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市场调查报告书
商品编码
1587592

到 2030 年覆晶市场预测：基板、凸点技术、应用、最终用户和地区进行的全球分析

Flip Chip Market Forecasts to 2030 - Global Analysis By Substrate, Bumping Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2024年全球覆晶市场规模将达306亿美元，预计2030年将达到518亿美元，预测期内复合年增长率为9.2%。

覆晶是一种半导体封装技术，它使用将晶片垫片连接到基板上相应垫片的焊料凸块晶粒积体电路（IC）晶片直接安装到基板或电路基板。与用细线连接晶粒的传统引线接合法合不同，覆晶可以实现更紧凑的设计并提高电气性能。将晶粒翻转过来可以透过焊料焊料凸块进行直接电气连接，从而改善散热并减少讯号延迟。

对先进封装的需求不断增长

对先进封装技术不断增长的需求极大地推动了覆晶构装的采用和创新。这种翻转晶片并透过焊料凸块将其直接连接到基板的方法提高了电气性能和温度控管。随着家用电子电器、物联网设备和汽车应用变得越来越复杂，对更小、更快、更有效率元件的需求不断增加，导致製造商考虑覆晶解决方案。这些技术提供了更高的 I/O 密度并减少了寄生电感和电容，使其成为高速应用的理想选择。

温度控管问题

温度控管问题极大地影响了覆晶技术的性能和可靠性，倒装晶片技术是一种广泛使用的积体电路封装方法。覆晶的特点是将晶粒直接安装到基板上并透过焊料凸块连接。这种配置有利于缩短讯号途径长度，但通常会带来散热挑战。随着晶片变得越来越复杂，它们会产生大量热量，这可能会导致热应力并影响性能。如果没有有效的散热，动作温度可能会升高，导致效率降低、可能发生热失控，甚至晶片故障。

扩大 LED 和功率元件的用途

LED技术和先进功率元件的日益采用显着提高了覆晶构装的性能和实用性。覆晶是一种将半导体晶粒直接安装到基板上的方法，提供出色的电气连接和温度控管，使其成为高密度应用的理想选择。随着 LED 照明和电力电子在各个行业中变得越来越普遍，对更有效率、更紧凑、更可靠的封装解决方案的需求正在迅速增加。覆晶技术透过实现更小的外形尺寸和改善散热来满足这些需求，这对于维持 LED 和功率装置的性能和寿命至关重要。

智慧财产权问题

覆晶技术对于先进半导体封装至关重要，但面临阻碍其广泛采用的重大智慧财产权 (IP) 挑战。不同的公司在覆晶製程、材料和设计方面持有大量专利，从而形成复杂的授权合约并可能引发法律纠纷。这种碎片化对新参与企业和小型企业造成了障碍，它们可能缺乏应对复杂智慧财产权环境的资源。专注于诉讼而不是开发的公司可能会抑制创新并减缓覆晶技术本身的进步。此外，与智慧财产权合规和侵权风险相关的高成本阻碍了研发投资，进一步影响了技术发展。

COVID-19 的影响：

COVID-19 大流行对覆晶产业产生了重大影响，扰乱了世界各地的供应链和製造流程。由于封锁，许多半导体製造工厂面临暂时关闭或产能减少，导致生产延迟。由于远端工作和对数位技术的依赖增加，对电子设备的需求增加，进一步加剧了供应链的紧张，并导致必需材料的短缺。总体而言，疫情凸显了半导体生态系统的脆弱性，并促使人们重新评估策略，以增强抵御能力并满足全球对先进电子元件日益增长的需求。

预计聚酰胺细分市场将在预测期内成为最大的细分市场

预计聚酰胺细分市场在预测期内将占据最大份额。聚酰胺以其优异的热稳定性、机械强度和耐化学性而闻名，并且越来越多地用于覆晶封装和绝缘层。这些特性有助于减少热循环和潮湿问题，这在高性能应用中非常重要。聚酰胺透过增加层间黏合力并降低分层的可能性，有助于延长覆晶组件的使用寿命和耐用性。

预计航太和国防部门在预测期内复合年增长率最高

预计航太和国防领域将在预测期内快速成长。覆晶构装允许半导体晶片直接连接到基板，减少电气途径长度并最大限度地减少讯号损失，这在高频环境中至关重要。这项创新对于重量、尺寸和温度控管都很重要的航太和国防应用特别有益。硬化覆晶设计采用了先进的材料和工艺，以确保在极端温度和辐射等恶劣条件下的稳健性。

比最大的地区

预计亚太地区将在整个预测期内保持最大的市场份额。汽车技术的发展，特别是电动车 (EV) 和高级驾驶辅助系统 (ADAS) 的兴起，增加了对紧凑高效半导体解决方案的需求。覆晶技术能够实现更高效的晶片到基板互连，因此越来越受欢迎，因为它可以提高性能，同时最大限度地减少空间和重量，而空间和重量一直是现代汽车设计的关键因素。中国、日本和韩国等国家正在引领这一趋势，大力投资半导体製造以支持其蓬勃发展的汽车工业。

复合年增长率最高的地区：

透过促进技术创新、确保品质标准和促进永续实践，预计欧洲地区在预测期内的复合年增长率最高。旨在电子废弃物管理和环境永续性的法律规范鼓励製造商采用先进技术来提高效率并减少生态影响。严格的安全和性能法规确保覆晶产品符合高品质标准，提高消费者的信任和行业信誉。此外，欧盟（EU）以减少对不可再生资源的依赖为重点，正在促进替代材料和工艺的研发，以进一步提高竞争力。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
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    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球覆晶市场：依基板

  • 层压板
  • 陶瓷製品
  • 聚酰胺
  • 硅
  • 其他基板

第六章 全球覆晶市场：透过凸点技术

  • 黏着凸点
  • 焊料凸块
  • 螺柱凸块
  • 其他碰撞技术

第七章全球覆晶市场：依应用分类

  • 记忆库
  • 感应器
  • 发光二极体
  • 图形处理单元
  • 其他用途

第八章全球覆晶市场：依最终用户分类

  • 家电
  • 车
  • 卫生保健
  • 航太和国防
  • 通讯/IT
  • 其他最终用户

第九章全球覆晶市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第10章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十一章 公司概况

  • ASE Group
  • Broadcom Inc
  • Chipbond Technology Corporation
  • Infineon Technologies
  • Intel Corporation
  • KLA Corporation
  • NXP Semiconductors
  • Powertech Technology Inc
  • Renesas Electronics Corporation
  • Semtech Corporation
  • Skyworks Solutions
  • Toshiba Corporation
  • UTAC Holdings Ltd
Product Code: SMRC27688

According to Stratistics MRC, the Global Flip Chip Market is accounted for $30.6 billion in 2024 and is expected to reach $51.8 billion by 2030 growing at a CAGR of 9.2% during the forecast period. Flip chip is a semiconductor packaging technology where an integrated circuit (IC) die is mounted directly onto a substrate or circuit board, using solder bumps that connect the chip's pads to corresponding pads on the substrate. Unlike traditional wire bonding, which connects the die with fine wires, flip chip allows for a more compact design and improved electrical performance. The die is flipped upside down, enabling a direct electrical connection through the solder bumps, which facilitates better heat dissipation and reduces signal delay.

Market Dynamics:

Driver:

Rising demand for advanced packaging

The rising demand for advanced packaging technologies is significantly enhancing the adoption and innovation of Flip Chip packaging. This method, which involves flipping the chip to connect directly to the substrate using solder bumps, allows for improved electrical performance and thermal management. As consumer electronics, IoT devices, and automotive applications become more sophisticated, the need for smaller, faster, and more efficient components drives manufacturers to explore Flip Chip solutions. These technologies facilitate higher I/O density and reduce parasitic inductance and capacitance, making them ideal for high-speed applications.

Restraint:

Thermal management issues

Thermal management issues significantly impact the performance and reliability of flip chip technology, a widely used packaging method in integrated circuits. Flip chips feature a die mounted directly onto a substrate, connecting through solder bumps. This configuration, while advantageous for reducing signal path lengths, often leads to challenges in heat dissipation. As chips become more powerful, they generate substantial heat, which can cause thermal stresses and affect performance. Ineffective heat removal can lead to increased operating temperatures, resulting in reduced efficiency, potential thermal runaway, and even failure of the chip.

Opportunity:

Increased adoption of LED and power devices

The increased adoption of LED technology and advanced power devices is substantially enhancing the performance and utility of flip chip packaging. Flip chip, a method where the semiconductor die is mounted directly onto a substrate, offers superior electrical connectivity and thermal management, making it ideal for high-density applications. As LED lighting and power electronics gain traction in various industries, the demand for more efficient, compact, and reliable packaging solutions has surged. Flip chip technology accommodates these needs by enabling smaller form factors and better heat dissipation, which is crucial for maintaining performance and longevity in LED and power devices.

Threat:

Intellectual property issues

The flip chip technology, essential for advanced semiconductor packaging, faces significant intellectual property (IP) challenges that hinder its widespread adoption. Various companies hold numerous patents related to flip chip processes, materials, and designs, leading to complex licensing agreements and potential legal disputes. This fragmentation creates barriers for new entrants and smaller firms, who may lack the resources to navigate the intricate IP landscape. Innovation can be stifled as companies focus on litigation rather than development, slowing the advancement of flip chip technology itself. The high costs associated with IP compliance and the risk of infringement also deter investment in research and development, further impacting the technology's evolution.

Covid-19 Impact:

The COVID-19 pandemic significantly impacted the flip chip industry, disrupting supply chains and manufacturing processes worldwide. As lockdowns were enforced, many semiconductor fabrication facilities faced temporary closures or reduced capacity, leading to delays in production. The heightened demand for electronics spurred by remote work and increased digital reliance further strained the supply chain, resulting in shortages of essential materials. Overall, the pandemic highlighted vulnerabilities in the semiconductor ecosystem, prompting a reevaluation of strategies to enhance resilience and meet the growing global demand for advanced electronic components.

The Polyamides segment is expected to be the largest during the forecast period

Polyamides segment is expected to dominate the largest share over the estimated period. Polyamides, known for their excellent thermal stability, mechanical strength, and chemical resistance, are increasingly used in the encapsulation and insulation layers of flip chips. These properties help mitigate issues related to thermal cycling and moisture, which are critical in high-performance applications. By improving adhesion between layers and reducing the likelihood of delamination, polyamides contribute to longer lifespans and increased durability of flip chip assemblies.

The Aerospace & Defense segment is expected to have the highest CAGR during the forecast period

Aerospace & Defense segment is estimated to grow at a rapid pace during the forecast period. Flip chip packaging allows for direct connection of semiconductor chips to substrates, reducing the length of electrical pathways and minimizing signal loss, which is vital in high-frequency environments. This innovation is particularly beneficial in aerospace and defense applications where weight, size, and thermal management are crucial. Enhanced flip chip designs incorporate advanced materials and processes to ensure robustness against harsh conditions, such as extreme temperatures and radiation.

Region with largest share:

Asia Pacific region is poised to hold the largest share of the market throughout the extrapolated period. As automotive technology evolves, particularly with the rise of electric vehicles (EVs) and advanced driver-assistance systems (ADAS), the need for compact and efficient semiconductor solutions is paramount. Flip Chip technology, which allows for a more efficient interconnection between chips and substrates, is increasingly favored for its ability to improve performance while minimizing space and weight crucial factors in modern automotive design. Countries like China, Japan, and South Korea are leading this trend, investing heavily in semiconductor manufacturing to support the burgeoning automotive industry.

Region with highest CAGR:

Europe region is estimated to witness the highest CAGR during the projected time frame by promoting innovation, ensuring quality standards, and fostering sustainable practices. Regulatory frameworks aimed at electronic waste management and environmental sustainability encourage manufacturers to adopt advanced technologies that improve efficiency and reduce ecological impact. Stringent safety and performance regulations ensure that Flip Chip products meet high-quality benchmarks, bolstering consumer confidence and industry credibility. The European Union's emphasis on reducing reliance on non-renewable resources also drives research and development in alternative materials and processes, further enhancing competitiveness.

Key players in the market

Some of the key players in Flip Chip market include ASE Group, Broadcom Inc, Chipbond Technology Corporation, Infineon Technologies, Intel Corporation, KLA Corporation, NXP Semiconductors, Powertech Technology Inc, Renesas Electronics Corporation, Semtech Corporation, Skyworks Solutions, Toshiba Corporation and UTAC Holdings Ltd.

Key Developments:

In December 2023, YES TECH launched the Mnano II series of small-pitch products in Spain that offers high reliability and low power dissipation in the display industry.

In December 2023, Innoscience launched low-voltage discrete HEMTs with FC QFN packaging that offers benefits such as easy assembly, mounting, and greater design flexibility.

In September 2022, Bharti Airtel, one of India's leading providers of communications services with more than 358 million subscribers, and IBM announced their intention to collaborate on the deployment of Airtel's edge computing platform in India, which will include 120 network data centers spread across 20 cities.

In July 2022, Luminus Devices Inc, a designer & manufacturer of LEDs and Solid-State Technology (SST) light sources for illumination markets, launched MP-3030-110F flip-chip LEDs. The flip chip design features no wire bond, creating higher reliability along with enhanced sulfur resistance for robust performance ideal for horticulture applications and outdoor & harsh lighting environments.

Substrates Covered:

  • Laminates
  • Ceramics
  • Polyamides
  • Silicon
  • Other Substrates

Bumping Technologies Covered:

  • Adhesive Bumping
  • Solder Bumping
  • Stud Bumping
  • Other Bumping Technologies

Applications Covered:

  • Memory Based
  • Sensors
  • Light Emitting Diode
  • Graphics Processing Unit
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive
  • Healthcare
  • Aerospace & Defense
  • Telecom & IT
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Flip Chip Market, By Substrate

  • 5.1 Introduction
  • 5.2 Laminates
  • 5.3 Ceramics
  • 5.4 Polyamides
  • 5.5 Silicon
  • 5.6 Other Substrates

6 Global Flip Chip Market, By Bumping Technology

  • 6.1 Introduction
  • 6.2 Adhesive Bumping
  • 6.3 Solder Bumping
  • 6.4 Stud Bumping
  • 6.5 Other Bumping Technologies

7 Global Flip Chip Market, By Application

  • 7.1 Introduction
  • 7.2 Memory Based
  • 7.3 Sensors
  • 7.4 Light Emitting Diode
  • 7.5 Graphics Processing Unit
  • 7.6 Other Applications

8 Global Flip Chip Market, By End User

  • 8.1 Introduction
  • 8.2 Consumer Electronics
  • 8.3 Automotive
  • 8.4 Healthcare
  • 8.5 Aerospace & Defense
  • 8.6 Telecom & IT
  • 8.7 Other End Users

9 Global Flip Chip Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 ASE Group
  • 11.2 Broadcom Inc
  • 11.3 Chipbond Technology Corporation
  • 11.4 Infineon Technologies
  • 11.5 Intel Corporation
  • 11.6 KLA Corporation
  • 11.7 NXP Semiconductors
  • 11.8 Powertech Technology Inc
  • 11.9 Renesas Electronics Corporation
  • 11.10 Semtech Corporation
  • 11.11 Skyworks Solutions
  • 11.12 Toshiba Corporation
  • 11.13 UTAC Holdings Ltd

List of Tables

  • Table 1 Global Flip Chip Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 3 Global Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 4 Global Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 5 Global Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 6 Global Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 7 Global Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 8 Global Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 9 Global Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 10 Global Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 11 Global Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 12 Global Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 13 Global Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 14 Global Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 15 Global Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 16 Global Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 17 Global Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 18 Global Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 19 Global Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 20 Global Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 21 Global Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 22 Global Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 23 Global Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 24 Global Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 25 Global Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 26 North America Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 27 North America Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 28 North America Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 29 North America Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 30 North America Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 31 North America Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 32 North America Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 33 North America Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 34 North America Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 35 North America Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 36 North America Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 37 North America Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 38 North America Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 39 North America Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 40 North America Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 41 North America Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 42 North America Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 43 North America Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 44 North America Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 45 North America Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 46 North America Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 47 North America Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 48 North America Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 49 North America Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 50 North America Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 51 Europe Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 52 Europe Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 53 Europe Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 54 Europe Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 55 Europe Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 56 Europe Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 57 Europe Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 58 Europe Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 59 Europe Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 60 Europe Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 61 Europe Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 62 Europe Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 63 Europe Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 64 Europe Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 65 Europe Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 66 Europe Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 67 Europe Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 68 Europe Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 69 Europe Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 70 Europe Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 71 Europe Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 72 Europe Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 73 Europe Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 74 Europe Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 75 Europe Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 76 Asia Pacific Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 77 Asia Pacific Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 78 Asia Pacific Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 79 Asia Pacific Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 80 Asia Pacific Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 81 Asia Pacific Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 82 Asia Pacific Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 83 Asia Pacific Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 84 Asia Pacific Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 85 Asia Pacific Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 86 Asia Pacific Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 87 Asia Pacific Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 88 Asia Pacific Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 89 Asia Pacific Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 90 Asia Pacific Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 91 Asia Pacific Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 92 Asia Pacific Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 93 Asia Pacific Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 94 Asia Pacific Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 95 Asia Pacific Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 96 Asia Pacific Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 97 Asia Pacific Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 98 Asia Pacific Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 99 Asia Pacific Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 100 Asia Pacific Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 101 South America Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 102 South America Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 103 South America Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 104 South America Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 105 South America Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 106 South America Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 107 South America Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 108 South America Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 109 South America Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 110 South America Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 111 South America Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 112 South America Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 113 South America Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 114 South America Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 115 South America Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 116 South America Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 117 South America Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 118 South America Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 119 South America Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 120 South America Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 121 South America Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 122 South America Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 123 South America Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 124 South America Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 125 South America Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 126 Middle East & Africa Flip Chip Market Outlook, By Country (2022-2030) ($MN)
  • Table 127 Middle East & Africa Flip Chip Market Outlook, By Substrate (2022-2030) ($MN)
  • Table 128 Middle East & Africa Flip Chip Market Outlook, By Laminates (2022-2030) ($MN)
  • Table 129 Middle East & Africa Flip Chip Market Outlook, By Ceramics (2022-2030) ($MN)
  • Table 130 Middle East & Africa Flip Chip Market Outlook, By Polyamides (2022-2030) ($MN)
  • Table 131 Middle East & Africa Flip Chip Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 132 Middle East & Africa Flip Chip Market Outlook, By Other Substrates (2022-2030) ($MN)
  • Table 133 Middle East & Africa Flip Chip Market Outlook, By Bumping Technology (2022-2030) ($MN)
  • Table 134 Middle East & Africa Flip Chip Market Outlook, By Adhesive Bumping (2022-2030) ($MN)
  • Table 135 Middle East & Africa Flip Chip Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 136 Middle East & Africa Flip Chip Market Outlook, By Stud Bumping (2022-2030) ($MN)
  • Table 137 Middle East & Africa Flip Chip Market Outlook, By Other Bumping Technologies (2022-2030) ($MN)
  • Table 138 Middle East & Africa Flip Chip Market Outlook, By Application (2022-2030) ($MN)
  • Table 139 Middle East & Africa Flip Chip Market Outlook, By Memory Based (2022-2030) ($MN)
  • Table 140 Middle East & Africa Flip Chip Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 141 Middle East & Africa Flip Chip Market Outlook, By Light Emitting Diode (2022-2030) ($MN)
  • Table 142 Middle East & Africa Flip Chip Market Outlook, By Graphics Processing Unit (2022-2030) ($MN)
  • Table 143 Middle East & Africa Flip Chip Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 144 Middle East & Africa Flip Chip Market Outlook, By End User (2022-2030) ($MN)
  • Table 145 Middle East & Africa Flip Chip Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 146 Middle East & Africa Flip Chip Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 147 Middle East & Africa Flip Chip Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 148 Middle East & Africa Flip Chip Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 149 Middle East & Africa Flip Chip Market Outlook, By Telecom & IT (2022-2030) ($MN)
  • Table 150 Middle East & Africa Flip Chip Market Outlook, By Other End Users (2022-2030) ($MN)