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市场调查报告书
商品编码
1873354

半导体封装设备：全球市占率及排名、总收入及需求预测（2025-2031年）

Semiconductor Molding Systems - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 118 Pages | 商品交期: 2-3个工作天内

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2024 年全球半导体封装设备市场规模估计为 4.26 亿美元，预计到 2031 年将达到 6.53 亿美元，在预测期（2025-2031 年）内复合年增长率为 6.6%。

本报告对近期半导体模塑设备的关税调整和国际战略反制措施进行了全面评估，包括跨境产业布局、资本配置模式、区域经济相互依存以及供应链重组。

半导体製造製程包括晶圆製造、晶圆测试、晶片封装和测试。封装是指在製造和加工完成后，对晶圆进行切割、焊线、模塑、修整和成型等工序，使积体电路能够与外部设备进行电气和讯号连接，同时为积体电路提供物理和化学保护。模塑是指将封装材料（例如环氧树脂混合物）在指定温度和压力下注入模腔，封装待保护装置（例如晶片）并使其固化形成整体的塑胶成型製程。

模塑部件在半导体封装中的作用是：

1. 保护。虽然裸露的半导体晶片在严格的环境控制下不会发生故障，但日常环境根本无法提供必要的环境控制。因此，晶片需要透过封装进行保护。

2. 支撑作用。支撑结构有两个功能。一是支撑晶片，即固定晶片并方便电路连接。二是形成一定的形状，在封装完成后支撑整个装置，降低装置整体受损的风险。

3. 连接功能。连接功能负责将晶片的电极连接到外部电路。引脚用于连接外部电路，金线将引脚连接到晶片的内部电路。载基板承载晶片，环氧树脂粘合剂将晶片固定在载基板上。引脚支撑整个装置，塑胶封装用于固定和保护装置。

4. 确保可靠性：每种包装都需要一定程度的可靠性，这是整个包装过程中最重要的指标。

半导体封装设备在半导体製造过程中发挥着至关重要的作用，尤其是在塑胶封装过程中，它能确保晶片保护、与外部电路基板的稳定电气连接以及提高机械稳定性。

塑胶封装是将封装材料（例如环氧树脂混合物）在指定的封装和压力下注入模腔，封装晶片或其他需要保护的装置，然后固化塑胶形成一个整体的过程。

半导体塑胶封装机的自动化程度决定了包括人事费用和封装材料成本在内的整体封装成本。不同产品之间的价格差异显着，主要取决于压机的数量。压机越多，价格越高。从全球生产区域来看，半导体塑胶封装系统的生产集中在日本和中国，其中日本占了大部分市场份额。国产塑胶封装机在产品性能和封装技术方面仍落后于国际主要企业（如东和工业株式会社）。然而，近年来中国企业在产品研发技术方面不断取得突破，一些企业，例如安徽海仪三一科技有限公司，已在高端封装市场占据了一定的市场份额。

本报告旨在按地区/国家、类型和应用对全球半导体封装设备市场进行全面分析，重点关注总销售量、收入、价格、市场份额和主要企业的排名。

本报告以销售量（台）和收入（百万美元）为指标，对半导体封装设备市场规模、估值和预测进行了呈现，以2024年为基准年，并涵盖了2020年至2031年的历史数据和预测数据。定量和定性分析将帮助读者制定半导体封装系统业务和成长策略，评估市场竞争，分析自身在当前市场中的地位，并做出明智的商业决策。

市场区隔

公司

  • Towa
  • Besi
  • ASMPT
  • I-PEX Inc
  • HIIG Trinity（Anhui）Technology
  • Shanghai Xinsheng
  • Mtex Matsumura
  • Asahi Engineering
  • Nextool Technology Co., Ltd.
  • APIC YAMADA
  • Suzhou Bopai Semiconductor（Boschman）
  • Suzhou Saiken Intelligent Technology
  • Jiangsu Guoxin Intelligent Equipment Co., Ltd
  • Dongguan Huayue Semiconductor Technology

按类型分類的细分市场

  • 全自动成型系统
  • 半自动成型系统
  • 手动成型系统

应用领域

  • 先进包装
  • 传统包装

按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 东南亚
    • 印度
    • 澳洲
    • 亚太其他地区
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 北欧国家
    • 其他欧洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 土耳其
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他中东和非洲地区

The global market for Semiconductor Molding Systems was estimated to be worth US$ 426 million in 2024 and is forecast to a readjusted size of US$ 653 million by 2031 with a CAGR of 6.6% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Semiconductor Molding Systems cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Packaging refers to cutting, wire bonding, molding, trim & forming the wafer after production and processing, so that the integrated circuit can achieve electrical and signal connections with external devices while providing physical and chemical protection for the integrated circuit. Molding refers to a plastic molding process in which packaging materials such as epoxy resin mixture are injected into the mold cavity at a certain temperature and pressure, and the devices that need to be protected, such as chips, are wrapped in the plastic, and then solidified into a whole body.

The roles of Molding products in semiconductor packaging are as follows:

1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging.

2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged.

3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it.

4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.

Semiconductor packaging equipment plays a vital role in the semiconductor manufacturing process, especially in the plastic encapsulation process, which ensures that the chip is protected, the electrical connection with the external circuit board is stable, and the mechanical stability is enhanced.

Plastic encapsulation refers to the process of injecting encapsulation materials (such as epoxy resin mixtures) into the mold cavity at a certain temperature and pressure, wrapping the chip and other devices that need to be protected in the plastic encapsulation material, and then curing them into a whole.

The degree of automation of semiconductor plastic encapsulation machines determines the cost of the entire encapsulation process, such as labor costs, packaging raw material costs, etc. The price difference between different products is very large, mainly depending on the number of presses. The more presses, the more expensive the price. In various regions of the world, the production areas of semiconductor plastic encapsulation systems are mainly distributed in Japan and China, with Japan occupying most of the market share. There is still a certain gap between Chinese plastic encapsulation machines and international leading companies (such as TOWA) in terms of product performance and packaging technology. However, as Chinese companies have made continuous breakthroughs in product development technology in recent years, some companies have also occupied a certain market share in the advanced packaging market, such as HIIG Trinity (Anhui) Technology.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Molding Systems, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Molding Systems by region & country, by Type, and by Application.

The Semiconductor Molding Systems market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Molding Systems.

Market Segmentation

By Company

  • Towa
  • Besi
  • ASMPT
  • I-PEX Inc
  • HIIG Trinity (Anhui) Technology
  • Shanghai Xinsheng
  • Mtex Matsumura
  • Asahi Engineering
  • Nextool Technology Co., Ltd.
  • APIC YAMADA
  • Suzhou Bopai Semiconductor (Boschman)
  • Suzhou Saiken Intelligent Technology
  • Jiangsu Guoxin Intelligent Equipment Co., Ltd
  • Dongguan Huayue Semiconductor Technology

Segment by Type

  • Fully Automatic Molding System
  • Semi-automatic Molding System
  • Manual Molding System

Segment by Application

  • Advanced Packaging
  • Traditional Packaging

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Semiconductor Molding Systems manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Semiconductor Molding Systems in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Semiconductor Molding Systems in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Semiconductor Molding Systems Product Introduction
  • 1.2 Global Semiconductor Molding Systems Market Size Forecast
    • 1.2.1 Global Semiconductor Molding Systems Sales Value (2020-2031)
    • 1.2.2 Global Semiconductor Molding Systems Sales Volume (2020-2031)
    • 1.2.3 Global Semiconductor Molding Systems Sales Price (2020-2031)
  • 1.3 Semiconductor Molding Systems Market Trends & Drivers
    • 1.3.1 Semiconductor Molding Systems Industry Trends
    • 1.3.2 Semiconductor Molding Systems Market Drivers & Opportunity
    • 1.3.3 Semiconductor Molding Systems Market Challenges
    • 1.3.4 Semiconductor Molding Systems Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Semiconductor Molding Systems Players Revenue Ranking (2024)
  • 2.2 Global Semiconductor Molding Systems Revenue by Company (2020-2025)
  • 2.3 Global Semiconductor Molding Systems Players Sales Volume Ranking (2024)
  • 2.4 Global Semiconductor Molding Systems Sales Volume by Company Players (2020-2025)
  • 2.5 Global Semiconductor Molding Systems Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Semiconductor Molding Systems Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Semiconductor Molding Systems Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor Molding Systems
  • 2.9 Semiconductor Molding Systems Market Competitive Analysis
    • 2.9.1 Semiconductor Molding Systems Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Molding Systems Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Molding Systems as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Fully Automatic Molding System
    • 3.1.2 Semi-automatic Molding System
    • 3.1.3 Manual Molding System
  • 3.2 Global Semiconductor Molding Systems Sales Value by Type
    • 3.2.1 Global Semiconductor Molding Systems Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Semiconductor Molding Systems Sales Value, by Type (2020-2031)
    • 3.2.3 Global Semiconductor Molding Systems Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Semiconductor Molding Systems Sales Volume by Type
    • 3.3.1 Global Semiconductor Molding Systems Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Semiconductor Molding Systems Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Semiconductor Molding Systems Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Semiconductor Molding Systems Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Advanced Packaging
    • 4.1.2 Traditional Packaging
  • 4.2 Global Semiconductor Molding Systems Sales Value by Application
    • 4.2.1 Global Semiconductor Molding Systems Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Semiconductor Molding Systems Sales Value, by Application (2020-2031)
    • 4.2.3 Global Semiconductor Molding Systems Sales Value, by Application (%) (2020-2031)
  • 4.3 Global Semiconductor Molding Systems Sales Volume by Application
    • 4.3.1 Global Semiconductor Molding Systems Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global Semiconductor Molding Systems Sales Volume, by Application (2020-2031)
    • 4.3.3 Global Semiconductor Molding Systems Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global Semiconductor Molding Systems Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global Semiconductor Molding Systems Sales Value by Region
    • 5.1.1 Global Semiconductor Molding Systems Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Semiconductor Molding Systems Sales Value by Region (2020-2025)
    • 5.1.3 Global Semiconductor Molding Systems Sales Value by Region (2026-2031)
    • 5.1.4 Global Semiconductor Molding Systems Sales Value by Region (%), (2020-2031)
  • 5.2 Global Semiconductor Molding Systems Sales Volume by Region
    • 5.2.1 Global Semiconductor Molding Systems Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global Semiconductor Molding Systems Sales Volume by Region (2020-2025)
    • 5.2.3 Global Semiconductor Molding Systems Sales Volume by Region (2026-2031)
    • 5.2.4 Global Semiconductor Molding Systems Sales Volume by Region (%), (2020-2031)
  • 5.3 Global Semiconductor Molding Systems Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America Semiconductor Molding Systems Sales Value, 2020-2031
    • 5.4.2 North America Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe Semiconductor Molding Systems Sales Value, 2020-2031
    • 5.5.2 Europe Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific Semiconductor Molding Systems Sales Value, 2020-2031
    • 5.6.2 Asia Pacific Semiconductor Molding Systems Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America Semiconductor Molding Systems Sales Value, 2020-2031
    • 5.7.2 South America Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa Semiconductor Molding Systems Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Semiconductor Molding Systems Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Semiconductor Molding Systems Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions Semiconductor Molding Systems Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.3.2 United States Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.4.2 Europe Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.5.2 China Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.6.2 Japan Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.7.2 South Korea Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Semiconductor Molding Systems Sales Value, 2020-2031
    • 6.9.2 India Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Semiconductor Molding Systems Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 Towa
    • 7.1.1 Towa Company Information
    • 7.1.2 Towa Introduction and Business Overview
    • 7.1.3 Towa Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 Towa Semiconductor Molding Systems Product Offerings
    • 7.1.5 Towa Recent Development
  • 7.2 Besi
    • 7.2.1 Besi Company Information
    • 7.2.2 Besi Introduction and Business Overview
    • 7.2.3 Besi Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 Besi Semiconductor Molding Systems Product Offerings
    • 7.2.5 Besi Recent Development
  • 7.3 ASMPT
    • 7.3.1 ASMPT Company Information
    • 7.3.2 ASMPT Introduction and Business Overview
    • 7.3.3 ASMPT Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 ASMPT Semiconductor Molding Systems Product Offerings
    • 7.3.5 ASMPT Recent Development
  • 7.4 I-PEX Inc
    • 7.4.1 I-PEX Inc Company Information
    • 7.4.2 I-PEX Inc Introduction and Business Overview
    • 7.4.3 I-PEX Inc Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.4.4 I-PEX Inc Semiconductor Molding Systems Product Offerings
    • 7.4.5 I-PEX Inc Recent Development
  • 7.5 HIIG Trinity (Anhui) Technology
    • 7.5.1 HIIG Trinity (Anhui) Technology Company Information
    • 7.5.2 HIIG Trinity (Anhui) Technology Introduction and Business Overview
    • 7.5.3 HIIG Trinity (Anhui) Technology Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.5.4 HIIG Trinity (Anhui) Technology Semiconductor Molding Systems Product Offerings
    • 7.5.5 HIIG Trinity (Anhui) Technology Recent Development
  • 7.6 Shanghai Xinsheng
    • 7.6.1 Shanghai Xinsheng Company Information
    • 7.6.2 Shanghai Xinsheng Introduction and Business Overview
    • 7.6.3 Shanghai Xinsheng Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.6.4 Shanghai Xinsheng Semiconductor Molding Systems Product Offerings
    • 7.6.5 Shanghai Xinsheng Recent Development
  • 7.7 Mtex Matsumura
    • 7.7.1 Mtex Matsumura Company Information
    • 7.7.2 Mtex Matsumura Introduction and Business Overview
    • 7.7.3 Mtex Matsumura Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.7.4 Mtex Matsumura Semiconductor Molding Systems Product Offerings
    • 7.7.5 Mtex Matsumura Recent Development
  • 7.8 Asahi Engineering
    • 7.8.1 Asahi Engineering Company Information
    • 7.8.2 Asahi Engineering Introduction and Business Overview
    • 7.8.3 Asahi Engineering Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.8.4 Asahi Engineering Semiconductor Molding Systems Product Offerings
    • 7.8.5 Asahi Engineering Recent Development
  • 7.9 Nextool Technology Co., Ltd.
    • 7.9.1 Nextool Technology Co., Ltd. Company Information
    • 7.9.2 Nextool Technology Co., Ltd. Introduction and Business Overview
    • 7.9.3 Nextool Technology Co., Ltd. Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.9.4 Nextool Technology Co., Ltd. Semiconductor Molding Systems Product Offerings
    • 7.9.5 Nextool Technology Co., Ltd. Recent Development
  • 7.10 APIC YAMADA
    • 7.10.1 APIC YAMADA Company Information
    • 7.10.2 APIC YAMADA Introduction and Business Overview
    • 7.10.3 APIC YAMADA Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.10.4 APIC YAMADA Semiconductor Molding Systems Product Offerings
    • 7.10.5 APIC YAMADA Recent Development
  • 7.11 Suzhou Bopai Semiconductor (Boschman)
    • 7.11.1 Suzhou Bopai Semiconductor (Boschman) Company Information
    • 7.11.2 Suzhou Bopai Semiconductor (Boschman) Introduction and Business Overview
    • 7.11.3 Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.11.4 Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Product Offerings
    • 7.11.5 Suzhou Bopai Semiconductor (Boschman) Recent Development
  • 7.12 Suzhou Saiken Intelligent Technology
    • 7.12.1 Suzhou Saiken Intelligent Technology Company Information
    • 7.12.2 Suzhou Saiken Intelligent Technology Introduction and Business Overview
    • 7.12.3 Suzhou Saiken Intelligent Technology Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.12.4 Suzhou Saiken Intelligent Technology Semiconductor Molding Systems Product Offerings
    • 7.12.5 Suzhou Saiken Intelligent Technology Recent Development
  • 7.13 Jiangsu Guoxin Intelligent Equipment Co., Ltd
    • 7.13.1 Jiangsu Guoxin Intelligent Equipment Co., Ltd Company Information
    • 7.13.2 Jiangsu Guoxin Intelligent Equipment Co., Ltd Introduction and Business Overview
    • 7.13.3 Jiangsu Guoxin Intelligent Equipment Co., Ltd Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.13.4 Jiangsu Guoxin Intelligent Equipment Co., Ltd Semiconductor Molding Systems Product Offerings
    • 7.13.5 Jiangsu Guoxin Intelligent Equipment Co., Ltd Recent Development
  • 7.14 Dongguan Huayue Semiconductor Technology
    • 7.14.1 Dongguan Huayue Semiconductor Technology Company Information
    • 7.14.2 Dongguan Huayue Semiconductor Technology Introduction and Business Overview
    • 7.14.3 Dongguan Huayue Semiconductor Technology Semiconductor Molding Systems Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.14.4 Dongguan Huayue Semiconductor Technology Semiconductor Molding Systems Product Offerings
    • 7.14.5 Dongguan Huayue Semiconductor Technology Recent Development

8 Industry Chain Analysis

  • 8.1 Semiconductor Molding Systems Industrial Chain
  • 8.2 Semiconductor Molding Systems Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Semiconductor Molding Systems Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Semiconductor Molding Systems Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer

List of Tables

  • Table 1. Semiconductor Molding Systems Market Trends
  • Table 2. Semiconductor Molding Systems Market Drivers & Opportunity
  • Table 3. Semiconductor Molding Systems Market Challenges
  • Table 4. Semiconductor Molding Systems Market Restraints
  • Table 5. Global Semiconductor Molding Systems Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global Semiconductor Molding Systems Revenue Market Share by Company (2020-2025)
  • Table 7. Global Semiconductor Molding Systems Sales Volume by Company (2020-2025) & (Units)
  • Table 8. Global Semiconductor Molding Systems Sales Volume Market Share by Company (2020-2025)
  • Table 9. Global Market Semiconductor Molding Systems Price by Company (2020-2025) & (K US$/Unit)
  • Table 10. Key Manufacturers Semiconductor Molding Systems Manufacturing Base and Headquarters
  • Table 11. Key Manufacturers Semiconductor Molding Systems Product Type
  • Table 12. Key Manufacturers Time to Begin Mass Production of Semiconductor Molding Systems
  • Table 13. Global Semiconductor Molding Systems Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Molding Systems as of 2024)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global Semiconductor Molding Systems Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global Semiconductor Molding Systems Sales Value by Type (2020-2025) & (US$ Million)
  • Table 18. Global Semiconductor Molding Systems Sales Value by Type (2026-2031) & (US$ Million)
  • Table 19. Global Semiconductor Molding Systems Sales Market Share in Value by Type (2020-2025)
  • Table 20. Global Semiconductor Molding Systems Sales Market Share in Value by Type (2026-2031)
  • Table 21. Global Semiconductor Molding Systems Sales Volume by Type: 2020 VS 2024 VS 2031 (Units)
  • Table 22. Global Semiconductor Molding Systems Sales Volume by Type (2020-2025) & (Units)
  • Table 23. Global Semiconductor Molding Systems Sales Volume by Type (2026-2031) & (Units)
  • Table 24. Global Semiconductor Molding Systems Sales Market Share in Volume by Type (2020-2025)
  • Table 25. Global Semiconductor Molding Systems Sales Market Share in Volume by Type (2026-2031)
  • Table 26. Global Semiconductor Molding Systems Price by Type (2020-2025) & (K US$/Unit)
  • Table 27. Global Semiconductor Molding Systems Price by Type (2026-2031) & (K US$/Unit)
  • Table 28. Global Semiconductor Molding Systems Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 29. Global Semiconductor Molding Systems Sales Value by Application (2020-2025) & (US$ Million)
  • Table 30. Global Semiconductor Molding Systems Sales Value by Application (2026-2031) & (US$ Million)
  • Table 31. Global Semiconductor Molding Systems Sales Market Share in Value by Application (2020-2025)
  • Table 32. Global Semiconductor Molding Systems Sales Market Share in Value by Application (2026-2031)
  • Table 33. Global Semiconductor Molding Systems Sales Volume by Application: 2020 VS 2024 VS 2031 (Units)
  • Table 34. Global Semiconductor Molding Systems Sales Volume by Application (2020-2025) & (Units)
  • Table 35. Global Semiconductor Molding Systems Sales Volume by Application (2026-2031) & (Units)
  • Table 36. Global Semiconductor Molding Systems Sales Market Share in Volume by Application (2020-2025)
  • Table 37. Global Semiconductor Molding Systems Sales Market Share in Volume by Application (2026-2031)
  • Table 38. Global Semiconductor Molding Systems Price by Application (2020-2025) & (K US$/Unit)
  • Table 39. Global Semiconductor Molding Systems Price by Application (2026-2031) & (K US$/Unit)
  • Table 40. Global Semiconductor Molding Systems Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 41. Global Semiconductor Molding Systems Sales Value by Region (2020-2025) & (US$ Million)
  • Table 42. Global Semiconductor Molding Systems Sales Value by Region (2026-2031) & (US$ Million)
  • Table 43. Global Semiconductor Molding Systems Sales Value by Region (2020-2025) & (%)
  • Table 44. Global Semiconductor Molding Systems Sales Value by Region (2026-2031) & (%)
  • Table 45. Global Semiconductor Molding Systems Sales Volume by Region (Units): 2020 VS 2024 VS 2031
  • Table 46. Global Semiconductor Molding Systems Sales Volume by Region (2020-2025) & (Units)
  • Table 47. Global Semiconductor Molding Systems Sales Volume by Region (2026-2031) & (Units)
  • Table 48. Global Semiconductor Molding Systems Sales Volume by Region (2020-2025) & (%)
  • Table 49. Global Semiconductor Molding Systems Sales Volume by Region (2026-2031) & (%)
  • Table 50. Global Semiconductor Molding Systems Average Price by Region (2020-2025) & (K US$/Unit)
  • Table 51. Global Semiconductor Molding Systems Average Price by Region (2026-2031) & (K US$/Unit)
  • Table 52. Key Countries/Regions Semiconductor Molding Systems Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 53. Key Countries/Regions Semiconductor Molding Systems Sales Value, (2020-2025) & (US$ Million)
  • Table 54. Key Countries/Regions Semiconductor Molding Systems Sales Value, (2026-2031) & (US$ Million)
  • Table 55. Key Countries/Regions Semiconductor Molding Systems Sales Volume, (2020-2025) & (Units)
  • Table 56. Key Countries/Regions Semiconductor Molding Systems Sales Volume, (2026-2031) & (Units)
  • Table 57. Towa Company Information
  • Table 58. Towa Introduction and Business Overview
  • Table 59. Towa Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 60. Towa Semiconductor Molding Systems Product Offerings
  • Table 61. Towa Recent Development
  • Table 62. Besi Company Information
  • Table 63. Besi Introduction and Business Overview
  • Table 64. Besi Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 65. Besi Semiconductor Molding Systems Product Offerings
  • Table 66. Besi Recent Development
  • Table 67. ASMPT Company Information
  • Table 68. ASMPT Introduction and Business Overview
  • Table 69. ASMPT Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 70. ASMPT Semiconductor Molding Systems Product Offerings
  • Table 71. ASMPT Recent Development
  • Table 72. I-PEX Inc Company Information
  • Table 73. I-PEX Inc Introduction and Business Overview
  • Table 74. I-PEX Inc Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 75. I-PEX Inc Semiconductor Molding Systems Product Offerings
  • Table 76. I-PEX Inc Recent Development
  • Table 77. HIIG Trinity (Anhui) Technology Company Information
  • Table 78. HIIG Trinity (Anhui) Technology Introduction and Business Overview
  • Table 79. HIIG Trinity (Anhui) Technology Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 80. HIIG Trinity (Anhui) Technology Semiconductor Molding Systems Product Offerings
  • Table 81. HIIG Trinity (Anhui) Technology Recent Development
  • Table 82. Shanghai Xinsheng Company Information
  • Table 83. Shanghai Xinsheng Introduction and Business Overview
  • Table 84. Shanghai Xinsheng Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 85. Shanghai Xinsheng Semiconductor Molding Systems Product Offerings
  • Table 86. Shanghai Xinsheng Recent Development
  • Table 87. Mtex Matsumura Company Information
  • Table 88. Mtex Matsumura Introduction and Business Overview
  • Table 89. Mtex Matsumura Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 90. Mtex Matsumura Semiconductor Molding Systems Product Offerings
  • Table 91. Mtex Matsumura Recent Development
  • Table 92. Asahi Engineering Company Information
  • Table 93. Asahi Engineering Introduction and Business Overview
  • Table 94. Asahi Engineering Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 95. Asahi Engineering Semiconductor Molding Systems Product Offerings
  • Table 96. Asahi Engineering Recent Development
  • Table 97. Nextool Technology Co., Ltd. Company Information
  • Table 98. Nextool Technology Co., Ltd. Introduction and Business Overview
  • Table 99. Nextool Technology Co., Ltd. Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 100. Nextool Technology Co., Ltd. Semiconductor Molding Systems Product Offerings
  • Table 101. Nextool Technology Co., Ltd. Recent Development
  • Table 102. APIC YAMADA Company Information
  • Table 103. APIC YAMADA Introduction and Business Overview
  • Table 104. APIC YAMADA Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 105. APIC YAMADA Semiconductor Molding Systems Product Offerings
  • Table 106. APIC YAMADA Recent Development
  • Table 107. Suzhou Bopai Semiconductor (Boschman) Company Information
  • Table 108. Suzhou Bopai Semiconductor (Boschman) Introduction and Business Overview
  • Table 109. Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 110. Suzhou Bopai Semiconductor (Boschman) Semiconductor Molding Systems Product Offerings
  • Table 111. Suzhou Bopai Semiconductor (Boschman) Recent Development
  • Table 112. Suzhou Saiken Intelligent Technology Company Information
  • Table 113. Suzhou Saiken Intelligent Technology Introduction and Business Overview
  • Table 114. Suzhou Saiken Intelligent Technology Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 115. Suzhou Saiken Intelligent Technology Semiconductor Molding Systems Product Offerings
  • Table 116. Suzhou Saiken Intelligent Technology Recent Development
  • Table 117. Jiangsu Guoxin Intelligent Equipment Co., Ltd Company Information
  • Table 118. Jiangsu Guoxin Intelligent Equipment Co., Ltd Introduction and Business Overview
  • Table 119. Jiangsu Guoxin Intelligent Equipment Co., Ltd Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 120. Jiangsu Guoxin Intelligent Equipment Co., Ltd Semiconductor Molding Systems Product Offerings
  • Table 121. Jiangsu Guoxin Intelligent Equipment Co., Ltd Recent Development
  • Table 122. Dongguan Huayue Semiconductor Technology Company Information
  • Table 123. Dongguan Huayue Semiconductor Technology Introduction and Business Overview
  • Table 124. Dongguan Huayue Semiconductor Technology Semiconductor Molding Systems Sales (Units), Revenue (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
  • Table 125. Dongguan Huayue Semiconductor Technology Semiconductor Molding Systems Product Offerings
  • Table 126. Dongguan Huayue Semiconductor Technology Recent Development
  • Table 127. Key Raw Materials Lists
  • Table 128. Raw Materials Key Suppliers Lists
  • Table 129. Semiconductor Molding Systems Downstream Customers
  • Table 130. Semiconductor Molding Systems Distributors List
  • Table 131. Research Programs/Design for This Report
  • Table 132. Key Data Information from Secondary Sources
  • Table 133. Key Data Information from Primary Sources

List of Figures

  • Figure 1. Semiconductor Molding Systems Product Picture
  • Figure 2. Global Semiconductor Molding Systems Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global Semiconductor Molding Systems Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Global Semiconductor Molding Systems Sales Volume (2020-2031) & (Units)
  • Figure 5. Global Semiconductor Molding Systems Sales Price (2020-2031) & (K US$/Unit)
  • Figure 6. Semiconductor Molding Systems Report Years Considered
  • Figure 7. Global Semiconductor Molding Systems Players Revenue Ranking (2024) & (US$ Million)
  • Figure 8. Global Semiconductor Molding Systems Players Sales Volume Ranking (2024) & (Units)
  • Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Semiconductor Molding Systems Revenue in 2024
  • Figure 10. Semiconductor Molding Systems Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 11. Fully Automatic Molding System Picture
  • Figure 12. Semi-automatic Molding System Picture
  • Figure 13. Manual Molding System Picture
  • Figure 14. Global Semiconductor Molding Systems Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 15. Global Semiconductor Molding Systems Sales Value Market Share by Type, 2024 & 2031
  • Figure 16. Global Semiconductor Molding Systems Sales Volume by Type (2020 VS 2024 VS 2031) & (Units)
  • Figure 17. Global Semiconductor Molding Systems Sales Volume Market Share by Type, 2024 & 2031
  • Figure 18. Global Semiconductor Molding Systems Price by Type (2020-2031) & (K US$/Unit)
  • Figure 19. Product Picture of Advanced Packaging
  • Figure 20. Product Picture of Traditional Packaging
  • Figure 21. Global Semiconductor Molding Systems Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 22. Global Semiconductor Molding Systems Sales Value Market Share by Application, 2024 & 2031
  • Figure 23. Global Semiconductor Molding Systems Sales Volume by Application (2020 VS 2024 VS 2031) & (Units)
  • Figure 24. Global Semiconductor Molding Systems Sales Volume Market Share by Application, 2024 & 2031
  • Figure 25. Global Semiconductor Molding Systems Price by Application (2020-2031) & (K US$/Unit)
  • Figure 26. North America Semiconductor Molding Systems Sales Value (2020-2031) & (US$ Million)
  • Figure 27. North America Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
  • Figure 28. Europe Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 29. Europe Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
  • Figure 30. Asia Pacific Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 31. Asia Pacific Semiconductor Molding Systems Sales Value by Region (%), 2024 VS 2031
  • Figure 32. South America Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 33. South America Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
  • Figure 34. Middle East & Africa Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 35. Middle East & Africa Semiconductor Molding Systems Sales Value by Country (%), 2024 VS 2031
  • Figure 36. Key Countries/Regions Semiconductor Molding Systems Sales Value (%), (2020-2031)
  • Figure 37. Key Countries/Regions Semiconductor Molding Systems Sales Volume (%), (2020-2031)
  • Figure 38. United States Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 39. United States Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • Figure 40. United States Semiconductor Molding Systems Sales Value by Application (%), 2024 VS 2031
  • Figure 41. Europe Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 42. Europe Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • Figure 43. Europe Semiconductor Molding Systems Sales Value by Application (%), 2024 VS 2031
  • Figure 44. China Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 45. China Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • Figure 46. China Semiconductor Molding Systems Sales Value by Application (%), 2024 VS 2031
  • Figure 47. Japan Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 48. Japan Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • Figure 49. Japan Semiconductor Molding Systems Sales Value by Application (%), 2024 VS 2031
  • Figure 50. South Korea Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 51. South Korea Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • Figure 52. South Korea Semiconductor Molding Systems Sales Value by Application (%), 2024 VS 2031
  • Figure 53. Southeast Asia Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 54. Southeast Asia Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • Figure 55. Southeast Asia Semiconductor Molding Systems Sales Value by Application (%), 2024 VS 2031
  • Figure 56. India Semiconductor Molding Systems Sales Value, (2020-2031) & (US$ Million)
  • Figure 57. India Semiconductor Molding Systems Sales Value by Type (%), 2024 VS 2031
  • Figure 58. India Semiconductor Molding Systems Sales Value by Application (%), 2024 VS 2031
  • Figure 59. Semiconductor Molding Systems Industrial Chain
  • Figure 60. Semiconductor Molding Systems Manufacturing Cost Structure
  • Figure 61. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 62. Bottom-up and Top-down Approaches for This Report
  • Figure 63. Data Triangulation
  • Figure 64. Key Executives Interviewed