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市场调查报告书
商品编码
1476302

2030 年 Chiplet 市场预测：按处理器、封装技术、应用和地区进行的全球分析

Chiplets Market Forecasts to 2030 - Global Analysis By Processor, By Packaging Technologies, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2023年全球chiplet市场规模将达到68.2亿美元，预计2030年将达到4,494.6亿美元，预测期内复合年增长率为81.9%。

小晶片是在积体电路 (IC) 系统中执行特定功能的模组化半导体组件。这些小型晶片在组装成更大的 IC 封装之前均经过单独设计、製造和测试。小晶片支援灵活且可扩展的系统设计，使 CPU、GPU 和 AI 加速器等复杂电子产品能够提高效能、降低开发成本并加快上市时间。

根据消费者科技协会的数据，2020 年 10 月假期季节期间，美国在游戏机、笔记型电脑、穿戴式装置和电视等科技相关商品上平均花费约 528 美元。

对更高性能和效率的需求

随着电子设备对技术创新的不断追求，对更高性能和效率的需求已成为chiplet市场的主要驱动因素。 Chiplet 能够将具有最佳化效能特征的专用元件（例如 CPU、GPU 和 AI 加速器）整合到一个系统中。这种模组化方法为设计高效能产品提供了更大的灵活性，同时也提高了能源效率。随着消费者对速度更快、功能更强大的设备的期望不断提高，基于小晶片的架构的采用有望显着增长。

标准化和互通性

缺乏普遍接受的标准会导致不同供应商的小晶片之间出现相容性问题，从而阻碍无缝互通性和整合到不同的系统中。标准化的缺乏使系统设计变得复杂，增加了开发时间，并增加了製造商的成本。此外，缺乏标准化介面限制了生态系统开发和协作的潜力，抑制了创新和市场成长。

生态系发展

半导体公司、晶圆代工厂、封装供应商和系统整合商之间的协作可以建立标准化介面、开发参考设计并建立供应链合作伙伴关係。这促进了创新、互通性和扩充性，从而能够在各种应用中快速部署基于小晶片的解决方案。此外，强大的生态系统可以促进知识共用，加速技术进步并刺激投资，从而促进小晶片市场的扩张，并使相关人员能够利用新的趋势和需求带来最佳机会。

智慧财产权（IP）风险

由于技术开发和整合的生态系统复杂，智慧财产权 (IP) 风险对 Chiplet 市场构成重大威胁。由于chiplet由多个营业单位开发并整合到各种系统中，因此存在知识产权侵权、诈欺以及诈欺其专有设计、演算法和技术的风险。这可能会导致法律纠纷、竞争优势丧失和业务关係受损，并抑制小晶片产业的创新和市场成长。

COVID-19 的影响：

COVID-19 大流行扰乱了小型晶片市场，导致供应链中断、工厂关闭和消费者需求减少。不确定性和景气衰退推迟了产品发布和半导体技术投资。然而，对数位基础设施和远端工作解决方案的需求不断增长，推动了chiplet在资料中心和通讯网路中的采用，在一定程度上缓解了市场低迷。

预计中央处理器 (CPU) 细分市场在预测期内将是最大的

在小晶片市场中，由于 CPU 在电子设备中发挥至关重要的作用，因此预计中央处理器 (CPU) 领域将在预测期内占据主导地位。随着 CPU 处理从基本运算到复杂运算的广泛任务，对基于小晶片的高级 CPU 设计的需求不断增长。由于资料中心、游戏和人工智慧等各种应用对高效能运算的需求不断增长，CPU 领域预计将在市场占有率和收益处于领先地位。

汽车业预计在预测期内复合年增长率最高

由于 ADAS（高级驾驶辅助系统）、电动和连网汽车技术的日益普及，汽车产业预计将出现小晶片市场中最高的复合年增长率。 Chiplet 将人工智慧处理器、感测器和通讯模组等复杂功能整合到汽车系统中，以提高车辆的安全性、效率和连接性。此外，对电动车和自动驾驶汽车的需求正在推动汽车产业小晶片的成长。

比例最高的地区：

在预测期内，亚太地区将以其强大的半导体製造生态系统（包括晶圆代工厂、封装设施和组装厂）预计将主导小晶片市场。此外，中国、日本、韩国和台湾等国家对家用电子电器、汽车和工业自动化的需求不断增长，正在推动小晶片的采用。此外，政府措施、技术基础设施投资和熟练劳动力正在进一步加强亚太地区小晶片市场的领导地位。

复合年增长率最高的地区：

在预测期内，由于各种因素，亚太地区的chiplet市场预计将快速扩张。该地区拥有强大的半导体製造基础设施、不断增加的研发投资、不断增长的家用电子电器需求以及越来越多地采用人工智慧和5G等先进技术。此外，中国、日本、韩国和台湾等主要市场参与者的存在也促进了该地区小晶片市场的良好成长轨迹。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球 Chiplet 市场：按处理器划分

  • 现场可程式闸阵列(FPGA)
  • 图形处理单元（GPU）
  • 中央处理器（CPU）
  • 应用处理单元（APU）
  • 人工智慧专用积体电路（AI ASIC）

第六章全球 Chiplet 市场：依封装技术划分

  • 2.5D封装
  • 3D包装
  • 板载晶片(COB)
  • 覆晶薄膜(COF)
  • 玻璃上晶片 (COG)
  • 晶圆上晶片 (COW)
  • 晶圆级封装 (WLP)
  • 扇出晶圆级封装 (FO-WLP)
  • 其他封装技术

第七章 全球 Chiplet 市场：依应用分类

  • 家用电器
    • 智慧型手机
    • 药片
    • 穿戴式装置
    • 游戏机
    • 电脑
    • 智慧家庭设备
  • 卫生保健
    • 医疗设备
    • 穿戴式健康监测器
    • 植入式医疗设备
    • 诊断设备
  • 车
    • ADAS（进阶驾驶辅助系统）（ADAS）
    • 资讯娱乐系统
    • 引擎控制单元（ECU）
    • 先进的感测器
  • 航太和国防
    • 雷达系统
    • 航空电子设备
    • 通讯系统
    • 监视系统
  • 产业
    • 工业自动化
    • 机器人技术
    • 过程控制系统
    • 物联网 (IoT) 设备
  • 通讯
    • 网路交换机
    • 路由器
    • 基地台
    • 光纤传输系统
  • 半导体
    • 小晶片开发
    • 整合到 SoC 中
    • 异质集成
  • 其他用途

第八章全球 Chiplet 市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第九章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第 10 章 公司概况

  • Advanced Micro Devices, Inc.（AMD）
  • Applied Materials, Inc.
  • ARM Holdings
  • Broadcom Inc.
  • GlobalFoundries Inc.
  • IBM Corporation
  • Infineon Technologies AG
  • Intel Corporation
  • Marvell Technology Group Ltd.
  • MediaTek Inc.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Qualcomm Incorporated
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Synopsys, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited（TSMC）
  • Texas Instruments Incorporated
  • United Microelectronics Corporation（UMC）
  • Xilinx, Inc.
Product Code: SMRC25848

According to Stratistics MRC, the Global Chiplets Market is accounted for $6.82 billion in 2023 and is expected to reach $449.46 billion by 2030 growing at a CAGR of 81.9% during the forecast period. Chiplets are modular semiconductor components that perform specific functions within an integrated circuit (IC) system. These small, individual chips can be independently designed, manufactured, and tested before being assembled into a larger IC package. Chiplets enable flexible and scalable system designs, allowing for improved performance, reduced development costs, and faster time-to-market for complex electronic devices such as CPUs, GPUs, and AI accelerators.

According to Consumer Technology Association, in October 2020, the population in the U.S. in the holiday season spent about US$ 528, on average, on technology-based items, which included video game consoles, laptops, wearable's and television sets.

Market Dynamics:

Driver:

Demand for higher performance and efficiency

The demand for higher performance and efficiency is a key driver in the chiplets market due to the relentless pursuit of innovation in electronic devices. Chiplets enable manufacturers to integrate specialized components with optimized performance characteristics, such as CPUs, GPUs, and AI accelerators, into a single system. This modular approach allows for greater flexibility in designing high-performance products while also improving energy efficiency. As consumer expectations for faster and more powerful devices continue to rise, the adoption of chiplet-based architectures is poised for significant growth.

Restraint:

Standardization and interoperability

Without universally accepted standards, compatibility issues arise between chiplets from different vendors, hindering seamless interoperability and integration into heterogeneous systems. This lack of standardization complicates system design, increases development time, and raises costs for manufacturers. Furthermore, the absence of standardized interfaces limits the potential for ecosystem development and collaboration, stifling innovation and market growth.

Opportunity:

Ecosystem development

Collaborative efforts among semiconductor companies, foundries, packaging suppliers, and system integrators can establish standardized interfaces, develop reference designs, and create supply chain partnerships. This fosters innovation, interoperability, and scalability, enabling faster adoption of chiplet-based solutions across various applications. Additionally, a robust ecosystem promotes knowledge sharing, accelerates technological advancements, and stimulates investment, driving the expansion of the chiplets market and unlocking new opportunities for stakeholders to capitalize on emerging trends and demands.

Threat:

Intellectual property (IP) risks

Intellectual property (IP) risks pose a significant threat to the chiplets market due to the complex ecosystem of technology development and integration. With chiplets being developed by multiple entities and integrated into various systems, there's a risk of IP infringement, unauthorized use, or misappropriation of proprietary designs, algorithms, or technologies. This can lead to legal disputes, loss of competitive advantage, and damage to business relationships, potentially hampering innovation and market growth in the chiplets industry.

Covid-19 Impact:

The COVID-19 pandemic disrupted the chiplets market, causing supply chain disruptions, factory closures, and reduced consumer demand. Uncertainty and economic downturns led to delays in product launches and investments in semiconductor technologies. However, the increased demand for digital infrastructure and remote work solutions has driven the adoption of chiplets in data centers and telecommunication networks, mitigating some of the market's downturns.

The central processing unit (CPU) segment is expected to be the largest during the forecast period

In the chiplets market, the central processing unit (CPU) segment is anticipated to dominate during the forecast period due to the critical role CPUs play in electronic devices. CPUs handle tasks ranging from basic operations to complex computations, driving demand for advanced chiplet-based CPU designs. With the increasing need for high-performance computing in various applications such as data centers, gaming, and artificial intelligence, the CPU segment is expected to lead in market share and revenue.

The automotive segment is expected to have the highest CAGR during the forecast period

The automotive segment is poised for the highest CAGR in the chiplets market due to the increasing adoption of advanced driver assistance systems (ADAS), electrification, and connected vehicle technologies. Chiplets enable the integration of complex functionalities, such as AI processors, sensors, and communication modules, into automotive systems, enhancing vehicle safety, efficiency, and connectivity. Additionally, the demand for electric and autonomous vehicles further drives the growth of chiplets in the automotive sector.

Region with largest share:

Over the forecast period, Asia Pacific is poised to dominate the chiplets market due to the region's robust semiconductor manufacturing ecosystem, including foundries, packaging facilities, and assembly plants. Additionally, the growing demand for consumer electronics, automotive vehicles, and industrial automation in countries like China, Japan, South Korea, and Taiwan drives the adoption of chiplets. Moreover, government initiatives, investments in technology infrastructure, and a skilled workforce further bolster Asia Pacific's leadership in the chiplets market.

Region with highest CAGR:

During the forecast period, the Asia Pacific region is expected to experience rapid expansion in the chiplets market due to various factors. These include the region's robust semiconductor manufacturing infrastructure, increasing investments in research and development, growing demand for consumer electronics and rising adoption of advanced technologies such as artificial intelligence and 5G. Additionally, the presence of key market players in countries like China, Japan, South Korea, and Taiwan contribute to the region's promising growth trajectory in the chiplets market.

Key players in the market

Some of the key players in Chiplets Market include Advanced Micro Devices, Inc. (AMD), Applied Materials, Inc., ARM Holdings, Broadcom Inc., GlobalFoundries Inc., IBM Corporation, Infineon Technologies AG, Intel Corporation, Marvell Technology Group Ltd., MediaTek Inc., Micron Technology, Inc., NVIDIA Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Synopsys, Inc., Taiwan Semiconductor Manufacturing Company Limited (TSMC), Texas Instruments Incorporated, United Microelectronics Corporation (UMC) and Xilinx, Inc.

Key Developments:

In January 2024, Intel Corportion announced its intention to collaborate with an R&D hub named IMEC, to ensure Intel's advanced chiplet packaging technologies satisfy the stringent quality and reliability requirements required for automotive use cases.

In August 2023, Google Cloud (US) and NVIDIA Corporation (US) collaborated to offer advanced AI infrastructure and software for deploying large generative AI models and accelerating data science tasks. This partnership streamlines AI supercomputer deployment via Google Cloud's NVIDIA-powered solutions, leveraging the same technology utilized by Google DeepMind and research teams. The integration optimizes PaxML, Google's LLM framework, for NVIDIA, accelerated computing, enhancing experimentation and scalability with H100 and A100 Tensor Core GPUs.

In June 2023, Intel Corporation (US) announced a partnership with Taiwan Semiconductor Manufacturing Company Limited (Taiwan) to manufacture chips for Intel's high-performance computing and graphics products. The partnership would help Intel reduce its reliance on external foundries.

Processors Covered:

  • Field-Programmable Gate Array (FPGA)
  • Graphics Processing Unit (GPU)
  • Central Processing Unit (CPU)
  • Application Processing Unit (APU)
  • Artificial Intelligence Application-specific Integrated Circuit (AI ASIC)

Packaging Technologies Covered:

  • 2.5D Packaging
  • 3D Packaging
  • Chip-on-Board (COB)
  • Chip-on-Flex (COF)
  • Chip-on-Glass (COG)
  • Chip-on-Wafer (COW)
  • Wafer-Level Packaging (WLP)
  • Fan-Out Wafer-Level Packaging (FO-WLP)
  • Other Packaging Technologies

Applications Covered:

  • Consumer Electronics
  • Healthcare
  • Automotive
  • Aerospace and Defense
  • Industrial
  • Telecommunications
  • Semiconductor
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Chiplets Market, By Processor

  • 5.1 Introduction
  • 5.2 Field-Programmable Gate Array (FPGA)
  • 5.3 Graphics Processing Unit (GPU)
  • 5.4 Central Processing Unit (CPU)
  • 5.5 Application Processing Unit (APU)
  • 5.6 Artificial Intelligence Application-specific Integrated Circuit (AI ASIC)

6 Global Chiplets Market, By Packaging Technology

  • 6.1 Introduction
  • 6.2 2.5D Packaging
  • 6.3 3D Packaging
  • 6.4 Chip-on-Board (COB)
  • 6.5 Chip-on-Flex (COF)
  • 6.6 Chip-on-Glass (COG)
  • 6.7 Chip-on-Wafer (COW)
  • 6.8 Wafer-Level Packaging (WLP)
  • 6.9 Fan-Out Wafer-Level Packaging (FO-WLP)
  • 6.10 Other Packaging Technologies

7 Global Chiplets Market, By Application

  • 7.1 Introduction
  • 7.2 Consumer Electronics
    • 7.2.1 Smartphones
    • 7.2.2 Tablets
    • 7.2.3 Wearable Devices
    • 7.2.4 Gaming Consoles
    • 7.2.5 Personal Computers
    • 7.2.6 Smart Home Devices
  • 7.3 Healthcare
    • 7.3.1 Medical Devices
    • 7.3.2 Wearable Health Monitors
    • 7.3.3 Implantable Medical Devices
    • 7.3.4 Diagnostic Equipment
  • 7.4 Automotive
    • 7.4.1 Advanced Driver Assistance Systems (ADAS)
    • 7.4.2 Infotainment Systems
    • 7.4.3 Engine Control Units (ECUs)
    • 7.4.4 Advanced Sensors
  • 7.5 Aerospace and Defense
    • 7.5.1 Radar Systems
    • 7.5.2 Avionics
    • 7.5.3 Communication Systems
    • 7.5.4 Surveillance Systems
  • 7.6 Industrial
    • 7.6.1 Industrial Automation
    • 7.6.2 Robotics
    • 7.6.3 Process Control Systems
    • 7.6.4 Internet of Things (IoT) Devices
  • 7.7 Telecommunications
    • 7.7.1 Network Switches
    • 7.7.2 Routers
    • 7.7.3 Base Stations
    • 7.7.4 Optical Transport Systems
  • 7.8 Semiconductor
    • 7.8.1 Chiplet Development
    • 7.8.2 Incorporation into SoCs
    • 7.8.3 Heterogeneous Integration
  • 7.9 Other Applications

8 Global Chiplets Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Advanced Micro Devices, Inc. (AMD)
  • 10.2 Applied Materials, Inc.
  • 10.3 ARM Holdings
  • 10.4 Broadcom Inc.
  • 10.5 GlobalFoundries Inc.
  • 10.6 IBM Corporation
  • 10.7 Infineon Technologies AG
  • 10.8 Intel Corporation
  • 10.9 Marvell Technology Group Ltd.
  • 10.10 MediaTek Inc.
  • 10.11 Micron Technology, Inc.
  • 10.12 NVIDIA Corporation
  • 10.13 Qualcomm Incorporated
  • 10.14 Renesas Electronics Corporation
  • 10.15 Samsung Electronics Co., Ltd.
  • 10.16 Synopsys, Inc.
  • 10.17 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • 10.18 Texas Instruments Incorporated
  • 10.19 United Microelectronics Corporation (UMC)
  • 10.20 Xilinx, Inc.

List of Tables

  • Table 1 Global Chiplets Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Chiplets Market Outlook, By Processor (2021-2030) ($MN)
  • Table 3 Global Chiplets Market Outlook, By Field-Programmable Gate Array (FPGA) (2021-2030) ($MN)
  • Table 4 Global Chiplets Market Outlook, By Graphics Processing Unit (GPU) (2021-2030) ($MN)
  • Table 5 Global Chiplets Market Outlook, By Central Processing Unit (CPU) (2021-2030) ($MN)
  • Table 6 Global Chiplets Market Outlook, By Application Processing Unit (APU) (2021-2030) ($MN)
  • Table 7 Global Chiplets Market Outlook, By Artificial Intelligence Application-specific Integrated Circuit (AI ASIC) (2021-2030) ($MN)
  • Table 8 Global Chiplets Market Outlook, By Packaging Technology (2021-2030) ($MN)
  • Table 9 Global Chiplets Market Outlook, By 2.5D Packaging (2021-2030) ($MN)
  • Table 10 Global Chiplets Market Outlook, By 3D Packaging (2021-2030) ($MN)
  • Table 11 Global Chiplets Market Outlook, By Chip-on-Board (COB) (2021-2030) ($MN)
  • Table 12 Global Chiplets Market Outlook, By Chip-on-Flex (COF) (2021-2030) ($MN)
  • Table 13 Global Chiplets Market Outlook, By Chip-on-Glass (COG) (2021-2030) ($MN)
  • Table 14 Global Chiplets Market Outlook, By Chip-on-Wafer (COW) (2021-2030) ($MN)
  • Table 15 Global Chiplets Market Outlook, By Wafer-Level Packaging (WLP) (2021-2030) ($MN)
  • Table 16 Global Chiplets Market Outlook, By Fan-Out Wafer-Level Packaging (FO-WLP) (2021-2030) ($MN)
  • Table 17 Global Chiplets Market Outlook, By Other Packaging Technologies (2021-2030) ($MN)
  • Table 18 Global Chiplets Market Outlook, By Application (2021-2030) ($MN)
  • Table 19 Global Chiplets Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 20 Global Chiplets Market Outlook, By Smartphones (2021-2030) ($MN)
  • Table 21 Global Chiplets Market Outlook, By Tablets (2021-2030) ($MN)
  • Table 22 Global Chiplets Market Outlook, By Wearable Devices (2021-2030) ($MN)
  • Table 23 Global Chiplets Market Outlook, By Gaming Consoles (2021-2030) ($MN)
  • Table 24 Global Chiplets Market Outlook, By Personal Computers (2021-2030) ($MN)
  • Table 25 Global Chiplets Market Outlook, By Smart Home Devices (2021-2030) ($MN)
  • Table 26 Global Chiplets Market Outlook, By Healthcare (2021-2030) ($MN)
  • Table 27 Global Chiplets Market Outlook, By Medical Devices (2021-2030) ($MN)
  • Table 28 Global Chiplets Market Outlook, By Wearable Health Monitors (2021-2030) ($MN)
  • Table 29 Global Chiplets Market Outlook, By Implantable Medical Devices (2021-2030) ($MN)
  • Table 30 Global Chiplets Market Outlook, By Diagnostic Equipment (2021-2030) ($MN)
  • Table 31 Global Chiplets Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 32 Global Chiplets Market Outlook, By Advanced Driver Assistance Systems (ADAS) (2021-2030) ($MN)
  • Table 33 Global Chiplets Market Outlook, By Infotainment Systems (2021-2030) ($MN)
  • Table 34 Global Chiplets Market Outlook, By Engine Control Units (ECUs) (2021-2030) ($MN)
  • Table 35 Global Chiplets Market Outlook, By Advanced Sensors (2021-2030) ($MN)
  • Table 36 Global Chiplets Market Outlook, By Aerospace and Defense (2021-2030) ($MN)
  • Table 37 Global Chiplets Market Outlook, By Radar Systems (2021-2030) ($MN)
  • Table 38 Global Chiplets Market Outlook, By Avionics (2021-2030) ($MN)
  • Table 39 Global Chiplets Market Outlook, By Communication Systems (2021-2030) ($MN)
  • Table 40 Global Chiplets Market Outlook, By Surveillance Systems (2021-2030) ($MN)
  • Table 41 Global Chiplets Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 42 Global Chiplets Market Outlook, By Industrial Automation (2021-2030) ($MN)
  • Table 43 Global Chiplets Market Outlook, By Robotics (2021-2030) ($MN)
  • Table 44 Global Chiplets Market Outlook, By Process Control Systems (2021-2030) ($MN)
  • Table 45 Global Chiplets Market Outlook, By Internet of Things (IoT) Devices (2021-2030) ($MN)
  • Table 46 Global Chiplets Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 47 Global Chiplets Market Outlook, By Network Switches (2021-2030) ($MN)
  • Table 48 Global Chiplets Market Outlook, By Routers (2021-2030) ($MN)
  • Table 49 Global Chiplets Market Outlook, By Base Stations (2021-2030) ($MN)
  • Table 50 Global Chiplets Market Outlook, By Optical Transport Systems (2021-2030) ($MN)
  • Table 51 Global Chiplets Market Outlook, By Semiconductor (2021-2030) ($MN)
  • Table 52 Global Chiplets Market Outlook, By Chiplet Development (2021-2030) ($MN)
  • Table 53 Global Chiplets Market Outlook, By Incorporation into SoCs (2021-2030) ($MN)
  • Table 54 Global Chiplets Market Outlook, By Heterogeneous Integration (2021-2030) ($MN)
  • Table 55 Global Chiplets Market Outlook, By Other Applications (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.