多层印刷电路基板市场规模、份额、成长分析（按材料类型、基板、分销管道、层数、应用、地区）- 产业预测，2025 年至 2032 年

2023 年全球多层印刷基板市场规模为 773 亿美元，预计将从 2024 年的 812.4 亿美元成长到 2032 年的 1,209.5 亿美元，预测期（2025-2032 年）的复合年增长率为 5.1%。

多层印刷电路基板(PCB) 因其众多技术优势而日益普及，例如体积小、重量轻、耐用性高以及灵活性强。这些 PCB 是满足智慧型手机和电脑等设备日益增长的小型化需求的关键，因此越来越多地应用于消费性电子、军事装备、医疗保健技术，尤其是智慧家庭自动化解决方案等各个领域。其设计将多层板整合在一块基板中，以增强功能，从而在小空间内实现高容量和高速度。此外，製造商还可以享受到生产刚性和柔性 PCB 的多功能性优势。然而，高昂的製造成本以及紧凑型设计带来的复杂性等挑战可能会阻碍该领域的市场成长。

目录

介绍

• 调查目的
• 研究范围
• 定义

调查方法

• 资讯采购
• 二次资料和一次资料方法
• 市场规模预测
• 市场假设与限制

执行摘要

• 全球市场展望
• 供需趋势分析
• 细分机会分析

市场动态与展望

• 市场概览
• 市场规模
• 市场动态
  • 驱动因素和机会
  • 限制与挑战
• 波特的分析

关键市场考察

• 关键成功因素
• 竞争程度
• 主要投资机会
• 市场生态系统
• 市场吸引力指数（2024年）
• PESTEL分析
• 总体经济指标
• 价值链分析
• 定价分析
• 案例研究
• 顾客购买行为分析

多层印刷电路基板市场规模（依材料类型划分）及复合年增长率（2025-2032）

• 市场概览
• 环氧树脂
• 聚酰亚胺
• CFR环氧树脂
• PTFE
• 热塑性塑料

多层印刷基板市场规模：依基板类型、复合年增长率（2025-2032）

• 市场概览
• 死板的
• 灵活的
• 软硬复合

多层印刷电路基板市场规模（依通路划分）及复合年增长率（2025-2032）

• 市场概览
• 直销
• 经销商
• 网上销售
• OEM

多层基板市场规模（以层数划分）及复合年增长率（2025-2032 年）

• 市场概览
• 4层
• 6层
• 8层
• 10层
• 10层或更多层

多层印刷基板市场规模（按应用划分）及复合年增长率（2025-2032）

• 市场概览
• 工业电子
• 卫生保健
• 航太/国防
• 车
• 资讯科技/通讯
• 家电
• 其他的

多层印刷基板市场规模（按地区）及复合年增长率（2025-2032）

• 北美洲
  • 美国
  • 加拿大
• 欧洲
  • 德国
  • 西班牙
  • 法国
  • 英国
  • 义大利
  • 其他欧洲国家地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 其他亚太地区
• 拉丁美洲
  • 巴西
  • 其他拉丁美洲
• 中东和非洲
  • 海湾合作委员会国家
  • 南非
  • 其他中东和非洲地区

竞争资讯

• 前五大公司对比
• 主要企业市场定位（2024年）
• 主要市场参与者所采取的策略
• 近期市场趋势
• 公司市场占有率分析（2024年）
• 主要企业简介
  • 公司详情
  • 产品系列分析
  • 公司分部份额分析
  • 收益与前一年同期比较对比（2022-2024 年）

主要企业简介

• Vector Electronics
• Compal Electronics
• Flex Ltd.
• Jabil Circuit
• Banda Electronics
• Zhen Ding Technology
• Taiwan Semiconductor Manufacturing Company
• Shenzhen Fastprint Electronics
• Sanmina Corporation
• Shenzhen Kaifa Technology
• Unimicron Technology
• Samsung Electronics
• Millennium Circuits Limited
• Nippon Mektron

结论和建议

Global Multilayer Printed Circuit Board Market size was valued at USD 77.3 billion in 2023 and is poised to grow from USD 81.24 billion in 2024 to USD 120.95 billion by 2032, growing at a CAGR of 5.1% during the forecast period (2025-2032).

Multilayer Printed Circuit Boards (PCBs) are gaining traction due to their numerous technical advantages, including compact size, lightweight design, exceptional durability, and improved flexibility. Essential for meeting the growing demand for miniaturization in devices like smartphones and computers, these PCBs are increasingly used across various sectors, such as consumer electronics, military equipment, and healthcare technologies, particularly in smart home automation solutions. Their design allows for increased functionality by combining multiple layers within a single board, delivering high capacity and speed in a reduced footprint. Moreover, manufacturers benefit from the versatility of producing both rigid and flexible PCBs. However, challenges such as high production costs and the complexity associated with compact designs may hinder market growth in this sector.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Multilayer Printed Circuit Board market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Multilayer Printed Circuit Board Market Segments Analysis

Global Multilayer Printed Circuit Board Market is segmented by Material Type, Substrate, Distribution Channel, Number of Layers, Application and region. Based on Material Type, the market is segmented into Epoxy Resin, Polyimide, CFR-epoxy, PTFE and Thermoplastic. Based on Substrate, the market is segmented into Rigid, Flexible and Rigid-Flex. Based on Distribution Channel, the market is segmented into Direct Sales, Distributors, Online Sales and OEMs. Based on Number of Layers, the market is segmented into 4 Layers, 6 Layers, 8 Layers, 10 Layers and More than 10 Layers. Based on Application, the market is segmented into Industrial Electronics, Healthcare, Aerospace and Defense, Automotive, IT and Telecom, Consumer Electronics and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Multilayer Printed Circuit Board Market

The global demand for electronic devices, including smartphones, laptops, and smart televisions, has significantly surged, driving the growth of the multilayer printed circuit board market. This upsurge is largely attributed to the increasing global population, which has heightened the need for advanced electronic gadgets. Additionally, the role of automated machinery and the prevalence of cellular towers in this tech-driven age cannot be overlooked. Furthermore, these electronic devices are not only essential for consumer use but also play a critical role in sectors such as aerospace, military, and various government institutions, all of which contribute to the expanding requirements for multilayer printed circuit boards.

Restraints in the Global Multilayer Printed Circuit Board Market

One of the key challenges facing the global multilayer printed circuit board market is the high cost associated with manufacturing, design, and depaneling processes. These expenses can significantly drive up the overall cost of multilayer boards. As a result, many leading electrical device manufacturers often turn to more affordable alternatives, which can be more economically viable. Additionally, the production timeline for multilayer printed circuit boards is considerably longer compared to that of traditional single or double-layer boards, further escalating costs and impacting the final product pricing. This combination of factors poses a significant restraint on market growth.

Market Trends of the Global Multilayer Printed Circuit Board Market

The Global Multilayer Printed Circuit Board (PCB) market is witnessing substantial growth, driven by the rapid adoption of technologies such as Artificial Intelligence (AI), the Internet of Things (IoT), and 5G. As we move further into a digitized era, the demand for efficient, high-capacity data transmission and processing solutions is accelerating. Multilayer PCBs are uniquely positioned to support these trends, offering enhanced capabilities for managing vast amounts of data with minimal latency. This synergy between multilayer PCBs and advanced technologies not only fuels market expansion but also aligns with the increasing need for innovative electronic applications across various industries.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Case Studies
• Customer Buying Behavior Analysis

Global Multilayer Printed Circuit Board Market Size by Material Type & CAGR (2025-2032)

• Market Overview
• Epoxy Resin
• Polyimide
• CFR-epoxy
• PTFE
• Thermoplastic

Global Multilayer Printed Circuit Board Market Size by Substrate & CAGR (2025-2032)

• Market Overview
• Rigid
• Flexible
• Rigid-Flex

Global Multilayer Printed Circuit Board Market Size by Distribution Channel & CAGR (2025-2032)

• Market Overview
• Direct Sales
• Distributors
• Online Sales
• OEMs

Global Multilayer Printed Circuit Board Market Size by Number of Layers & CAGR (2025-2032)

• Market Overview
• 4 Layers
• 6 Layers
• 8 Layers
• 10 Layers
• More than 10 Layers

Global Multilayer Printed Circuit Board Market Size by Application & CAGR (2025-2032)

• Market Overview
• Industrial Electronics
• Healthcare
• Aerospace and Defense
• Automotive
• IT and Telecom
• Consumer Electronics
• Others

Global Multilayer Printed Circuit Board Market Size & CAGR (2025-2032)

• North America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • US
  • Canada
• Europe (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Vector Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Compal Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Flex Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jabil Circuit
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Banda Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zhen Ding Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Taiwan Semiconductor Manufacturing Company
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Fastprint Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sanmina Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Kaifa Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unimicron Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Millennium Circuits Limited
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nippon Mektron
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations