市场调查报告书
商品编码
1324352
2030 年存储设备市场预测 - 按类型、用途、最终用户和地区分類的全球分析Memory Devices Market Forecasts to 2030 - Global Analysis By Type, Application, End User and By Geography |
据Stratistics MRC预测,2023年全球存储器件市场规模将达到1705.1亿美元,预计2030年将达到5087.1亿美元,复合年增长率为16.9%。
存储设备,例如计算机存储器,是用于存储数字资料的数字电子半导体设备。资料通常存储在硅积体电路存储芯片上的金属氧化物半导体 (MOS) 存储单元中。硅通常从沙子中开采出来,是这些积体电路的起点。工程师、冶金学家、化学家和物理学家都参与了将硅转化为存储芯片的过程。内存是在称为晶圆厂的大型设施中製造的,这些设施具有一些内置的洁净室条件。即使断电,资料和资讯也不会丢失或删除。它可以以很少的电力消耗存储大量的资料和资讯。
据美国能源部统计,美国大约有300万个资料中心。
大多数新兴国家都专注于数字意识和数字化。作为其中的一部分,许多国家正在积极实施物联网(IoT)技术。智能和链接设备系统已成为开发物联网项目的一个重要方面,因为它们促进了日常生活的自动化。解决方案需要大量的半导体存储器来存储资讯以及输入和输出资料。全球市场可能会受到这些技术在新兴国家的快速采用的推动。
半导体存储器件正在迅速流行。然而,建立存储器件製造设备所需的初始投资过高。晶圆、MOSFET、晶体管和冷却系统是这些设备中使用的昂贵零件。这直接影响最终产品的售价。此外,建立这些存储设备的製造设备需要时间,这阻碍了市场的增长。
大多数新兴国家正在做出巨大努力,以提高数字素养并实现经济数字化。存储设备生产的数字化提高了运营效率并实现自动化。电子行业的快速数字化和自动化以及智能手机、可穿戴设备和电子设备等技术先进设备中基于内存的功能的使用正在推动市场扩张。
内存存储设备和半导体製造商严重依赖中国公司,因为他们的大部分原材料都来自中国。该国首先受到疫情的重创,限制了当地市场,并导致半导体供应链出现问题。疫情影响对市场造成重大影响,导致原材料资源紧缺。这方面阻碍了市场的扩展。
COVID-19 大流行对 2020 年上半年的市场研究供应炼和製造业产生了重大影响。这对全球经济活动产生了负面影响。各国 COVID-19 病例的增加影响了市场的增长。突然实施的封锁限制迫使多家製造工厂关闭。此外,多个国家的硅等原材料供应链也受到干扰。此外,许多政府机构和重要公司已製定政策和计划来应对 COVID-19 的影响,这将在整个预测期内推动市场增长。
静态随机存取存储器(SRAM)领域预计将出现良好的增长。 SRAM 的运行速度明显快于 DRAM。 SRAM 功耗较低,用于速度敏感的缓存。 SRAM的内容不需要刷新。 SRAM 比 DRAM 更耐辐射。该领域的增长是由低功耗、高速缓存和效率推动的。
预计消费电子设备行业在预测期内将出现最快的年复合成长率。存储卡是一种电子资料存储设备,通常使用闪存来存储数字资讯。常见于数字便携式电子产品中。您可以通过将卡插入插槽而不是突出的 USB 闪存驱动器来为这些设备添加内存。智能手机和数码相机的普及正在推动这一领域的增长。
由于人工智能和物联网的采用不断增加,预计亚太地区在预测期内将占据最大的市场份额。此外,主要企业正在使用不同的业务方法,这有助于区域市场的扩张。销售额最高的国家是中国。中国拥有一些世界上最现代化的製造设施。由于个人电脑和工业中最新技术的使用,亚洲市场预计在预测期内将显着增长。
由于快速变化的技术,预计北美在预测期内将呈现最高的年复合成长率。企业间产生的大量资料催生了对该国更高效处理解决方案的需求。随着移动和低功耗设备、高端资料中心和大型片上缓存的引入,对非易失性、高密度、低能耗存储器提出了新的高优先级要求。美国在内存半导体製造技术,特别是DRAM和3D-NAND方面重新获得了竞争力。资料中心需求的不断扩大正在推动该地区内存零件的需求。
According to Stratistics MRC, the Global Memory Devices Market is accounted for $170.51 billion in 2023 and is expected to reach $508.71 billion by 2030 growing at a CAGR of 16.9% during the forecast period. Memory devices, such as computer memory, are digital electronic semiconductor devices used for digital data storage. Data is often stored in metal-oxide-semiconductor (MOS) memory cells on a silicon integrated circuit memory chip in such devices. Silicon, which is often mined from sand, is the starting point for these integrated circuits. Engineers, metallurgists, chemists, and physicists are all involved in the process of converting silicon into memory chips. Memory is manufactured in a massive facility known as a fab, which incorporates several clean room conditions. Even when there is no electricity, they do not lose or delete data or information. They can store large quantities of data and information while consuming very little power.
According to the US Department of Energy, there are about 3 million data centers in the United States.
The majority of emerging economies are focusing on digital awareness and digitalization. Many countries are actively implementing Internet of Things (IoT) technology on a big scale as part of the agenda. Smart and linked device systems are an important aspect of developing IoT projects since they encourage automation in everyday life. To store information and input and output data, the solutions require significant amounts of semiconductor memory. The worldwide market will be driven by the rapid adoption of these technologies in emerging economies.
Semiconductor memory devices are quickly gaining popularity. However, the initial investment necessary to establish any memory device manufacturing unit is too expensive. Wafers, MOSFETs, transistors, and cooling systems are among the more costly components used in these devices. This has a direct influence on the final product's selling price. Furthermore, the installation of manufacturing equipment for these memory devices takes time, which is impeding market growth.
The bulk of emerging economies are putting substantial effort into becoming digitally literate and digitizing their economies. Digitalization in memory device production enhances operational efficiency and enables automation. Rapid digitization and automation in the electronics sector, as well as the use of memory-based features in technologically sophisticated devices like as smartphones, wearables, and electronics, are driving market expansion.
Memory storage device and semiconductor makers rely largely on Chinese enterprises since the majority of the materials are sourced from China. The country was first devastated by the epidemic and put limitations on the local market, causing problems in the semiconductor supply chain. The pandemic effect has had a significant impact on the market, resulting in a scarcity of raw resources. This aspect is impeding market expansion.
The global COVID-19 epidemic greatly impacted the supply chain and manufacturing of market research in the first half of 2020. This had a detrimental influence on global economic activity. The increase in COVID-19 instances in various nations has had an impact on market growth. The installation of abrupt lockdown limitations has forced the shutdown of several manufacturing units. Furthermore, the raw material supply chain, such as silicon, has been interrupted in various nations. Furthermore, many government agencies and important businesses are developing policies and plans to address the COVID-19 impact, which will drive market growth throughout the projection period.
The static random access memory (SRAM) segment is estimated to have a lucrative growth. SRAM operates at a considerably quicker rate than DRAM. SRAM consumes less power and is used to provide speed-sensitive caching. The contents of SRAM do not need to be refreshed. SRAMs are more radiation resistant than DRAM. The segment's growth is being fuelled by its low power consumption, cache memory, and efficiency.
The consumer electronics segment is anticipated to witness the fastest CAGR growth during the forecast period. A memory card is an electronic data storage device that commonly uses flash memory to store digital information. These are frequently seen in digital portable electronic gadgets. They enable additional memory to such devices by inserting a card into a socket rather than a protruding USB flash drive. The increased use of smart phones and digital cameras is driving the segment's rise.
Asia Pacific is projected to hold the largest market share during the forecast period owing to increasing adoption of AI and the Internet of Things. Key corporations have also used a variety of business approaches, which has contributed to the area market's expansion. China is the country with the most revenue. China features some of the world's most modern manufacturing facilities. The Asian market is expected to grow considerably during the projected period due to the use of modern technologies in both personal computers and industries.
North America is projected to have the highest CAGR over the forecast period, owing to rapidly changing technologies. High data creation across businesses is generating a demand in the country for more efficient processing solutions. With the introduction of mobile and low-power devices, as well as high-end data centers and massive on-chip caches, a new high-priority requirement emerged: non-volatile, dense, and low-energy-consuming memories. The United States has recovered its competitiveness in memory semiconductor manufacturing technologies, particularly in DRAM and 3D-NAND. The growing demand for data centers is driving up demand for memory components in the region.
Some of the key players profiled in the Memory Devices Market include: IBM Corporation, Intel Corporation, Samsung Electronics Co. Ltd, Cypress Semiconductor Corporation, Micron Technology Inc., Kioxia Corporation, SK Hynix Inc., Nvidia Corporation, ROHM Co. Ltd., Maxim Integrated Products Inc., STMicroelectronics NV, Fujitsu, Broadcom Inc., Toshiba Corporation, Macronix International Co Limited, Taiwan Semiconductor, Sony, LAM Research, Texas Instruments and Silicon Catalyst.
In March 2022, Kioxia Corporation, a provider of memory solutions, announced it would start construction of an advanced new fabrication facility at its Kitakami Plant in Japan for the possible expansion of manufacturing of its proprietary 3D Flash memory BiCSFLASHTM. Construction of this facility is planned to commence in April 2022 and is expected to be completed in 2023.
In December 2021, Micron Technology announced plans for its new memory design center in Midtown Atlanta, the United States, expanding the company's reach into the Southeast United States. Micron aims to establish strong partnerships with many institutions in the region including Georgia Tech, Emory University, Spelman College Morehouse College, and the University of Georgia.
In July 2021, Intel Corporation, a global supplier of advanced processing units and memory storage systems, has partnered with MediaTek, a supplier of processors for smartphones. Through this partnership, the two companies will be able to share a foundry for manufacturing semiconductors and memory storage devices.
In Aug 2019, Samsung announced its 6th generation V-NAND memory with 100 active layers using new circuit design technology. It features 10% lower latencies and consumes 15% lower amount of power when compared to Samsung's previous-generation V-NAND products. This V-NAND also features lower power consumption than its predecessors.
In July 2019, Fujitsu Semiconductor announced the release of the 8Mbit ReRAM MB85AS8MT, which is reportedly the world's largest density as a mass-produced This ReRAM product, suitable for wearable devices, was jointly developed with Panasonic Semiconductor Solutions Co. Limited.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.