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市场调查报告书
商品编码
1873410
EUV光刻掩模检测设备:全球市占率及排名、总收入及需求预测(2025-2031年)EUV Mask Defect Inspection Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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2024 年全球 EUV 光刻掩模缺陷检测设备的市场规模估计为 18.64 亿美元,预计到 2031 年将成长至 38.46 亿美元,2025 年至 2031 年的复合年增长率为 12.5%。
本报告对近期有关 EUV 光刻掩模缺陷检测设备的关税调整和国际战略反制措施的跨境产业布局、资本配置模式、区域经济相互依存关係和供应链重组进行了全面评估。
掩模(也称为光掩模或光罩)是微影术工艺中使用的图形母版,常用于微电子加工。作为图形资讯的载体,掩模透过曝光製程将图形转移到基板上,从而实现图形转移。
掩模缺陷检测是半导体微影术程的关键步骤,其目的是检查掩模并识别和修復缺陷。作为微影术刻製程的关键组成部分,光罩负责将电路图案精确地转移到晶圆上,其品质直接影响晶圆图案的精度和最终装置的性能。缺陷类型多种多样,包括颗粒污染、图案破损、桥接问题、光罩材料本身的缺陷。
EUV光刻掩模缺陷检测系统是先进半导体製程技术中至关重要的专用设备。鑑于EUV微影术技术对精度要求极高,即使在掩模上最小的缺陷也会对晶圆上的电路图案品质产生显着影响,进而可能对晶片性能和产量比率造成不利影响。因此,使用专用检测系统对EUV光刻掩模进行严格检测是确保半导体製造品质的关键步骤。
光学检测是目前半导体检测技术的主流。半导体光学检测的类型包括图案缺陷检测、非图案检测和掩模检测。其中,图案缺陷侦测又分为明场侦测与暗场侦测。两者都分析光讯号,差异在于明场侦测利用垂直反射光讯号,而暗场侦测利用散射光讯号。
半导体微影术程需要使用不同的光源来製作不同的光罩。掩模的用途十分广泛,通常分为二元掩模、相移掩模和极紫外线(EUV)掩模。 EUV掩模是一种专为极紫外线(EUV)微影术技术设计的新型掩模。由于EUV光的波长极短,容易被多种材料吸收,因此无法使用透镜等传统屈光元件。 EUV掩模利用布拉格定律,透过多层(ML)结构反射光束(与EUV不同,深紫外线(DUV)光刻使用透射光)。这种掩模广泛应用于7nm、5nm、3nm和2nm等先进製造製程(台积电计划于2025年量产)。
目前,掩模检测技术主要有光学检测和扫描电子显微镜(SEM)检测两种。 Lasertec和KLA是光学检测设备的主要製造商,而Advantest是SEM检测设备的製造商。从下游应用的角度来看,如果在掩模上使用光阻,则需要使用EUV掩模检测系统(换句话说,只要使用EUV曝光系统,就必须使用EUV检测系统)。然而,目前并非所有下游厂商使用的EUV掩模都带有光阻。
在深紫外线(DUV)微影和光学光罩技术中,保护膜(Pelicle)扮演关键角色。掩模检测设备的工作波长为193奈米,并透过这层保护膜进行检测。对于晶圆厂而言,这是一个简单且有效率的过程。然而,对于极紫外线(EUV)光刻,掩模製造必须在专门的掩模车间进行。此时,掩模侦测变得更加复杂,需要高解析度的系统。在理想的晶圆厂环境中,保护膜可以保护掩模免受颗粒污染,同时允许检测系统透过这层保护膜进行检测。如果没有发现缺陷,则可以继续进行后续工序;如果侦测到缺陷,则必须移除保护膜并将遮罩送至遮罩研讨会进行清洗。
EUV光刻掩模缺陷检测系统主要应用于掩模加工厂和晶圆厂。晶圆厂包括光罩生产线和晶圆生产线。晶圆厂采用EUV光刻掩模缺陷检测系统主要有两个原因。首先,当在掩模上附着一层薄膜时,其他检测工具(例如电子束或DUV检测工具)难以进行高灵敏度检测。薄膜的存在会阻碍这些工具的侦测能力,使其无法准确地识别微小缺陷。其次,EUV检测系统具有极高的检测精度,能够检测到传统DUV光刻掩模检测方法无法捕捉的缺陷和颗粒。掩模加工厂历来占据较大的市场份额,预计到2023年将达到约61%。然而,随着更小尺寸先进製程节点的商业化进程加快,预计到2030年,晶圆厂的市占率将达到42%。
目前,EUV光刻掩模检测市场由KLA和Lasertec两家公司主导。 EUV光刻掩模检测系统精度高、技术复杂,但交货週期较长。例如,Lasertec的交货週期为两年。预计这两家主要企业在未来几年内将继续保持其在EUV光刻掩模检测市场的领先地位。
本报告旨在对全球 EUV 光刻掩模缺陷检测设备市场按地区/国家、类型和应用进行全面分析,重点关注总销售量、收入、价格、市场份额和主要企业的排名。
本报告以销量和收入(百万美元)为单位,对EUV光刻掩模检测设备市场规模、估计值和预测进行了呈现,以2024年为基准年,并涵盖了2020年至2031年的历史数据和预测数据。定量和定性分析将帮助读者制定EUV光刻掩模检测设备业务和成长策略,评估市场竞争,分析自身在当前市场中的地位,并做出明智的商业决策。
市场区隔
公司
按类型分類的细分市场
应用领域
按地区
The global market for EUV Mask Defect Inspection Equipment was estimated to be worth US$ 1864 million in 2024 and is forecast to a readjusted size of US$ 3846 million by 2031 with a CAGR of 12.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on EUV Mask Defect Inspection Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Mask, also known as Photomask or Reticle, is a graphic master used in the lithography process commonly used in microelectronics processing technology. As a carrier of graphic information, Mask transfers the graphic to the base material through the exposure process, thereby realizing the transfer of the graphic.
Mask defect detection is a key link in the semiconductor lithography process, which aims to check the Mask and identify and repair the defects on it. As a critical component in the lithography process, Mask is responsible for accurately transferring the circuit pattern to the wafer, and its quality is directly related to the accuracy of the wafer pattern and the performance of the final device. There are various types of defects, including particle contamination, pattern breakage, bridging problems, and defects in the mask material itself.
EUV Mask defect detection equipment is a special equipment that plays an important role in the high-end semiconductor process technology. Given the high precision required by EUV lithography technology, even the smallest defect on the Mask may significantly affect the quality of the circuit pattern on the wafer, and thus adversely affect the performance and yield of the chip. Therefore, the use of special detection equipment to strictly inspect the EUV Mask is an indispensable key link to ensure the quality of semiconductor manufacturing.
At present, optical detection is the mainstream in semiconductor detection technology. The types of semiconductor optical detection include pattern, non-pattern and mask detection. Among them, pattern defect detection is divided into bright field and dark field detection. Both are analyzed through optical signals. The difference is that the bright field is a vertically reflected light signal, while the dark field is a scattered light signal.
In the semiconductor lithography process, corresponding light sources need to be used for different masks. Different mask applications vary greatly, and can be generally divided into binary masks, phase-shift masks and EUV masks. EUV Mask is a new type of mask designed specifically for EUV (extreme ultraviolet) lithography technology. Given the extremely short wavelength of EUV and its easy absorption by a variety of materials, traditional refractive elements such as lenses cannot be used. Instead, according to the Bragg law, the reflection of the light beam is achieved through a multi-layer (ML) structure (unlike EUV, DUV uses transmitted light). This type of mask is widely used in 7nm, 5nm, 3nm and 2nm (TSMC plans to mass produce in 2025) high-end manufacturing processes.
At present, mask detection technology is mainly optical detection and SEM detection. Among them, the optical inspection companies are mainly Lasertec and KLA, while SEM inspection is Advantest. From the perspective of downstream applications, as long as the mask uses Pellicle, EUV Mask inspection equipment is required (in other words, as long as there is an EUV lithography machine, EUV inspection equipment must be used), but at present, not all EUV Masks of downstream terminal manufacturers will be used with Pellicle.
In DUV lithography or optical Mask technology, Pellicle plays a key role. The Mask inspection tool operates at an exposure wavelength of 193nm, and inspection is performed through this layer of film. For the wafer fab, this is a direct and efficient process. However, in extreme ultraviolet (EUV) lithography technology, the manufacturing process of the Mask needs to be carried out in a dedicated Mask workshop. At this point, the inspection of the Mask becomes more complicated because it requires a high-resolution system. In the wafer fab environment, the ideal situation is to use a layer of Pellicle to protect the Mask from particle contamination, while allowing the inspection system to work through this layer of Pellicle. If there are no defects, you can proceed; if defects are detected, you need to remove the pellicle and send the Mask to the Mask workshop for cleaning.
EUV Mask defect detection equipment is mainly used in Mask Shop and Fab. The Fab includes the mask production line and the wafer manufacturing production line. For the Fab, there are two main reasons for using EUV Mask defect detection equipment. First, once the pellicle is attached to the Mask, other types of equipment (such as electron beam or DUV equipment) except EUV detection equipment are difficult to achieve high-sensitivity detection effects. This is because the presence of pellicles interferes with the detection capabilities of these devices, making it difficult for them to accurately identify tiny defects. Secondly, EUV detection equipment has higher detection accuracy and can detect defects and particles that traditional DUV Mask detection methods cannot capture. Mask Shop has always had a relatively large share, reaching about 61% in 2023. However, with the acceleration of commercialization of smaller advanced process nodes, it is expected that the share of Fab will reach 42% by 2030.
At present, the EUV Mask defect detection equipment market is mainly monopolized by KLA and Lasertec. EUV Mask defect detection equipment is a high-precision and advanced equipment with a long delivery time. For example, Lasertec's delivery time is two years. In the next few years, the two leading companies will still maintain a monopoly in the EUV Mask defect detection market.
This report aims to provide a comprehensive presentation of the global market for EUV Mask Defect Inspection Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of EUV Mask Defect Inspection Equipment by region & country, by Type, and by Application.
The EUV Mask Defect Inspection Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding EUV Mask Defect Inspection Equipment.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of EUV Mask Defect Inspection Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of EUV Mask Defect Inspection Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of EUV Mask Defect Inspection Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.