封面
市场调查报告书
商品编码
1909148

3D感测器市场规模、份额和成长分析(按连接方式、测量方法、类型、技术、最终用途产业和地区划分)-2026-2033年产业预测

3D Sensor Market Size, Share, and Growth Analysis, By Connectivity, By Measuring Method, By Type, By Technology, By End Use Industry, By Region - Industry Forecast 2026-2033

出版日期: | 出版商: SkyQuest | 英文 196 Pages | 商品交期: 3-5个工作天内

价格
简介目录

全球 3D 感测器市场规模预计在 2024 年达到 52 亿美元,从 2025 年的 66 亿美元成长到 2033 年的 444 亿美元,在预测期(2026-2033 年)内复合年增长率为 26.9%。

受智慧型设备日益普及及其在交通运输、医疗保健和工业自动化等领域与家用电子电器融合的推动,全球3D感测器市场正经历显着成长。製造商正致力于开发先进的3D感测技术,例如脸部辨识、手势控制和深度感知,这些技术对于市场扩张至关重要。随着智慧型手机製造商利用结构光和飞行时间技术增强生物识别安全性并实现身临其境型用户体验,人工智慧智慧型手机、穿戴式装置和AR/VR设备的需求激增进一步推动了3D感测器产业的发展。 VR头戴装置的销售量预计将大幅成长,这印证了3D感测器在塑造消费性电子产品未来发展中日益重要的地位。

全球3D感测器市场驱动因素

3D感测器技术的进步是全球市场的主要驱动力,这主要得益于其在游戏主机、扩增实境(AR)和虚拟实境(VR)设备以及智慧型手机中的广泛应用。该技术透过飞行时间(ToF)感测器和结构光感测器,实现了脸部辨识、手势追踪和身临其境型使用者体验等应用。随着对互动功能和高品质影像处理的需求持续增长,包括电子产业主要企业的主要企业都在积极采用并广泛应用这些功能。因此,电子产业已成为3D感测器市场的主要收入来源。

限制全球3D感测器市场的因素

全球3D感测器市场面临诸多限制因素,包括结构光、光达和飞行时间(ToF)感测器的高成本,这些都阻碍了其在大众市场的普及。儘管价格正在逐步降低,但目前的价格仍然是中阶设备普及的一大障碍。此外,经济和健康方面的挑战使得进入东南亚和印度等价格敏感型市场变得特别困难,尤其是在旅行限制期间。如何在性能和价格之间取得平衡仍然是一项挑战,尤其是在消费性电子和汽车等快速发展的行业对高性价比解决方案的需求日益增长的情况下。

全球3D感测器市场趋势

全球3D感测器市场正经历一场变革,人工智慧(AI)和物联网(IoT)的融合成为其发展的核心。这种整合正在提升自动化、安防、医疗健康等多个领域的即时决策能力,并催生机器人和病患监测等应用。 5G技术和边缘运算的广泛应用进一步加速了这一趋势,它们能够实现更快的数据处理和更高级的应用,最终促进3D感测器的普及。随着这些技术的不断发展,一个充满活力的生态系统正在形成,不断提升3D感测器的功能和通用性,使其始终处于创新前沿。

目录

介绍

  • 调查目标
  • 调查范围
  • 定义

调查方法

  • 资讯收集
  • 二手资料和一手资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 细分市场机会分析

市场动态与展望

  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 限制与挑战
  • 波特分析

关键市场考察

  • 关键成功因素
  • 竞争程度
  • 关键投资机会
  • 市场生态系统
  • 市场吸引力指数(2025)
  • PESTEL 分析
  • 总体经济指标
  • 价值链分析
  • 定价分析

全球3D感测器市场规模:依连接方式及复合年增长率划分(2026-2033年)

  • 有线网路连接
  • 无线网路连线

全球3D感测器市场规模(按测量方法和复合年增长率划分)(2026-2033年)

  • 时延法
  • 三角测量法
  • 聚焦法

全球3D感测器市场规模(按类型和复合年增长率划分)(2026-2033年)

  • 影像感测器
  • 位置感测器
  • 声波感测器
  • 磁力计
  • 其他感测器

全球3D感测器市场规模(依技术及复合年增长率划分)(2026-2033年)

  • 立体视觉
  • 结构光
  • 飞行时间法
  • 超音波
  • 其他技术

全球3D感测器市场规模(依终端用户产业划分)及复合年增长率(2026-2033年)

  • 家用电子电器
  • 工业机器人
  • 航太/国防
  • 卫生保健
  • 娱乐
  • 其他终端用户产业

全球3D感测器市场规模及复合年增长率(2026-2033年)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 西班牙
    • 法国
    • 英国
    • 义大利
    • 其他欧洲地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 亚太其他地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地区
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东和非洲地区

竞争资讯

  • 前五大公司对比
  • 主要企业的市场定位(2025 年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市占率分析(2025 年)
  • 主要企业公司简介
    • 公司详情
    • 产品系列分析
    • 依业务板块进行公司股票分析
    • 2023-2025年营收年比比较

主要企业简介

  • Infineon Technologies AG(Germany)
  • Microchip Technology Inc.(USA)
  • Sony Group Corporation(Japan)
  • STMicroelectronics NV(Switzerland)
  • Intel Corporation(USA)
  • ams-OSRAM AG(Austria)
  • Qualcomm Technologies Inc.(USA)
  • Keyence Corporation(Japan)
  • OMNIVISION Technologies Inc.(USA)
  • Cognex Corporation(USA)
  • Texas Instruments Inc.(USA)
  • Samsung Electronics Co. Ltd.(South Korea)
  • LMI Technologies Inc.(USA)
  • ifm electronic GmbH(Germany)
  • SICK AG(Germany)
  • NXP Semiconductors(Netherlands)
  • Lumentum Holdings Inc.(USA)
  • Velodyne Lidar Inc.(USA)
  • Melexis NV(Belgium)
  • PMD Technologies AG(Germany)

结论与建议

简介目录
Product Code: SQMIG45J2355

Global 3D Sensor Market size was valued at USD 5.2 Billion in 2024 and is poised to grow from USD 6.6 Billion in 2025 to USD 44.4 Billion by 2033, growing at a CAGR of 26.9% during the forecast period (2026-2033).

The global market for 3D sensors is witnessing significant growth driven by the rising adoption of smart devices and the integration of consumer electronics across sectors such as transportation, healthcare, and industrial automation. Manufacturers are innovating with advanced 3D sensing capabilities, including facial recognition, gesture control, and depth sensing, which are crucial for market expansion. The surge in demand for AI smartphones, wearables, and AR/VR devices further propels the 3D sensor industry, as smartphone makers enhance biometric security and facilitate immersive user experiences through structured light and time-of-flight technology. Projections indicate a substantial increase in sales of VR headgear, underscoring the growing importance of 3D sensors in shaping the future of consumer electronics.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global 3D Sensor market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global 3D Sensor Market Segments Analysis

Global 3D Sensor Market is segmented by Connectivity, Measuring Method, Type, Technology, End Use Industry and region. Based on Connectivity, the market is segmented into Wired Network Connectivity and Wireless Network Connectivity. Based on Measuring Method, the market is segmented into Time-Delay Method, Triangulation Method and Focus Method. Based on Type, the market is segmented into Image Sensor, Position Sensor, Acoustic Sensor, Magnetometer and Other Sensors. Based on Technology, the market is segmented into Stereo Vision, Structured Light, Time-Of-Flight, Ultrasound and Other Technologies. Based on End Use Industry, the market is segmented into Consumer Electronics, Automotive, Industrial Robotics, Aerospace & Defense, Healthcare, Entertainment and Other End-Use Industries. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global 3D Sensor Market

The advancement of 3D sensor technology has become a pivotal driver in the global market, particularly with its integration into gaming consoles, augmented reality (AR) and virtual reality (VR) devices, as well as smartphones. This technology enables applications such as face recognition, gesture tracking, and immersive user experiences through time-of-flight (ToF) and structured light sensors. As the demand for interactive features and high-quality imaging continues to grow, leading companies, including prominent names in the electronics sector, have embraced and widely implemented these capabilities. Consequently, the electronics industry stands out as the primary revenue contributor within the 3D sensor market landscape.

Restraints in the Global 3D Sensor Market

The Global 3D Sensor market faces significant restraints, notably high costs associated with structured light, LiDAR, and Time-of-Flight (ToF) sensors, which hinder their adoption in mass markets. Despite gradual improvements in affordability, the current pricing remains a barrier for mid-range devices. Additionally, economic challenges and health-related issues have made price-sensitive markets, such as those in Southeast Asia and India, particularly difficult to penetrate, especially during periods of restricted movement. Balancing performance with affordability continues to pose a challenge, particularly for rapidly evolving sectors like consumer electronics and the automotive industry, where cost-effective solutions are increasingly sought after.

Market Trends of the Global 3D Sensor Market

The Global 3D Sensor market is witnessing a transformative shift as integration with artificial intelligence (AI) and the Internet of Things (IoT) takes center stage. This convergence enhances real-time decision-making capabilities across various sectors, notably in automation, security, and healthcare with applications such as robotics and patient monitoring. The proliferation of 5G technology and edge computing is further propelling this trend by enabling faster data processing and more sophisticated applications, ultimately facilitating broader deployment. As these technologies evolve, they are creating a dynamic ecosystem that elevates the functionality and versatility of 3D sensors, positioning them at the forefront of innovation.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2025
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis

Global 3D Sensor Market Size by Connectivity & CAGR (2026-2033)

  • Market Overview
  • Wired Network Connectivity
  • Wireless Network Connectivity

Global 3D Sensor Market Size by Measuring Method & CAGR (2026-2033)

  • Market Overview
  • Time-Delay Method
  • Triangulation Method
  • Focus Method

Global 3D Sensor Market Size by Type & CAGR (2026-2033)

  • Market Overview
  • Image Sensor
  • Position Sensor
  • Acoustic Sensor
  • Magnetometer
  • Other Sensors

Global 3D Sensor Market Size by Technology & CAGR (2026-2033)

  • Market Overview
  • Stereo Vision
  • Structured Light
  • Time-Of-Flight
  • Ultrasound
  • Other Technologies

Global 3D Sensor Market Size by End Use Industry & CAGR (2026-2033)

  • Market Overview
  • Consumer Electronics
  • Automotive
  • Industrial Robotics
  • Aerospace & Defense
  • Healthcare
  • Entertainment
  • Other End-Use Industries

Global 3D Sensor Market Size & CAGR (2026-2033)

  • North America (Connectivity, Measuring Method, Type, Technology, End Use Industry)
    • US
    • Canada
  • Europe (Connectivity, Measuring Method, Type, Technology, End Use Industry)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Connectivity, Measuring Method, Type, Technology, End Use Industry)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Connectivity, Measuring Method, Type, Technology, End Use Industry)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Connectivity, Measuring Method, Type, Technology, End Use Industry)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2025
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2025
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

  • Infineon Technologies AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Microchip Technology Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Sony Group Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics N.V. (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ams-OSRAM AG (Austria)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Qualcomm Technologies Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Keyence Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • OMNIVISION Technologies Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Cognex Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Texas Instruments Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Samsung Electronics Co. Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • LMI Technologies Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ifm electronic GmbH (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • SICK AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • NXP Semiconductors (Netherlands)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Lumentum Holdings Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Velodyne Lidar Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Melexis N.V. (Belgium)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • PMD Technologies AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations