多层印刷电路基板市场规模、份额和成长分析（按材料类型、基板、通路、层数、应用和地区划分）—2026-2033年产业预测

预计到 2024 年，全球多层印刷电路基板(PCB) 市场规模将达到 812.4 亿美元，到 2025 年将达到 853.9 亿美元，到 2033 年将达到 1271.2 亿美元，预测期（2026-2033 年）的复合年增长率为 5.1%。

由于其许多技术优势，包括尺寸紧凑、重量轻、耐用性和柔软性，全球多层印刷电路基板(PCB) 市场正经历显着成长。这些特性满足了智慧型手机和电脑对轻量化、高效组件日益增长的需求。多层 PCB 的应用领域十分广泛，涵盖电子、军事、医疗以及快速发展的智慧家庭自动化市场。多层整合能够实现更强大的功能和更优异的电气性能，在紧凑的面积内提供高容量和高速度。虽然刚性和柔性设计的可製造柔软性带来了机会，但高昂的维护成本以及对紧凑型多层解决方案的需求也为市场扩张带来了挑战。

推动全球多层印刷基板市场发展的因素

全球对智慧型手机、笔记型电脑和智慧型电视等电子设备的需求是推动多层印刷基板市场成长的主要因素。随着全球人口的成长，这些重要设备的普及率显着提高，从而带动了对印刷电路基板的需求。这些元件在确保效率和功能方面发挥着至关重要的作用，不仅在家用电子电器领域，而且在航太、军事和政府机构等关键领域也是如此。此外，自动化机械和通讯基础设施整合的进步也进一步推动了各工业领域对多层印刷电路基板的需求成长。

限制全球多层印刷基板市场的因素

多层印刷基板的製造流程面临许多挑战，主要原因在于其生产、设计和分板等环节的高成本。这些环节的高昂成本促使企业寻求更经济的替代方案，尤其是在电子产业的竞争对手积极采用低成本解决方案的情况下。此外，与传统的单层或双层基板相比，多层基板的製造週期更长，这进一步增加了成本，最终影响成品的整体定价。这些因素共同限制了多层印刷电路基板在全球市场的成长与普及。

全球多层印刷基板市场趋势

受人工智慧、物联网和5G等先进技术需求不断增长的推动，全球多层印刷基板市场正经历强劲成长。随着数位转型加速，这些技术需要高效的资料传输、处理和管理能力，而多层印刷电路板凭藉其能够容纳复杂电路设计和高密度应用的能力，恰好满足了这些需求。电子设备小型化和高性能的趋势进一步推动了对多层印刷电路基板的需求，使製造商能够开发紧凑、高性能的产品，以应对低延迟和数据密集型应用的挑战。这些技术的融合使多层印刷电路基板成为不断发展的电子产业中不可或缺的关键组成部分。

目录

介绍

• 调查目标
• 调查范围
• 定义

调查方法

• 资讯收集
• 二手资料和一手资料方法
• 市场规模预测
• 市场假设与限制

执行摘要

• 全球市场展望
• 供需趋势分析
• 细分市场机会分析

市场动态与展望

• 市场规模
• 市场动态
  • 驱动因素和机会
  • 限制与挑战
• 波特分析

关键市场考察

• 关键成功因素
• 竞争程度
• 关键投资机会
• 市场生态系统
• 市场吸引力指数（2025）
• PESTEL 分析
• 总体经济指标
• 价值链分析
• 定价分析
• 案例研究
• 顾客购买行为分析

全球多层印刷基板市场规模（按材料类型和复合年增长率划分）（2026-2033 年）

• 环氧树脂
• 聚酰亚胺
• CFR-环氧树脂
• 聚四氟乙烯（PTFE）
• 热塑性树脂

全球多层印刷基板市场规模（按基板和复合年增长率划分）（2026-2033 年）

• 刚性基板
• 软式电路板
• 软硬复合

全球多层印刷电路基板市场规模（依通路划分）及复合年增长率（2026-2033 年）

• 直销
• 经销商
• 线上销售
• OEM

全球多层印刷基板市场规模（按层数和复合年增长率划分）（2026-2033 年）

• 4层
• 6层
• 8层
• 10层
• 10层或更多层

全球多层印刷基板市场规模（按应用及复合年增长率划分）（2026-2033 年）

• 工业电子
• 卫生保健
• 航太/国防
• 车
• 资讯科技/通讯
• 家用电子电器
• 其他的

全球多层印刷电路基板市场规模及复合年增长率（2026-2033）

• 北美洲
  • 美国
  • 加拿大
• 欧洲
  • 德国
  • 西班牙
  • 法国
  • 英国
  • 义大利
  • 其他欧洲地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 亚太其他地区
• 拉丁美洲
  • 巴西
  • 其他拉丁美洲地区
• 中东和非洲
  • 海湾合作委员会国家
  • 南非
  • 其他中东和非洲地区

竞争资讯

• 前五大公司对比
• 主要企业的市场定位（2025 年）
• 主要市场参与者所采取的策略
• 近期市场趋势
• 公司市占率分析（2025 年）
• 主要企业公司简介
  • 公司详情
  • 产品系列分析
  • 依业务板块进行公司股票分析
  • 2023-2025年营收年比比较

主要企业简介

• Vector Electronics
• Compal Electronics
• Flex Ltd.
• Jabil Circuit
• Banda Electronics
• Zhen Ding Technology
• Taiwan Semiconductor Manufacturing Company
• Shenzhen Fastprint Electronics
• Sanmina Corporation
• Shenzhen Kaifa Technology
• Unimicron Technology
• Samsung Electronics
• Millennium Circuits Limited
• Nippon Mektron

结论与建议

Global Multilayer Printed Circuit Board Market size was valued at USD 81.24 Billion in 2024 and is poised to grow from USD 85.39 Billion in 2025 to USD 127.12 Billion by 2033, growing at a CAGR of 5.1% during the forecast period (2026-2033).

The global market for Multilayer Printed Circuit Boards (PCBs) is witnessing significant growth driven by their numerous technical advantages, including compact size, lightweight design, durability, and enhanced flexibility. These features cater to the increasing demand for lightweight and efficient components in smartphones and computers. Multilayer PCBs find applications across diverse sectors, such as electronics, military, healthcare, and the rapidly evolving smart home automation market. Their ability to integrate multiple layers allows for greater functionality and superior electrical performance with high capacity and speed in a reduced footprint. While the flexibility in manufacturing both rigid and flexible designs presents opportunities, the higher costs associated with service availability and the need for compact, multi-layer solutions pose challenges to market expansion.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Multilayer Printed Circuit Board market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Multilayer Printed Circuit Board Market Segments Analysis

Global Multilayer Printed Circuit Board Market is segmented by Material Type, Substrate, Distribution Channel, Number of Layers, Application and region. Based on Material Type, the market is segmented into Epoxy Resin, Polyimide, CFR-epoxy, PTFE and Thermoplastic. Based on Substrate, the market is segmented into Rigid, Flexible and Rigid-Flex. Based on Distribution Channel, the market is segmented into Direct Sales, Distributors, Online Sales and OEMs. Based on Number of Layers, the market is segmented into 4 Layers, 6 Layers, 8 Layers, 10 Layers and More than 10 Layers. Based on Application, the market is segmented into Industrial Electronics, Healthcare, Aerospace and Defense, Automotive, IT and Telecom, Consumer Electronics and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Multilayer Printed Circuit Board Market

The global demand for electronic devices, including smartphones, laptops, and smart televisions, is a primary catalyst driving the growth of the multilayer printed circuit board market. As the global population continues to rise, the penetration of these essential devices has significantly increased, leading to a heightened need for printed circuit boards. These components play a crucial role not only in consumer electronics but also in critical sectors such as aerospace, military, and government institutions, ensuring efficiency and functionality. Additionally, the integration of automated machinery and advancements in telecommunications infrastructure further support the burgeoning demand for multilayer printed circuit boards across various industries.

Restraints in the Global Multilayer Printed Circuit Board Market

The manufacturing process of multilayer printed circuit boards faces significant challenges, primarily due to high costs associated with production, design, and depaneling. The expense of these processes often leads companies to seek more affordable alternatives, particularly as competitors in the electronics sector increasingly adopt lower-cost solutions. Additionally, the extended production time required for multilayer boards, compared to traditional single or double-layer options, further exacerbates costs, ultimately impacting the overall pricing of the final product. This combination of factors poses a considerable restraint on the growth and adoption of multilayer printed circuit boards in the global market.

Market Trends of the Global Multilayer Printed Circuit Board Market

The Global Multilayer Printed Circuit Board market is experiencing robust growth, driven by the increasing demand for advanced technologies such as AI, IoT, and 5G. As digital transformation accelerates, these technologies require efficient data transmission, processing, and management capabilities, which multilayer PCBs facilitate through their ability to handle complex circuit designs and high-density applications. The trend towards miniaturization and enhanced performance in electronic devices further fuels the need for multilayer PCBs, enabling manufacturers to create compact, high-performance products that meet the challenges of low latency and data-intensive applications. This convergence of technological advancements positions multilayer PCBs as a critical component in the evolving electronics landscape.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2025
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Case Studies
• Customer Buying Behavior Analysis

Global Multilayer Printed Circuit Board Market Size by Material Type & CAGR (2026-2033)

• Market Overview
• Epoxy Resin
• Polyimide
• CFR-epoxy
• PTFE
• Thermoplastic

Global Multilayer Printed Circuit Board Market Size by Substrate & CAGR (2026-2033)

• Market Overview
• Rigid
• Flexible
• Rigid-Flex

Global Multilayer Printed Circuit Board Market Size by Distribution Channel & CAGR (2026-2033)

• Market Overview
• Direct Sales
• Distributors
• Online Sales
• OEMs

Global Multilayer Printed Circuit Board Market Size by Number of Layers & CAGR (2026-2033)

• Market Overview
• 4 Layers
• 6 Layers
• 8 Layers
• 10 Layers
• More than 10 Layers

Global Multilayer Printed Circuit Board Market Size by Application & CAGR (2026-2033)

• Market Overview
• Industrial Electronics
• Healthcare
• Aerospace and Defense
• Automotive
• IT and Telecom
• Consumer Electronics
• Others

Global Multilayer Printed Circuit Board Market Size & CAGR (2026-2033)

• North America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • US
  • Canada
• Europe (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2025
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2025
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

• Vector Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Compal Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Flex Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jabil Circuit
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Banda Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zhen Ding Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Taiwan Semiconductor Manufacturing Company
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Fastprint Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sanmina Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Kaifa Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unimicron Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Millennium Circuits Limited
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nippon Mektron
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations