全球热管理组件市场规模、份额、成长分析，按类型（硬体和软体）、按应用（消费性电子产品、汽车）- 2024-2031 年产业预测

2022年全球热管理组件市场规模为113.5亿美元，预计将从2023年的124.7亿美元成长到2031年的265.4亿美元，预测期间（2024-2031年）复合年增长率为9.9%。

由于许多企业的快速数字化，对笔记型电脑、平板电脑和智慧型手机等电子产品的需求不断增长。热管理组件对于控制温度和避免过热是必要的，因为这些设备在运作时会产生热量。因此，由于对这些设备的需求不断增长，热管理组件的市场正在扩大。对节能解决方案日益增长的需求也推动了该行业的发展。

由于能源效率降低了成本并且对环境的负面影响较小，因此已成为许多行业的主要关注点。由于热管理组件控制电子系统和设备的温度，因此它们对于实现能源效率至关重要。使用热管理组件有助于降低电子设备的能耗，这一事实推动了对热管理组件的需求。

然而，市场也面临一些困难，例如热管理零件的价格昂贵以及最终用户对其优势的忽视。儘管存在这些障碍，预计未来几年仍将有一些重要的趋势和机会推动市场的成长。全球汽车产业的一个新兴趋势是电动和混合动力汽车的日益普及。为了控制这些汽车中电池和其他组件的温度，需要热管理组件。预计热管理组件市场将随着电动和混合动力车的需求而大幅成长。此外，由于人工智慧在热管理系统中的广泛使用以及对较小热管理组件的需求不断增长等因素，市场正在看到许多机会。

目录

执行摘要

• 市场概况
• 命运之轮

研究方法论

• 资讯采购
• 二手和主要资料来源
• 市场规模估计
• 市场假设与限制

母公司市场分析

• 市场概况
• 市场规模
• 市场动态
  • 司机
  • 机会
  • 限制
  • 挑战

主要市场洞察

• 技术分析
• 定价分析
• 供应链分析
• 价值链分析
• 市场生态系统
• 智慧财产权分析
• 贸易分析
• 启动分析
• 原料分析
• 创新矩阵
• 管道产品分析
• 总体经济指标
• 顶级投资分析
• 成功的关键因素
• 竞争程度

市场动态与展望

• 市场动态
  • 司机
  • 机会
  • 限制
  • 挑战
• 监管环境
• 波特分析
• 对未来颠覆的特别见解

按类型分類的全球热管理组件市场

• 市场概况
• 硬体和软体

全球热管理元件市场（按应用）

• 市场概况
• 消费性电子产品
• 汽车
• 航空航太和国防
• 卫生保健
• 工业的
• 其他的

全球热管理组件市场规模（按地区）

• 市场概况
• 北美洲
  • 美国
  • 加拿大
• 欧洲
  • 德国
  • 西班牙
  • 法国
  • 英国
  • 欧洲其他地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 亚太其他地区
• 拉丁美洲
  • 巴西
  • 拉丁美洲其他地区
• 中东和非洲 (MEA)
  • 海湾合作委员会国家
  • 南非
  • MEA 的其余部分

竞争格局

• 前 5 名玩家比较
• 2021 年关键参与者的市场定位
• 主要市场参与者所采取的策略
• 最佳制胜策略
• 近期市集活动
• 主要公司市占率（%），2021年

主要公司简介

• Laird Thermal Systems (UK)
• Delta Electronics, Inc. (Taiwan)
• Advanced Cooling Technologies, Inc. (US)
• Parker Hannifin Corporation (US)
• Vertiv Holdings Co (US)
• Fujipoly America Corporation (US)
• European Thermodynamics Ltd (UK)
• Zalman Tech Co. Ltd. (South Korea)
• Boyd Corporation (US)
• Master Bond Inc. (US)
• Wakefield-Vette, Inc. (US)
• Thermacore, Inc. (US)
• Henkel AG & Co. KGaA (Germany)
• Aavid Thermalloy, LLC (US)
• Cool Innovations, Inc. (US)
• Nvent Electric Plc (UK)
• Jaro Thermal (US)
• CUI Devices (US)
• TE Connectivity Ltd. (Switzerland)
• Molex, LLC (US)

Global Thermal Management Components Market size was valued at USD 11.35 Billion in 2022 and is poised to grow from USD 12.47 Billion in 2023 to USD 26.54 Billion by 2031, at a CAGR of 9.9% during the forecast period (2024-2031).

The demand for electronics like laptops, tablets, and smartphones is rising as a result of the quick digitization of many businesses. Thermal management components are necessary to control the temperature and avoid overheating because these devices produce heat while they are operating. Thus, the market for thermal management components is expanding due to the rising demand for these devices. The industry is also being driven by the increasing need for energy-efficient solutions.

Since energy efficiency lowers costs and has a little negative impact on the environment, it has become a major concern for many sectors. Because thermal management components control the temperature of electronic systems and devices, they are essential to attaining energy efficiency. The need for thermal management components is being driven by the fact that using these components helps to lower the energy consumption of electronic equipment.

The market does, however, also confront certain difficulties, such as the high price of thermal management parts and end users' ignorance of their advantages. Not withstanding these obstacles, a number of important trends and opportunities are predicted to drive the market's growth in the upcoming years. An emerging trend in the worldwide automotive industry is the growing popularity of electric and hybrid cars. To control the temperature of the battery and other components in these cars, thermal management components are needed. It is anticipated that the market for thermal management components will grow significantly along with the demand for electric and hybrid cars. Additionally, the market is seeing a number of opportunities due to factors including the expanding use of artificial intelligence in thermal management systems and the growing need for smaller thermal management components.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Thermal Management Components Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Thermal Management Components Market Segmental Analysis

Global Thermal Management Components Market is segmented on the basis of type, application, and region. By type, the market is segmented into hardware and software. By application, the market is segmented into consumer electronics, automotive, aerospace and defense, healthcare, industrial, and others. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers of the Global Thermal Management Components Market

Thermal management component demand is being driven by the increasing use of electronic devices, such as laptops, gaming consoles, tablets, smartphones, and automobile electronics. The necessity for efficient heat dissipation increases as these devices get smaller and more potent in order to avoid overheating and guarantee dependable operation.

Restraints in the Global Thermal Management Components Market

Thermoelectric coolers and high-performance heat sinks are examples of pricey advanced thermal management components. They may not be adopted as widely as they may be, particularly in marketplaces where prices are crucial. To meet market demands, manufacturers must strike a compromise between the performance and cost of their thermal management technologies.

Market Trends of the Global Thermal Management Components Market

Growing use of liquid cooling solutions: In high-power electronic applications, liquid cooling devices like liquid heat exchangers and cold plates are becoming more and more common. Better heat dissipation is provided by them in comparison to conventional air-cooling techniques. Liquid cooling technologies, for example, provide increased power densities and efficient thermal management in data centers and electric car battery cooling.

increasing emphasis on environmentally and energy-friendly solutions The development of energy- and environmentally-efficient thermal management components is becoming more and more important. This involves integrating energy-saving technologies like phase-change materials (PCMs) or thermoelectric coolers (TECs), which use waste heat for cooling purposes, with sustainable materials like bio-based thermal interface materials.

Table of Contents

Executive Summary

• Market Overview
• Wheel of Fortune

Research Methodology

• Information Procurement
• Secondary & Primary Data Sources
• Market Size Estimation
• Market Assumptions & Limitations

Parent Market Analysis

• Market Overview
• Market Size
• Market Dynamics
  • Drivers
  • Opportunities
  • Restraints
  • Challenges

Key Market Insights

• Technology Analysis
• Pricing Analysis
• Supply Chain Analysis
• Value Chain Analysis
• Ecosystem of the Market
• IP Analysis
• Trade Analysis
• Startup Analysis
• Raw Material Analysis
• Innovation Matrix
• Pipeline Product Analysis
• Macroeconomic Indicators
• Top Investment Analysis
• Key Success Factor
• Degree of Competition

Market Dynamics & Outlook

• Market Dynamics
  • Drivers
  • Opportunities
  • Restraints
  • Challenges
• Regulatory Landscape
• Porters Analysis
  • Competitive rivalry
  • Threat of Substitute Products
  • Bargaining Power of Buyers
  • Threat of New Entrants
  • Bargaining Power of Suppliers
• Skyquest Special Insights on Future Disruptions
  • Political Impact
  • Economic Impact
  • Social Impact
  • Technical Impact
  • Environmental Impact
  • Legal Impact

Global Thermal Management Components Market by Type

• Market Overview
• Hardware and software

Global Thermal Management Components Market by Application

• Market Overview
• Consumer electronics
• automotive
• aerospace and defense
• healthcare
• industrial
• and others

Global Thermal Management Components Market Size by Region

• Market Overview
• North America
  • USA
  • Canada
• Europe
  • Germany
  • Spain
  • France
  • UK
  • Rest of Europe
• Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America
  • Brazil
  • Rest of Latin America
• Middle East & Africa (MEA)
  • GCC Countries
  • South Africa
  • Rest of MEA

Competitive Landscape

• Top 5 Player Comparison
• Market Positioning of Key Players, 2021
• Strategies Adopted by Key Market Players
• Top Winning Strategies
  • By Development
  • By Company
  • By Year
• Recent Activities in the Market
• Key Companies Market Share (%), 2021

Key Company Profiles

• Laird Thermal Systems (UK)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Delta Electronics, Inc. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Advanced Cooling Technologies, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Parker Hannifin Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Vertiv Holdings Co (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Fujipoly America Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• European Thermodynamics Ltd (UK)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zalman Tech Co. Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Boyd Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Master Bond Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Wakefield-Vette, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Thermacore, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Henkel AG & Co. KGaA (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Aavid Thermalloy, LLC (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Cool Innovations, Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nvent Electric Plc (UK)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jaro Thermal (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• CUI Devices (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• TE Connectivity Ltd. (Switzerland)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Molex, LLC (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments