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2030 年 3D NAND快闪记忆体快闪记忆体市场预测：按类型、外形规格、记忆体密度、应用、最终用户和地区进行的全球分析

3D Nand Flash Memory Market Forecasts to 2030 - Global Analysis By Type (Single-Level Cell, Multi-Level Cell, Triple-Level Cell and Quad-Level Cell), Form Factor, Memory Density, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2024年全球3D NAND快闪记忆体市场规模将达222亿美元，预计2030年将达到570亿美元，预测期内复合年增长率为17%。

3D NAND快闪记忆体是一种非挥发性储存技术，可将资料储存在 3D 储存单元阵列中，与传统 2D NAND 相比，可提供更高的储存密度和改进的效能。此技术将储存单元垂直堆迭成多层，并在不增加表面积的情况下增加储存容量。广泛应用于固态硬碟、记忆卡、智慧型手机和资料中心等应用。与传统 NAND 技术相比，3D NAND 具有更快的资料存取速度、更低的功耗和更高的耐用性。

根据爱立信移动报告，预计到2024年终5G合约将占北美移动合约的55%。

对储存容量的需求不断增长

3D NAND快闪记忆体快闪记忆体为传统 2D NAND 技术的物理限制提供了解决方案，该技术受到硅晶圆上水平空间的限制。透过垂直堆迭储存单元，3D NAND 增加了给定区域中的资料储存容量。随着对 SSD、智慧型手机和笔记型电脑等大容量设备的需求不断增长，3D NAND 为製造商提供了生产更高容量储存解决方案的可行解决方案，从而推动市场成长。

可靠性和耐用性问题

3D NAND快闪记忆体的寿命是有限的，以程式设计/擦除週期来衡量。儘管与 2D NAND 相比，耐用性有所提高，但由于储存单元堆迭的增加，单元会随着时间的推移而继续劣化。对于高效能伺服器、资料中心和汽车系统等资料可靠性和耐用性至关重要的应用来说，寿命缩短是一个问题。此外，过早磨损可能导致资料损坏或遗失，从而降低该技术在这些领域的吸引力并阻碍市场发展。

从传统硬碟 (HDD) 转向固态硬碟 (SSD) 的转变增多

由于 3D NAND 技术，SSD 提供比 HDD 更快的读取/写入速度。该技术透过减少延迟并在更小的区域储存更多资料来提高资料传输速度。 3D NAND 对于高效能 SSD 至关重要，因为游戏、影像製作、人工智慧和巨量资料分析等应用需要更快的储存速度。 SSD 没有活动部件，因此不易受到物理损坏且更耐用。随着企业和消费者优先考虑可靠性，SSD 变得越来越受欢迎，从而增加了对基于 3D NAND 的储存解决方案的需求。

与替代技术的竞争

3D XPoint 是一种由英特尔和美光开发的非挥发性记忆体技术，是 3D NAND 的潜在替代品，可提供更高的效能、更低的延迟和更高的耐用性。预计它将成为高效能储存应用领域3D NAND的有力竞争对手。儘管仍处于采用的早期阶段，3D XPoint 的速度和耐用性优势使其成为资料中心和企业市场的强大竞争对手。一旦具有成本效益并被广泛采用，3D XPoint 可以减少对 3D NAND 的需求。

COVID-19 的影响

COVID-19的疫情对3D NAND快闪记忆体市场产生了重大影响。供应链中断，包括半导体短缺和工厂关闭，导致生产延误和成本增加。然而，远距工作、电子商务和数位服务的激增推动了资料储存需求的增加，使市场受益。云端运算、游戏和人工智慧应用的扩展也推动了由 3D NAND 驱动的 SSD 的成长。

通用快闪记忆体储存领域预计将在预测期内成为最大的领域

由于对高效能记忆体解决方案的需求，预计通用快闪记忆体储存领域将在预测期内获得最大的市场占有率。最新版本Universal Flash Storage 2.1和Universal Flash Storage 3.1采用先进的NAND快闪记忆体技术（如3D NAND）以实现更快的读写速度。智慧型手机、平板电脑和笔记型电脑中越来越多地采用通用快闪记忆体储存3.1，推动了对高速NAND 记忆体的需求，特别是满足通用快闪储存效能标准的3D NAND，从而增强了消费性电子产品中的3D NAND市场。

资料中心和云端服务产业预计在预测期内复合年增长率最高

由于配备 3D NAND 的固态硬碟等先进储存技术可实现快速资料搜寻、即时处理和高速资料传输，预计资料中心和云端服务将在预测期内实现良好成长。与 HDD 等传统储存解决方案相比，3D NAND 提供更快的读取/写入速度、更低的延迟和更强的耐用性，使其成为云端储存和高效能运算应用的理想选择，这正在加速 3D NAND快闪记忆体市场的成长。

占比最大的地区：

北美尤其是美国是储存技术创新中心，由英特尔、美光科技、西部数据等主要半导体厂商主导3D NAND快闪记忆体市场发展。这种创新领导力加速了 3D NAND快闪记忆体快闪记忆体的开发和采用，透过多级单元 (MLC)、三级单元 (TLC) 和四级单元 (QLC) 3D NAND 记忆体等开创性创新引领世界. 我们正在推动市场增长。

复合年增长率最高的地区：

这是因为亚太地区的数位转型正在推动对强大资料储存解决方案的需求，特别是在云端运算、巨量资料分析和基于人工智慧的应用程式方面。 3D NAND 等高效能储存解决方案因其速度、可靠性和耐用性而非常适合这些服务。由于亚太地区云端服务和资料中心的扩张，对 3D NAND 的需求不断增加，推动了市场成长。

免费客製化服务

订阅此报告的客户将收到以下免费自订选项之一：

  • 公司简介
    • 其他市场公司的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争标基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球3D NAND快闪记忆体体市场：依类型

  • 单层单元
  • 多层单元
  • 三级细胞
  • 四级单元

第六章全球 3D NAND快闪记忆体市场：依外形规格

  • 通用快闪记忆体
  • 非挥发性记忆体表达
  • 嵌入式多媒体卡
  • 固态硬碟
  • 其他外形规格

第七章全球3D NAND快闪记忆体体市场：按记忆体密度

  • 低密度记忆体
  • 高密度记忆体

第8章全球3D NAND快闪记忆体市场：依应用分类

  • 智慧型手机和穿戴式装置
  • 平板电脑和笔记型电脑
  • 资料中心和云端服务
  • 高效能运算
  • 储存阵列和伺服器
  • 先进的驾驶辅助系统
  • 其他应用

第 9 章 全球 3D NAND快闪记忆体市场：依最终使用者划分

  • 家电
  • 车
  • 工业和物联网
  • 企业储存
  • 其他最终用户

第10章全球3D NAND快闪记忆体市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第十一章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十二章 公司概况

  • Samsung Electronics Co.Ltd.
  • Toshiba Corporation
  • SK Hynix Semiconductor Inc.
  • Micron Technology Inc.
  • Intel Corporation
  • Apple Inc.
  • Lenovo Group Ltd
  • Advanced Micro Devices
  • STMicroelectronics
  • SanDisk Corporation
  • Western Digital
  • VIA Technologies INC.
  • Infineon Technologies AG
  • Microchip Technology Inc.
  • ON Semiconductor
  • Integrated Silicon Solution Inc.
  • Realtek Semiconductor Corp.
Product Code: SMRC28251

According to Stratistics MRC, the Global 3D Nand Flash Memory Market is accounted for $22.2 billion in 2024 and is expected to reach $57.0 billion by 2030 growing at a CAGR of 17% during the forecast period. 3D NAND Flash Memory is a non-volatile storage technology that stores data in a 3D array of memory cells, resulting in higher storage density and improved performance compared to traditional 2D NAND. This technology stacks memory cells vertically in multiple layers, increasing storage capacity without requiring more surface area. It is widely used in applications like solid-state drives, memory cards, smartphones, and data centers. 3D NAND offers faster data access speeds, lower power consumption, and higher durability compared to older NAND technologies.

According to the Ericsson Mobility report, in the North American region, 5G subscriptions are expected to account for 55% of mobile subscriptions by the end of 2024.

Market Dynamics:

Driver:

Increasing demand for storage capacity

3D NAND flash memory offers a solution to the physical limitations of traditional 2D NAND technology, which has limitations due to horizontal space constraints on silicon wafers. By stacking memory cells vertically, 3D NAND increases the storage capacity of data in a given area. As demand for high-capacity devices like SSDs, smartphones, and laptops increases, 3D NAND provides a viable solution for manufacturers to produce storage solutions with higher capacities boosting the market growth.

Restraint:

Reliability and durability concerns

3D NAND flash memory has a finite lifespan, measured in Program/Erase cycles. Despite its improved endurance over 2D NAND, the cells continue to degrade over time due to increased stacking of memory cells. This reduced lifespan is a concern for applications like high-performance servers, data centers, and automotive systems, where data reliability and endurance are crucial. Moreover premature wear can lead to data corruption or loss, undermining the technology's appeal in these sectors hampers the market.

Opportunity:

Increasing shift from traditional hard disk drives (HDDs) to solid-state drives (SSDs)

SSDs offer faster read/write speeds compared to HDDs, thanks to 3D NAND technology. This technology reduces latency and stores more data in a smaller area, enhancing data transfer speeds. As applications like gaming, video production, AI, and big data analytics demand faster storage, 3D NAND is crucial for high-performance SSDs. SSDs also offer superior durability due to their lack of moving parts, making them less susceptible to physical damage. As businesses and consumers prioritize reliability, SSDs are increasingly preferred, boosting demand for 3D NAND-based storage solutions.

Threat:

Competition from alternative technologies

3D XPoint, a non-volatile memory technology developed by Intel and Micron, is a potential alternative to 3D NAND, offering higher performance, lower latency, and greater endurance. It is seen as a strong competitor to 3D NAND in high-performance storage applications. Although still in its early stages of adoption, 3D XPoint's advantages in speed and endurance make it a strong competitor in the data center and enterprise markets. If more cost-effective and widely adopted, 3D XPoint could reduce demand for 3D NAND.

Covid-19 Impact

The COVID-19 pandemic significantly impacted the 3D NAND flash memory market. Supply chain disruptions, including semiconductor shortages and factory shutdowns, led to delays in production and increased costs. However, the surge in remote work, e-commerce, and digital services drove higher demand for data storage, benefiting the market. The expansion of cloud computing, gaming, and AI applications also fueled growth in SSDs powered by 3D NAND.

The universal flash storage segment is expected to be the largest during the forecast period

The universal flash storage segment is predicted to secure the largest market share throughout the forecast period owing to demand for high-performance memory solutions. The latest versions, universal flash storage 2.1 and universal flash storage 3.1, use advanced NAND flash technology like 3D NAND for faster read and write speeds. The growing adoption of universal flash storage 3.1 in smartphones, tablets, and laptops is boosting demand for high-speed NAND memory, particularly 3D NAND, which meets universal flash storage performance standards, strengthening the 3D NAND market in consumer electronics.

The data centers & cloud services segment is expected to have the highest CAGR during the forecast period

The data centers & cloud services is expected to register lucrative growth during the estimation period due to advanced storage technologies like solid-state drives powered by 3D NAND for rapid data retrieval, real-time processing, and high-speed data transfer. 3D NAND offers faster read/write speeds, lower latency, and enhanced durability compared to traditional storage solutions like HDDs, making it ideal for cloud storage and high-performance computing applications accelerating the growth of the 3D NAND flash memory market.

Region with largest share:

During the estimation period, the North America region is expected to capture the largest market share owing to North America, particularly the US, is a hub for innovation in storage technologies, with leading semiconductor manufacturers like Intel, Micron Technology, and Western Digital leading the development of 3D NAND flash memory. This leadership in technological innovation accelerates the development and adoption of 3D NAND flash memory, driving global market growth through pioneering innovations like multi-level cell (MLC), triple-level cell (TLC), and quad-level cell (QLC) 3D NAND memory.

Region with highest CAGR:

Over the forecasted timeframe, the Asia Pacific is anticipated to exhibit the highest CAGR due to region's digital transformation is boosting the demand for robust data storage solutions, especially in cloud computing, big data analytics, and AI-based applications. High-performance storage solutions, such as 3D NAND, are well-suited for these services due to their speed, reliability, and endurance. The demand for 3D NAND is increasing due to the expansion of cloud services and data centers across APAC, fostering market growth.

Key players in the market

Some of the key players in 3D Nand Flash Memory market include Samsung Electronics Co.Ltd., Toshiba Corporation, SK Hynix Semiconductor Inc., Micron Technology Inc., Intel Corporation, Apple Inc., Lenovo Group Ltd, Advanced Micro Devices, STMicroelectronics, SanDisk Corporation, Western Digital, VIA Technologies INC, Infineon Technologies AG, Microchip Technology Inc., ON Semiconductor, Integrated Silicon Solution Inc. and Realtek Semiconductor Corp.

Key Developments:

In December 2024, Quobly Forges & STMicroelectronics announced a transformative collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, to produce quantum processor units (QPUs) at scale.

In November 2024, Nimbus and Toshiba announced joint development of next-generation pure hydrogen fuel cell stack. Under this agreement, Nimbus will combine its patented "four-fluid stack technology" with Toshiba's long-established "fuel cell commercialization and mass production technology" to jointly develop the pure hydrogen fuel cell stack.

In November 2024, Toshiba Electronic Devices & Storage Corporation has launched TLX9152M an automotive photorelay with an output withstand voltage of 900V (min) that is highly suitable for application in high voltage automotive batteries. The new photorelay is housed in an SO16L-T package Volume shipments.

In May 2024, Bosch Ventures Amplifies Commitment to Cleantech with two Battery Recycling Investments. In an electrified world, battery recycling makes a significant contribution to conserving natural resources.

Types Covered:

  • Single-Level Cell
  • Multi-Level Cell
  • Triple-Level Cell
  • Quad-Level Cell

Form Factors Covered:

  • Universal Flash Storage
  • Non-Volatile Memory Express
  • embedded MultiMediaCard
  • Solid-State Drives
  • Other Form Factors

Memory Densities Covered:

  • Low-Density Memory
  • High-Density Memory

Applications Covered:

  • Smartphones & Wearables
  • Tablets & Laptops
  • Data Centers & Cloud Services
  • High-Performance Computing
  • Storage Arrays & Servers
  • Advanced Driver-Assistance Systems
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive
  • Industrial and IoT
  • Enterprise Storage
  • Other End User

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global 3D Nand Flash Memory Market, By Type

  • 5.1 Introduction
  • 5.2 Single-Level Cell
  • 5.3 Multi-Level Cell
  • 5.4 Triple-Level Cell
  • 5.5 Quad-Level Cell

6 Global 3D Nand Flash Memory Market, By Form Factor

  • 6.1 Introduction
  • 6.2 Universal Flash Storage
  • 6.3 Non-Volatile Memory Express
  • 6.4 embedded MultiMediaCard
  • 6.5 Solid-State Drives
  • 6.6 Other Form Factors

7 Global 3D Nand Flash Memory Market, By Memory Density

  • 7.1 Introduction
  • 7.2 Low-Density Memory
  • 7.3 High-Density Memory

8 Global 3D Nand Flash Memory Market, By Application

  • 8.1 Introduction
  • 8.2 Smartphones & Wearables
  • 8.3 Tablets & Laptops
  • 8.4 Data Centers & Cloud Services
  • 8.5 High-Performance Computing
  • 8.6 Storage Arrays & Servers
  • 8.7 Advanced Driver-Assistance Systems
  • 8.8 Other Applications

9 Global 3D Nand Flash Memory Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive
  • 9.4 Industrial and IoT
  • 9.5 Enterprise Storage
  • 9.6 Other End User

10 Global 3D Nand Flash Memory Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Samsung Electronics Co.Ltd.
  • 12.2 Toshiba Corporation
  • 12.3 SK Hynix Semiconductor Inc.
  • 12.4 Micron Technology Inc.
  • 12.5 Intel Corporation
  • 12.6 Apple Inc.
  • 12.7 Lenovo Group Ltd
  • 12.8 Advanced Micro Devices
  • 12.9 STMicroelectronics
  • 12.10 SanDisk Corporation
  • 12.11 Western Digital
  • 12.12 VIA Technologies INC.
  • 12.13 Infineon Technologies AG
  • 12.14 Microchip Technology Inc.
  • 12.15 ON Semiconductor
  • 12.16 Integrated Silicon Solution Inc.
  • 12.17 Realtek Semiconductor Corp.

List of Tables

  • Table 1 Global 3D Nand Flash Memory Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global 3D Nand Flash Memory Market Outlook, By Type (2022-2030) ($MN)
  • Table 3 Global 3D Nand Flash Memory Market Outlook, By Single-Level Cell (2022-2030) ($MN)
  • Table 4 Global 3D Nand Flash Memory Market Outlook, By Multi-Level Cell (2022-2030) ($MN)
  • Table 5 Global 3D Nand Flash Memory Market Outlook, By Triple-Level Cell (2022-2030) ($MN)
  • Table 6 Global 3D Nand Flash Memory Market Outlook, By Quad-Level Cell (2022-2030) ($MN)
  • Table 7 Global 3D Nand Flash Memory Market Outlook, By Form Factor (2022-2030) ($MN)
  • Table 8 Global 3D Nand Flash Memory Market Outlook, By Universal Flash Storage (2022-2030) ($MN)
  • Table 9 Global 3D Nand Flash Memory Market Outlook, By Non-Volatile Memory Express (2022-2030) ($MN)
  • Table 10 Global 3D Nand Flash Memory Market Outlook, By embedded MultiMediaCard (2022-2030) ($MN)
  • Table 11 Global 3D Nand Flash Memory Market Outlook, By Solid-State Drives (2022-2030) ($MN)
  • Table 12 Global 3D Nand Flash Memory Market Outlook, By Other Form Factors (2022-2030) ($MN)
  • Table 13 Global 3D Nand Flash Memory Market Outlook, By Memory Density (2022-2030) ($MN)
  • Table 14 Global 3D Nand Flash Memory Market Outlook, By Low-Density Memory (2022-2030) ($MN)
  • Table 15 Global 3D Nand Flash Memory Market Outlook, By High-Density Memory (2022-2030) ($MN)
  • Table 16 Global 3D Nand Flash Memory Market Outlook, By Application (2022-2030) ($MN)
  • Table 17 Global 3D Nand Flash Memory Market Outlook, By Smartphones & Wearables (2022-2030) ($MN)
  • Table 18 Global 3D Nand Flash Memory Market Outlook, By Tablets & Laptops (2022-2030) ($MN)
  • Table 19 Global 3D Nand Flash Memory Market Outlook, By Data Centers & Cloud Services (2022-2030) ($MN)
  • Table 20 Global 3D Nand Flash Memory Market Outlook, By High-Performance Computing (2022-2030) ($MN)
  • Table 21 Global 3D Nand Flash Memory Market Outlook, By Storage Arrays & Servers (2022-2030) ($MN)
  • Table 22 Global 3D Nand Flash Memory Market Outlook, By Advanced Driver-Assistance Systems (2022-2030) ($MN)
  • Table 23 Global 3D Nand Flash Memory Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 24 Global 3D Nand Flash Memory Market Outlook, By End User (2022-2030) ($MN)
  • Table 25 Global 3D Nand Flash Memory Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 26 Global 3D Nand Flash Memory Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 27 Global 3D Nand Flash Memory Market Outlook, By Industrial and IoT (2022-2030) ($MN)
  • Table 28 Global 3D Nand Flash Memory Market Outlook, By Enterprise Storage (2022-2030) ($MN)
  • Table 29 Global 3D Nand Flash Memory Market Outlook, By Other End User (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.