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市场调查报告书
商品编码
1873663
独立式ISP晶片:全球市场份额和排名、总收入和需求预测(2025-2031年)Independent ISP Chip - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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2024 年全球独立 ISP 晶片市场规模估计为 6.89 亿美元,预计在预测期(2025-2031 年)内将以 5.8% 的复合年增长率增长,到 2031 年达到 10.22 亿美元。
本报告对近期关税调整和国际策略反制措施对独立ISP晶片跨境产业布局、资本配置模式、区域经济相互依存关係和供应链重组的影响进行了全面评估。
影像讯号处理器 (ISP) 是处理前端影像感测器输出讯号的单元。 ISP 晶片分为整合式和分离式两种类型。目前,大多数智慧型手机使用整合式 ISP 晶片,该晶片整合在处理器中,并整合到设备的 SoC 处理器中。分立式 ISP 晶片独立于处理器,虽然价格较高,但其优势也相当显着。
全球领先的独立ISP晶片製造商包括意法半导体(STMicroelectronics)和安森美半导体(ON Semiconductor),这两家公司占据了超过38%的市场份额。亚太地区是最大的市场,约占55%的市场份额,其次是欧洲和北美,分别占15%和18%的市场份额。按产品类型划分,支援HDR的晶片是最大的细分市场,占92%的市场份额;按应用领域划分,安防产业约占40%的市场份额。
独立ISP晶片市场的驱动因素如下:
1. 技术突破:效能飞跃与人工智慧集成
彻底革新影像处理能力
低照度优化:凭藉 AI 降噪演算法和多频谱融合技术,独立的 ISP 晶片即使在极低照度环境下也能实现显着提高的信噪比。
动态范围增强:AI驱动的自适应HDR技术可即时优化明暗细节,减少过曝和欠曝。搭载高通骁龙8 Elite处理器的AI影像讯号处理器(ISP)支援4K解析度下的无限语意分割,从而实现对每个区域的差异化最佳化。
防手震与多模式融合:6自由度数位防手震、PDAF高速自动对焦和多感测器资料融合(雷达、红外线等)提高了拍摄稳定性,满足了运动场景的需求。
针对电源效率和运算能力进行了最佳化
AI模型压缩:透过量化和剪枝演算法,AI ISP实现了终端端的低延迟处理。例如,DeepSeek-R1模型压缩了生产规模所需的参数数量,并降低了储存需求。
硬体协同设计:NPU 和 ISP 深度集成,提升处理效率。联发科天玑 9400 的 NPU 890 支持自主感知和推理,显着提升能效。
2. 市场需求:多样化的应用场景
智慧安全监控
智慧城市和安城计划正在推动对高清摄影机的需求,而独立的ISP晶片支援人脸部辨识和车牌辨识等功能。
将 AI 处理器嵌入到 IPCSoC 中,可以实现从被动监控到主动感知的转变,支援结构化资料处理和智慧分析。
汽车电子产业的爆炸性成长
自动驾驶等级的不断提高(5 级自动驾驶需要 20 多个摄影机)正在推动对汽车 ISP 晶片的需求。
独立 ISP 必须支援多通道 4K影像并行处理、HDR 和低照度优化,以满足 ADAS(高级驾驶辅助系统)和 DMS(驾驶员监控系统)的需求。
高阶消费性电子产品
随着智慧型手机对影像品质的要求越来越高,传统的整合式影像讯号处理器(ISP)已无法满足这些需求,促使厂商开发独立式ISP。例如,vivo的大萤幕蓝心系列手机就配备了AI ISP,以支援多模态互动(语音、手势和图像)。
数位相机设备需求的不断增长,以及电影製作等专业领域对更高解析度和稳定性的需求,正在推动ISP晶片的升级。
物联网 (IoT) 和 5G 的兴起
物联网设备(例如智慧家庭摄影机)的普及和5G网路的发展正在加速资料传输,拓展ISP晶片的应用场景。例如,智慧汽车晶片支援Wi-Fi互联和即时监控,满足了车载物联网(ISP)的需求。
3. 政策支持:国内替代和标准改进
由顶级设计团队推动
政府已将积体电路产业纳入「十四五」规划,并透过税收优惠、研发补贴等措施支持人工智慧晶片的发展。 《建构人工智慧产业国家综合标准化体係指南(2024年版)》提出,到2026年要製定50多项与人工智慧晶片相关的国家标准。
地方政策(例如对北京和上海工业园区的支持)正在加速人工智慧晶片公司的丛集。
加速本地化进程
政策主导和技术突破正在推动国内人工智慧晶片产业链的发展,例如威瑞思的AI-ISP晶片实现了车规级量产,精嘉维的JM9系列GPU性能可与国际主流产品媲美。
预计到 2025 年,日本人工智慧晶片的自给率将达到 35%,但上游设备(如曝光设备)仍依赖进口,需要长期投资才能突破这一差距。
行业标准和规范
国际标准(例如 IEC 62805、ASTM F3287-18)规范製造过程和品管,而国家协会标准(例如 T/CAS 386-2019)则强调製造环境的清洁性和工艺稳定性,以确保产品一致性。
4. 产业链整合:上下游整合与生态系统建构
上游和下游技术合作
独立的ISP晶片与CMOS感测器和SoC晶片协同优化,以提升整体效能。例如,OmniVision Technologies发布了一款整合ISP的CMOS感测器,而安森美半导体则提供CIS+ISP整合解决方案。
前端晶片和后端晶片(如IPCSoC和NVRSoC)的结合提供了端到端的智慧解决方案,降低了传输和储存成本。
生态系中的合作与竞争
主要厂商正透过技术创新和产品升级来增强自身竞争力。例如,意法半导体和安森美半导体在ISP晶片领域拥有深厚的技术积累,并不断推出新产品引领市场方向。
跨国合作,例如晶片製造商和演算法公司之间的联合研发,正在加速技术实施,例如百度 PaddlePaddle 和 Cambrian MLU 的适配,并促进 AI ISP 在医疗和教育领域的应用。
5. 未来趋势:科技融合与应用情境深化
人工智慧与量子运算的融合
量子运算有可能突破传统ISP的物理限制,提高影像处理速度和能源效率,并成为智慧终端的核心驱动力。
垂直场景加深
医学(例如,即时增强手术影像)和教育(例如,用于远端教育的高清影像传输)等领域对 ISP 晶片提出了新的要求,并推动了专用解决方案的发展。
终端云端协作的标准化
2025 年巴黎人工智慧高峰会旨在促进人工智慧伦理和端到端部署规范,促进跨平台协作,并提高 ISP 晶片在端到云端协作场景中的安全性和效率。
独立ISP晶片市场的成长主要受技术突破、日益精细化的需求、政策支持以及产业链协同效应的驱动。随着人工智慧技术的深度融合、应用场景的拓展以及国产晶片替代进程的加速,独立ISP晶片市场将面临更广阔的发展机会。企业需要持续专注于技术创新、市场需求变化和政策指南,以增强自身竞争优势并应对潜在挑战。
本报告旨在透过按地区/国家、类型和应用进行分析,全面介绍全球独立ISP晶片市场,重点关注总销售量、收入、价格、市场份额和主要企业的排名。
本报告以销售量(百万片)和收入(百万美元)为单位,对独立ISP晶片市场规模、估算和预测进行了呈现,基准年为2024年,并包含了2020年至2031年的历史数据和预测数据。定量和定性分析相结合,有助于读者制定业务和成长策略,评估市场竞争,分析自身在当前市场中的地位,并就独立ISP晶片做出明智的商业决策。
市场区隔
公司
按类型分類的细分市场
应用领域
按地区
The global market for Independent ISP Chip was estimated to be worth US$ 689 million in 2024 and is forecast to a readjusted size of US$ 1022 million by 2031 with a CAGR of 5.8% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Independent ISP Chip cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
ISP, abbreviated as "Image Signal Processor", is a unit used to process the output signals of front-end image sensors. ISP chips are divided into two types: integrated and independent. Currently, most mobile phones use integrated ISP chips that come with processors, which are integrated into the phone's SOC processor. The independent ISP chip exists independently of the processor, and although it has a high cost, its advantages are also quite obvious.
Global key players of Independent ISP Chip include STMicroelectronics and Onsemi. The top two players hold a share over 38%. Asia-Pacific is the largest market, has a share about 55%, followed by Europe and North America, with share 15% and 18%, separately. In terms of product type, Supports HDR Chip is the largest segment, occupied for a share of 92%, and in terms of application, Security has a share about 40%.
The market drivers of independent ISP chips include:
1. Technological breakthroughs: performance leap and AI fusion
Image processing capability revolution
Low-light environment optimization: Through AI noise reduction algorithm and multi-spectral fusion technology, independent ISP chips can achieve a significant improvement in signal-to-noise ratio under extremely low illumination.
Dynamic range expansion: AI-driven adaptive HDR technology can optimize light and dark details in real time and reduce overexposure or underexposure. Qualcomm Snapdragon 8 Elite's AI ISP supports unlimited semantic segmentation at 4K resolution and implements differentiated optimization for different areas.
Anti-shake and multi-modal fusion: 6DOF digital anti-shake, PDAF fast focus and multi-sensor data fusion (such as radar, infrared) improve imaging stability and meet the needs of sports scenes.
Energy efficiency and computing power optimization
AI model compression: Through quantization and pruning algorithms, AI ISP achieves low-latency processing on the end side. For example, the DeepSeek-R1 model compresses the number of parameters to an operational scale, reducing storage requirements.
Hardware co-design: NPU and ISP are deeply integrated to improve processing efficiency. MediaTek Dimensity 9400's NPU 890 supports autonomous perception and reasoning, and its energy efficiency ratio is significantly improved.
2. Market demand: Diversified application scenarios
Intelligent security monitoring
Smart city and safe city projects drive the demand for high-definition cameras, and independent ISP chips support functions such as face recognition and license plate recognition.
After the IPCSoC is embedded with the AI processor, it realizes the transition from passive monitoring to active recognition, and supports structured data processing and intelligent analysis.
Explosive growth of automotive electronics
The level of autonomous driving has been improved (more than 20 cameras are required for L5 level), which has promoted the demand for on-board ISP chips.
Independent ISP needs to support multi-channel 4K video parallel processing, HDR and low-light optimization to meet the needs of ADAS (advanced driving assistance system) and DMS (driver monitoring system).
High-end consumer electronics
Smartphones have higher requirements for image quality, and traditional integrated ISPs are difficult to meet the needs, prompting manufacturers to develop independent ISPs. For example, the vivo Blue Heart large model is combined with the AI ISP to achieve "voice + gesture + image" multi-modal interaction.
The demand for digital camera equipment is growing, and the requirements for high resolution and high stability in professional fields (such as film production) drive the upgrade of ISP chips.
Internet of Things and 5G empowerment
The popularization of IoT devices (such as smart home cameras) and 5G networks accelerate data transmission and expand the application scenarios of ISP chips. For example, smart car chips support Wifi interconnection and real-time monitoring to meet the needs of the Internet of Vehicles.
3. Policy support: domestic substitution and standard improvement
Top-level design promotion
The country has included the integrated circuit industry in the "14th Five-Year Plan" and supported the development of AI chips through tax incentives, R&D subsidies and other measures. The "Guidelines for the Construction of the National Comprehensive Standardization System for the Artificial Intelligence Industry (2024 Edition)" requires the formulation of more than 50 national standards for AI chips by 2026.
Local policies (such as support for industrial parks in Beijing and Shanghai) accelerate the clustering development of AI chip companies.
Acceleration of the localization process
Policy-driven and technological breakthroughs promote the development of the domestic AI chip industry chain. For example, VeriSilicon's AI-ISP chips have achieved automotive-grade mass production, and Jingjiawei's JM9 series GPU performance is comparable to international mainstream products.
The self-sufficiency rate of domestic AI chips is expected to reach 35% in 2025, but upstream equipment (such as lithography machines) still relies on imports and requires long-term investment to break through.
Industry standards and specifications
International standards (such as IEC 62805, ASTM F3287-18) regulate production processes and quality control, and domestic group standards (such as T/CAS 386-2019) emphasize production cleanliness and process stability to ensure product consistency.
4. Industry chain collaboration: upstream and downstream linkage and ecological construction
Upstream and downstream technology collaboration
Independent ISP chips are coordinated and optimized with CMOS sensors and SoC chips to improve overall performance. For example, OmniVision Technologies launched a CMOS sensor with integrated ISP, and ON Semiconductor provides CIS+ISP integrated solutions.
The combination of front-end and back-end chips (such as IPCSoC and NVRSoC) provides end-to-end intelligent solutions to reduce transmission and storage costs.
Ecological cooperation and competition
Major manufacturers enhance their competitiveness through technological innovation and product upgrades. For example, STMicroelectronics and ON Semiconductor have deep technical accumulation in the field of ISP chips and continue to launch new products to lead the market direction.
Cross-border cooperation (such as joint research and development by chip manufacturers and algorithm companies) accelerates the implementation of technology, such as the adaptation of Baidu PaddlePaddle and Cambrian MLU, which promotes the application of AI ISP in medical and education fields.
5. Future trends: technology integration and scene deepening
AI and quantum computing integration
Quantum computing may break through the physical limitations of traditional ISPs, improve image processing speed and energy efficiency, and become the core driving force of smart terminals.
Vertical scene deepening
Medical (such as real-time enhancement of surgical images), education (such as high-definition video transmission of remote education) and other fields have put forward new requirements for ISP chips, promoting the development of dedicated solutions.
End-cloud collaboration standardization
The 2025 Paris AI Summit promotes AI ethics and end-side deployment specifications, promotes cross-platform collaboration, and improves the security and efficiency of ISP chips in end-cloud collaboration scenarios.
The growth of the independent ISP chip market is the result of technological breakthroughs, demand upgrades, policy support and industry chain synergy. In the future, with the in-depth integration of AI technology, the expansion of application scenarios and the acceleration of domestic substitution, the independent ISP chip market will usher in a broader development space. Enterprises need to continue to pay attention to technological innovation, changes in market demand and policy guidance to consolidate their competitive advantages and respond to potential challenges.
This report aims to provide a comprehensive presentation of the global market for Independent ISP Chip, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Independent ISP Chip by region & country, by Type, and by Application.
The Independent ISP Chip market size, estimations, and forecasts are provided in terms of sales volume (M Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Independent ISP Chip.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Independent ISP Chip manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Independent ISP Chip in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Independent ISP Chip in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.