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市场调查报告书
商品编码
1858797

玻璃通孔 (TGV) 晶圆：全球市场份额和排名、总销售额和需求预测 (2025-2031)

Through Glass Via (TGV) Wafer - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 106 Pages | 商品交期: 2-3个工作天内

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2024 年全球玻璃通孔 (TGV) 晶圆市场规模估计为 3.7 亿美元，预计到 2031 年将达到 14.25 亿美元，2025 年至 2031 年的复合年增长率为 20.2%。

本报告全面评估了近期关税调整和国际战略反制措施对玻璃通孔 (TGV) 晶圆跨境产业布局、资本配置模式、区域经济相互依存关係和供应链重组的影响。

预计到2024年，全球玻璃通孔（TGV）晶圆产量将达到约405万片，全球平均市场价格约为每片90美元。玻璃通孔（TGV）晶圆是一种在玻璃基板形成并镀有垂直通孔的晶圆，可用于微型电子设备的高密度布线，并作为讯号、电源和热的垂直路径。

TGV晶圆的主要上游供应商包括高纯度玻璃基板製造商、铜和导电材料供应商以及专业微加工设备製造商。下游环节则涉及晶圆级封装（WLP）製造商、OSAT（开放式系统测试）公司以及最终产品电子产品製造商。在这个产业链中，原料和设备供应商对成本和交货时间有显着影响，而封装製造商最终负责实现最终产品的价值。

随着智慧型手机的快速发展以及对穿戴式装置、无线射频模组和高频高速电子元件需求的不断增长，TGV技术凭藉其小型化、高密度布线和优异的散热性能等优势备受关注。 TGV晶圆在提升电子元件性能方面发挥重要作用，尤其是在5G、毫米波通讯和汽车电子等应用领域。

产业发展趋势主要集中在降低生产成本、提高产量比率、优化通孔设计、增强封装相容性等方面。同时，TGV晶圆也在不断发展，朝着更大、更薄、更可靠的方向发展，以满足高性能电子封装的需求。

在全球范围内，TGV晶圆生产仍然由少数几家技术先进的製造商主导。产能受限于诸多因素，例如高精度雷射钻孔设备、铜镀层均匀性控制以及清洗製程。单条生产线的产能通常仅限于每月数千到数万片晶圆。

作为一种高附加价值中间材料，TGV晶圆通常具有较高的毛利率，但易受原物料价格波动和资本折旧免税额的影响。典型的毛利率在30%至35%之间，高端应用和客製化产品的毛利率预计会更高。

成本主要包括玻璃基板材料、通孔加工、镀铜和封装/测试，约占总成本的 70-80%，设备折旧免税额和人事费用构成剩余部分。

TGV晶圆主要应用于高阶电子封装领域，如晶圆层次电子构装（WLP/FOWLP）、射频前端模组、微型感测器、汽车电子元件等。随着5G和毫米波通讯应用的成长，下游需求不断扩大，推动了产业的快速发展。

本报告旨在对全球玻璃通孔 (TGV) 晶圆市场按地区/国家、类型和应用进行全面分析，重点关注总销售量、收入、价格、市场份额和主要企业的排名。

本报告基于历史数据和预测数据，对2020年至2031年（以2024年为基准年）的玻璃通孔（TGV）晶圆市场规模、销售量（千片）和收入（百万美元）进行了估算和预测。报告采用定量和定性分析相结合的方法，旨在帮助读者制定业务/成长策略、评估市场竞争格局、分析自身在当前市场中的地位，并为玻璃通孔（TGV）晶圆市场做出明智的商业决策。

市场区隔

公司

  • Corning
  • LPKF
  • Samtec
  • SCHOTT
  • Xiamen Sky Semiconductor Technology
  • Tecnisco
  • PLANOPTIK
  • NSG Group
  • AGC
  • JNTC

按类型分類的细分市场

  • 300 mm
  • 200 mm
  • 小于150毫米

应用领域

  • 家用电子电器
  • 汽车电子
  • 高效能运算和资料中心
  • 其他的

按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 东南亚
    • 印度
    • 澳洲
    • 亚太其他地区
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 北欧国家
    • 其他欧洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 土耳其
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他中东和非洲地区

The global market for Through Glass Via (TGV) Wafer was estimated to be worth US$ 370 million in 2024 and is forecast to a readjusted size of US$ 1425 million by 2031 with a CAGR of 20.2% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Through Glass Via (TGV) Wafer cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

In 2024, global Through Glass Via (TGV) Wafer production reached approximately 4.05 million Pcs, with an average global market price of around US$ 90 per pcs. A Through Glass Via (TGV) wafer refers to a glass substrate in which vertical through-holes are formed and metallized, enabling high-density interconnections for miniaturized electronic devices and serving as vertical pathways for signals, power, or heat.

The primary upstream suppliers for TGV wafers include high-purity glass substrate manufacturers, copper and conductive material suppliers, and specialized micro-processing equipment manufacturers. Downstream, the chain involves wafer-level packaging houses, packaging and testing (OSAT) companies, and end-product electronics manufacturers. Within this industrial chain, raw material and equipment suppliers significantly impact cost and delivery times, while packaging houses are ultimately responsible for realizing the final product value.

Driven by the rapid development of smartphones, wearable devices, RF modules, and high-frequency/high-speed electronic components, TGV technology is gaining attention due to its advantages in miniaturization, high-density interconnects, and excellent thermal performance. Particularly in application scenarios such as 5G, millimeter-wave, and automotive electronics, TGV wafers provide critical support for enhancing electronic device performance.

Industry development trends are primarily focused on reducing production costs, improving yield rates, optimizing through-hole design, and enhancing packaging compatibility. Concurrently, TGV wafers are evolving towards larger sizes, thinner profiles, and higher reliability to meet the demands of high-performance electronic packaging.

Globally, TGV wafer production remains dominated by a limited number of technologically advanced manufacturers. Production capacity is constrained by factors such as high-precision laser drilling equipment, uniformity control in copper plating, and cleaning processes. Single production line capacity is typically limited, ranging from thousands to tens of thousands of wafers per month.

As a high-value-added intermediate material, TGV wafers generally command relatively high gross margins, but these are significantly affected by fluctuations in raw material prices and equipment depreciation. The typical gross margin range is 30% to 35%, with margins potentially higher for high-end applications or customized products.

Costs are primarily driven by glass substrate materials, through-hole processing, copper plating, and packaging/testing, accounting for approximately 70% to 80% of the total cost. Equipment depreciation and labor costs constitute the remaining portion.

TGV wafers are ultimately consumed mainly in high-end electronic packaging segments, such as Wafer-Level Packaging (WLP/FOWLP), RF front-end modules, micro-sensors, and automotive electronic components. With the growth in 5G and millimeter-wave communication applications, downstream demand continues to expand, driving rapid development in the industry.

This report aims to provide a comprehensive presentation of the global market for Through Glass Via (TGV) Wafer, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Through Glass Via (TGV) Wafer by region & country, by Type, and by Application.

The Through Glass Via (TGV) Wafer market size, estimations, and forecasts are provided in terms of sales volume (K Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Glass Via (TGV) Wafer.

Market Segmentation

By Company

  • Corning
  • LPKF
  • Samtec
  • SCHOTT
  • Xiamen Sky Semiconductor Technology
  • Tecnisco
  • PLANOPTIK
  • NSG Group
  • AGC
  • JNTC

Segment by Type

  • 300 mm
  • 200 mm
  • Below150 mm

Segment by Application

  • Consumer Electronics
  • Automotive Electronics
  • High-performance Computing and Data Centers
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Through Glass Via (TGV) Wafer manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Through Glass Via (TGV) Wafer in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Through Glass Via (TGV) Wafer in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Through Glass Via (TGV) Wafer Product Introduction
  • 1.2 Global Through Glass Via (TGV) Wafer Market Size Forecast
    • 1.2.1 Global Through Glass Via (TGV) Wafer Sales Value (2020-2031)
    • 1.2.2 Global Through Glass Via (TGV) Wafer Sales Volume (2020-2031)
    • 1.2.3 Global Through Glass Via (TGV) Wafer Sales Price (2020-2031)
  • 1.3 Through Glass Via (TGV) Wafer Market Trends & Drivers
    • 1.3.1 Through Glass Via (TGV) Wafer Industry Trends
    • 1.3.2 Through Glass Via (TGV) Wafer Market Drivers & Opportunity
    • 1.3.3 Through Glass Via (TGV) Wafer Market Challenges
    • 1.3.4 Through Glass Via (TGV) Wafer Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Through Glass Via (TGV) Wafer Players Revenue Ranking (2024)
  • 2.2 Global Through Glass Via (TGV) Wafer Revenue by Company (2020-2025)
  • 2.3 Global Through Glass Via (TGV) Wafer Players Sales Volume Ranking (2024)
  • 2.4 Global Through Glass Via (TGV) Wafer Sales Volume by Company Players (2020-2025)
  • 2.5 Global Through Glass Via (TGV) Wafer Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Through Glass Via (TGV) Wafer Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Through Glass Via (TGV) Wafer Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Through Glass Via (TGV) Wafer
  • 2.9 Through Glass Via (TGV) Wafer Market Competitive Analysis
    • 2.9.1 Through Glass Via (TGV) Wafer Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Through Glass Via (TGV) Wafer Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Glass Via (TGV) Wafer as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 300 mm
    • 3.1.2 200 mm
    • 3.1.3 Below150 mm
  • 3.2 Global Through Glass Via (TGV) Wafer Sales Value by Type
    • 3.2.1 Global Through Glass Via (TGV) Wafer Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Through Glass Via (TGV) Wafer Sales Value, by Type (2020-2031)
    • 3.2.3 Global Through Glass Via (TGV) Wafer Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Through Glass Via (TGV) Wafer Sales Volume by Type
    • 3.3.1 Global Through Glass Via (TGV) Wafer Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Through Glass Via (TGV) Wafer Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Through Glass Via (TGV) Wafer Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Through Glass Via (TGV) Wafer Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Consumer Electronics
    • 4.1.2 Automotive Electronics
    • 4.1.3 High-performance Computing and Data Centers
    • 4.1.4 Others
  • 4.2 Global Through Glass Via (TGV) Wafer Sales Value by Application
    • 4.2.1 Global Through Glass Via (TGV) Wafer Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Through Glass Via (TGV) Wafer Sales Value, by Application (2020-2031)
    • 4.2.3 Global Through Glass Via (TGV) Wafer Sales Value, by Application (%) (2020-2031)
  • 4.3 Global Through Glass Via (TGV) Wafer Sales Volume by Application
    • 4.3.1 Global Through Glass Via (TGV) Wafer Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global Through Glass Via (TGV) Wafer Sales Volume, by Application (2020-2031)
    • 4.3.3 Global Through Glass Via (TGV) Wafer Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global Through Glass Via (TGV) Wafer Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global Through Glass Via (TGV) Wafer Sales Value by Region
    • 5.1.1 Global Through Glass Via (TGV) Wafer Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Through Glass Via (TGV) Wafer Sales Value by Region (2020-2025)
    • 5.1.3 Global Through Glass Via (TGV) Wafer Sales Value by Region (2026-2031)
    • 5.1.4 Global Through Glass Via (TGV) Wafer Sales Value by Region (%), (2020-2031)
  • 5.2 Global Through Glass Via (TGV) Wafer Sales Volume by Region
    • 5.2.1 Global Through Glass Via (TGV) Wafer Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global Through Glass Via (TGV) Wafer Sales Volume by Region (2020-2025)
    • 5.2.3 Global Through Glass Via (TGV) Wafer Sales Volume by Region (2026-2031)
    • 5.2.4 Global Through Glass Via (TGV) Wafer Sales Volume by Region (%), (2020-2031)
  • 5.3 Global Through Glass Via (TGV) Wafer Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 5.4.2 North America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 5.5.2 Europe Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 5.6.2 Asia Pacific Through Glass Via (TGV) Wafer Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 5.7.2 South America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions Through Glass Via (TGV) Wafer Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.3.2 United States Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.4.2 Europe Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.5.2 China Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.6.2 Japan Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.7.2 South Korea Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Through Glass Via (TGV) Wafer Sales Value, 2020-2031
    • 6.9.2 India Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Through Glass Via (TGV) Wafer Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 Corning
    • 7.1.1 Corning Company Information
    • 7.1.2 Corning Introduction and Business Overview
    • 7.1.3 Corning Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 Corning Through Glass Via (TGV) Wafer Product Offerings
    • 7.1.5 Corning Recent Development
  • 7.2 LPKF
    • 7.2.1 LPKF Company Information
    • 7.2.2 LPKF Introduction and Business Overview
    • 7.2.3 LPKF Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 LPKF Through Glass Via (TGV) Wafer Product Offerings
    • 7.2.5 LPKF Recent Development
  • 7.3 Samtec
    • 7.3.1 Samtec Company Information
    • 7.3.2 Samtec Introduction and Business Overview
    • 7.3.3 Samtec Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 Samtec Through Glass Via (TGV) Wafer Product Offerings
    • 7.3.5 Samtec Recent Development
  • 7.4 SCHOTT
    • 7.4.1 SCHOTT Company Information
    • 7.4.2 SCHOTT Introduction and Business Overview
    • 7.4.3 SCHOTT Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 SCHOTT Through Glass Via (TGV) Wafer Product Offerings
    • 7.4.5 SCHOTT Recent Development
  • 7.5 Xiamen Sky Semiconductor Technology
    • 7.5.1 Xiamen Sky Semiconductor Technology Company Information
    • 7.5.2 Xiamen Sky Semiconductor Technology Introduction and Business Overview
    • 7.5.3 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Product Offerings
    • 7.5.5 Xiamen Sky Semiconductor Technology Recent Development
  • 7.6 Tecnisco
    • 7.6.1 Tecnisco Company Information
    • 7.6.2 Tecnisco Introduction and Business Overview
    • 7.6.3 Tecnisco Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 Tecnisco Through Glass Via (TGV) Wafer Product Offerings
    • 7.6.5 Tecnisco Recent Development
  • 7.7 PLANOPTIK
    • 7.7.1 PLANOPTIK Company Information
    • 7.7.2 PLANOPTIK Introduction and Business Overview
    • 7.7.3 PLANOPTIK Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 PLANOPTIK Through Glass Via (TGV) Wafer Product Offerings
    • 7.7.5 PLANOPTIK Recent Development
  • 7.8 NSG Group
    • 7.8.1 NSG Group Company Information
    • 7.8.2 NSG Group Introduction and Business Overview
    • 7.8.3 NSG Group Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.8.4 NSG Group Through Glass Via (TGV) Wafer Product Offerings
    • 7.8.5 NSG Group Recent Development
  • 7.9 AGC
    • 7.9.1 AGC Company Information
    • 7.9.2 AGC Introduction and Business Overview
    • 7.9.3 AGC Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.9.4 AGC Through Glass Via (TGV) Wafer Product Offerings
    • 7.9.5 AGC Recent Development
  • 7.10 JNTC
    • 7.10.1 JNTC Company Information
    • 7.10.2 JNTC Introduction and Business Overview
    • 7.10.3 JNTC Through Glass Via (TGV) Wafer Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.10.4 JNTC Through Glass Via (TGV) Wafer Product Offerings
    • 7.10.5 JNTC Recent Development

8 Industry Chain Analysis

  • 8.1 Through Glass Via (TGV) Wafer Industrial Chain
  • 8.2 Through Glass Via (TGV) Wafer Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Through Glass Via (TGV) Wafer Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Through Glass Via (TGV) Wafer Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer

List of Tables

  • Table 1. Through Glass Via (TGV) Wafer Market Trends
  • Table 2. Through Glass Via (TGV) Wafer Market Drivers & Opportunity
  • Table 3. Through Glass Via (TGV) Wafer Market Challenges
  • Table 4. Through Glass Via (TGV) Wafer Market Restraints
  • Table 5. Global Through Glass Via (TGV) Wafer Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global Through Glass Via (TGV) Wafer Revenue Market Share by Company (2020-2025)
  • Table 7. Global Through Glass Via (TGV) Wafer Sales Volume by Company (2020-2025) & (K Pcs)
  • Table 8. Global Through Glass Via (TGV) Wafer Sales Volume Market Share by Company (2020-2025)
  • Table 9. Global Market Through Glass Via (TGV) Wafer Price by Company (2020-2025) & (US$/Pcs)
  • Table 10. Key Manufacturers Through Glass Via (TGV) Wafer Manufacturing Base and Headquarters
  • Table 11. Key Manufacturers Through Glass Via (TGV) Wafer Product Type
  • Table 12. Key Manufacturers Time to Begin Mass Production of Through Glass Via (TGV) Wafer
  • Table 13. Global Through Glass Via (TGV) Wafer Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Glass Via (TGV) Wafer as of 2024)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global Through Glass Via (TGV) Wafer Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global Through Glass Via (TGV) Wafer Sales Value by Type (2020-2025) & (US$ Million)
  • Table 18. Global Through Glass Via (TGV) Wafer Sales Value by Type (2026-2031) & (US$ Million)
  • Table 19. Global Through Glass Via (TGV) Wafer Sales Market Share in Value by Type (2020-2025)
  • Table 20. Global Through Glass Via (TGV) Wafer Sales Market Share in Value by Type (2026-2031)
  • Table 21. Global Through Glass Via (TGV) Wafer Sales Volume by Type: 2020 VS 2024 VS 2031 (K Pcs)
  • Table 22. Global Through Glass Via (TGV) Wafer Sales Volume by Type (2020-2025) & (K Pcs)
  • Table 23. Global Through Glass Via (TGV) Wafer Sales Volume by Type (2026-2031) & (K Pcs)
  • Table 24. Global Through Glass Via (TGV) Wafer Sales Market Share in Volume by Type (2020-2025)
  • Table 25. Global Through Glass Via (TGV) Wafer Sales Market Share in Volume by Type (2026-2031)
  • Table 26. Global Through Glass Via (TGV) Wafer Price by Type (2020-2025) & (US$/Pcs)
  • Table 27. Global Through Glass Via (TGV) Wafer Price by Type (2026-2031) & (US$/Pcs)
  • Table 28. Global Through Glass Via (TGV) Wafer Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 29. Global Through Glass Via (TGV) Wafer Sales Value by Application (2020-2025) & (US$ Million)
  • Table 30. Global Through Glass Via (TGV) Wafer Sales Value by Application (2026-2031) & (US$ Million)
  • Table 31. Global Through Glass Via (TGV) Wafer Sales Market Share in Value by Application (2020-2025)
  • Table 32. Global Through Glass Via (TGV) Wafer Sales Market Share in Value by Application (2026-2031)
  • Table 33. Global Through Glass Via (TGV) Wafer Sales Volume by Application: 2020 VS 2024 VS 2031 (K Pcs)
  • Table 34. Global Through Glass Via (TGV) Wafer Sales Volume by Application (2020-2025) & (K Pcs)
  • Table 35. Global Through Glass Via (TGV) Wafer Sales Volume by Application (2026-2031) & (K Pcs)
  • Table 36. Global Through Glass Via (TGV) Wafer Sales Market Share in Volume by Application (2020-2025)
  • Table 37. Global Through Glass Via (TGV) Wafer Sales Market Share in Volume by Application (2026-2031)
  • Table 38. Global Through Glass Via (TGV) Wafer Price by Application (2020-2025) & (US$/Pcs)
  • Table 39. Global Through Glass Via (TGV) Wafer Price by Application (2026-2031) & (US$/Pcs)
  • Table 40. Global Through Glass Via (TGV) Wafer Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 41. Global Through Glass Via (TGV) Wafer Sales Value by Region (2020-2025) & (US$ Million)
  • Table 42. Global Through Glass Via (TGV) Wafer Sales Value by Region (2026-2031) & (US$ Million)
  • Table 43. Global Through Glass Via (TGV) Wafer Sales Value by Region (2020-2025) & (%)
  • Table 44. Global Through Glass Via (TGV) Wafer Sales Value by Region (2026-2031) & (%)
  • Table 45. Global Through Glass Via (TGV) Wafer Sales Volume by Region (K Pcs): 2020 VS 2024 VS 2031
  • Table 46. Global Through Glass Via (TGV) Wafer Sales Volume by Region (2020-2025) & (K Pcs)
  • Table 47. Global Through Glass Via (TGV) Wafer Sales Volume by Region (2026-2031) & (K Pcs)
  • Table 48. Global Through Glass Via (TGV) Wafer Sales Volume by Region (2020-2025) & (%)
  • Table 49. Global Through Glass Via (TGV) Wafer Sales Volume by Region (2026-2031) & (%)
  • Table 50. Global Through Glass Via (TGV) Wafer Average Price by Region (2020-2025) & (US$/Pcs)
  • Table 51. Global Through Glass Via (TGV) Wafer Average Price by Region (2026-2031) & (US$/Pcs)
  • Table 52. Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 53. Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value, (2020-2025) & (US$ Million)
  • Table 54. Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value, (2026-2031) & (US$ Million)
  • Table 55. Key Countries/Regions Through Glass Via (TGV) Wafer Sales Volume, (2020-2025) & (K Pcs)
  • Table 56. Key Countries/Regions Through Glass Via (TGV) Wafer Sales Volume, (2026-2031) & (K Pcs)
  • Table 57. Corning Company Information
  • Table 58. Corning Introduction and Business Overview
  • Table 59. Corning Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 60. Corning Through Glass Via (TGV) Wafer Product Offerings
  • Table 61. Corning Recent Development
  • Table 62. LPKF Company Information
  • Table 63. LPKF Introduction and Business Overview
  • Table 64. LPKF Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 65. LPKF Through Glass Via (TGV) Wafer Product Offerings
  • Table 66. LPKF Recent Development
  • Table 67. Samtec Company Information
  • Table 68. Samtec Introduction and Business Overview
  • Table 69. Samtec Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 70. Samtec Through Glass Via (TGV) Wafer Product Offerings
  • Table 71. Samtec Recent Development
  • Table 72. SCHOTT Company Information
  • Table 73. SCHOTT Introduction and Business Overview
  • Table 74. SCHOTT Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 75. SCHOTT Through Glass Via (TGV) Wafer Product Offerings
  • Table 76. SCHOTT Recent Development
  • Table 77. Xiamen Sky Semiconductor Technology Company Information
  • Table 78. Xiamen Sky Semiconductor Technology Introduction and Business Overview
  • Table 79. Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 80. Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Product Offerings
  • Table 81. Xiamen Sky Semiconductor Technology Recent Development
  • Table 82. Tecnisco Company Information
  • Table 83. Tecnisco Introduction and Business Overview
  • Table 84. Tecnisco Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 85. Tecnisco Through Glass Via (TGV) Wafer Product Offerings
  • Table 86. Tecnisco Recent Development
  • Table 87. PLANOPTIK Company Information
  • Table 88. PLANOPTIK Introduction and Business Overview
  • Table 89. PLANOPTIK Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 90. PLANOPTIK Through Glass Via (TGV) Wafer Product Offerings
  • Table 91. PLANOPTIK Recent Development
  • Table 92. NSG Group Company Information
  • Table 93. NSG Group Introduction and Business Overview
  • Table 94. NSG Group Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 95. NSG Group Through Glass Via (TGV) Wafer Product Offerings
  • Table 96. NSG Group Recent Development
  • Table 97. AGC Company Information
  • Table 98. AGC Introduction and Business Overview
  • Table 99. AGC Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 100. AGC Through Glass Via (TGV) Wafer Product Offerings
  • Table 101. AGC Recent Development
  • Table 102. JNTC Company Information
  • Table 103. JNTC Introduction and Business Overview
  • Table 104. JNTC Through Glass Via (TGV) Wafer Sales (K Pcs), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 105. JNTC Through Glass Via (TGV) Wafer Product Offerings
  • Table 106. JNTC Recent Development
  • Table 107. Key Raw Materials Lists
  • Table 108. Raw Materials Key Suppliers Lists
  • Table 109. Through Glass Via (TGV) Wafer Downstream Customers
  • Table 110. Through Glass Via (TGV) Wafer Distributors List
  • Table 111. Research Programs/Design for This Report
  • Table 112. Key Data Information from Secondary Sources
  • Table 113. Key Data Information from Primary Sources

List of Figures

  • Figure 1. Through Glass Via (TGV) Wafer Product Picture
  • Figure 2. Global Through Glass Via (TGV) Wafer Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global Through Glass Via (TGV) Wafer Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Global Through Glass Via (TGV) Wafer Sales Volume (2020-2031) & (K Pcs)
  • Figure 5. Global Through Glass Via (TGV) Wafer Sales Price (2020-2031) & (US$/Pcs)
  • Figure 6. Through Glass Via (TGV) Wafer Report Years Considered
  • Figure 7. Global Through Glass Via (TGV) Wafer Players Revenue Ranking (2024) & (US$ Million)
  • Figure 8. Global Through Glass Via (TGV) Wafer Players Sales Volume Ranking (2024) & (K Pcs)
  • Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Through Glass Via (TGV) Wafer Revenue in 2024
  • Figure 10. Through Glass Via (TGV) Wafer Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 11. 300 mm Picture
  • Figure 12. 200 mm Picture
  • Figure 13. Below150 mm Picture
  • Figure 14. Global Through Glass Via (TGV) Wafer Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 15. Global Through Glass Via (TGV) Wafer Sales Value Market Share by Type, 2024 & 2031
  • Figure 16. Global Through Glass Via (TGV) Wafer Sales Volume by Type (2020 VS 2024 VS 2031) & (K Pcs)
  • Figure 17. Global Through Glass Via (TGV) Wafer Sales Volume Market Share by Type, 2024 & 2031
  • Figure 18. Global Through Glass Via (TGV) Wafer Price by Type (2020-2031) & (US$/Pcs)
  • Figure 19. Product Picture of Consumer Electronics
  • Figure 20. Product Picture of Automotive Electronics
  • Figure 21. Product Picture of High-performance Computing and Data Centers
  • Figure 22. Product Picture of Others
  • Figure 23. Global Through Glass Via (TGV) Wafer Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 24. Global Through Glass Via (TGV) Wafer Sales Value Market Share by Application, 2024 & 2031
  • Figure 25. Global Through Glass Via (TGV) Wafer Sales Volume by Application (2020 VS 2024 VS 2031) & (K Pcs)
  • Figure 26. Global Through Glass Via (TGV) Wafer Sales Volume Market Share by Application, 2024 & 2031
  • Figure 27. Global Through Glass Via (TGV) Wafer Price by Application (2020-2031) & (US$/Pcs)
  • Figure 28. North America Through Glass Via (TGV) Wafer Sales Value (2020-2031) & (US$ Million)
  • Figure 29. North America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
  • Figure 30. Europe Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 31. Europe Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
  • Figure 32. Asia Pacific Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 33. Asia Pacific Through Glass Via (TGV) Wafer Sales Value by Region (%), 2024 VS 2031
  • Figure 34. South America Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 35. South America Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
  • Figure 36. Middle East & Africa Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 37. Middle East & Africa Through Glass Via (TGV) Wafer Sales Value by Country (%), 2024 VS 2031
  • Figure 38. Key Countries/Regions Through Glass Via (TGV) Wafer Sales Value (%), (2020-2031)
  • Figure 39. Key Countries/Regions Through Glass Via (TGV) Wafer Sales Volume (%), (2020-2031)
  • Figure 40. United States Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 41. United States Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • Figure 42. United States Through Glass Via (TGV) Wafer Sales Value by Application (%), 2024 VS 2031
  • Figure 43. Europe Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 44. Europe Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • Figure 45. Europe Through Glass Via (TGV) Wafer Sales Value by Application (%), 2024 VS 2031
  • Figure 46. China Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 47. China Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • Figure 48. China Through Glass Via (TGV) Wafer Sales Value by Application (%), 2024 VS 2031
  • Figure 49. Japan Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 50. Japan Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • Figure 51. Japan Through Glass Via (TGV) Wafer Sales Value by Application (%), 2024 VS 2031
  • Figure 52. South Korea Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 53. South Korea Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • Figure 54. South Korea Through Glass Via (TGV) Wafer Sales Value by Application (%), 2024 VS 2031
  • Figure 55. Southeast Asia Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 56. Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • Figure 57. Southeast Asia Through Glass Via (TGV) Wafer Sales Value by Application (%), 2024 VS 2031
  • Figure 58. India Through Glass Via (TGV) Wafer Sales Value, (2020-2031) & (US$ Million)
  • Figure 59. India Through Glass Via (TGV) Wafer Sales Value by Type (%), 2024 VS 2031
  • Figure 60. India Through Glass Via (TGV) Wafer Sales Value by Application (%), 2024 VS 2031
  • Figure 61. Through Glass Via (TGV) Wafer Industrial Chain
  • Figure 62. Through Glass Via (TGV) Wafer Manufacturing Cost Structure
  • Figure 63. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 64. Bottom-up and Top-down Approaches for This Report
  • Figure 65. Data Triangulation
  • Figure 66. Key Executives Interviewed