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2030 年粘合片市场预测 - 按黏合材料、最终用户和地区分類的全球分析Bonding Sheet Market Forecasts to 2030 - Global Analysis By Adhesive Material, End User and By Geography |
根据 Stratistics MRC 的数据,2023 年全球粘合片市场规模为 4.2253 亿美元,预计到 2030 年将达到 7.9247 亿美元,预测期内年复合成长率为 9.4%。
粘结片材是一面具有水泥涂层、用于表面涂层或粘结的片材或黏合。还有另一个弹出层可以防止初始抓握。成品有多种,但它们通常是反光且光滑的。它有多种名称,包括片状黏剂、无添加剂水泥和纯黏剂。粘合片通常用于多面覆盖物以粘合柔性内层或硬盖层。它经常用于製造强度水槽、刚柔结合 PCB、粘合加强筋以及其他用于将柔性电路连接到不可弯曲柔性片材的组件。此外,它还用于復杂的迭加。
显示屏、电路基板和其他零件都黏合在这些板上。粘合片也越来越多地用于固定和固定电子控制和 ADAS(高级驾驶员辅助系统)零件的电子零件组件。由于全球汽车行业的扩张、对乘用车现代化的日益重视以及驾驶员辅助和监控系统等最尖端科技的整合,预计对粘合板的需求将在预测期内增加。
人工智能、物联网和通讯基础设施的发展带动了电子和半导体行业的繁荣。半导体零件的供应对该行业至关重要。中国和东南亚是这些零件的主要生产地区。半导体行业受到国际贸易问题以及美国技术优势衝突的影响。 COVID-19 的爆发也对业务产生了未知的影响。由于国际合作和激烈竞争,半导体供应链不透明。
汽车行业正在经历从传统钢铁向复合材料、铝和镁等低密度合金以及超高强度钢的转变。与重型车辆相比,轻型车辆加速速度更快,能量更少,因此在提高车辆经济性方面具有巨大潜力。这些新材料需要新的连接工艺。粘合板提供设计弹性,防止移动车辆产生的震动和压力,并延长保质期。通过使用粘合片可以显着减少紧固件等车辆零件的数量。这正在加速市场扩张。
当水分进入纤维之间时,纤维之间的有效黏合面积减少,纤维降低纸张的挺度和强度。粘合剂层本身的性能也会因水分而减弱。水分管理不良可能会对黏合片材的许多品质产生不利影响。纸张老化速度更快,因为它将酸性分解产物保留在封闭、密闭的环境中。市场需求受到这些要素的阻碍。
COVID-19 的爆发影响了全球市场。供应链故障和工人中断影响全球市场。全球许多国家实施了停工限制,导致生产工厂停止运营。疫情进一步影响了市场,包括旅行限制、原材料供应有限、运营受限以及进出口减少。然而,疫情导致消费电子和医疗保健行业对座椅的需求激增。
由于其高效率、高性能和热性能,聚酰亚胺领域预计将出现良好的增长。特别是,聚酰胺耐磨损和擦伤。卓越的强度就是这一特性的结果。聚酰胺耐化学品,适合在恶劣环境下保护电线和电缆。聚酰胺具有优异的机械性能、拉伸强度、耐热性和耐化学性。聚酰胺优异的机械性能、拉伸强度、耐热性和耐化学性正在推动市场扩张。
预计电子行业在预测期内将出现最快的年复合成长率。在电子行业中,芯片、硬盘驱动器、LED 模块和其他电子零件使用粘合片固定并黏合在一起。整合人工智能(AI)、物联网(IoT)和智能小工具新趋势的消费电子产品的发展增加了对电子和光电用途粘合片的需求。
预计亚太地区在预测期内将占据最大的市场份额。该地区庞大的人口、加速的工业扩张以及严格的环境法规都直接导致了粘合片材需求的增加。此外,该地区用途数量的不断增加正在推动粘结片行业的技术创新和进步,从而支持亚太地区粘结片市场的扩张。
预计亚太地区在预测期内年复合成长率最高。消费者可支配收入的增加、生活方式的改善以及移动设备使用的增加都有助于市场的扩张。该地区的市场扩张得益于中国、日本、澳大利亚和印度的经济发展和工业化、乘用车销量的增加以及建筑业的崛起。为了利用新兴国家廉价的劳动力和原材料,跨国公司正在那里建立製造设施。粘合片在电子和汽车领域的广泛用途正在推动该地区的市场增长。
According to Stratistics MRC, the Global Bonding Sheet Market is accounted for $422.53 million in 2023 and is expected to reach $792.47 million by 2030 growing at a CAGR of 9.4% during the forecast period. A bonding sheet is a sheet or film used for surface covering or bonding that has a cement coating on one side. To prevent an early grip, it has a separate paper discharge layer. Despite occasionally is available in finished variations, it is often reflexive and smooth. It goes under a variety of names, including sheet glue, unadulterated cement, and just glue. A Bonding sheet is typically employed in multi-facet coverings to join flexible interior layers or stiff cap layers. It is frequently used for creating intensity sinks, rigid flex PCBs, bond stiffeners, and other components to attach flexible circuits to unbending flex sheets. In addition, it is used for elaborate overlays.
Display screens, circuit boards, and other components are adhered to these sheets. For holding and fixing electronics assemblies for electronic control and advanced driver assistance system components, bonding sheet is also being used more and more. The demand for bonding sheets is expected to increase throughout the projected period as a result of the expanding automotive sector globally, the growing emphasis on modernizing passenger vehicles, and the integration of cutting-edge technologies including driver assistance and monitoring systems.
The development of AI, IoT, and telecom infrastructure has led to a boom in the electronics and semiconductor industries. The supply of semiconductor components is crucial to the industry. China and Southeast Asia are the main manufacturing regions for these components. The semiconductor sector is being impacted by international trade issues as well as rivalries between the US and China over technological superiority. The COVID-19 epidemic has had an unknown impact on the business as well. Because of the presence of international cooperation and intense rivalry, the semiconductor supply chain is unclear.
The automobile industry is increasingly moving away from traditional steels in favour of composites, low-density alloys like aluminum and magnesium, and ultra-high strength steels. Lightweight cars have a considerable potential to increase vehicle economy since they accelerate more quickly with less energy than heavier ones. New bonding processes are needed for these new materials. Bonding sheet provides flexibility in design, defense against vibration and stress from moving vehicles, and extended shelf life. The amount of vehicle parts, such as fasteners, that are needed can be greatly reduced by the usage of bonding sheet. This factor is accelerating market expansion.
The effective bonded area between the fibers decreases as a result of moisture between the fiber-fiber linkages, which reduces the paper's stiffness and strength. The characteristics of the adhesive layer itself might be weakened by moisture. Numerous bonding sheet qualities might be negatively impacted by poor moisture management. The paper keeps the acidic breakdown products in an enclosed, airtight environment, which hastens aging. The market demand is being hampered by these factors.
The COVID-19 epidemic had an effect on the world market. Supply chain breakdowns and worker impairment have an impact on the worldwide market. A number of nations throughout the world imposed lockdown restrictions, which resulted in the shutdown of production plants. The epidemic further impacted the market with travel restrictions, restricted raw material supply, operating constraints, and decreased import and export activity. Nevertheless, the pandemic saw a spike in demand for these sheets from the consumer electronics and healthcare industries.
The polyimides segment is estimated to have a lucrative growth, due to its high efficiency, performance, and thermal properties. In particular, polyamide is resistant to wear and scrapes. Its exceptional strength is a result of this feature. Wires and cables in caustic environments are better protected by polyamides since they have a strong resilience to chemicals. It gives better mechanical characteristics, more tensile strength, and heat and chemical resistance. The market's expansion is being sped up by all these qualities.
The electronics segment is anticipated to witness the fastest CAGR growth during the forecast period. Chips, hard drives, LED modules, and other electronic components are held and adhered to one another using bonding sheets in the electronics industry. The demand for bonding sheets for electronics and optoelectronics applications is rising as a result of the development of consumer electronics products that integrate artificial intelligence (AI), the internet of things (IoT), and new trends of smart gadgets.
Asia Pacific is projected to hold the largest market share during the forecast period. The region's high population, accelerating industrial expansion, and strict environmental regulations can all be directly linked to the rise in demand for bonding sheet. Additionally, the increasing number of applications in the region is encouraging innovations and advances in the bonding sheet industry, which is supporting the expansion of the APAC bonding sheet market.
Asia Pacific is projected to have the highest CAGR over the forecast period. Consumer's rising disposable incomes, bettering lifestyles, and the growing use of mobile devices all contribute to the market's expansion. The expansion of the market in the region is supported by the economic development and industrialization of China, Japan, Australia, and India, the rising sales of passenger cars, and the thriving construction industry. To take advantage of the cheap labor and raw resources in emerging nations, multinational corporations are establishing manufacturing facilities there. The huge applications of bonding sheets in electronics and automotive sectors is driving the market growth in the region.
Some of the key players profiled in the Bonding Sheet Market include: DuPont, Namics Corporation, Fujikura Ltd, Nikkan Industries Co.,Ltd, Microcosm Technology Co., Ltd, Dexerials Corporation, Nitto Denko Corporation, Arisawa Manufacturing Corporation, Hanwha Solutions Advanced Materials Division, Shin-Etsu Polymer Co. Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd, Qinglong Adhesives, Nippon Mektron Ltd and Toray Industries, Inc.