查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1862472

碳化硅晶圆雷射切割设备：全球市占率及排名、总收入及需求预测（2025-2031年）

SiC Wafer Laser Cutting Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 109 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

全球 SiC 晶圆雷射切割设备市场：预计 2024 年市场规模为 1.38 亿美元，预计在预测期（2025-2031 年）内将以 15.8% 的复合年增长率增长，到 2031 年达到 3.81 亿美元。

本报告对近期与碳化硅晶圆雷射切割设备相关的关税调整和国际战略反制措施进行了全面评估，包括跨境产业布局、资本配置模式、区域经济相互依存关係和供应链重组。

预计到 2024 年，全球 SiC 晶圆雷射切割机的产量将达到 242 台，全球平均市场价格约为每台 578,000 美元。

碳化硅（SiC）于1893年被发现，最初用作研磨和汽车煞车片的工业磨料。 20世纪中期，碳化硅晶片的应用扩展到了LED技术领域。此后，由于其优异的物理性能，碳化硅的应用范围不断扩大，涵盖了许多半导体应用。这些优异的性能在半导体产业内外广泛的应用中均有体现。随着摩尔定律似乎接近极限，许多半导体公司将目光投向了碳化硅，将其视为未来的半导体材料。

与传统的硅基基板相比，使用碳化硅有许多优点，其中一个主要优点是其硬度，这使其在高速、高温和高电压应用中具有许多优势。

碳化硅晶片具有高导热性，能够有效地将热量从一点传递到另一点，从而提高导电性，并最终促进尺寸缩小，这是向碳化硅晶片过渡的通用目标之一。

碳化硅基板还具有很低的热膨胀係数。热膨胀是指材料在加热或冷却时所发生的膨胀或收缩的量和方向。虽然冰是最常见的例子，但碳化硅与许多金属的性质相反，它在冷却时会膨胀，在加热时会收缩。碳化硅的低热膨胀係数意味着它在加热或冷却时尺寸和形状变化很小。这一特性使其成为小型装置封装和单晶片上电晶体高密度整合的理想材料。

碳化硅的硬度与钻石相当。因此，用钻石刀片切割碳化硅容易产生碎屑和裂缝等缺陷，导致电流洩漏，无法满足汽车应用的严格要求。

碳化硅雷射切割法是一种雷射改质切割技术。其原理是利用透镜聚焦高穿透波长的雷射光束，照射到晶圆内部，造成多光子吸收，形成局部变形层（改质层）。此层主要由空位、高位错密度层和裂缝组成。改质层成为后续晶圆切割和裂缝扩展的起始点。透过优化雷射和光路系统，将改质层限制在晶圆内部，并利用外力引导裂缝扩展至晶圆的顶面或底面，避免对晶圆表面造成热损伤，从而将晶圆切割成指定尺寸。

从过去十年的复合年增长率来看，开发中国家对封装测试设备的需求更为活跃。由于当前半导体市场晶片短缺，封装测试产业正在寻求资本扩张，并积极扩大产能。随着碳化硅元件在新能源汽车、能源、工业、通讯等领域的应用日益广泛，市场对碳化硅雷射切割的需求也不断增长。

与传统的磨料切割和雷射消熔相比，雷射隐形切割具有更好的划线品质和更高的效率，并且可以实现不规则形状晶片的切割，从而提高产量比率。凭藉这些优势，雷射隐形切割已成为主流的晶圆划线技术，也是MEMS装置晶片製造中不可或缺的技术。

本报告旨在对全球 SiC 晶圆雷射切割设备市场按地区/国家、类型和应用进行全面分析，重点关注总销售量、收入、价格、市场份额和主要企业的排名。

本报告以销售量（台）和收入（百万美元）为单位，提供碳化硅晶圆雷射切割设备的市场规模、估算和预测，以2024年为基准年，并包含2020年至2031年的历史数据和预测数据。透过定量和定性分析，我们帮助读者制定业务/成长策略，评估市场竞争，分析自身在当前市场中的地位，并就碳化硅晶圆雷射切割设备做出明智的商业决策。

市场区隔

公司

  • DISCO Corporation
  • Suzhou Delphi Laser Co
  • Han's Laser Technology
  • 3D-Micromac
  • Synova SA
  • HGTECH
  • ASMPT
  • GHN.GIE
  • Wuhan DR Laser Technology

按类型分類的细分市场

  • 加工尺寸小于 6 英寸
  • 加工尺寸小于 8 英寸

应用领域

  • 晶圆代工厂
  • IDM

按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 东南亚
    • 印度
    • 澳洲
    • 亚太其他地区
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 北欧国家
    • 其他欧洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 土耳其
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他中东和非洲地区

The global market for SiC Wafer Laser Cutting Equipment was estimated to be worth US$ 138 million in 2024 and is forecast to a readjusted size of US$ 381 million by 2031 with a CAGR of 15.8% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on SiC Wafer Laser Cutting Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

In 2024, global SiC Wafer Laser Cutting Equipment production reached 242 units, with an average global market price of around US$ 578,000 per unit.

Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. About midway through the 20th century, SiC wafer uses grew to include in LED technology. Since then, it has expanded into numerous semiconductor applications due to its advantageous physical properties. These properties are apparent in its wide range of uses in and outside the semiconductor industry. With Moore's Law appearing to reach it's limit, many companies within the semiconductor industry is looking towards silicon carbide as the semiconductor material of the future.

There are numerous advantages to using silicon carbide over more traditional silicon substrates. One of the major advantages is its hardness. This gives the material many advantages, in high speed, high temperature and/or high voltage applications.

Silicon carbide wafers have high thermal conductivity, which means they can transfer heat from one point to another well. This improves its electrical conductivity and ultimately miniaturization, one of the common goals of switching to SiC wafers.

Silicon carbide substrates also have a low coefficient for thermal expansion. Thermal expansion is the amount and direction a material expands or contracts as it heats up or cools down. The most common explanation is ice, although it behaves opposite of most metals, expanding as it cools and shrinking as it heats up. Silicon carbide's low coefficient for thermal expansion means that it does not change significantly in size or shape as it is heated up or cooled down, which makes it perfect for fitting into small devices and packing more transistors onto a single chip.

SiC has the similar hardness as the diamond. Hence dicing the SiC by diamond blade will produce defects of chipping and crack which will induce the current leakage that can't meet the strict demand of automobile applications.

The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.

Judging from the compound annual growth rate in the past ten years, the demand for packaging and testing equipment in developing countries is more vigorous. Due to the current shortage of chips in the chip market, the packaging and testing industry is seeking capital expansion and actively expanding production capacity. As the penetration rate of silicon carbide devices in new energy vehicles, energy, industry, communications and other fields increases, the market demand for silicon carbide laser cutting.

Compared with the traditional grinding wheel cutting and laser ablation, the laser stealth cutting method has better scribing quality and high scribing efficiency, and can realize irregular-shaped chip dicing, which improves the wafer output rate. These advantages make laser stealth dicing become the mainstream of wafer scribing technology, and even an indispensable technology for MEMS device chip manufacturing.

This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Cutting Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of SiC Wafer Laser Cutting Equipment by region & country, by Type, and by Application.

The SiC Wafer Laser Cutting Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Cutting Equipment.

Market Segmentation

By Company

  • DISCO Corporation
  • Suzhou Delphi Laser Co
  • Han's Laser Technology
  • 3D-Micromac
  • Synova S.A.
  • HGTECH
  • ASMPT
  • GHN.GIE
  • Wuhan DR Laser Technology

Segment by Type

  • Processing Sizes up to 6 Inches
  • Processing Sizes up to 8 Inches

Segment by Application

  • Foundry
  • IDM

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of SiC Wafer Laser Cutting Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of SiC Wafer Laser Cutting Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 SiC Wafer Laser Cutting Equipment Product Introduction
  • 1.2 Global SiC Wafer Laser Cutting Equipment Market Size Forecast
    • 1.2.1 Global SiC Wafer Laser Cutting Equipment Sales Value (2020-2031)
    • 1.2.2 Global SiC Wafer Laser Cutting Equipment Sales Volume (2020-2031)
    • 1.2.3 Global SiC Wafer Laser Cutting Equipment Sales Price (2020-2031)
  • 1.3 SiC Wafer Laser Cutting Equipment Market Trends & Drivers
    • 1.3.1 SiC Wafer Laser Cutting Equipment Industry Trends
    • 1.3.2 SiC Wafer Laser Cutting Equipment Market Drivers & Opportunity
    • 1.3.3 SiC Wafer Laser Cutting Equipment Market Challenges
    • 1.3.4 SiC Wafer Laser Cutting Equipment Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global SiC Wafer Laser Cutting Equipment Players Revenue Ranking (2024)
  • 2.2 Global SiC Wafer Laser Cutting Equipment Revenue by Company (2020-2025)
  • 2.3 Global SiC Wafer Laser Cutting Equipment Players Sales Volume Ranking (2024)
  • 2.4 Global SiC Wafer Laser Cutting Equipment Sales Volume by Company Players (2020-2025)
  • 2.5 Global SiC Wafer Laser Cutting Equipment Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers SiC Wafer Laser Cutting Equipment Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers SiC Wafer Laser Cutting Equipment Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of SiC Wafer Laser Cutting Equipment
  • 2.9 SiC Wafer Laser Cutting Equipment Market Competitive Analysis
    • 2.9.1 SiC Wafer Laser Cutting Equipment Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by SiC Wafer Laser Cutting Equipment Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiC Wafer Laser Cutting Equipment as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Processing Sizes up to 6 Inches
    • 3.1.2 Processing Sizes up to 8 Inches
  • 3.2 Global SiC Wafer Laser Cutting Equipment Sales Value by Type
    • 3.2.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global SiC Wafer Laser Cutting Equipment Sales Value, by Type (2020-2031)
    • 3.2.3 Global SiC Wafer Laser Cutting Equipment Sales Value, by Type (%) (2020-2031)
  • 3.3 Global SiC Wafer Laser Cutting Equipment Sales Volume by Type
    • 3.3.1 Global SiC Wafer Laser Cutting Equipment Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Type (2020-2031)
    • 3.3.3 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global SiC Wafer Laser Cutting Equipment Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Foundry
    • 4.1.2 IDM
  • 4.2 Global SiC Wafer Laser Cutting Equipment Sales Value by Application
    • 4.2.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global SiC Wafer Laser Cutting Equipment Sales Value, by Application (2020-2031)
    • 4.2.3 Global SiC Wafer Laser Cutting Equipment Sales Value, by Application (%) (2020-2031)
  • 4.3 Global SiC Wafer Laser Cutting Equipment Sales Volume by Application
    • 4.3.1 Global SiC Wafer Laser Cutting Equipment Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Application (2020-2031)
    • 4.3.3 Global SiC Wafer Laser Cutting Equipment Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global SiC Wafer Laser Cutting Equipment Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Region
    • 5.1.1 Global SiC Wafer Laser Cutting Equipment Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2020-2025)
    • 5.1.3 Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2026-2031)
    • 5.1.4 Global SiC Wafer Laser Cutting Equipment Sales Value by Region (%), (2020-2031)
  • 5.2 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region
    • 5.2.1 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2020-2025)
    • 5.2.3 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2026-2031)
    • 5.2.4 Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (%), (2020-2031)
  • 5.3 Global SiC Wafer Laser Cutting Equipment Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 5.4.2 North America SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 5.5.2 Europe SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 5.6.2 Asia Pacific SiC Wafer Laser Cutting Equipment Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 5.7.2 South America SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.3.2 United States SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.4.2 Europe SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.5.2 China SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.6.2 Japan SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.7.2 South Korea SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.8.2 Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India SiC Wafer Laser Cutting Equipment Sales Value, 2020-2031
    • 6.9.2 India SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India SiC Wafer Laser Cutting Equipment Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 DISCO Corporation
    • 7.1.1 DISCO Corporation Company Information
    • 7.1.2 DISCO Corporation Introduction and Business Overview
    • 7.1.3 DISCO Corporation SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 DISCO Corporation SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.1.5 DISCO Corporation Recent Development
  • 7.2 Suzhou Delphi Laser Co
    • 7.2.1 Suzhou Delphi Laser Co Company Information
    • 7.2.2 Suzhou Delphi Laser Co Introduction and Business Overview
    • 7.2.3 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.2.5 Suzhou Delphi Laser Co Recent Development
  • 7.3 Han's Laser Technology
    • 7.3.1 Han's Laser Technology Company Information
    • 7.3.2 Han's Laser Technology Introduction and Business Overview
    • 7.3.3 Han's Laser Technology SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 Han's Laser Technology SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.3.5 Han's Laser Technology Recent Development
  • 7.4 3D-Micromac
    • 7.4.1 3D-Micromac Company Information
    • 7.4.2 3D-Micromac Introduction and Business Overview
    • 7.4.3 3D-Micromac SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 3D-Micromac SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.4.5 3D-Micromac Recent Development
  • 7.5 Synova S.A.
    • 7.5.1 Synova S.A. Company Information
    • 7.5.2 Synova S.A. Introduction and Business Overview
    • 7.5.3 Synova S.A. SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 Synova S.A. SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.5.5 Synova S.A. Recent Development
  • 7.6 HGTECH
    • 7.6.1 HGTECH Company Information
    • 7.6.2 HGTECH Introduction and Business Overview
    • 7.6.3 HGTECH SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 HGTECH SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.6.5 HGTECH Recent Development
  • 7.7 ASMPT
    • 7.7.1 ASMPT Company Information
    • 7.7.2 ASMPT Introduction and Business Overview
    • 7.7.3 ASMPT SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 ASMPT SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.7.5 ASMPT Recent Development
  • 7.8 GHN.GIE
    • 7.8.1 GHN.GIE Company Information
    • 7.8.2 GHN.GIE Introduction and Business Overview
    • 7.8.3 GHN.GIE SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.8.4 GHN.GIE SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.8.5 GHN.GIE Recent Development
  • 7.9 Wuhan DR Laser Technology
    • 7.9.1 Wuhan DR Laser Technology Company Information
    • 7.9.2 Wuhan DR Laser Technology Introduction and Business Overview
    • 7.9.3 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.9.4 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Product Offerings
    • 7.9.5 Wuhan DR Laser Technology Recent Development

8 Industry Chain Analysis

  • 8.1 SiC Wafer Laser Cutting Equipment Industrial Chain
  • 8.2 SiC Wafer Laser Cutting Equipment Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 SiC Wafer Laser Cutting Equipment Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 SiC Wafer Laser Cutting Equipment Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer

List of Tables

  • Table 1. SiC Wafer Laser Cutting Equipment Market Trends
  • Table 2. SiC Wafer Laser Cutting Equipment Market Drivers & Opportunity
  • Table 3. SiC Wafer Laser Cutting Equipment Market Challenges
  • Table 4. SiC Wafer Laser Cutting Equipment Market Restraints
  • Table 5. Global SiC Wafer Laser Cutting Equipment Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global SiC Wafer Laser Cutting Equipment Revenue Market Share by Company (2020-2025)
  • Table 7. Global SiC Wafer Laser Cutting Equipment Sales Volume by Company (2020-2025) & (Units)
  • Table 8. Global SiC Wafer Laser Cutting Equipment Sales Volume Market Share by Company (2020-2025)
  • Table 9. Global Market SiC Wafer Laser Cutting Equipment Price by Company (2020-2025) & (US$/Unit)
  • Table 10. Key Manufacturers SiC Wafer Laser Cutting Equipment Manufacturing Base and Headquarters
  • Table 11. Key Manufacturers SiC Wafer Laser Cutting Equipment Product Type
  • Table 12. Key Manufacturers Time to Begin Mass Production of SiC Wafer Laser Cutting Equipment
  • Table 13. Global SiC Wafer Laser Cutting Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiC Wafer Laser Cutting Equipment as of 2024)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global SiC Wafer Laser Cutting Equipment Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global SiC Wafer Laser Cutting Equipment Sales Value by Type (2020-2025) & (US$ Million)
  • Table 18. Global SiC Wafer Laser Cutting Equipment Sales Value by Type (2026-2031) & (US$ Million)
  • Table 19. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Value by Type (2020-2025)
  • Table 20. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Value by Type (2026-2031)
  • Table 21. Global SiC Wafer Laser Cutting Equipment Sales Volume by Type: 2020 VS 2024 VS 2031 (Units)
  • Table 22. Global SiC Wafer Laser Cutting Equipment Sales Volume by Type (2020-2025) & (Units)
  • Table 23. Global SiC Wafer Laser Cutting Equipment Sales Volume by Type (2026-2031) & (Units)
  • Table 24. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Volume by Type (2020-2025)
  • Table 25. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Volume by Type (2026-2031)
  • Table 26. Global SiC Wafer Laser Cutting Equipment Price by Type (2020-2025) & (US$/Unit)
  • Table 27. Global SiC Wafer Laser Cutting Equipment Price by Type (2026-2031) & (US$/Unit)
  • Table 28. Global SiC Wafer Laser Cutting Equipment Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 29. Global SiC Wafer Laser Cutting Equipment Sales Value by Application (2020-2025) & (US$ Million)
  • Table 30. Global SiC Wafer Laser Cutting Equipment Sales Value by Application (2026-2031) & (US$ Million)
  • Table 31. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Value by Application (2020-2025)
  • Table 32. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Value by Application (2026-2031)
  • Table 33. Global SiC Wafer Laser Cutting Equipment Sales Volume by Application: 2020 VS 2024 VS 2031 (Units)
  • Table 34. Global SiC Wafer Laser Cutting Equipment Sales Volume by Application (2020-2025) & (Units)
  • Table 35. Global SiC Wafer Laser Cutting Equipment Sales Volume by Application (2026-2031) & (Units)
  • Table 36. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Volume by Application (2020-2025)
  • Table 37. Global SiC Wafer Laser Cutting Equipment Sales Market Share in Volume by Application (2026-2031)
  • Table 38. Global SiC Wafer Laser Cutting Equipment Price by Application (2020-2025) & (US$/Unit)
  • Table 39. Global SiC Wafer Laser Cutting Equipment Price by Application (2026-2031) & (US$/Unit)
  • Table 40. Global SiC Wafer Laser Cutting Equipment Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 41. Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2020-2025) & (US$ Million)
  • Table 42. Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2026-2031) & (US$ Million)
  • Table 43. Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2020-2025) & (%)
  • Table 44. Global SiC Wafer Laser Cutting Equipment Sales Value by Region (2026-2031) & (%)
  • Table 45. Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (Units): 2020 VS 2024 VS 2031
  • Table 46. Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2020-2025) & (Units)
  • Table 47. Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2026-2031) & (Units)
  • Table 48. Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2020-2025) & (%)
  • Table 49. Global SiC Wafer Laser Cutting Equipment Sales Volume by Region (2026-2031) & (%)
  • Table 50. Global SiC Wafer Laser Cutting Equipment Average Price by Region (2020-2025) & (US$/Unit)
  • Table 51. Global SiC Wafer Laser Cutting Equipment Average Price by Region (2026-2031) & (US$/Unit)
  • Table 52. Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 53. Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value, (2020-2025) & (US$ Million)
  • Table 54. Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value, (2026-2031) & (US$ Million)
  • Table 55. Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Volume, (2020-2025) & (Units)
  • Table 56. Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Volume, (2026-2031) & (Units)
  • Table 57. DISCO Corporation Company Information
  • Table 58. DISCO Corporation Introduction and Business Overview
  • Table 59. DISCO Corporation SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 60. DISCO Corporation SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 61. DISCO Corporation Recent Development
  • Table 62. Suzhou Delphi Laser Co Company Information
  • Table 63. Suzhou Delphi Laser Co Introduction and Business Overview
  • Table 64. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 65. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 66. Suzhou Delphi Laser Co Recent Development
  • Table 67. Han's Laser Technology Company Information
  • Table 68. Han's Laser Technology Introduction and Business Overview
  • Table 69. Han's Laser Technology SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 70. Han's Laser Technology SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 71. Han's Laser Technology Recent Development
  • Table 72. 3D-Micromac Company Information
  • Table 73. 3D-Micromac Introduction and Business Overview
  • Table 74. 3D-Micromac SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 75. 3D-Micromac SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 76. 3D-Micromac Recent Development
  • Table 77. Synova S.A. Company Information
  • Table 78. Synova S.A. Introduction and Business Overview
  • Table 79. Synova S.A. SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 80. Synova S.A. SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 81. Synova S.A. Recent Development
  • Table 82. HGTECH Company Information
  • Table 83. HGTECH Introduction and Business Overview
  • Table 84. HGTECH SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 85. HGTECH SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 86. HGTECH Recent Development
  • Table 87. ASMPT Company Information
  • Table 88. ASMPT Introduction and Business Overview
  • Table 89. ASMPT SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 90. ASMPT SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 91. ASMPT Recent Development
  • Table 92. GHN.GIE Company Information
  • Table 93. GHN.GIE Introduction and Business Overview
  • Table 94. GHN.GIE SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 95. GHN.GIE SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 96. GHN.GIE Recent Development
  • Table 97. Wuhan DR Laser Technology Company Information
  • Table 98. Wuhan DR Laser Technology Introduction and Business Overview
  • Table 99. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
  • Table 100. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Product Offerings
  • Table 101. Wuhan DR Laser Technology Recent Development
  • Table 102. Key Raw Materials Lists
  • Table 103. Raw Materials Key Suppliers Lists
  • Table 104. SiC Wafer Laser Cutting Equipment Downstream Customers
  • Table 105. SiC Wafer Laser Cutting Equipment Distributors List
  • Table 106. Research Programs/Design for This Report
  • Table 107. Key Data Information from Secondary Sources
  • Table 108. Key Data Information from Primary Sources

List of Figures

  • Figure 1. SiC Wafer Laser Cutting Equipment Product Picture
  • Figure 2. Global SiC Wafer Laser Cutting Equipment Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global SiC Wafer Laser Cutting Equipment Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Global SiC Wafer Laser Cutting Equipment Sales Volume (2020-2031) & (Units)
  • Figure 5. Global SiC Wafer Laser Cutting Equipment Sales Price (2020-2031) & (US$/Unit)
  • Figure 6. SiC Wafer Laser Cutting Equipment Report Years Considered
  • Figure 7. Global SiC Wafer Laser Cutting Equipment Players Revenue Ranking (2024) & (US$ Million)
  • Figure 8. Global SiC Wafer Laser Cutting Equipment Players Sales Volume Ranking (2024) & (Units)
  • Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by SiC Wafer Laser Cutting Equipment Revenue in 2024
  • Figure 10. SiC Wafer Laser Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 11. Processing Sizes up to 6 Inches Picture
  • Figure 12. Processing Sizes up to 8 Inches Picture
  • Figure 13. Global SiC Wafer Laser Cutting Equipment Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 14. Global SiC Wafer Laser Cutting Equipment Sales Value Market Share by Type, 2024 & 2031
  • Figure 15. Global SiC Wafer Laser Cutting Equipment Sales Volume by Type (2020 VS 2024 VS 2031) & (Units)
  • Figure 16. Global SiC Wafer Laser Cutting Equipment Sales Volume Market Share by Type, 2024 & 2031
  • Figure 17. Global SiC Wafer Laser Cutting Equipment Price by Type (2020-2031) & (US$/Unit)
  • Figure 18. Product Picture of Foundry
  • Figure 19. Product Picture of IDM
  • Figure 20. Global SiC Wafer Laser Cutting Equipment Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 21. Global SiC Wafer Laser Cutting Equipment Sales Value Market Share by Application, 2024 & 2031
  • Figure 22. Global SiC Wafer Laser Cutting Equipment Sales Volume by Application (2020 VS 2024 VS 2031) & (Units)
  • Figure 23. Global SiC Wafer Laser Cutting Equipment Sales Volume Market Share by Application, 2024 & 2031
  • Figure 24. Global SiC Wafer Laser Cutting Equipment Price by Application (2020-2031) & (US$/Unit)
  • Figure 25. North America SiC Wafer Laser Cutting Equipment Sales Value (2020-2031) & (US$ Million)
  • Figure 26. North America SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
  • Figure 27. Europe SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 28. Europe SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
  • Figure 29. Asia Pacific SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 30. Asia Pacific SiC Wafer Laser Cutting Equipment Sales Value by Region (%), 2024 VS 2031
  • Figure 31. South America SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 32. South America SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
  • Figure 33. Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 34. Middle East & Africa SiC Wafer Laser Cutting Equipment Sales Value by Country (%), 2024 VS 2031
  • Figure 35. Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Value (%), (2020-2031)
  • Figure 36. Key Countries/Regions SiC Wafer Laser Cutting Equipment Sales Volume (%), (2020-2031)
  • Figure 37. United States SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 38. United States SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • Figure 39. United States SiC Wafer Laser Cutting Equipment Sales Value by Application (%), 2024 VS 2031
  • Figure 40. Europe SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 41. Europe SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • Figure 42. Europe SiC Wafer Laser Cutting Equipment Sales Value by Application (%), 2024 VS 2031
  • Figure 43. China SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 44. China SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • Figure 45. China SiC Wafer Laser Cutting Equipment Sales Value by Application (%), 2024 VS 2031
  • Figure 46. Japan SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 47. Japan SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • Figure 48. Japan SiC Wafer Laser Cutting Equipment Sales Value by Application (%), 2024 VS 2031
  • Figure 49. South Korea SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 50. South Korea SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • Figure 51. South Korea SiC Wafer Laser Cutting Equipment Sales Value by Application (%), 2024 VS 2031
  • Figure 52. Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 53. Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • Figure 54. Southeast Asia SiC Wafer Laser Cutting Equipment Sales Value by Application (%), 2024 VS 2031
  • Figure 55. India SiC Wafer Laser Cutting Equipment Sales Value, (2020-2031) & (US$ Million)
  • Figure 56. India SiC Wafer Laser Cutting Equipment Sales Value by Type (%), 2024 VS 2031
  • Figure 57. India SiC Wafer Laser Cutting Equipment Sales Value by Application (%), 2024 VS 2031
  • Figure 58. SiC Wafer Laser Cutting Equipment Industrial Chain
  • Figure 59. SiC Wafer Laser Cutting Equipment Manufacturing Cost Structure
  • Figure 60. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 61. Bottom-up and Top-down Approaches for This Report
  • Figure 62. Data Triangulation
  • Figure 63. Key Executives Interviewed