules with the increasing end users in various industries is the key factor supporting the growth of the market globally. The increasing application of intelligent power modules in the automotive industry manufacturers using MOSFET meets the automotive industry's stringent quality and reliability standards. The market players are also focusing on introducing intelligent power module solutions that further bolster the market growth. For instance, in October 2023, Littelfuse, Inc. launched power module IXTY2P50PA, the first automotive-grade PolarP(TM) P-Channel Power MOSFET. The product design meets the demanding requirements of automotive applications, providing exceptional performance and reliability.
The global intelligent power module market is segmented on the power device, voltage rating, and vertical. Based on the power device, the market is sub-segmented into IGBT and MOSFET. Based on the voltage rating, the market is sub-segmented into 0 V to 599 V, 600 V to 1,199 V, and 1,200 V and above. Further, based on vertical, the market is sub-segmented into consumer electronics, ICT, automotive, industrial and others (aerospace). Among the power devices, the IGBT sub-segment is anticipated to hold a considerable share of the market owing to the increasing use of semiconductor modules that integrate into a single package all the circuitry required to operate an intelligent power module.
Among the verticals, the consumer electronics sub-segment is expected to hold a considerable share of the global intelligent power module market. The segmental growth is attributed to the increasing use of intelligent power modules in consumer electronics to increase power efficiency, smaller and lighter size and weight, higher reliability, and easier circuit design. Intelligent power modules with are perfect for constructing smart metering, smart lighting, and smart tracking devices. For instance, in November 2023, Eoxys System launched an Ultra-Low Power NB-IoT ML SOM Module for building intelligent and secure IoT devices. Customers can develop their IoT smart metering and smart tracking solutions more quickly by utilizing the XENO+ NB-IoT ML SOM's intelligent computing and cellular connectivity functionalities.
The global intelligent power module market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among these, Asia-Pacific is anticipated to hold a prominent share of the market across the globe, owing to the growing adoption of intelligent power modules with SiC MOSFET modules, an innovative material for EV power modules, China-based EV, manufacturers are also utilizing this technology.
Among all regions, the North American region is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to increasing demand for intelligent power modules for energy savings and lower product operating costs. Market players focusing on introducing an integrated intelligent power module that provides protection features such as overcurrent protection, under-voltage protection, and temperature sensing. For instance, in September 2023, Ideal Power Inc. launched SymCool(TM) IQ Intelligent Power Module. SymCool(TM) IQ builds on the bidirectional B-TRAN(TM) multi-die packaging design to integrate intelligent driver optimized for bidirectional operation. The SymCool(TM) IQ, rated at 1200V and 160A, has significant advantages compared to IGBT modules, including lower losses and inherent bi-directionality.
The major companies serving the global intelligent power module market include Infineon Technologies AG, Mitsubishi Electric Corp., Renesas Electronics Corp., Semiconductor Components Industries, LLC, Toshiba Corp., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in April 2023, Semikron Danfoss and ROHM Semiconductor collaborated on the implementation of silicon carbide (SiC) inside power modules. The new 1200V RGA IGBT from ROHM was added by Semikron Danfoss to their lineup of low-power modules. The new 1200V RGA IGBT from ROHM is intended to serve as a substitute for the most recent Generation 7 IGBT devices in industrial settings.