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市场调查报告书
商品编码
1489379
到 2030 年线上测试市场预测:按产品、组件、技术、应用、最终用户和地区进行的全球分析In-Circuit Test Market Forecasts to 2030 - Global Analysis By Product (Bare Board Testing, In-Circuit Functional Testing, Analog Testing, Mixed Signal Testing and Other Products), Component, Technology, Application, End User and By Geography |
根据 Stratistics MRC 的数据,2023 年全球线上测试市场规模将达到 13.2 亿美元,预计到 2030 年将达到 16.4 亿美元,预测期内复合年增长率为 4.6%。
线上测试是电子製造中用于检查印刷基板组件 (PCBA) 品质的方法。测试是透过连接到 PCB 的组件进行的。 ICT 有助于识别元件值不正确、开路和短路等缺陷。 ICT 是一种在 PCBA 投入生产之前验证其完整性的快速有效方法,有助于提高整体产品可靠性和品管。
根据台湾电路板协会(TPCA)的深入分析,日韩PCB产业凭藉其终端产品设计能力,策略性地从低端产品向中阶产品转移,市场占有率已达到15.31%。
电子设备的复杂性不断增加
随着电子设备变得越来越复杂,元件密集且功能先进,传统的检测方法可能无法准确检测缺陷。 ICT 提供精确的测试能力,可以识别复杂电路中的缺陷,确保电子组件的品质和可靠性。这种日益增加的复杂性突显了 ICT 满足消费者和行业要求的严格品质标准的重要性,从而刺激了市场扩张。
测试复杂零件的局限性
由于存取点有限、设计复杂以及无法测试积体电路等不可存取的元件等因素,线上测试 (ICT) 在测试复杂元件方面面临限制。这些挑战阻碍了 ICT 检测某些类型缺陷的能力,例如间歇性缺陷或复杂零件内的缺陷。因此,ICT 可能无法为高度复杂的电子元件组件提供全面的测试范围。随着製造商寻求更全面的测试解决方案,这种限制可能会阻碍市场成长。
电子元件的小型化
电子元件小型化的趋势正在推动线上测试的发展,这需要更精确和可靠的测试方法。随着电子元件变得越来越小且电路基板的封装越来越密集,缺陷和故障的风险也随之增加。 ICT 提供了一种高精度的方法来检测这些问题,确保小型电子组件的品质和可靠性。因此,随着小型化趋势的发展,对 ICT 解决方案的需求也不断增加。
相容性问题
线上测试中的相容性问题源自于 ICT 系统需要与不同的电子元件和元件有效连接。缺乏相容性会导致效率低下、不准确并增加测试时间,从而降低生产效率并增加製造商的成本。此外,不断发展的行业标准和技术使相容性挑战更加复杂化,这可能会限制 ICT 解决方案的有效性和采用,从而阻碍市场成长。
COVID-19 的影响
COVID-19 的疫情对线上测试市场产生了各种影响。最初,由于全球供应链和製造业务中断,对 ICT 解决方案的需求放缓。然而,随着各行业适应远距工作和数位转型的加速,ICT技术的需求不断增加。此外,对支援远端工作和线上活动的通讯基础设施和电子设备的日益重视进一步增加了对 ICT 解决方案的需求。
模拟测试部分预计将成为预测期内最大的部分
模拟测试领域预计将出现良好的成长。 ICT 中的类比测试涉及检验印刷基板(PCB) 上的电阻器、电容器和放大器等类比元件的功能和性能。此测试可确保类比电路符合指定的容差和性能标准。它们在确保类比电子组件的品质和可靠性方面发挥关键作用,特别是在需要精确类比讯号处理的应用中,例如音讯、视讯和基于感测器的系统。
设计检验测试领域预计在预测期内复合年增长率最高。
预计设计检验测试领域在预测期内将出现最高的复合年增长率。 DVT 中利用 ICT 在产品开发的早期阶段检验电子设计的功能和性能。透过对原型和早期设计进行 ICT 测试,工程师可以识别并纠正潜在的设计缺陷,并确保最终产品符合性能规格和品质标准。 ICT 透过及早发现问题来简化产品开发流程,减少製造週期后期昂贵的设计修改的需要,并最终缩短上市时间并提高整体产品可靠性。
由于电子製造业强劲,预计亚太地区在预测期内将占据最大的市场占有率。中国、日本、韩国和台湾等国家是主要贡献者,拥有大量电子製造商和组装厂。该地区受益于技术熟练的劳动力、技术进步以及支持电子产业的有利政府政策等因素。此外,消费性电子、汽车电子和通讯基础设施的需求不断增长,进一步推动亚太地区ICT解决方案的采用,维持该地区的成长和在全球ICT市场的主导地位。
由于其强大的电子製造生态系统和技术创新,预计北美在预测期内将呈现最高的复合年增长率。该地区拥有大量领先的 ICT 解决方案提供商和电子公司,尤其是在美国和加拿大。严格的品质标准、对先进电子产品的高需求以及对研发的重视等因素促进了北美ICT市场的稳定成长。
According to Stratistics MRC, the Global In-Circuit Test Market is accounted for $1.32 billion in 2023 and is expected to reach $1.64 billion by 2030 growing at a CAGR of 4.6% during the forecast period. In-Circuit Test is a method used in electronics manufacturing to verify the quality of printed circuit board assemblies (PCBAs). It involves testing components while they are still mounted on the PCB. ICT helps identify faults such as incorrect component values, open circuits, and shorts. It's a fast and efficient way to ensure the integrity of PCBAs before they move to further stages of production, contributing to overall product reliability and quality control.
According to the insightful analysis provided by the Taiwan Printed Circuit Association (TPCA), Japanese and South Korean PCB industries, by leveraging their design prowess in terminal products, have strategically transitioned from low to mid-range products with a market share of 15.31%.
Increasing complexity of electronic devices
As electronic devices become more intricate with densely packed components and advanced functionalities, traditional testing methods may fall short in detecting defects accurately. ICT offers precise testing capabilities that can identify faults within complex circuitry, ensuring the quality and reliability of electronic assemblies. This growing complexity underscores the importance of ICT in meeting the stringent quality standards demanded by consumers and industries, thereby fueling its market expansion.
Limitations in testing complex components
In-Circuit Test (ICT) faces limitations in testing complex components due to factors like limited access points, intricate designs, and the inability to test non-accessible components like integrated circuits. These challenges hinder ICT's ability to detect certain types of defects, such as intermittent faults or defects within complex components. Consequently, ICT may not provide comprehensive testing coverage for highly complex electronic assemblies. This limitation can hamper market growth as manufacturers seek more comprehensive testing solutions.
Miniaturization of electronic components
The rising trend of miniaturization in electronic components fuels the growth of the in-circuit test by necessitating more precise and reliable testing methods. As electronic components become smaller and more densely packed on circuit boards, the risk of defects and faults increases. ICT offers a highly accurate means of detecting these issues, ensuring the quality and reliability of miniaturized electronic assemblies. Consequently, the demand for ICT solutions rises in tandem with the miniaturization trend.
Compatibility issues
Compatibility issues in in-circuit test arise due to the need for ICT systems to interface effectively with a wide range of electronic components and assemblies. Lack of compatibility can lead to inefficiencies, inaccuracies, and increased testing times, hampering productivity and increasing costs for manufacturers. Moreover, evolving industry standards and technologies further compound compatibility challenges, potentially limiting the effectiveness and adoption of ICT solutions, thereby impeding market growth.
Covid-19 Impact
The covid-19 pandemic has had a mixed impact on the in-circuit test market. Initially, disruptions in global supply chains and manufacturing operations led to a slowdown in demand for ICT solutions. However, as industries adapted to remote work and digital transformation accelerated, there was a subsequent increase in demand for ICT technologies. Additionally, the growing emphasis on telecommunication infrastructure and electronic devices to support remote work and online activities further boosted the demand for ICT solutions, albeit with some fluctuations due to ongoing economic uncertainties.
The analog testing segment is expected to be the largest during the forecast period
The analog testing segment is estimated to have a lucrative growth. Analog testing in ICT involves verifying the functionality and performance of analog components such as resistors, capacitors, and amplifiers on a printed circuit board (PCB). This testing ensures that analog circuits meet specified tolerances and performance criteria. It plays a crucial role in ensuring the quality and reliability of analog electronic assemblies, especially in applications where precise analog signal processing is essential, such as audio, video, and sensor-based systems.
The design verification testing segment is expected to have the highest CAGR during the forecast period
The design verification testing segment is anticipated to witness the highest CAGR growth during the forecast period. ICT is utilized in DVT to validate the functionality and performance of electronic designs during the early stages of product development. By subjecting prototypes or initial designs to ICT, engineers can identify and rectify potential design flaws, ensuring that the final product meets performance specifications and quality standards. It helps streamline the product development process by detecting issues early, reducing the need for costly design revisions later in the production cycle, and ultimately improving time-to-market and overall product reliability.
Asia Pacific is projected to hold the largest market share during the forecast period due to its robust electronics manufacturing sector. Countries like China, Japan, South Korea, and Taiwan are key contributors, hosting numerous electronics manufacturers and assembly plants. The region benefits from factors such as skilled labor, technological advancements, and favorable government policies supporting the electronics industry. Additionally, the increasing demand for consumer electronics, automotive electronics, and telecommunications infrastructure further drives the adoption of ICT solutions in the Asia-Pacific region, sustaining its growth and prominence in the global ICT market.
North America is projected to have the highest CAGR over the forecast period, owing to its robust electronics manufacturing ecosystem and technological innovation. The region boasts a significant presence of leading ICT solution providers and electronics companies, particularly in the United States and Canada. Factors such as stringent quality standards, high demand for advanced electronic products, and a focus on research and development contribute to the steady growth of the ICT market in North America.
Key players in the market
Some of the key players profiled in the In-Circuit Test Market include Keysight Technologies, Teradyne, Advantest Corporation, SPEA S.p.A., Test Research Inc. (TRI), Digitaltest GmbH, JTAG Technologies, Seica S.p.A., Hioki E.E. Corporation, ASSET InterTech, Averna, Acculogic Inc. and Konrad GmbH.
In November 2020, Hioki launched the In-Circuit Tester FA1220-02. It is the space-saving design system generating pass/fail judgments for circuit boards that are populated with electronic components. Its slide-in mechanism simplifies installation and removal of test fixtures, reducing man-hours and workload and improving productivity in populated board testing and production environments.
In February 2020, Test Research, Inc. (TRI) launched the TR5001 SII LED Series, a multicore In-Circuit Test (ICT) solution for LED lighting. The TR5001 SII LED Series is an ICT+FCT innovation that can test up to 1080 LED channels for color and brightness simultaneously. It has up to four independent cores for multi-core parallel testing and a quick disconnection interface.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.