市场调查报告书
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半导体晶圆的全球市场规模、份额、成长分析(按晶圆尺寸、按应用) - 2023-2030 年产业预测Global Semiconductor Wafer Market Size, Share, Growth Analysis, By Wafer size(150mm, 200mm), By Application(Consumer Electronics, Automotive) - Industry Forecast 2023-2030 |
2022年全球半导体晶圆市场规模为191.9亿美元,预测期内(2024-2031年)复合年增长率为5.43%,从2023年的202.3亿美元增至2031年的308.8亿美元,预计将增长至10,000,000 美元。
近年来,在电子设备需求成长和半导体产业进步的推动下,全球半导体晶圆市场经历了显着扩张。这一成长的主要驱动力是智慧型手机和其他家用电子电器的日益普及,这需要能够提高性能和功能的先进IC,这刺激了对半导体晶圆的需求。此外,物联网 (IoT) 设备的快速普及和 5G 技术的普及也是促成因素。此外,在安全功能、资讯娱乐系统和电动车技术需求的推动下,先进电子和半导体元件在现代汽车中的快速集成,正在推动汽车行业成为半导体晶圆的另一个重要市场,并已成为消费者。从地理角度来看,亚太地区正在成为成长最快的市场,这主要是由于中国、韩国和台湾等国家存在主要半导体製造地。这些地区以半导体晶圆的高产量而闻名,并得到有利的政府政策和半导体基础设施投资的支持。
自上而下和自下而上的方法已用于估计和检验半导体晶圆的全球市场规模,并估计其他各个相关子市场的规模。用于估计市场规模的调查方法包括以下详细资讯:确定市场主要企业的二次研究,确定每个地区的市场占有率的主要和二次研究。整个过程包括研究主要企业的年度和财务报告以及广泛的采访,以获得执行长、副总裁、董事和行销负责人等行业领导者的重要见解。所有股份比率和细分均使用二手资讯确定并使用主要资讯检验。本研究涵盖的所有可能影响市场的参数都经过了考虑、详细研究、初步研究检验和分析,以获得最终的定量和定性资料。
半导体晶圆全球细分市场分析
全球半导体晶圆市场按晶圆尺寸、应用和地区进行细分。依晶圆尺寸,市场分为150mm、200mm、300mm和450mm。按应用划分,可分为家用电子电器、汽车和工业。依地区划分,分为北美、欧洲、亚太地区、中东/非洲、拉丁美洲。
全球半导体晶圆市场驱动因素
推动全球半导体产业扩张的关键因素是人工智慧(AI)、物联网(IoT)和自动驾驶汽车等新兴领域对最尖端科技的需求不断增长。这些领域依赖高效能半导体装置来实现复杂的功能和资料处理能力。随着这些产业不断发展并将半导体元件纳入其係统,半导体需求预计将增加,从而推动产业成长。
全球半导体晶圆市场限制因素
全球半导体产业面临的一大挑战是全球半导体晶片持续短缺。电子产品需求增加、供应链中断和地缘政治紧张等因素加剧了这种短缺。结果,製造商面临供应限制、生产週期更长和成本更高的问题。汽车、家电、通讯等严重依赖半导体晶片的产业难以满足市场需求,影响了整个产业的成长。
全球半导体晶圆市场趋势
半导体晶圆市场的一个显着趋势是强调小型化和尖端製程技术的进步。随着对更小、更强大的电子设备的需求增加,半导体製造商努力突破技术界限,生产更小、更有效的晶片。这一趋势涉及先进光刻技术的探索和引入,例如极紫外线(EUV)光刻,以及新材料和结构的采用,例如3D晶体管和奈米级架构。这些努力旨在提高半导体装置的性能、功率效率和封装密度。
Global Semiconductor Wafer Market size was valued at USD 19.19 Billion in 2022 and is poised to grow from USD 20.23 Billion in 2023 to USD 30.88 Billion by 2031, at a CAGR of 5.43% during the forecast period (2024-2031).
The global semiconductor wafer market has experienced notable expansion in recent times, propelled by heightened demand for electronic devices and advancements within the semiconductor industry. A key driver behind this growth is the increasing adoption of smartphones and other consumer electronics, which necessitate sophisticated ICs capable of delivering enhanced performance and functionality, thereby stimulating demand for semiconductor wafers. Furthermore, the surging popularity of Internet of Things (IoT) devices and the widespread deployment of 5G technology are also contributing factors. Moreover, the automotive sector represents another significant consumer of semiconductor wafers, as the integration of advanced electronics and semiconductor components in modern vehicles has surged, driven by the demand for safety features, infotainment systems, and electric vehicle technology. From a geographical perspective, Asia Pacific emerges as a burgeoning market, primarily owing to the presence of key semiconductor manufacturing hubs in countries like China, South Korea, and Taiwan. These regions are renowned for their high-volume production of semiconductor wafers, supported by favourable governmental policies and investments in semiconductor infrastructure.
Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Wafer Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analysed to get the final quantitative and qualitative data.
Global Semiconductor Wafer Market Segmental Analysis
Global Semiconductor Wafer Market is segmented by wafer size, application, and region. Based on wafer size, the market can be segmented into 150mm, 200mm, 300mm, and 450mm. Based on application, the market is segmented into consumer electronics, automotive, and industrial. Based on region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.
Drivers of the Global Semiconductor Wafer Market
A key factor propelling the expansion of the worldwide semiconductor industry is the growing need for cutting-edge technologies in emerging domains like artificial intelligence (AI), Internet of Things (IoT), and autonomous vehicles. These sectors rely on high-performance semiconductor devices to facilitate intricate functionalities and data processing capabilities. As these industries continue to grow and incorporate semiconductor components into their systems, the demand for semiconductors is anticipated to increase, thereby fuelling the industry's growth.
Restraints in the Global Semiconductor Wafer Market
A significant challenge confronting the global semiconductor industry is the persistent shortage of semiconductor chips worldwide. This scarcity has been intensified by factors including heightened demand for electronic devices, disruptions in the supply chain, and geopolitical tensions. Consequently, manufacturers have encountered supply limitations, prolonged production cycles, and escalated costs. Industries heavily reliant on semiconductor chips, such as automotive, consumer electronics, and telecommunications, have encountered difficulties in meeting market demands, thereby affecting the overall growth of the industry.
Market Trends of the Global Semiconductor Wafer Market
A notable trend observed in the semiconductor wafer market is the heightened emphasis on miniaturization and the advancement of cutting-edge process technologies. With the increasing demand for smaller yet more potent electronic devices, semiconductor producers are striving to push technological boundaries to manufacture smaller and more effective chips. This trend entails the exploration and implementation of advanced lithography methods, like extreme ultraviolet (EUV) lithography, along with the adoption of novel materials and structures, such as 3D transistors and nanoscale architectures. These endeavours aim to improve the performance, power efficiency, and packing density of semiconductor devices.