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市场调查报告书
商品编码
1577239

2030 年半导体键结市场预测：按类型、材料、製程、技术、应用、最终用户和地区进行的全球分析

Semiconductor Bonding Market Forecasts to 2030 - Global Analysis By Type (Wire Bonding, Flip Chip Bonding, Bump Bonding, Interposer Bonding and Other Types), Material, Process, Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，2024 年全球半导体键结市场规模为 10.445 亿美元，预计到 2030 年将达到 14.484 亿美元，预测期内复合年增长率为 5.6%。

半导体键结是电子装置组装中的重要工艺，将不同的半导体材料互连以形成功能电路和组件。该工艺涉及多种技术，包括引线接合法、覆晶键合和黏剂键合，每种技术都经过专门设计，以确保牢固的电气和机械连接。有效的键结对于半导体装置的性能、可靠性和寿命至关重要，并影响温度控管、讯号完整性和整体装置效率。

各行业需求增加

该市场的需求正在各个行业不断扩大，包括家电、汽车和通讯。在 5G、物联网和电动车等趋势的推动下，对先进电子产品的需求不断增加，对高效、可靠的半导体连接的需求也不断增加。这种扩散正在推动键合技术的创新，使製造商能够满足性能要求并增加越来越小、越来越强大的电子系统的功能。

缺乏技术纯熟劳工

市场上缺乏技术纯熟劳工构成了阻碍生产效率和创新的重大挑战。由于缺乏训练有素的技术人员和工程师，主要企业难以维持品质标准，这可能导致半导体设备的缺陷率增加。这些劳动力差异减缓了先进技术的开发，推迟了计划进度，并最终影响了竞争力以及满足各行业对先进电子产品不断增长的需求的能力。

转向电动车 (EV)

向电动车 (EV) 的转变正在推动市场的显着成长。这些车辆需要复杂的电子系统来进行电池管理、配电和资讯娱乐。这种转变增加了对确保安全、效率和性能的可靠半导体连接的需求。因此，製造商正在投资创新的黏合技术，以满足电动车应用的特定需求，推动进步，提高电动车组件的功能和可靠性。

生产成本高

市场上不断上升的生产成本会对製造商的盈利和竞争力产生重大影响。这些增加的成本可归因于先进的材料和复杂的连接技术。因此，公司可能难以维持其产品的实惠价格，这可能会限制市场准入并减少整体需求。这些财务负担也会阻碍研发投资，并阻碍对未来成长至关重要的键合技术的创新和进步。

COVID-19 的影响：

COVID-19 大流行对市场产生了重大影响，扰乱了供应链并导致生产延误。停工和劳动力短缺降低了製造能力，而远距工作和医疗保健应用中对电子产品的需求增加则导致资源紧张。此外，半导体供不应求出现，影响了依赖黏合元件的各个产业。这些挑战凸显了提高半导体製造流程和供应链管理的弹性和灵活性的必要性。

预计覆晶键合领域在预测期内将是最大的

预计覆晶接合领域在预测期内将占据最大的市场占有率。该技术增强了电气性能和温度控管，从而实现智慧型手机、电脑和汽车电子等高性能应用的紧凑设计。随着小型化和效率要求的提高，覆晶接合不断受到关注并推动创新，以支援现代电子设备不断变化的需求。

汽车业预计在预测期内复合年增长率最高

预计汽车业在预测期内复合年增长率最高。随着汽车製造商整合驾驶辅助、资讯娱乐和电动动力传动系统等技术，可靠的半导体接合已成为性能和安全性的关键。这一趋势正在加速创新黏合技术的采用，使製造商能够生产更小、更有效率的组件，以满足现代汽车应用和电动车所需的严格标准。

比最大的地区

在技​​术进步的推动下，预计北美地区将在预测期内占据最大的市场占有率。主要驱动因素包括 5G、汽车电子产品和物联网应用的日益普及。主要企业正在投资创新的黏合技术，以提高性能和效率。作为额外的好处，该地区受益于强大的研发生态系统，促进半导体产业内的协作和创新，以满足不断变化的市场需求。

复合年增长率最高的地区：

预计亚太地区在预测期内将实现最高成长率。物联网、人工智慧和 5G 等技术的日益普及极大地推动了对先进半导体键合技术的需求。这些技术需要依赖高效接合製程的高性能晶片。电动车产量的增加是一个主要驱动因素，因为这些汽车需要复杂的半导体元件来实现电源管理和效率。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争标基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球半导体键结市场：按类型

  • 引线接合法
  • 覆晶接合
  • 凸块接合
  • 中介层键合
  • 其他类型

第六章 全球半导体键结市场：依材料分类

  • 金子
  • 铝
  • 焊接
  • 黏剂
  • 其他材料

第七章全球半导体键结市场：按流程

  • 晶粒到晶粒接合
  • 晶粒/晶圆键合
  • 晶圆间键合
  • 其他工艺

第八章全球半导体键结市场：依技术分类

  • 热压黏合
  • 用黏剂黏合
  • 焊点
  • 混合键合
  • 其他技术

第九章 全球半导体键结市场：依应用分类

  • 储存装置
  • 射频装置
  • CMOS影像感测器
  • 引导的
  • 微机电系统元件
  • 单独的组件
  • 积体电路（IC）
  • 其他用途

第10章全球半导体键结市场：依最终用户分类

  • 半导体製造商
  • 医疗设备製造商
  • 车
  • 航太和国防
  • 通讯设备
  • 研究所
  • 其他最终用户

第十一章全球半导体键结市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第十二章 主要进展

  • 合约、伙伴关係、合作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十三章 公司概况

  • EV Group
  • ASMPT Semiconductor Solutions
  • MRSI Systems.
  • WestBond Inc.
  • Panasonic Holding Corporation
  • Palomar Technologies
  • Dr. Tresky AG
  • BE Semiconductor Industries NV
  • Fasford Technology Co.Ltd
  • Kulicke and Soffa Industries Inc.
  • DIAS Automation
  • Shibaura Mechatronics Corporation
  • SUSS MicroTec SE
  • Tokyo Electron Limited
  • Intel Corporation
  • Kulicke and Soffa Industries, Inc.
  • TDK Corporation
Product Code: SMRC27559

According to Stratistics MRC, the Global Semiconductor Bonding Market is accounted for $1044.5 million in 2024 and is expected to reach $1448.4 million by 2030 growing at a CAGR of 5.6% during the forecast period. Semiconductor bonding is a crucial process in the assembly of electronic devices, where different semiconductor materials are interconnected to form functional circuits and components. This process encompasses various techniques, including wire bonding, flip-chip bonding, and adhesive bonding, each tailored to ensure robust electrical and mechanical connections. Effective bonding is essential for the performance, reliability, and longevity of semiconductor devices, influencing thermal management, signal integrity, and overall device efficiency.

Market Dynamics:

Driver:

Increasing demand from various industries

The market is experiencing growing demand across various industries, including consumer electronics, automotive, and telecommunications. As the need for advanced electronic devices rises, driven by trends like 5G, IoT, and electric vehicles, the demand for efficient and reliable semiconductor connections intensifies. This surge propels innovations in bonding technologies, enabling manufacturers to meet performance requirements and enhance the functionality of increasingly compact and powerful electronic systems.

Restraint:

Shortage of skilled labor

The shortage of skilled labor in the market poses significant challenges, hindering production efficiency and innovation. With a lack of trained technicians and engineers, companies may struggle to maintain quality standards, leading to increased defect rates in semiconductor devices. This workforce gap can slow down the development of advanced technologies and delay project timelines, ultimately impacting competitiveness and the ability to meet the rising demand for sophisticated electronic products in various industries.

Opportunity:

Shift towards electric vehicles (EVs)

The shift towards electric vehicles (EVs) is driving substantial growth in the market, as these vehicles require advanced electronic systems for battery management, power distribution, and infotainment. This transition increases the demand for reliable semiconductor connections that ensure safety, efficiency, and performance. Consequently, manufacturers are investing in innovative bonding technologies to meet the specific needs of EV applications, fostering advancements that enhance the functionality and reliability of electric vehicle components.

Threat:

High production costs

High production costs in the market can significantly impact profitability and competitiveness for manufacturers. These elevated expenses may stem from advanced materials, intricate bonding techniques. As a result, companies may struggle to maintain affordable pricing for their products, limiting market accessibility and reducing overall demand. This financial strain can also hinder investment in research and development, stalling innovation and advancements in bonding technologies critical for future growth.

Covid-19 Impact:

The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in production. Lockdowns and labor shortages led to reduced manufacturing capacity, while increased demand for electronics in remote work and healthcare applications strained resources. Additionally, semiconductor shortages emerged, affecting various industries reliant on bonded components. These challenges highlighted the need for greater resilience and flexibility in semiconductor manufacturing processes and supply chain management.

The flip chip bonding segment is projected to be the largest during the forecast period

The flip chip bonding segment is projected to account for the largest market share during the projection period. This method enhances electrical performance and thermal management, enabling compact designs in high-performance applications such as smartphones, computers, and automotive electronics. As demand for miniaturization and efficiency grows, flip chip bonding continues to gain prominence, driving innovations that support the evolving needs of modern electronic devices.

The automotives segment is expected to have the highest CAGR during the forecast period

The automotives segment is expected to have the highest CAGR during the extrapolated period. As automakers integrate technologies like driver assistance, infotainment, and electric powertrains, reliable semiconductor bonding becomes essential for performance and safety. This trend is accelerating the adoption of innovative bonding techniques, enabling manufacturers to produce smaller, more efficient components that meet the rigorous standards required for modern automotive applications and electric vehicles.

Region with largest share:

North America region is projected to account for the largest market share during the forecast period fueled by advancements in technology. Key drivers include the rising adoption of 5G, automotive electronics, and IoT applications. Major companies are investing in innovative bonding techniques to enhance performance and efficiency. Additionally, the region benefits from a strong research and development ecosystem, fostering collaboration and innovation within the semiconductor industry to address evolving market needs.

Region with highest CAGR:

Asia Pacific is expected to register the highest growth rate over the forecast period. The increasing adoption of technologies such as IoT, AI, and 5G is significantly boosting demand for advanced semiconductor bonding techniques. These technologies require high-performance chips that depend on efficient bonding processes. The rise in electric vehicle production is a major driver, as these vehicles require sophisticated semiconductor components for power management and efficiency.

Key players in the market

Some of the key players in Semiconductor Bonding market include EV Group, ASMPT Semiconductor Solutions, MRSI Systems., WestBond Inc., Panasonic Holding Corporation, Palomar Technologies, Dr. Tresky AG, BE Semiconductor Industries NV, Fasford Technology Co.Ltd , Kulicke and Soffa Industries Inc., DIAS Automation, Shibaura Mechatronics Corporation, SUSS MicroTec SE, Tokyo Electron Limited, Intel Corporation, Kulicke and Soffa Industries, Inc. and TDK Corporation.

Key Developments:

In March 2024, TANAKA Kikinzoku Kogyo K.K., a leading company in the precious metals industry, recently pioneered the semiconductor bonding field by developing a gold particle bonding technology. This innovative method utilizes AuRoFUSE, a specialized low-temperature fired paste, to facilitate gold-to-gold bonding in high-density semiconductor mounting applications.

In December 2023, Tokyo Electron Kyushu developed an Extreme Laser Lift Off (XLO) technology. This cutting-edge approach is set to revolutionize the field of 3D integration for advanced semiconductor devices that utilize permanent wafer bonding.

Types Covered:

  • Wire Bonding
  • Flip Chip Bonding
  • Bump Bonding
  • Interposer Bonding
  • Other Types

Materials Covered:

  • Gold
  • Aluminum
  • Solder
  • Conductive Adhesives
  • Other Materials

Processes Covered:

  • Die-to-Die Bonding
  • Die-to-Wafer Bonding
  • Wafer-to-Wafer Bonding
  • Other Processes

Technologies Covered:

  • Thermo-Compression Bonding
  • Adhesive Bonding
  • Solder Bonding
  • Hybrid Bonding
  • Other Technologies

Applications Covered:

  • Memory Devices
  • RF Devices
  • CMOS Image Sensors
  • LED
  • MEMS Devices
  • Discrete Components
  • Integrated Circuits (ICs)
  • Other Applications

End Users Covered:

  • Semiconductor Manufacturers
  • Medical Device Manufacturers
  • Automotives
  • Aerospace & Defense
  • Telecommunications Equipments
  • Research Institutions
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Semiconductor Bonding Market, By Type

  • 5.1 Introduction
  • 5.2 Wire Bonding
  • 5.3 Flip Chip Bonding
  • 5.4 Bump Bonding
  • 5.5 Interposer Bonding
  • 5.6 Other Types

6 Global Semiconductor Bonding Market, By Material

  • 6.1 Introduction
  • 6.2 Gold
  • 6.3 Aluminum
  • 6.4 Solder
  • 6.5 Conductive Adhesives
  • 6.6 Other Materials

7 Global Semiconductor Bonding Market, By Process

  • 7.1 Introduction
  • 7.2 Die-to-Die Bonding
  • 7.3 Die-to-Wafer Bonding
  • 7.4 Wafer-to-Wafer Bonding
  • 7.5 Other Processes

8 Global Semiconductor Bonding Market, By Technology

  • 8.1 Introduction
  • 8.2 Thermo-Compression Bonding
  • 8.3 Adhesive Bonding
  • 8.4 Solder Bonding
  • 8.5 Hybrid Bonding
  • 8.6 Other Technologies

9 Global Semiconductor Bonding Market, By Application

  • 9.1 Introduction
  • 9.2 Memory Devices
  • 9.3 RF Devices
  • 9.4 CMOS Image Sensors
  • 9.5 LED
  • 9.6 MEMS Devices
  • 9.7 Discrete Components
  • 9.8 Integrated Circuits (ICs)
  • 9.9 Other Applications

10 Global Semiconductor Bonding Market, By End User

  • 10.1 Introduction
  • 10.2 Semiconductor Manufacturers
  • 10.3 Medical Device Manufacturers
  • 10.4 Automotives
  • 10.5 Aerospace & Defense
  • 10.6 Telecommunications Equipments
  • 10.7 Research Institutions
  • 10.8 Other End Users

11 Global Semiconductor Bonding Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 EV Group
  • 13.2 ASMPT Semiconductor Solutions
  • 13.3 MRSI Systems.
  • 13.4 WestBond Inc.
  • 13.5 Panasonic Holding Corporation
  • 13.6 Palomar Technologies
  • 13.7 Dr. Tresky AG
  • 13.8 BE Semiconductor Industries NV
  • 13.9 Fasford Technology Co.Ltd
  • 13.10 Kulicke and Soffa Industries Inc.
  • 13.11 DIAS Automation
  • 13.12 Shibaura Mechatronics Corporation
  • 13.13 SUSS MicroTec SE
  • 13.14 Tokyo Electron Limited
  • 13.15 Intel Corporation
  • 13.16 Kulicke and Soffa Industries, Inc.
  • 13.17 TDK Corporation

List of Tables

  • Table 1 Global Semiconductor Bonding Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Semiconductor Bonding Market Outlook, By Type (2022-2030) ($MN)
  • Table 3 Global Semiconductor Bonding Market Outlook, By Wire Bonding (2022-2030) ($MN)
  • Table 4 Global Semiconductor Bonding Market Outlook, By Flip Chip Bonding (2022-2030) ($MN)
  • Table 5 Global Semiconductor Bonding Market Outlook, By Bump Bonding (2022-2030) ($MN)
  • Table 6 Global Semiconductor Bonding Market Outlook, By Interposer Bonding (2022-2030) ($MN)
  • Table 7 Global Semiconductor Bonding Market Outlook, By Other Types (2022-2030) ($MN)
  • Table 8 Global Semiconductor Bonding Market Outlook, By Material (2022-2030) ($MN)
  • Table 9 Global Semiconductor Bonding Market Outlook, By Gold (2022-2030) ($MN)
  • Table 10 Global Semiconductor Bonding Market Outlook, By Aluminum (2022-2030) ($MN)
  • Table 11 Global Semiconductor Bonding Market Outlook, By Solder (2022-2030) ($MN)
  • Table 12 Global Semiconductor Bonding Market Outlook, By Conductive Adhesives (2022-2030) ($MN)
  • Table 13 Global Semiconductor Bonding Market Outlook, By Other Materials (2022-2030) ($MN)
  • Table 14 Global Semiconductor Bonding Market Outlook, By Process (2022-2030) ($MN)
  • Table 15 Global Semiconductor Bonding Market Outlook, By Die-to-Die Bonding (2022-2030) ($MN)
  • Table 16 Global Semiconductor Bonding Market Outlook, By Die-to-Wafer Bonding (2022-2030) ($MN)
  • Table 17 Global Semiconductor Bonding Market Outlook, By Wafer-to-Wafer Bonding (2022-2030) ($MN)
  • Table 18 Global Semiconductor Bonding Market Outlook, By Other Processes (2022-2030) ($MN)
  • Table 19 Global Semiconductor Bonding Market Outlook, By Technology (2022-2030) ($MN)
  • Table 20 Global Semiconductor Bonding Market Outlook, By Thermo-Compression Bonding (2022-2030) ($MN)
  • Table 21 Global Semiconductor Bonding Market Outlook, By Adhesive Bonding (2022-2030) ($MN)
  • Table 22 Global Semiconductor Bonding Market Outlook, By Solder Bonding (2022-2030) ($MN)
  • Table 23 Global Semiconductor Bonding Market Outlook, By Hybrid Bonding (2022-2030) ($MN)
  • Table 24 Global Semiconductor Bonding Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 25 Global Semiconductor Bonding Market Outlook, By Application (2022-2030) ($MN)
  • Table 26 Global Semiconductor Bonding Market Outlook, By Memory Devices (2022-2030) ($MN)
  • Table 27 Global Semiconductor Bonding Market Outlook, By RF Devices (2022-2030) ($MN)
  • Table 28 Global Semiconductor Bonding Market Outlook, By CMOS Image Sensors (2022-2030) ($MN)
  • Table 29 Global Semiconductor Bonding Market Outlook, By LED (2022-2030) ($MN)
  • Table 30 Global Semiconductor Bonding Market Outlook, By MEMS Devices (2022-2030) ($MN)
  • Table 31 Global Semiconductor Bonding Market Outlook, By Discrete Components (2022-2030) ($MN)
  • Table 32 Global Semiconductor Bonding Market Outlook, By Integrated Circuits (ICs) (2022-2030) ($MN)
  • Table 33 Global Semiconductor Bonding Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 34 Global Semiconductor Bonding Market Outlook, By End User (2022-2030) ($MN)
  • Table 35 Global Semiconductor Bonding Market Outlook, By Semiconductor Manufacturers (2022-2030) ($MN)
  • Table 36 Global Semiconductor Bonding Market Outlook, By Medical Device Manufacturers (2022-2030) ($MN)
  • Table 37 Global Semiconductor Bonding Market Outlook, By Automotives (2022-2030) ($MN)
  • Table 38 Global Semiconductor Bonding Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 39 Global Semiconductor Bonding Market Outlook, By Telecommunications Equipments (2022-2030) ($MN)
  • Table 40 Global Semiconductor Bonding Market Outlook, By Research Institutions (2022-2030) ($MN)
  • Table 41 Global Semiconductor Bonding Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.