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市场调查报告书
商品编码
1403357
到 2030 年无铅氮回流焊炉的全球市场预测:按类型、最终用户和地区分析Lead-Free Nitrogen Reflow Soldering Oven Market Forecasts to 2030 - Global Analysis By Type, End User and By Geography |
根据 Stratistics MRC 的数据,预测期内全球无铅氮回流焊炉市场将以 3.5% 的复合年增长率成长。
无铅氮气回流焊炉是电子製造所使用的专用设备。其目的是在受控氮气气氛中使用无铅焊接方法将表面黏着技术元件焊接到印刷电路基板(PCB) 上。透过使用传统含铅焊料的更安全替代品,该技术符合环境法,并消除了与铅暴露相关的健康危害。这些烤箱可确保精确的温度曲线,使元件的回流焊接更加容易。
根据《世界人口评论》,中国出口了价值约 2.72 兆美元的商品和服务,仍然是世界上最大的出口国。该国主要出口电脑、智慧型手机、广播设备、积体电路和商用机器零件等电子设备和机械。
製造智慧型手机、电脑、汽车电子和物联网设备等电子设备的产业需要精密可靠的焊接设备。无铅氮气回流焊接浴在确保电路基板焊接元件的完整性方面发挥着至关重要的作用。随着电子设备的不断发展,包括小型化和复杂化的趋势,对先进焊接解决方案的需求不断增加。此外,由环境法规推动的无铅焊料的转变进一步增加了对这些专用烤箱的需求,使它们成为现代电子製造流程中的重要工具。
无铅氮气回流焊炉具有巨大的持续成本,包括能源消耗、氮气供应和维护。这些先进的烘箱通常需要连续供应氮气,消耗额外的资源并增加营运费用。此外,维持精确温度控制的能源集中特性也增加了整体营运成本。因此,这是市场需求的主要障碍。
需要电子元件具有严格可靠性标准的行业通常需要精密焊接解决方案。无铅氮气回流焊炉提供受控气氛,以最大限度地减少氧化并确保关键任务系统所需的准确焊点。在这些安全性和可靠性至关重要的行业中,对可靠的电子设备的需求很高,这使得这些专用烤箱成为必不可少的工具。此外,为这些高可靠性应用提供服务的製造商有机会满足严格的品质要求,扩大其市场份额,并将自己打造为可靠且技术先进的焊接解决方案的提供者。
由于特定要求或技术偏好,某些行业可能无法轻易采用无铅焊接方法或专用焊接设备。拥有成熟焊接工艺或在利基市场运营的行业可能不愿意过渡到新技术。此外,优先考虑成本效益而不是满足严格的环境法规的行业可能会选择替代的传统焊接解决方案。这种有限的采用带来了挑战,并阻碍了希望进入这些行业的製造商的市场。
由于供应链挑战、工业活动减少和市场不确定性,疫情最初导致市场混乱和放缓。然而,电子产业的某些部分,特别是与通讯设备、计算设备和医疗用电子设备相关的部分,由于远端工作的转变和医疗保健需求的增加,需求有所增加,这可能对焊炉市场产生了正面影响。因此,随着各行业应对情势变化并开始恢復生产业务,经济正逐步復苏。
据估计,气相炉部分占最大份额。这些烤箱采用独特的焊接工艺,利用气相介质,通常使用具有特定沸腾特性的特殊流体。气相炉具有精确的温度分布、出色的传热以及有效焊接复杂组件的能力等优点。此外,这些烤箱因其能够实现精确的温度控制、减少焊接缺陷并提供高效且一致的焊接结果而脱颖而出,使其成为该行业专业且有价值的领域的重要组成部分。
预计电子製造领域在预测期内将出现良好成长。无铅氮气回流焊炉可确保精确且环保的元件焊接,在电子製造中发挥至关重要的作用。该烤箱透过保持受控温度、减少焊接缺陷并遵守无铅焊接标准,有助于生产高品质的电子设备。此外,它在电子製造中的应用强调了其在生产可靠且技术先进的电子产品同时满足环境法规方面的重要性。
在估计期间,亚太地区占据最大的市场占有率。对家用电子电器、汽车电子、通讯和其他电子产品的需求不断增长正在推动亚太地区焊接设备市场的成长。亚太地区的一些国家是电子产品的主要製造地,正在吸引对现代焊接设备的投资,以确保更高的生产品质并符合国际标准。此外,电子元件的小型化、製造业采用工业 4.0 以及对缺陷最少的高品质焊接的需求等趋势正在推动无铅氮气回流焊炉市场。
由于技术进步和严格的环境法规,预计北美在预测期内将出现盈利成长。无铅焊接设备市场,包括氮基回流焊炉,是由对高品质、环保焊接解决方案的需求所推动的。焊接技术的创新、无铅标准的遵守以及电子组装中精确温度控制的需求等因素促进了北美无铅氮气回流焊炉市场的崛起。
According to Stratistics MRC, the Global Lead-Free Nitrogen Reflow Soldering Oven Market is growing at a CAGR of 3.5% during the forecast period. The Lead-Free Reflow Soldering Oven is a specialised piece of equipment used in electronics manufacturing. Its purpose is to use a lead-free soldering method in a regulated nitrogen atmosphere to solder surface-mounted components onto printed circuit boards (PCBs). By using safer substitutes for conventional lead-based solders, this technique complies with environmental laws and removes the health hazards related to lead exposure. Accurate temperature profiles are ensured by these ovens, which makes it easier to reflow solder components.
According to the World Population Review, with an estimated export of US$ 2.72 trillion worth of goods and services, China remained the world's largest export. The country mostly exports electronic equipment and machinery such as computers, smart phones, broadcast equipment, integrated circuits, and office machine parts.
Industries producing electronic devices, such as smart phones, computers, automotive electronics, and IoT gadgets, require precise and reliable soldering equipment. Lead-free nitrogen reflow soldering ovens play a pivotal role in ensuring the integrity of soldered components on circuit boards. With the continuous evolution of electronic devices, including the trend towards miniaturisation and higher complexity, the need for sophisticated soldering solutions rises. Moreover, the shift toward lead-free soldering, driven by environmental regulations, further amplifies the demand for these specialized ovens, establishing them as indispensable tools in modern electronics manufacturing processes.
Lead-Free Nitrogen Reflow Soldering Ovens demand substantial ongoing expenses, including energy consumption, nitrogen supply, and maintenance. These advanced ovens often require a continuous supply of nitrogen, consuming additional resources and increasing operational expenditure. Also, the energy-intensive nature of maintaining precise temperature control adds to the overall operational costs. Thus, it acts as a significant barrier to market demand.
Industries requiring electronic components with stringent reliability standards often necessitate precision soldering solutions. Lead-Free Nitrogen Reflow Soldering ovens offer controlled atmospheres, minimising oxidation and ensuring precise soldering joints crucial for mission-critical systems. The demand for dependable electronics in these sectors, where safety and reliability are paramount, positions these specialised ovens as essential tools. Moreover, manufacturers catering to these high-reliability applications have the opportunity to meet the stringent quality requirements, expand their market presence, and establish themselves as providers of reliable and technologically advanced soldering solutions.
Some industries, due to their specific requirements or technological preferences, may not readily embrace lead-free soldering methods or specialised soldering equipment. Industries with established soldering processes or those operating in niche markets may exhibit reluctance to transition to new technologies. Also, industries that prioritise cost-effectiveness over compliance with stringent environmental regulations might opt for alternative, more conventional soldering solutions. This limited adoption creates a challenge for manufacturers aiming to penetrate these industries, hindering the market.
The pandemic initially caused disruptions and a slowdown in the market due to supply chain challenges, reduced industrial activities, and market uncertainties. However, certain segments within the electronics industry, particularly those related to telecommunication equipment, computing devices, and medical electronics, experienced increased demand due to the shift to remote work and increased healthcare needs, which might have positively impacted the market for soldering ovens. This has led to a gradual recovery as industries adapted to the evolving circumstances and began restoring their manufacturing operations.
The vapour-phase oven segment is estimated to hold the largest share. These ovens employ a unique soldering process utilising a vapour-phase medium, typically a special fluid with specific boiling properties. Vapour-phase ovens offer advantages such as precise temperature profiles, excellent thermal transfer, and the ability to solder complex assemblies efficiently. Moreover, these ovens are stand out for their ability to achieve precise temperature control, mitigate soldering defects, and offer efficient and consistent soldering results, making them a specialised and valuable segment in the industry.
The Electronics Manufacturing segment is anticipated to have lucrative growth during the forecast period. Lead-Free Nitrogen Reflow Soldering ovens play a pivotal role in electronic manufacturing by ensuring precise and environmentally compliant soldering of components. The ovens contribute to the production of high-quality electronic devices by maintaining controlled temperatures, reducing soldering defects, and adhering to lead-free soldering standards. Moreover, their application in electronics manufacturing underscores their significance in producing reliable and technologically advanced electronic products while meeting environmental regulations.
Asia Pacific commanded the largest market share during the extrapolated period. The increasing demand for consumer electronics, automotive electronics, telecommunications, and other electronic products has driven the growth of the soldering equipment market in the APAC region. Several countries in the APAC region serve as major manufacturing hubs for electronics, attracting investments in modern soldering equipment to ensure higher production quality and compliance with international standards. Moreover, trends such as miniaturization of electronic components, the adoption of Industry 4.0 practices in manufacturing, and the demand for high-quality soldering with minimal defects drive the market for Lead-Free Nitrogen Reflow Soldering Ovens.
North America is expected to witness profitable growth over the projection period, owing to technological advancements and stringent environmental regulations. The market for lead-free soldering equipment, including reflow soldering ovens utilizing nitrogen, is driven by the demand for high-quality, environmentally friendly soldering solutions. Factors such as innovation in soldering technology, compliance with lead-free standards, and the need for precise temperature control in electronics assembly contribute to the prominence of the Lead-Free Nitrogen Reflow Soldering Oven market in North America.
Some of the key players in the Lead-Free Nitrogen Reflow Soldering Oven Market include Rehm Thermal Systems, Kurtz Ersa, BTU International, Heller Industries, Tamura Corporation, Vitronics Soltec, JT Automation Equipment Co., Ltd., Seho Systems GmbH, JUKI, SEHO Systems, Shenzhen JT Automation, Dongguan Folungwin Automatic Equipment, SMT Wertheim and Senju Metal Industry Co (SMIC).
In June 2023, Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to unveil the new Auto Scavenger Module, a valuable extension for the Ersa HR 600 XL rework platform. Designed to enhance the efficiency and effectiveness of non-contact removal of residual solder from circuit boards, this module represents a significant advancement in rework technology.
In March 2022, Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce that it has released the new EXOS 10/26 convection reflow soldering system with a vacuum chamber of 600 mm to handle PCBs with a maximum length of 600 mm.