查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1861296

扇出型晶圆层次电子构装：全球市占率和排名、总销售额和需求预测（2025-2031 年）

Fan-Out Wafer Level Packaging - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 83 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

全球扇出型晶圆层次电子构装市场预计在 2024 年达到 5.99 亿美元，预计到 2031 年将达到 15.81 亿美元，2025 年至 2031 年的复合年增长率为 15.0%。

在扇出型晶圆级封装（WLP）技术中，晶片在嵌入面板之前会被切割和分离。具体来说，晶片正面朝下贴附在载体上，晶片间距与电路设计的间距规格相符。然后，接收器进行成型以形成面板，接着进行分离、密封面板和密封面板转移。这种晶圆形式（也称为重构晶圆）可广泛应用于标准晶圆工艺，电路设计必须形成在密封面板上。由于密封面板的面积大于晶片，因此可以将I/O触点放置在扇入晶圆区域，或在塑胶模具上扇出以容纳更多I/O触点。

智慧型手机、平板电脑、穿戴式装置和物联网装置的日益普及，推动了对更小、更轻、更节能的半导体封装的需求。 FOWLP（面外晶圆级封装）技术能够实现纤薄设计和更小的封装尺寸，使其成为紧凑型电子设备的理想选择。随着消费者对高性能、外观时尚设备的需求不断增长，製造商正在加速采用FOWLP解决方案。

5G智慧型手机、AR/ VR头戴装置和游戏主机的兴起推动了对速度更快、功耗更低、密度更高的半导体封装的需求。扇出型板载封装（FOWLP）能够提高讯号完整性、缩短布线距离并降低寄生电感，进而提升处理器、记忆体模组和感测器的效能。这一趋势是推动扇出型封装在先进行动和运算应用中普及的关键因素。

现代电子设备越来越多地将逻辑、记忆体、射频组件和感测器等多种功能整合到单一封装中。 FOWLP 支援异构集成，能够有效率地封装多个晶粒和组件。这种能力使製造商能够生产出具有更佳温度控管和可靠性的多功能高性能晶片，从而推动市场成长。

汽车产业，尤其是电动车 (EV) 和自动驾驶汽车 (AV)，越来越依赖先进的半导体封装技术来整合感测器、电源管理、高级驾驶辅助系统 (ADAS) 和资讯娱乐系统。 FOWLP 封装技术具有高密度整合和更优异的电气性能，使其非常适合对空间、可靠性和散热性能要求极高的汽车应用。

全球向 5G 网路和高速无线通讯的转型正在推动对扇出型低功耗 (FOWLP) 封装的需求。扇出型封装能够有效地路由高频讯号，减少讯号损耗并提高整体射频效能，使其成为 5G 收发器、物联网闸道器和无线模组的理想解决方案。

本报告旨在按地区/国家、类型和应用对全球扇出型晶圆层次电子构装市场进行全面分析，重点关注总收入、市场份额和主要企业的排名。

本报告以销售收入为指标，对扇出晶圆层次电子构装）市场规模、估算和预测进行了呈现，以2024年为基准年，并涵盖了2020年至2031年的历史数据和预测数据。定量和定性分析将帮助读者制定业务和成长策略，评估市场竞争，分析自身在当前市场中的地位，并就扇出晶圆层次电子构装做出明智的商业决策。

市场区隔

公司

  • TSMC
  • ASE Technology Holding Co.
  • JCET Group
  • Amkor Technology
  • Siliconware Technology（SuZhou）Co.
  • Nepes

按类型分類的细分市场

  • 高密度扇出封装
  • 核心扇出封装

应用领域

  • CMOS影像感测器
  • 无线连线
  • 逻辑和记忆体积体电路
  • 微机电系统和感测器
  • 类比和混合积体电路
  • 其他的

按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 东南亚
    • 印度
    • 澳洲
    • 亚太其他地区
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 北欧国家
    • 其他欧洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 土耳其
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他中东和非洲地区

The global market for Fan-Out Wafer Level Packaging was estimated to be worth US$ 599 million in 2024 and is forecast to a readjusted size of US$ 1581 million by 2031 with a CAGR of 15.0% during the forecast period 2025-2031.

The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip face down to the Carrier, and the chip spacing should conform to the Pitch specification of the circuit design, while the receiver performs Molding to form a Panel. Follow-up will be separation, sealant panel and a vehicle for sealant panel Wafer shape, also called reconstruct Wafer (Reconstituted Wafer), can be widely used standard Wafer process, need is formed on the sealant panel circuit design. Since the area of the sealing panel is larger than that of the chip, not only can I/O contacts be made into the wafer area by Fan-In method; It can also be Fanned Out on a plastic mold to accommodate more I/O contacts.

The proliferation of smartphones, tablets, wearables, and IoT devices is driving the need for smaller, lighter, and more power-efficient semiconductor packages. FOWLP offers a thin form factor and reduced package size, making it ideal for compact electronics. As consumer demand for high-performance and aesthetically sleek devices rises, manufacturers are increasingly adopting FOWLP solutions.

The rise of 5G smartphones, AR/VR headsets, and gaming consoles requires high-speed, low-power, and high-density semiconductor packages. FOWLP provides improved signal integrity, shorter interconnects, and lower parasitic inductance, which enhance performance for processors, memory modules, and sensors. This trend is a key driver for the adoption of fan-out packaging in advanced mobile and computing applications.

Modern electronic devices increasingly integrate multiple functions such as logic, memory, RF components, and sensors within a single package. FOWLP supports heterogeneous integration, allowing multiple dies and components to be packaged together efficiently. This capability enables manufacturers to produce multi-functional, high-performance chips with enhanced thermal management and reliability, fueling market growth.

The automotive sector, particularly electric vehicles (EVs) and autonomous vehicles (AVs), is increasingly relying on advanced semiconductor packages for sensors, power management, ADAS (Advanced Driver Assistance Systems), and infotainment systems. FOWLP provides high-density integration and improved electrical performance, making it suitable for automotive applications where space constraints, reliability, and thermal performance are critical.

The global shift toward 5G networks and high-speed wireless communication is boosting demand for FOWLP. Fan-out packaging allows efficient routing of high-frequency signals, reduces signal loss, and enhances overall RF performance, making it an attractive solution for 5G transceivers, IoT gateways, and wireless modules.

This report aims to provide a comprehensive presentation of the global market for Fan-Out Wafer Level Packaging, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Fan-Out Wafer Level Packaging by region & country, by Type, and by Application.

The Fan-Out Wafer Level Packaging market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-Out Wafer Level Packaging.

Market Segmentation

By Company

  • TSMC
  • ASE Technology Holding Co.
  • JCET Group
  • Amkor Technology
  • Siliconware Technology (SuZhou) Co.
  • Nepes

Segment by Type

  • High Density Fan-Out Package
  • Core Fan-Out Package

Segment by Application

  • CMOS Image Sensor
  • A Wireless Connection
  • Logic and Memory Integrated Circuits
  • Mems and Sensors
  • Analog and Hybrid Integrated Circuits
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Fan-Out Wafer Level Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Revenue of Fan-Out Wafer Level Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Revenue of Fan-Out Wafer Level Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Fan-Out Wafer Level Packaging Product Introduction
  • 1.2 Global Fan-Out Wafer Level Packaging Market Size Forecast (2020-2031)
  • 1.3 Fan-Out Wafer Level Packaging Market Trends & Drivers
    • 1.3.1 Fan-Out Wafer Level Packaging Industry Trends
    • 1.3.2 Fan-Out Wafer Level Packaging Market Drivers & Opportunity
    • 1.3.3 Fan-Out Wafer Level Packaging Market Challenges
    • 1.3.4 Fan-Out Wafer Level Packaging Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Fan-Out Wafer Level Packaging Players Revenue Ranking (2024)
  • 2.2 Global Fan-Out Wafer Level Packaging Revenue by Company (2020-2025)
  • 2.3 Key Companies Fan-Out Wafer Level Packaging Manufacturing Base Distribution and Headquarters
  • 2.4 Key Companies Fan-Out Wafer Level Packaging Product Offered
  • 2.5 Key Companies Time to Begin Mass Production of Fan-Out Wafer Level Packaging
  • 2.6 Fan-Out Wafer Level Packaging Market Competitive Analysis
    • 2.6.1 Fan-Out Wafer Level Packaging Market Concentration Rate (2020-2025)
    • 2.6.2 Global 5 and 10 Largest Companies by Fan-Out Wafer Level Packaging Revenue in 2024
    • 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Fan-Out Wafer Level Packaging as of 2024)
  • 2.7 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 High Density Fan-Out Package
    • 3.1.2 Core Fan-Out Package
  • 3.2 Global Fan-Out Wafer Level Packaging Sales Value by Type
    • 3.2.1 Global Fan-Out Wafer Level Packaging Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Fan-Out Wafer Level Packaging Sales Value, by Type (2020-2031)
    • 3.2.3 Global Fan-Out Wafer Level Packaging Sales Value, by Type (%) (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 CMOS Image Sensor
    • 4.1.2 A Wireless Connection
    • 4.1.3 Logic and Memory Integrated Circuits
    • 4.1.4 Mems and Sensors
    • 4.1.5 Analog and Hybrid Integrated Circuits
    • 4.1.6 Others
  • 4.2 Global Fan-Out Wafer Level Packaging Sales Value by Application
    • 4.2.1 Global Fan-Out Wafer Level Packaging Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Fan-Out Wafer Level Packaging Sales Value, by Application (2020-2031)
    • 4.2.3 Global Fan-Out Wafer Level Packaging Sales Value, by Application (%) (2020-2031)

5 Segmentation by Region

  • 5.1 Global Fan-Out Wafer Level Packaging Sales Value by Region
    • 5.1.1 Global Fan-Out Wafer Level Packaging Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Fan-Out Wafer Level Packaging Sales Value by Region (2020-2025)
    • 5.1.3 Global Fan-Out Wafer Level Packaging Sales Value by Region (2026-2031)
    • 5.1.4 Global Fan-Out Wafer Level Packaging Sales Value by Region (%), (2020-2031)
  • 5.2 North America
    • 5.2.1 North America Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.2.2 North America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • 5.3 Europe
    • 5.3.1 Europe Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.3.2 Europe Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • 5.4 Asia Pacific
    • 5.4.1 Asia Pacific Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.4.2 Asia Pacific Fan-Out Wafer Level Packaging Sales Value by Region (%), 2024 VS 2031
  • 5.5 South America
    • 5.5.1 South America Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.5.2 South America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • 5.6 Middle East & Africa
    • 5.6.1 Middle East & Africa Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 5.6.2 Middle East & Africa Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.3.2 United States Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.4.2 Europe Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.5.2 China Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.6.2 Japan Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.7.2 South Korea Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Fan-Out Wafer Level Packaging Sales Value, 2020-2031
    • 6.9.2 India Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Fan-Out Wafer Level Packaging Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 TSMC
    • 7.1.1 TSMC Profile
    • 7.1.2 TSMC Main Business
    • 7.1.3 TSMC Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.1.4 TSMC Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.1.5 TSMC Recent Developments
  • 7.2 ASE Technology Holding Co.
    • 7.2.1 ASE Technology Holding Co. Profile
    • 7.2.2 ASE Technology Holding Co. Main Business
    • 7.2.3 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.2.4 ASE Technology Holding Co. Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.2.5 ASE Technology Holding Co. Recent Developments
  • 7.3 JCET Group
    • 7.3.1 JCET Group Profile
    • 7.3.2 JCET Group Main Business
    • 7.3.3 JCET Group Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.3.4 JCET Group Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.3.5 JCET Group Recent Developments
  • 7.4 Amkor Technology
    • 7.4.1 Amkor Technology Profile
    • 7.4.2 Amkor Technology Main Business
    • 7.4.3 Amkor Technology Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.4.4 Amkor Technology Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.4.5 Amkor Technology Recent Developments
  • 7.5 Siliconware Technology (SuZhou) Co.
    • 7.5.1 Siliconware Technology (SuZhou) Co. Profile
    • 7.5.2 Siliconware Technology (SuZhou) Co. Main Business
    • 7.5.3 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.5.4 Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.5.5 Siliconware Technology (SuZhou) Co. Recent Developments
  • 7.6 Nepes
    • 7.6.1 Nepes Profile
    • 7.6.2 Nepes Main Business
    • 7.6.3 Nepes Fan-Out Wafer Level Packaging Products, Services and Solutions
    • 7.6.4 Nepes Fan-Out Wafer Level Packaging Revenue (US$ Million) & (2020-2025)
    • 7.6.5 Nepes Recent Developments

8 Industry Chain Analysis

  • 8.1 Fan-Out Wafer Level Packaging Industrial Chain
  • 8.2 Fan-Out Wafer Level Packaging Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Fan-Out Wafer Level Packaging Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Fan-Out Wafer Level Packaging Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer

List of Tables

  • Table 1. Fan-Out Wafer Level Packaging Market Trends
  • Table 2. Fan-Out Wafer Level Packaging Market Drivers & Opportunity
  • Table 3. Fan-Out Wafer Level Packaging Market Challenges
  • Table 4. Fan-Out Wafer Level Packaging Market Restraints
  • Table 5. Global Fan-Out Wafer Level Packaging Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global Fan-Out Wafer Level Packaging Revenue Market Share by Company (2020-2025)
  • Table 7. Key Companies Fan-Out Wafer Level Packaging Manufacturing Base Distribution and Headquarters
  • Table 8. Key Companies Fan-Out Wafer Level Packaging Product Type
  • Table 9. Key Companies Time to Begin Mass Production of Fan-Out Wafer Level Packaging
  • Table 10. Global Fan-Out Wafer Level Packaging Companies Market Concentration Ratio (CR5 and HHI)
  • Table 11. Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Fan-Out Wafer Level Packaging as of 2024)
  • Table 12. Mergers & Acquisitions, Expansion Plans
  • Table 13. Global Fan-Out Wafer Level Packaging Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 14. Global Fan-Out Wafer Level Packaging Sales Value by Type (2020-2025) & (US$ Million)
  • Table 15. Global Fan-Out Wafer Level Packaging Sales Value by Type (2026-2031) & (US$ Million)
  • Table 16. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Type (2020-2025)
  • Table 17. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Type (2026-2031)
  • Table 18. Global Fan-Out Wafer Level Packaging Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 19. Global Fan-Out Wafer Level Packaging Sales Value by Application (2020-2025) & (US$ Million)
  • Table 20. Global Fan-Out Wafer Level Packaging Sales Value by Application (2026-2031) & (US$ Million)
  • Table 21. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Application (2020-2025)
  • Table 22. Global Fan-Out Wafer Level Packaging Sales Market Share in Value by Application (2026-2031)
  • Table 23. Global Fan-Out Wafer Level Packaging Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 24. Global Fan-Out Wafer Level Packaging Sales Value by Region (2020-2025) & (US$ Million)
  • Table 25. Global Fan-Out Wafer Level Packaging Sales Value by Region (2026-2031) & (US$ Million)
  • Table 26. Global Fan-Out Wafer Level Packaging Sales Value by Region (2020-2025) & (%)
  • Table 27. Global Fan-Out Wafer Level Packaging Sales Value by Region (2026-2031) & (%)
  • Table 28. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 29. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value, (2020-2025) & (US$ Million)
  • Table 30. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value, (2026-2031) & (US$ Million)
  • Table 31. TSMC Basic Information List
  • Table 32. TSMC Description and Business Overview
  • Table 33. TSMC Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 34. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of TSMC (2020-2025)
  • Table 35. TSMC Recent Developments
  • Table 36. ASE Technology Holding Co. Basic Information List
  • Table 37. ASE Technology Holding Co. Description and Business Overview
  • Table 38. ASE Technology Holding Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 39. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of ASE Technology Holding Co. (2020-2025)
  • Table 40. ASE Technology Holding Co. Recent Developments
  • Table 41. JCET Group Basic Information List
  • Table 42. JCET Group Description and Business Overview
  • Table 43. JCET Group Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 44. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of JCET Group (2020-2025)
  • Table 45. JCET Group Recent Developments
  • Table 46. Amkor Technology Basic Information List
  • Table 47. Amkor Technology Description and Business Overview
  • Table 48. Amkor Technology Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 49. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of Amkor Technology (2020-2025)
  • Table 50. Amkor Technology Recent Developments
  • Table 51. Siliconware Technology (SuZhou) Co. Basic Information List
  • Table 52. Siliconware Technology (SuZhou) Co. Description and Business Overview
  • Table 53. Siliconware Technology (SuZhou) Co. Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 54. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of Siliconware Technology (SuZhou) Co. (2020-2025)
  • Table 55. Siliconware Technology (SuZhou) Co. Recent Developments
  • Table 56. Nepes Basic Information List
  • Table 57. Nepes Description and Business Overview
  • Table 58. Nepes Fan-Out Wafer Level Packaging Products, Services and Solutions
  • Table 59. Revenue (US$ Million) in Fan-Out Wafer Level Packaging Business of Nepes (2020-2025)
  • Table 60. Nepes Recent Developments
  • Table 61. Key Raw Materials Lists
  • Table 62. Raw Materials Key Suppliers Lists
  • Table 63. Fan-Out Wafer Level Packaging Downstream Customers
  • Table 64. Fan-Out Wafer Level Packaging Distributors List
  • Table 65. Research Programs/Design for This Report
  • Table 66. Key Data Information from Secondary Sources
  • Table 67. Key Data Information from Primary Sources

List of Figures

  • Figure 1. Fan-Out Wafer Level Packaging Product Picture
  • Figure 2. Global Fan-Out Wafer Level Packaging Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global Fan-Out Wafer Level Packaging Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Fan-Out Wafer Level Packaging Report Years Considered
  • Figure 5. Global Fan-Out Wafer Level Packaging Players Revenue Ranking (2024) & (US$ Million)
  • Figure 6. The 5 and 10 Largest Companies in the World: Market Share by Fan-Out Wafer Level Packaging Revenue in 2024
  • Figure 7. Fan-Out Wafer Level Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 8. High Density Fan-Out Package Picture
  • Figure 9. Core Fan-Out Package Picture
  • Figure 10. Global Fan-Out Wafer Level Packaging Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 11. Global Fan-Out Wafer Level Packaging Sales Value Market Share by Type, 2024 & 2031
  • Figure 12. Product Picture of CMOS Image Sensor
  • Figure 13. Product Picture of A Wireless Connection
  • Figure 14. Product Picture of Logic and Memory Integrated Circuits
  • Figure 15. Product Picture of Mems and Sensors
  • Figure 16. Product Picture of Analog and Hybrid Integrated Circuits
  • Figure 17. Product Picture of Others
  • Figure 18. Global Fan-Out Wafer Level Packaging Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 19. Global Fan-Out Wafer Level Packaging Sales Value Market Share by Application, 2024 & 2031
  • Figure 20. North America Fan-Out Wafer Level Packaging Sales Value (2020-2031) & (US$ Million)
  • Figure 21. North America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 22. Europe Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 23. Europe Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 24. Asia Pacific Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 25. Asia Pacific Fan-Out Wafer Level Packaging Sales Value by Region (%), 2024 VS 2031
  • Figure 26. South America Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 27. South America Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 28. Middle East & Africa Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 29. Middle East & Africa Fan-Out Wafer Level Packaging Sales Value by Country (%), 2024 VS 2031
  • Figure 30. Key Countries/Regions Fan-Out Wafer Level Packaging Sales Value (%), (2020-2031)
  • Figure 31. United States Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 32. United States Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 33. United States Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 34. Europe Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 35. Europe Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 36. Europe Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 37. China Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 38. China Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 39. China Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 40. Japan Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 41. Japan Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 42. Japan Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 43. South Korea Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 44. South Korea Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 45. South Korea Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 46. Southeast Asia Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 47. Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 48. Southeast Asia Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 49. India Fan-Out Wafer Level Packaging Sales Value, (2020-2031) & (US$ Million)
  • Figure 50. India Fan-Out Wafer Level Packaging Sales Value by Type (%), 2024 VS 2031
  • Figure 51. India Fan-Out Wafer Level Packaging Sales Value by Application (%), 2024 VS 2031
  • Figure 52. Fan-Out Wafer Level Packaging Industrial Chain
  • Figure 53. Fan-Out Wafer Level Packaging Manufacturing Cost Structure
  • Figure 54. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 55. Bottom-up and Top-down Approaches for This Report
  • Figure 56. Data Triangulation
  • Figure 57. Key Executives Interviewed