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市场调查报告书
商品编码
1873409
EEPROM晶片-全球市场份额和排名、总收入和需求预测(2025-2031年)EEPROM Chips - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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2024年全球EEPROM晶片市场规模预计为10.16亿美元,预计到2031年将成长至17.72亿美元,2025年至2031年的复合年增长率为8.5%。
本报告从跨境产业布局、资本配置模式、区域经济相互依存以及供应链重组等方面,对近期针对 EEPROM 晶片的关税调整和国际战略反制措施进行了全面评估。
EEPROM(电可擦可程式唯读记忆体)是一种使用者可修改的唯读记忆体(ROM),可以透过施加高于正常电压的方式重复擦除和重新编程(写入)。 EEPROM晶片必须完全擦除和重新编程,不能选择性擦除和重新编程,且其使用寿命有限,通常只有数万到数十万次的可程式设计循环。由于EEPROM在电脑使用过程中经常需要重新编程,因此其使用寿命是设计中的重要考虑因素。
EEPROM 是 Electrically 可程式设计)的缩写,它是一种可重写的存储晶片或存储组件,即使断电也能保留存储的信息,被称为非挥发性记忆体。
由于其低功耗、非挥发性储存和高可靠性等优势,EEPROM晶片已成为众多产业不可或缺的核心元件。其应用范围将持续扩展,涵盖消费性电子、汽车、工业、物联网、医疗、家电和通讯等众多领域。随着技术的进步,尤其是在整合和安全方面的提升,市场前景预计将保持稳定成长。随着汽车智慧化和电气化进程的加速、ADAS应用的广泛普及以及车载摄影机数量的不断增加,EEPROM在汽车领域的应用显着增长,其应用范围进一步扩展至ADAS、智慧驾驶座、智慧连网、3E系统、开关微型马达、底盘和变速箱等领域。这推动了每辆车EEPROM需求的快速成长。预计到2024年,EEPROM在汽车产业的营收份额将达到约14%,未来几年的复合年增长率约为17.02%。
就消费而言,中国目前是全球最大的消费市场,预计到2024年将占据52.4%的销售市场份额,其次是北美和欧洲,分别占10.5%和8.2%。未来几年,在物联网、智慧家庭、新能源汽车、5G通讯、工业4.0和智慧製造等产业的推动下,中国有望成为成长最快的市场,2025年至2031年的复合年增长率约为14.62%。
就产量而言,中国和东南亚是主要的生产地区,2024年分别占市场份额的47.5%和35.5%。预计中国在未来几年将维持最高的成长率,到2031年将达到市占率的61.8%。
从製造商的角度来看,全球领先的EEPROM晶片製造商包括意法半导体(STMicroelectronics)、微芯科技(Microchip Technology)、巨科半导体(Giantec Semiconductor)、安森美半导体(ON Semiconductor)、艾博瑞克(Abric)、普旦亚半导体(PouzFuya S药)复音半导体(A药叶) Microelectronics)、瑞萨电子(Renesas Electronics)、罗姆半导体(ROHM Semiconductor)、上海百灵半导体(Shanghai Belling)、华虹半导体(Huahong Semiconductor)、弗里蒙特微器件(FMD)、亚德诺半导体(Ananalogces)、H圳nanalogces(FMD)。 Chip)和武汉鑫源半导体(Wuhan Xinyuan Semiconductor)。截至2024年,全球顶级製造商主要是意法半导体和微芯科技,约占51%的市场份额。第二梯队製造商包括巨辰半导体(Juchen Semiconductor)、安森美半导体(ON Semiconductor)、艾博瑞克(Abric)、普兰半导体(Praan Semiconductor)、復旦微电子(Fudan Microelectronics)、瑞萨电子(Renesas Electronics)、百灵半导体(上海)导体半导体(上海)导体半导体(上海)导体半导体(Shangul)。 Belling)与华虹半导体(Huahong Semiconductor),总合占41%的市占率。预计未来几年,该行业的竞争将更加激烈,尤其是在中国市场。
未来EEPROM晶片市场的主要发展趋势与成长点:
1. 物联网 (IoT) 和智慧型装置的快速发展是推动 EEPROM 晶片需求成长的关键因素。随着智慧家庭、智慧城市和穿戴式装置等物联网产品的普及,对小型化、低功耗和高可靠性储存晶片的需求持续成长,尤其是在感测器资料储存和装置配置领域。
2. 汽车电子产业的扩张,特别是自动驾驶技术、车载资讯娱乐系统和电动车(EV)的发展,显示未来对EEPROM晶片的需求将持续成长。汽车对低功耗和大容量资料储存的需求将成为市场成长的关键驱动力。
3. 高密度和低耗电量
随着积体电路技术的进步,EEPROM晶片的储存密度不断提高,而功耗却持续降低。未来,为了满足日益增长的资料储存需求,EEPROM将实现更高的储存容量和更低的功耗。低功耗和小尺寸将成为重要的设计因素,尤其是在嵌入式应用中。
4. 整合和多功能性
多功能整合将是EEPROM未来发展的关键趋势。越来越多的EEPROM晶片将整合更多功能,例如更高的读写速度、内建加密功能、耐高温性能以及更宽的工作电压范围。整合度的提高不仅有助于降低成本,还能减少基板面积占用并提高产品可靠性。
5. 三维储存技术的应用
先进的储存技术,例如3D NAND,正在逐步占领市场。这些技术目前已应用于传统储存设备(例如快闪记忆体和固态硬碟),但它们也可能对EEPROM晶片的设计和製造产生影响。 3D堆迭技术有望实现更高的储存密度和更低的功耗。
6. 加强安全和加密要求
随着网路安全和资料隐私问题日益严峻,EEPROM未来将更加重视资料保护和加密功能。例如,在金融支付、智慧卡和物联网等应用中,整合硬体加密模组的EEPROM晶片有望涌现,以确保资料安全。
7. 与替代技术的竞争
随着快闪记忆体和磁阻随机存取记忆体(MRAM)等新型储存技术的发展,EEPROM晶片可能会面临一定的市场竞争。特别是MRAM和闪存,在速度和储存密度方面具有优势。然而,由于其较长的擦写寿命和小型化特性,EEPROM在许多特定应用中仍然占据着不可替代的地位。
本报告旨在按地区/国家、类型和应用对全球 EEPROM 晶片市场进行全面分析,重点关注总销售量、收入、价格、市场份额和主要企业的排名。
本报告以销售量(百万片)和收入(百万美元)为单位,对EEPROM晶片市场规模、估算和预测进行了呈现,以2024年为基准年,并涵盖了2020年至2031年的历史数据和预测数据。透过定量和定性分析,我们帮助读者制定业务/成长策略、评估市场竞争、分析自身在当前市场中的地位,并就EEPROM晶片做出明智的商业决策。
市场区隔
公司
按类型分類的细分市场
应用领域
按地区
The global market for EEPROM Chips was estimated to be worth US$ 1016 million in 2024 and is forecast to a readjusted size of US$ 1772 million by 2031 with a CAGR of 8.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on EEPROM Chips cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
EEPROM (electrically erasable programmable read-only memory) is user-modifiable read-only memory (ROM) that can be erased and reprogrammed (written to) repeatedly through the application of higher than normal electrical voltage. An EEPROM chip has to be erased and reprogrammed in its entirety, not selectively. It also has a limited life - that is, the number of times it can be reprogrammed is limited to tens or hundreds of thousands of times. In an EEPROM that is frequently reprogrammed while the computer is in use, the life of the EEPROM can be an important design consideration.
EEPROM is the abbreviation of Electrically Erasable Programmable Read-Only Memory. It is a rewritable memory chip or memory component that can still retain the stored information in the absence of power. This is called non-volatile memory.
Due to its advantages such as low power consumption, non-volatile storage, and high reliability, EEPROM chips have become an indispensable core component in many industries. In many fields such as consumer electronics, automobiles, industry, the Internet of Things, medical care, home appliances, and communications, the application of EEPROM chips will continue to expand. With the advancement of technology, especially the improvement of integration and safety, its market prospects will continue to maintain strong growth. With the acceleration of the process of automobile intelligence and electrification, the more popularization of ADAS applications, and the increase in the number of on-board cameras, the use of automotive EEPROM is increasing significantly, and the application scope of automotive EEPROM has also been further expanded to ADAS, smart cockpits, smart networking, three-electric systems, switch micromotors, chassis transmission, etc., driving the rapid increase in the demand for EEPROM per vehicle. The automotive industry will have a sales share of approximately 14% in 2024, and a CAGR of approximately 17.02% in the next few years.
In terms of consumption, China is currently the world's largest consumer market, accounting for 52.4% of the sales market share in 2024, followed by North America and Europe, accounting for 10.5% and 8.2% respectively. In the next few years, driven by industries such as the Internet of Things (IoT), smart homes, new energy vehicles, 5G communications, Industry 4.0 and smart manufacturing, China is expected to grow the fastest, with a CAGR of approximately 14.62% during 2025-2031.
From the production side, China and Southeast Asia are two important production regions, accounting for 47.5% and 35.5% of the market share in 2024 respectively. It is expected that China will maintain the fastest growth rate in the next few years, and its share is expected to reach 61.8% in 2031.
From the perspective of manufacturers, the core EEPROM chip manufacturers worldwide mainly include STMicroelectronics, Microchip Technology, Giantec Semiconductor, onsemi, ABLIC, Puya Semiconductor, Fudan Microelectronics, Renesas Electronics, ROHM Semiconductor, Shanghai Belling, Hua Hong Semiconductor, Fremont Micro Devices (FMD), Analog Devices, NXP, Shenzhen Hangshun Chip, Wuhan Xinyuan Semiconductor, etc. In 2024, the world's first-tier manufacturers mainly include STMicroelectronics and Microchip Technology, and the first-tier manufacturers account for about 51% of the market share; the second-tier manufacturers include Juchen Semiconductor, ON Semiconductor, ABLIC, Puran Semiconductor, Fudan Microelectronics, Renesas Electronics, Rohm Semiconductor, Shanghai Belling, Huahong Semiconductor, etc., with a total share of 41%. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.
The main development trends and growth points of the future market of EEPROM chips:
1. The rapid development of the Internet of Things (IoT) and smart devices is an important factor driving the growth of EEPROM chip demand. With the popularity of IoT products such as smart homes, smart cities, and wearable devices, the demand for small, low-power, and highly reliable memory chips continues to rise, especially in the fields of sensor data storage and device configuration.
2. The expansion of the automotive electronics field, especially the development of autonomous driving, in-vehicle infotainment systems, and electric vehicles (EVs), indicates that the demand for EEPROM chips will continue to rise. The demand for low power consumption and high data storage in automobiles will become an important driving force for market growth.
3. Higher density and lower power consumption
With the advancement of integrated circuit technology, the storage density of EEPROM chips continues to increase, and power consumption continues to decrease. In the future, EEPROM will achieve higher storage capacity and lower current consumption to meet the growing demand for data storage. Especially in embedded applications, low power consumption and small size will become important design considerations.
4. Integration and multifunctionality
Multifunctional integration will be an important trend in the future development of EEPROM. More and more EEPROM chips will integrate more functions, such as enhanced read and write speeds, built-in encryption, high temperature resistance, and a wide voltage operating range. The increase in integration not only helps to reduce costs, but also reduces circuit board area and improves product reliability.
5. Application of 3D storage technology
3D NAND and other advanced storage technologies are gradually entering the market. Although these technologies have been applied in traditional storage fields (such as Flash and SSD), they may also affect the design and manufacture of EEPROM chips. Through 3D stacking technology, higher storage density and lower power consumption can be achieved.
6. Increased security and encryption requirements
With the increasing severity of network security and data privacy issues, EEPROM will place more emphasis on data protection and encryption functions in the future. For example, some EEPROM chips will integrate hardware encryption modules to ensure data security, especially in applications such as financial payments, smart cards, and the Internet of Things.
7. Competition from alternative technologies
With the development of new storage technologies such as Flash storage and MRAM (magnetoresistive random access memory), EEPROM chips may face certain market competition. In particular, MRAM and Flash storage have certain advantages in terms of high speed and higher storage density. However, EEPROM still occupies an irreplaceable position in many specific applications due to its stronger erase and write life and miniaturization characteristics.
This report aims to provide a comprehensive presentation of the global market for EEPROM Chips, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of EEPROM Chips by region & country, by Type, and by Application.
The EEPROM Chips market size, estimations, and forecasts are provided in terms of sales volume (Million Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding EEPROM Chips.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of EEPROM Chips manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of EEPROM Chips in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of EEPROM Chips in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.