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市场调查报告书
商品编码
1383376
晶片雷射脱盖机市场预测至 2030 年:按类型、应用和地区分類的全球分析Chip Laser Decapping Machine Market Forecasts to 2030 - Global Analysis By Type, Application (Integrated Circuits Trays, Plastic Packaged Devices, Printed Circuit Board Boards, Power Devices and Other Applications) and By Geography |
根据Stratistics MRC的数据,2023年全球晶片雷射开盖机市场规模为3.048亿美元,预计到2030年将达到4.927亿美元,预测期内CAGR为7.1%。
半导体产业使用的一种复杂工具被称为晶片雷射脱盖机,用于精确去除积体电路(IC) 晶片上的保护涂层,例如环氧模塑料和陶瓷封装。该设备使用聚焦雷射光束根据需要去除封装,同时保护底层 IC,使工程师和科学家能够检查晶片的内部结构,以进行品质保证、设计分析和缺陷查找。
无损开盖允许打开并分析积体电路(IC) 等半导体零件,而不会影响其结构完整性。此外,它对于故障分析、品管和逆向工程至关重要,因为它可以恢復有价值、昂贵或稀有的 IC。此外,这种无损能力在法医调查中的证据保存或需要拆卸和重新组装 IC 时受到高度追捧,从而无需新样本即可进行更彻底的检查。此外,它还透过减少更换昂贵 IC 的需要来降低成本。因此,该策略将提高半导体分析和研究的有效性和适应性,推动市场成长。
晶片雷射脱盖设备市场由于需要大量的初始投资而存在许多困难。最初,小型和大型半导体公司都可能对采用这项技术犹豫不决,因为它带来了巨大的财务负担。此外,高昂的初期成本阻碍了新进入者和新兴企业进入市场。此外,由于阻碍市场竞争和创新的高资本要求,采用率可能会下降。
对小型化、提高性能和扩大效用的需求正在推动半导体封装技术的快速发展。此外,当涉及到倒装晶片、球栅阵列(BGA) 和晶圆级封装等各种晶片封装的开盖时,晶片雷射压盖机提供了尖端的解决方案来支援先进半导体装置的设计和测试。 。此外,消费者对电子产品、汽车电子和物联网(IoT)应用的需求不断增长,正在推动全球电子製造业的成长。
晶片雷射开盖机是一项相对较新且专业的技术。由于市场对其功能和优点的了解不足,这些机器可能不会被广泛采用。另外,晶片雷射开盖机是一种先进的机器,需要技术专业知识来进行操作和维护,所以要操作机器、解决问题、提高机器的性能,需要有熟练的人力资源。因此,这些因素阻碍了市场的拓展。
晶片雷射开盖机市场受到COVID-19疫情的多方面不利影响。此外,供应链和製造业的中断以及封锁和旅行限制导致生产延误、获得重要零件的机会有限以及维修和维护机器的困难。此外,随着资源转向与 COVID-19 相关的研究和诊断,其他技术领域,例如晶片雷射开盖机等半导体分析工具,必须应对资金和关注度下降的问题。因此,由于疫情带来的经济不确定性所带来的预算限制,许多企业无法购买和使用如此先进的机械,从而抑制了市场的扩张。
半自动部分估计占有最大份额,因为存在以半自动部分代表的结合手动和自动功能的旋盖型态。儘管这些仪器的开盖程序是自动化的,但设置和样品製备仍需要操作员的参与。此外,半自动机器具有多功能性、高效性以及创建客製化解决方案的能力,使其成为某些需要高度控制的半导体分析和逆向工程应用的绝佳选择。因此,这些方面都大大推动了市场的扩张。
由于用于对托盘中的 IC 进行开盖的专用设备,预计积体电路(IC) 托盘细分市场在预测期内将出现最高的CAGR。此外,这些托盘经常用于半导体测试和製造中,以处理和储存 IC 晶片。 IC 托盘章节涵盖了准确且无损地对托盘中的 IC 晶片进行开盖的要求,以实现品管、故障分析和逆向工程。此外,这些机器使用雷射技术去除封装,同时保持 IC 的完整性。因此,确保半导体品质、高效有序发展尖端晶片技术至关重要。
北美拥有丰富的政府政策和援助,包括税收优惠、补贴以及研发资助计划,支持北美半导体产业。此外,这些倡议旨在培养创造力、推动半导体技术并增加行业竞争。此外,美国国家科学基金会(NSF)和国防部(DoD)等政府机构可能为半导体技术研究提供资金,以及晶片雷射脱盖机等专用工具的开发和应用也正在产生影响。因此,这些是推动市场规模扩大的一些因素。
由于专注于精度、自动化和效率的创新脱盖设备,预计欧洲在预测期内将出现最高的CAGR。这些创新还包括卓越的雷射技术,可实现更有选择性和更精确的开盖。此外,符合国际环境目标的环保脱盖技术的开发也受到欧洲对永续性的重视的影响。此外,透过学术机构和区域产业领导者之间的合作,我们的故障评估和逆向工程能力得到了极大的提升。因此,欧洲在晶片雷射旋盖机市场的地位因其在这些领域的技术领先地位而得到加强。
According to Stratistics MRC, the Global Chip Laser Decapping Machine Market is accounted for $304.8 million in 2023 and is expected to reach $492.7 million by 2030 growing at a CAGR of 7.1% during the forecast period. A complex tool used in the semiconductor industry is known as chip laser decapping machine, which is used to precisely remove protective coatings from integrated circuit (IC) chips like epoxy molding compounds or ceramic packaging. The device uses a concentrated laser beam to remove encapsulating materials on demand while protecting the underlying IC, and it gives engineers and scientists access to the interior workings of the chip for quality assurance, design analysis, and defect finding.
It enables the opening and analysis of semiconductor components, such as integrated circuits (ICs), without affecting their structural integrity. Additionally, this is crucial for failure analysis, quality control, and reverse engineering, as it enables the recovery of valuable, expensive, or rare ICs. Moreover, in order to preserve evidence in forensic investigations or for ICs that need to be deconstructed and put back together again, this non-destructive capacity is highly sought because it eliminates the need for new samples and enables more thorough investigations. Furthermore, by reducing the need to replace priceless ICs, it also saves money. Thus, this strategy improves semiconductor analysis and research's effectiveness and adaptability, thereby drive the market growth.
There are a number of difficulties caused by the significant initial investment needed in the market for chip laser decapping machines. Initially, both small and major semiconductor companies may be discouraged from implementing this technology by the substantial financial burden it can cause. Furthermore, the significant beginning costs also prevent new and emerging enterprises from entering the market. Moreover, slower adoption rates might be caused by high capital needs, hence which also hinder market competition and innovation.
The requirements for downsizing, improved performance, and expanded usefulness are driving a rapid evolution in semiconductor packaging technology. Additionally, when it comes to decapping different chip packages, such as flip-chip, ball grid array (BGA), and wafer-level packages, chip laser decapping machines offer a cutting-edge solution that supports the design and testing of sophisticated semiconductor devices. Furthermore, increased consumer demand for electronic products, automotive electronics, and Internet of Things (IoT) applications is fueling the growth of the worldwide electronics manufacturing sector.
Machines for chip laser decapping are a relatively new and specialized technology. These machines may not be widely adopted because of the market's inadequate knowledge of their capabilities and advantages. Additionally, chip laser decapping machines are sophisticated machines that demand technical expertise to operate and maintain, so to operate the machinery, resolve problems, and improve machine performance, skilled individuals are required. Hence, these factors hindering market expansion.
The chip laser decapping machine market was adversely affected by the COVID-19 epidemic in a number of ways. Additionally, production delays, limited access to essential components, and difficulties with machine repair and maintenance were caused by the global disruption of supply chains and manufacturing, as well as lockdowns and travel restrictions. Moreover, other technological fields, such as semiconductor analysis tools like chip laser decapping machines, had to deal with a reduction in funding and attention as resources were shifted to COVID-19-related research and diagnosis. Therefore, as a result of budget constraints brought on by the pandemic's economic uncertainty, many businesses were unable to purchase and use such advanced machinery, which restrained the market's expansion.
The semi-automatic segment is estimated to hold the largest share, due to a form of decapping equipment that combines manual and automated features is represented by the semi-automatic segment. Although the decapping procedure on these devices is automated, some operator involvement is necessary for setup or sample preparation. Furthermore, semi-automatic machines are the best option for certain semiconductor analysis and reverse engineering applications when a high level of control is required because they offer versatility, efficiency, and the ability to create customized solutions. Therefore, these aspects significantly boost the market expansion.
The integrated circuits (IC) trays segment is anticipated to have highest CAGR during the forecast period, due to specialized equipment made for decapping ICs contained in trays. Additionally, these trays are frequently used in semiconductor testing and manufacturing for handling and storing IC chips. The chapter on IC Trays deals with the requirement for precise, non-destructive decapsulation of chips inside of their trays, enabling quality control, failure analysis, and reverse engineering. Moreover, while maintaining the integrity of the ICs, these machines use laser technology to remove the encapsulating materials. Therefore, they are essential for ensuring semiconductor quality and the efficient and regulated development of cutting-edge chip technology.
North America commanded the largest market share during the extrapolated period owing to wider government measures and assistance, like tax incentives, subsidies, and funding programs for R&D, has aided the semiconductor industry in North America. Additionally, these initiatives seek to promote creativity, advance semiconductor technologies, and strengthen industry competition. Moreover, funding for semiconductor technology research has occasionally been provided by government organizations like the National Science Foundation (NSF) and the Department of Defense (DoD), which has a subsequent impact on the creation and application of specialized tools like chip laser decapping machines. Therefore, these are some of the factors which help in driving the market size.
Europe is expected to witness highest CAGR over the projection period, owing to innovative decapping equipment that focus on accuracy, automation, and efficiency. The decapping procedure has been made easier by these innovations, which also include better laser technology for more selective and precise decapping. Additionally, the development of eco-friendly decapping techniques that are in line with international environmental goals has also been impacted by Europe's emphasis on sustainability. Furthermore, capabilities for failure assessment and reverse engineering have been significantly improved through collaboration between academic institutions and regional leaders in industry. Therefore, Europe's position in the market for chip laser decapping machines is strengthened by its technological leadership in these fields.
Some of the key players in the Chip Laser Decapping Machine Market include: Nisene Technology Group, Inc, Kaimeiwo Laser, Plasma-Therm LLC, Han's Laser, Rudolph Technologies, Wuhan Keyi Laser, Huacong Technology, Hamamatsu Photonics, Xcerra Corporation and Accurex Measurement.
In June 2019, Nanometrics Signs Agreement for Merger of Equals Combination With Rudolph Technologies.
In November 2018, Rudolph Technologies, Inc. announced the availability of its NovusEdge™ system for edge, notch and backside inspection of un-patterned wafers.