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市场调查报告书
商品编码
1503365
到 2030 年 LTCC 和 HTCC 市场预测:按产品类型、製程类型、材料类型、应用、最终用户和地区进行的全球分析LTCC And HTCC Market Forecasts to 2030 - Global Analysis By Product Type (Substrates, Packages and Modules), Process Type, Material Type, Application, End User and By Geography |
根据Stratistics MRC预测,2024年LTCC和HTCC的全球市场规模将达到31.4亿美元,预计到2030年将达到43.4亿美元,预测期内复合年增长率为5.5%。
低温共烧陶瓷(LTCC)和高温共烧陶瓷(HTCC)是用于电子元件生产的技术。 LTCC 使用可在 900°C 以下温度共烧的陶瓷材料。这种方法允许将电阻器、电容器和电感器等被动元件整合在陶瓷基板内,使其适用于射频模组和医疗设备等高频、高密度应用。另一方面,HTCC 使用的陶瓷材料需要在 1600°C 以上的温度下烧製。此製程通常用于需要更高热稳定性和机械稳定性的应用,例如航太和军用电子产品。
电子设备小型化的需求
LTCC 和 HTCC 受益于此趋势,因为它们可以在较小的占地面积内整合多个被动元件,使其成为智慧型手机、医疗植入和物联网设备等小型设备的理想选择。 LTCC 的低介电损耗和出色的热性能也支援这些应用所需的性能和可靠性。这也包括航太、军事和工业电子产品,其中 HTCC 出色的热稳定性和机械稳定性至关重要。总体而言,对更小、更有效率的电子设备的推动正在加速 LTCC 和 HTCC 技术的进步和采用。
初始投资高
为这些先进陶瓷技术建立製造设施需要大量资本支出,用于专业设备、材料和熟练劳动力。这种财务障碍会阻碍中小企业(SME)进入市场并限制创新和竞争。此外,改进这些技术的研发 (R&D) 成本高昂,进一步加重了潜在投资者和製造商的负担。结果是,拥有充足管理资源的大公司可能会垄断市场,导致价格竞争力下降和进度延误。
扩大通讯基础设施
LTCC 技术受益于其处理高频讯号的能力,使其成为 5G 网路和其他先进电讯系统中小型高效组件的理想选择。这增加了对基于 LTCC 的滤波器、天线和模组的需求。同时,HTCC技术具有优异的热稳定性和机械稳定性,支援高功率电讯应用,即使在恶劣条件下也能确保可靠的性能,推动市场成长。
仅提供有限的材料
高纯度陶瓷或某些金属膏等专用原材料的短缺可能会导致供应链中断和价格上涨,从而影响製造商满足需求的能力。这些限制也会阻碍研究和开发,减缓创新和新产品的推出。因此,公司可能在扩大业务规模和维持有竞争力的定价方面面临挑战,这可能会阻碍市场成长。
COVID-19 的影响
疫情爆发导致供应链严重延误,工厂不得不暂时关闭并保护员工。这种中断导致 LTCC 和 HTCC 材料和组件的製造和交货延迟,从而难以满足需求和履行义务。此外,疫情带来的景气衰退改变了消费者的消费习惯和投资选择,一些行业,如医疗保健、通讯、汽车、航太和汽车工业等,是LTCC和HTCC元件的重要用户,这导致商品和服务需求下降。
多晶片模组市场预计在预测期内成为最大的市场
将多个半导体晶粒整合到单一封装中的多晶片模组预计将成为预测期内最大的市场,因为它们需要先进的构装基板来支援其紧凑性和高性能。 LTCC 和 HTCC 材料具有出色的热稳定性、电气性能以及与微型电子元件的兼容性,是这些基板的理想选择。因此,在 MCM 中使用 LTCC 和 HTCC 可以增强功能、减少讯号损失并改善散热,这对于高频和高功率应用至关重要。
预计通讯业在预测期内的复合年增长率最高
由于LTCC技术在微波和毫米波频段应用(例如蓝牙模组、行动电话前端模组和WLAN)中的快速普及,预计通讯业的复合年增长率最高。此外,随着各公司开发先进的 LTCC 产品,新的商机也等着。
由于该地区对基于 LTCC 的 PCB 的需求不断增长以及无线通讯行业的崛起,预计北美将在预测期内占据最大的市场占有率。在欧洲,电动车产业的市场开拓是市场成长的因素。 2020年,欧洲将超越中国成为最大的电动车市场。 2020年电动车销量为140万辆,占电动车总销量的45.0%。电动车产业的成长预计将增加对汽车电子产品的需求,并对预测期内的产品需求产生正面影响。
由于印度、中国、韩国和日本等国家汽车、消费和工业电子产业的快速发展,预计亚太地区在预测期内将维持最高的复合年增长率。随着世界各国政府实施电动车奖励计划,预计汽车电子产品製造商将被吸引到该地区。此外,随着5G技术的出现,中国正在见证电力电子产业的投资,预计有助于市场成长。
According to Stratistics MRC, the Global LTCC And HTCC Market is accounted for $3.14 billion in 2024 and is expected to reach $4.34 billion by 2030 growing at a CAGR of 5.5% during the forecast period. Low-Temperature Co-fired Ceramics (LTCC) and High-Temperature Co-fired Ceramics (HTCC) are technologies used in the manufacturing of electronic components. LTCC involves the use of ceramic materials that can be co-fired at temperatures below 900°C. This method allows for the integration of passive components like resistors, capacitors, and inductors within the ceramic substrate, making it suitable for high-frequency and high-density applications, such as RF modules and medical devices. HTCC, on the other hand, uses ceramic materials that require firing at temperatures above 1600°C. This process is typically used for applications that demand higher thermal and mechanical stability, such as aerospace and military electronics.
Demand for miniaturized electronics
LTCC and HTCC benefits from this trend due to its capability to integrate multiple passive components within a small footprint, making it ideal for compact devices such as smartphones, medical implants, and IoT devices. The low dielectric loss and excellent thermal properties of LTCC also support the performance and reliability required in these applications. This includes aerospace, military, and industrial electronics, where HTCC's superior thermal and mechanical stability is essential. Overall, the push for smaller, more efficient electronic devices accelerates advancements and adoption in both LTCC and HTCC technologies
High Initial Investment
Setting up manufacturing facilities for these advanced ceramic technologies involves substantial capital expenditure on specialized equipment, materials, and skilled labor. This financial barrier can deter small and medium-sized enterprises (SMEs) from entering the market, limiting innovation and competition. Additionally, the significant costs associated with research and development (R&D) for improving these technologies further strain potential investors and manufacturers. As a result, the market can become dominated by larger companies with sufficient resources, potentially leading to less competitive pricing and slower advancements.
Telecom infrastructure expansion
LTCC technology benefits due to its capability to handle high-frequency signals, making it ideal for compact, efficient components in 5G networks and other advanced telecom systems. This drives demand for LTCC-based filters, antennas, and modules. On the other hand HTCC technology, with its superior thermal and mechanical stability, supports high-power telecom applications, ensuring reliable performance under demanding conditions propel the growth of the market.
Limited material availability
Scarcity of specialized raw materials, such as high-purity ceramics and specific metal pastes, can lead to supply chain disruptions and higher prices, affecting manufacturers' ability to meet demand. This limitation can also hinder research and development efforts, slowing innovation and the introduction of new products. Consequently, companies may face challenges in scaling their operations and maintaining competitive pricing, which can deter market growth
Covid-19 Impact
The epidemic caused extensive supply chain delays since industrial plants had to close temporarily to comply with lockdown procedures and protect employees. The manufacture and delivery of LTCC and HTCC materials and components were delayed as a result of this interruption, making it difficult to satisfy demand and complete obligations. In addition, the economic recession brought on by the pandemic changed consumer spending habits and investment choices, which resulted in a decline in demand for goods and services in some industries, including healthcare, telecommunications, automotive, aerospace and the automotive industry all of which are important users of LTCC and HTCC components.
The multi-chip modules segment is expected to be the largest during the forecast period
The multi-chip modules is expected to be the largest during the forecast period as which integrate multiple semiconductor dies into a single package, demand advanced substrates to support their compact and high-performance nature. LTCC and HTCC materials are ideal for these substrates due to their excellent thermal stability, electrical properties, and compatibility with miniaturized electronic components. Thus the use of LTCC and HTCC in MCMs enables enhanced functionality, reduced signal loss, and improved heat dissipation, which are crucial for high-frequency and high-power applications.
The telecommunications segment is expected to have the highest CAGR during the forecast period
The telecommunications segment is expected to have the highest CAGR during the forecast period due to the penetration of LTCC technology is rapidly increasing for applications in microwave and millimeter-wave frequency band in areas including Bluetooth module, front end module of mobile phones, and WLAN. Moreover, new opportunities lie ahead as various companies are developing advanced LTCC products, which are projected to benefit these companies to expand their footprint in 5G communication.
North America is projected to hold the largest market share during the forecast period attributed to the rising demand for LTCC based PCBs and the flourishing wireless communication industry in the region. In Europe, market growth is attributed to the development of the EV industry. In 2020, Europe exceeded China and became the largest EV market. With 1.4 million EVs sold, the region held a revenue share of 45.0% of EV sales in 2020. Growth in the EV industry will augment demand for auto electronics and positively influence product demand over the forecast period.
Asia Pacific is projected to hold the highest CAGR over the forecast period owing to the rapidly flourishing automotive, consumer, and industrial electronics sectors in countries such as India, China, South Korea, and Japan. The ongoing incentive schemes for EVs by governments of different countries are anticipated to attract auto-electronic product manufacturers to the region. Furthermore, with the advent of 5G technology, China is witnessing investments in its power electronics industry, which is anticipated to benefit market growth.
Key players in the market
Some of the key players in LTCC And HTCC market include ACX Corp., API Technologies, ECRI Microelectronics, Hitachi Metals Ltd, KOA Corporation, Kyocera Corporation, Maruwa Co. Ltd., Micro Systems Technologies, Murata Manufacturing Co., Ltd., NGK Spark Plug Ltd., NIKKO Company, Selmic Oy, Soar Technology Co., Ltd., TDK Corporation and Yokowo co., ltd
In June 2024, Kyocera launches new cut-off solution "KGZ" for small parts machining. In addition, there are some challenges regarding the workability of the machine, such as the need for a skilled operator to quickly and accurately replace and install inserts in a narrow space.
In June 2024, Kyocera Installs World's First*1 Fine Cordierite Ceramic Mirror for International Space Station's Experimental Optical Communications. This demonstration was conducted jointly by the National Institute of Information and Communications Technology
In June 2024, Hitachi Energy launches innovative oil-free and plug-and-play traction transformer. This plug-and-play solution is a breakthrough technology for dry-type on-board traction transformer.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.