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市场调查报告书
商品编码
1917652
ABF(味之素增材膜)-全球市场份额和排名、总收入和需求预测(2026-2032 年)ABF (Ajinomoto Build-up Film) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032 |
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味之素迭层膜™ (ABF) 是一种薄膜型热固性中阶绝缘介质,用于建构高密度多层构装基板(通常为 FC-BGA/「ABF基板」)。其核心产品形式包括:(i) 用于迭层封装的介质薄膜;(ii) 支援大规模生产和转换的配套产品和中间产品(例如,涉及将清漆涂覆到载体薄膜上的清漆-薄膜製造链)。 ABF 的主要应用领域包括 PC 和工作站处理器、伺服器/资料中心、网路设备以及 AI/HPC 平台(在这些封装中,讯号完整性、布线密度和基板可靠性至关重要)。目前,该领域的竞争格局高度集中。味之素株式会社声称其在高性能半导体绝缘薄膜的全球市占率超过 95%。味之素 FineTechno 的 ABF 产品页面显示,其在主流 PC 市场的份额接近 100%,这使得 ABF 成为该生态系统中绝缘薄膜的现有标准。同时,市场正积极培育同功能类别(层压介质薄膜)的认证替代品。例如,积水化学正在销售一种用于FC-BGA的热固性层压介质薄膜,声称其与SAP生产线相容,并已被具有OSAT组装经验的主要基板供应商(日本和台湾)采用。这表明,即使现有技术仍保持其优势,「第二来源」的开发在技术和商业性都在稳步推进。
产业趋势和需求推动要素正日益受到人工智慧/高效能运算(AI/HPC)主导的基板复杂性和吞吐量的影响,而非传统的以个人电脑为中心的成长。味之素的ICT简报明确指出,ABF(增强型导电薄膜)的需求与通讯和资讯基础设施(伺服器、资料中心和网路)的成长密切相关,并将每块电路基板ABF用量的指数级增长量化为一个关键的结构性因素:例如,个人电脑基板使用6层ABF,而高效能运算电路基板使用18层,其基板表面积是前者的3.5倍,这意味着高效能CPU基板的ABF用量不到前者的10倍,具有「双倍效应」。这意味着每块电路板的产量更高,材料用量也更大。在技术方面,此蓝图的重点在于降低高速讯号传输的介电损耗(Df),以及控制翘曲、提高抗裂性,并改善SAP层压中细线宽和间距的製造流程。积水化学的研发讯息明确提及降低损耗因子(Df)以满足224Gb乙太网路切换器及更高规格交换器的需求,这反映了下一代电气技术的发展方向。供应方面的因应措施主要集中在确保产能、提高认证流程效率以及透过多元化供应管道降低风险。现有企业正利用其事实上的标准地位(以及自产品商业化以来长期积累的认证经验)来扩展和加强其供应链,而新参与企业则致力于研发与SAP兼容的低损耗层压薄膜,以期通过FC-BGA及相关先进封装节点的客户认证项目来获取市场份额。
全球味之素增材製造膜 (ABF) 市场规模预计在 2024 年达到 5.1407 亿美元,到 2032 年达到 10.6909 亿美元,2026 年至 2032 年的复合年增长率为 10.93%。
味之素增效膜(ABF)主要产自日本,约98.66%的产量产自日本。除日本外,台湾和中国当地也有小规模ABF生产,预计未来几年中国大陆将扮演重要角色。
全球领先的味之素增材製造膜(ABF)生产商包括味之素精工株式会社、积水化学株式会社、WaferChem Technology Corporation 和太阳油墨株式会社。其中,味之素精工株式会社占据全球味之素增材製造膜(ABF)市场的主导地位,市占率约96.42%。预计未来几年将有更多公司进入味之素增材製造膜(ABF)市场。目前潜在的参与企业包括珠海宏昌电子材料有限公司、西安天河防务科技有限公司、莲花控股有限公司和广东海诺新材料科技有限公司。
台湾、日本、韩国、中国当地和东南亚是ABF薄膜销售(消费)的主要市场,分别占市场份额的41.88%、27.13%、10.99%、13.91%和5.71%。全球ABF基板主要产自这些地区,预计这些地区将继续主导全球市场。全球领先的ABF基板製造商包括Unimicron、Ibiden、南亚PCB、新光电气工业株式会社、Kinsus Interconnect、AT&S、Semco、京瓷和TOPPAN。截至2025年,以收入计算,全球排名前七的公司将占据约91.86%的市场。主要终端用户包括英特尔、AMD、英伟达、苹果和三星。截至2025年,主要终端用户正与供应商展开激烈竞争,以确保其高效能运算(HPC)晶片製造所需的ABF基板供给能力,至少持续到2026年。几乎所有ABF基板製造商都计划在未来几年扩大产能,并且有多家公司计划进入市场。未来两到五年,全球竞争环境将发生巨大变化,前景充满不不确定性。
本报告旨在对全球味之素增材膜(ABF)市场按地区/国家、产品和应用进行全面分析,重点关注总销售量、收入、价格、市场份额和主要企业的排名。
本报告以2025年为基准年,以味之素增厚膜(ABF)市场规模、估算和预测数据,以销售量(千平方公尺)和收入(百万美元)为单位进行呈现,并涵盖2020年至2031年的历史数据和预测数据。我们的定量和定性分析将帮助读者制定用味之素增厚膜(ABF)的业务和成长策略,评估竞争格局,分析自身在当前市场中的地位,并做出明智的商业决策。
市场区隔
公司
产品细分
应用领域
区域生产
按地区分類的销售额和消费量
Ajinomoto Build-up Film(TM) (ABF) is a film-type thermosetting interlayer insulating dielectric used to build high-density multilayer package substrates (typically FC-BGA / "ABF substrates"); its core product forms in industry practice include (i) dielectric film supplied for lamination in build-up stacks and (ii) adjacent supply formats and intermediates such as varnish-to-film manufacturing chains (varnish applied on carrier film) that underpin volume production and conversion. ABF's dominant applications are PC and workstation processors, servers/data centers, network equipment, and increasingly AI/HPC platforms-i.e., packages where signal integrity, wiring density, and substrate reliability are critical. The current competitive landscape remains highly concentrated: Ajinomoto discloses >95% global share for insulating films used in high-performance semiconductors, while Ajinomoto Fine-Techno's ABF page claims near-100% share in major PCs and positions ABF as the incumbent insulation film standard in that ecosystem. At the same time, the market is actively cultivating qualified alternatives in the same functional category (build-up dielectric films); for example, Sekisui markets thermosetting build-up dielectric films for FC-BGA, asserting SAP-line compatibility and adoption by major substrate suppliers (Japan/Taiwan) with OSAT assembly experience-illustrating that "second-source" development is technically and commercially underway even if the incumbent remains dominant.
Industry trends and demand drivers are increasingly defined by AI/HPC-led substrate complexity and throughput rather than legacy PC-only growth. Ajinomoto's ICT briefing explicitly ties ABF demand to telecommunications and information infrastructure growth (servers, data centers, networks), and quantifies the key structural driver as ABF intensity per substrate rising sharply: a representative comparison shows PC substrates using 6 ABF layers versus HPC substrates using 18 ABF layers, with larger substrate surface area (index 3.5) and an implication of <10X ABF usage per high-performance CPU substrate-a "double effect" of more units plus higher material per unit. On the technology side, the roadmap focuses on lower dielectric loss (Df) for higher-speed signaling, alongside warpage control, crack resistance, and manufacturability for finer line/space in SAP build-up; Sekisui's development messaging explicitly references lowering Df to meet 224Gb Ethernet switch needs and beyond, reflecting where next-generation electrical requirements are headed. Supply-side responses therefore center on capacity assurance, qualification throughput, and multi-source risk mitigation: the incumbent leverages its de facto standard position (and long qualification history since first commercialization) while expanding and hardening supply chains, and challengers pursue SAP-compatible, low-loss build-up films to win incremental share through customer qualification programs in FC-BGA and adjacent advanced packaging nodes.
The global ABF (Ajinomoto Build-up Film) market size was US$ 514.07 million in 2024 and will reach US$ 1,069.09 million in 2032; it is expected to grow at a CAGR of 10.93% from 2026 to 2032.
The ABF (Ajinomoto Build-up Film) are mainly produced in Japan, about 98.66% ABF films are produced in Japan. In addition to Japan, China Taiwan and China mainland also produce small ABF films. Chiniese is expected to play an important role in the coming years.
Global key manufacturers of ABF (Ajinomoto Build-up Film) include Ajinomoto Fine-Techno, Sekisui Chemical Co., Ltd., WaferChem Technology Corporation, and Taiyo Ink, etc. Ajinomoto Fine-Techno is dominating the global ABF (Ajinomoto Build-up Film) market, with a share about 96.42 percent. In next few years, more companies are expected to enter ABF (Ajinomoto Build-up Film) market. Currently, potential entrants include Zhuhai Hongchang Electronic Materials, Xi'an Tianhe Defense Technology, LOTUS HOLDINGS, and Guangdong Hinnotech New Materials Technology.
In terms of ABF Film sales (consumption), China Taiwan, Japan, South Korea, China mainland and Southeast Asia are the key market, with market shares 41.88%, 27.13%, 10.99%, 13.91%, and 5.71% respectively. The global ABF substrates are mainly produced in these regions. In future, there regions will still dominate the global ABF substrates market. The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2025, the global top seven players had a share approximately 91.86% in terms of revenue. Key end users are Intel, AMD, Nvidia, Apple, and Samsung, etc. In 2025, the key end users are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2026. Almost all of ABF substrates manufacturers have plans to expand production capacity in next few years, and there also several companies have planned to enter to produce ABF substrates. The global competitive situation will be totally different after two or five years, filled with uncertainty.
This report aims to provide a comprehensive presentation of the global market for ABF (Ajinomoto Build-up Film), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of ABF (Ajinomoto Build-up Film) by region & country, by Product, and by Application.
The ABF (Ajinomoto Build-up Film) market size, estimations, and forecasts are provided in terms of sales volume (K square meters) and sales revenue ($ millions), considering 2025 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding ABF (Ajinomoto Build-up Film).
Market Segmentation
By Company
Segment by Product
Segment by Application
Production by Region
Sales/Consumption by Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of ABF (Ajinomoto Build-up Film) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Product, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of ABF (Ajinomoto Build-up Film) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of ABF (Ajinomoto Build-up Film) in country level. It provides sigmate data by Product, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.