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市场调查报告书
商品编码
1625314

至 2030 年晶圆层次电子构装市场预测：按封装类型、互连技术、最终用户和地区分類的全球分析

Wafer Level Packaging Market Forecasts to 2030 - Global Analysis By Package Type, Interconnect Technology, End User and by Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2024年全球晶圆层次电子构装市场规模将达95.8亿美元，预计2030年将达到297.8亿美元，预测期内复合年增长率为20.8%。

晶圆层次电子构装（WLP）是一种先进的半导体封装方法，在封装晶圆级封装。透过消除通常在晶圆切割后执行的传统封装步骤，该技术具有更小的尺寸、更高的性能和更低的生产成本等优势。此外，WLP 将元件放置得更紧密，从而实现更密集的互连、更好的温度控管和更快的讯号传输，使其成为小型高性能设备（例如可穿戴设备、智慧型手机和汽车电子产品）的理想选择。

根据世界半导体贸易统计（WSTS），包括晶圆层次电子构装在内的全球半导体市场预计将大幅成长，2021年销售额预计将达到5,510亿美元。

对性能优越的晶片的需求

现代电子设备对更高频宽、更快处理速度和更低功耗的需求不断增长，推动了晶圆层次电子构装的采用。随着晶片变得越来越复杂，特别是在游戏、通讯和高效能运算等行业，需要封装解决方案来满足这些需求。此外，与传统封装技术相比，WLP 具有许多优势，包括提高电源效率、提高讯号完整性和提高电气性能。

初期投资成本高

专用工具和技术的初始成本高昂是采用晶圆层次电子构装的主要障碍之一。实施晶圆层次电子构装需要先进的製造基础设施，包括用于晶片测试、封装和晶圆键合技术的专用工具。此外，这些系统可能很昂贵，特别是对于缺乏资金购买必要机械的中小型企业。此过程还涉及高昂的研发 (R&D) 成本，以改进方法并实现目标性能标准。

穿戴式科技和医疗设备的发展

晶圆层次电子构装在医疗设备领域具有巨大潜力，尤其是随着穿戴式医疗技术的日益普及。这些小型轻量设备需要强大的感测器、处理器和通讯模组来追踪血糖值、心率和大脑活动等健康资讯。非侵入式穿戴式健康监测设备的开发取决于将这些不同组件组合成单一紧凑封装的能力，而 WLP 使这成为可能。此外，WLP还可应用于需要小型电子设备安装在有限空间内的诊断设备，以及必须在有限空间内可靠运作的植入式医疗设备。

其他封装技术的竞争压力

可以提供类似优势的替代先进封装技术对晶圆层次电子构装市场构成了严重威胁。系统级封装(SiP)、3D 封装、覆晶和板载晶片(COB) 等技术正在凭藉减少环境影响、提高性能和成本效益等类似优势来争夺市场占有率。此外，在需要垂直整合的应用中，例如记忆体模组和高效能运算，垂直堆迭多个晶片的3D封装可能是更好的选择。

COVID-19 的影响：

晶圆层次电子构装(WLP) 受到 COVID-19 大流行的严重影响，该流行病主要扰乱了全球供应链和半导体製造流程。劳动力短缺、旅行限制和工厂关闭导致生产延迟和重要材料的前置作业时间延长，影响了 WLP 解决方案的及时交付。此外，在疫情初期，经济不确定性和消费者对电子产品的需求下降暂时减缓了市场扩张。然而，随着企业适应新常态，对医疗、汽车和家用电子电器的需求增加，需要使用 WLP 等尖端封装技术。

晶圆级晶片规模封装 (WLCSP) 领域预计将在预测期内成为最大的领域

晶圆级构装（WLP）市场预计将由晶圆级构装（WLCSP）领域主导。 WLCSP 被广泛使用，因为它提供了一种紧凑、经济且有效的封装解决方案来取代传统封装技术。 WLCSP 将晶片直接整合到封装中，几乎不需要额外的元件，从而显着减小了设备尺寸和重量，使其成为穿戴式装置、智慧型手机和消费性电子应用的理想选择。此外，对更小、更强大的电子设备的需求不断增长，推动了 WLCSP 的普及。

预计铜柱细分市场在预测期间内复合年增长率最高

在晶圆层次电子构装（WLP）市场中，铜柱细分市场预计复合年增长率最高。铜柱技术可以提高半导体装置的性能和可靠性，因此迅速普及，特别是在高密度和高性能应用中。此外，此封装技术使用铜柱代替传统的焊料凸块，从而具有出色的抗电迁移性、增加的机械强度和改善的导热性。这些优点使得铜柱封装特别适合高效能运算、汽车电子和5G等尖端应用。

占比最大的地区：

由于存在中国、日本、韩国和台湾等重要的半导体製造地，亚太地区 (APAC) 占据了晶圆层次电子构装(WLP) 市场的最大份额。日月光集团、三星、台积电等电子和半导体领域的大公司都位于亚洲。为了满足对更快、更紧凑、更有效的电子设备不断增长的需求，这些公司正在大力投资 WLP 等尖端封装技术。此外，该地区强大的製造基础，以及汽车、通讯和消费电子产业的快速创新和采用，支持亚太地区在 WLP 市场的持续主导地位。

复合年增长率最高的地区：

晶圆层次电子构装(WLP) 市场预计将以北美地区最高的复合年增长率成长。特别是随着5G、无人驾驶汽车和物联网（IoT）的普及，消费性电子、医疗保健、汽车和通讯等领域对先进半导体封装的需求不断增加。许多处于封装创新前沿的顶级半导体公司和研究机构都位于北美。此外，资料中心、人工智慧 (AI) 和高效能运算的使用不断增加，进一步加速了对复杂 WLP 解决方案的需求。

提供免费客製化：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场公司的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争标基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球晶圆层次电子构装市场：依封装类型

  • 扇入晶圆层次电子构装(FI-WLP)
  • 扇出晶圆层次电子构装(FO-WLP)
  • 3D TSV晶圆层次电子构装
  • 2.5D TSV晶圆层次电子构装
  • 晶圆级晶片尺寸封装 (WLCSP)

第六章全球晶圆层次电子构装市场：依互连技术划分

  • 直通硅晶穿孔(TSV)
  • 焊料凸块
  • 铜柱
  • 覆晶

第七章全球晶圆层次电子构装市场：依最终用户分类

  • 家电
  • 资讯科技/通讯
  • 车
  • 产业
  • 航太和国防
  • 卫生保健
  • 其他最终用户

第八章全球晶圆层次电子构装市场：依地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第九章 主要进展

  • 合约、伙伴关係、合作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第 10 章 公司概况

  • Amkor Technology, Inc.
  • Fujitsu Limited
  • Nordson Corporation
  • Toshiba Corporation
  • Lam Research Corporation
  • Qualcomm Technologies, Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Deca Technologies, Inc
  • Nemotek Technology Inc.
  • Infineon Technologies AG
  • Taiwan Semiconductor Manufacturing Company Limited
  • KLA Corporation
  • Applied Materials, Inc.
  • ChipMOS Technologies Inc.
  • Tokyo Electron Ltd.
Product Code: SMRC28269

According to Stratistics MRC, the Global Wafer Level Packaging Market is accounted for $9.58 billion in 2024 and is expected to reach $29.78 billion by 2030 growing at a CAGR of 20.8% during the forecast period. Wafer Level Packaging (WLP) is a state-of-the-art semiconductor packaging method that encapsulates chips at the wafer level prior to their separation into separate pieces. By doing away with the need for conventional packaging procedures, which are typically performed after the wafer is cut, this technique offers benefits like smaller size, improved performance, and cheaper production costs. Moreover, WLP is particularly well suited for small, high-performing devices like wearables, smartphones, and automotive electronics because it positions components close together, allowing for high-density interconnections, better thermal management, and faster signal transmission.

According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market, which includes wafer level packaging, is expected to grow significantly, with sales expected to reach $551 billion in 2021.

Market Dynamics:

Driver:

Demand for chips with superior performance

Wafer-level packaging adoption is being driven by the growing demand for modern electronics to have higher bandwidth, faster processing speeds, and lower power consumption. As chips get more sophisticated, particularly in industries like gaming, telecommunications, and high-performance computing, they need packaging solutions that can meet these demands. Additionally, WLP offers a number of advantages over conventional packaging techniques, including improved power efficiency, higher signal integrity, and better electrical performance.

Restraint:

Expensive initial investment costs

The high upfront cost of specialized tools and technologies is one of the major obstacles to Wafer Level Packaging adoption. Advanced manufacturing infrastructure, such as specialized tools for die testing, encapsulation, and wafer bonding, is required to implement WLP. Furthermore, these systems can be costly, especially for small and mid-sized businesses that might lack the funds to purchase the required machinery. In order to improve methods and reach targeted performance standards, the process also entails high research and development (R&D) expenses.

Opportunity:

Developments in wearable technology and medical devices

Wafer Level Packaging has significant prospects in the medical device sector, especially given the growing popularity of wearable medical technology. These small, light devices need powerful sensors, processors, and communication modules to track health information like blood sugar, heart rate, and even brain activity. The development of non-invasive, wearable health monitoring devices depends on the ability to combine these diverse components into a single, compact package, which WLP makes possible. Moreover, WLP is also applicable to diagnostic equipment that needs small electronics to fit into limited spaces and implantable medical devices that must function dependably in confined spaces.

Threat:

Competitive pressure from other packaging technologies

Alternative cutting-edge packaging technologies that can provide comparable advantages pose a serious threat to the wafer-level packaging market. With comparable benefits like lower environmental impact, enhanced performance, and cost-effectiveness, technologies like System-in-Package (SiP), 3D packaging, flip-chip, and Chip-on-Board (COB) are vying for market share. Additionally, in some applications, like memory modules or high-performance computing, where vertical integration is desired, 3D packaging, which entails stacking multiple chips vertically, may be more appropriate.

Covid-19 Impact:

Wafer Level Packaging (WLP) was significantly impacted by the COVID-19 pandemic, which mainly disrupted global supply chains and semiconductor manufacturing processes. Production delays and longer lead times for essential materials resulted from labor shortages, travel restrictions, and factory closures, which impacted the timely delivery of WLP solutions. Furthermore, a brief slowdown in market expansion was caused by the economic uncertainty and a decline in consumer demand for electronic products during the early stages of the pandemic. But as businesses adjusted to the new normal, the demand for medical, automotive, and consumer electronics devices increased, necessitating the use of cutting-edge packaging technologies like WLP.

The Wafer Level Chip Scale Packaging (WLCSP) segment is expected to be the largest during the forecast period

The Wafer Level Packaging (WLP) market is expected to be dominated by the Wafer Level Chip Scale Packaging (WLCSP) segment. Because it offers a small, affordable, and effective substitute for conventional packaging techniques, WLCSP is a widely used packaging solution. It entails putting the chip straight onto the package with few extra parts, greatly reducing the device's size and weight, making it perfect for wearables, smartphones, and consumer electronics applications. Moreover, the widespread use of WLCSP is being driven by the increasing demand for more compact, powerful electronic devices that perform better and use less energy.

The Copper Pillar segment is expected to have the highest CAGR during the forecast period

In the Wafer Level Packaging (WLP) market, the Copper Pillar segment is expected to have the highest CAGR. Because copper pillar technology can enhance semiconductor devices' performance and dependability, especially in high-density and high-performance applications, it is rapidly gaining popularity. Additionally, this packaging technique offers superior electro migration resistance, increased mechanical strength, and improved thermal conductivity by substituting copper pillars for conventional solder bumps. Because of these benefits, copper pillar packaging is especially well-suited for cutting-edge uses like high-performance computing, automotive electronics, and 5G.

Region with largest share:

Due to the presence of important semiconductor manufacturing hubs, such as China, Japan, South Korea, and Taiwan, the Asia-Pacific (APAC) region commands the largest share of the Wafer Level Packaging (WLP) market. Large companies in the electronics and semiconductor sectors, including ASE Group, Samsung, and TSMC, are based in Asia. To keep up with the increasing demand for faster, more compact, and more effective electronic devices, these companies make significant investments in cutting-edge packaging technologies like WLP. Furthermore, the region's robust manufacturing base, along with rapid technological innovation and adoption in the automotive, telecommunications, and consumer electronics industries, supports APAC's ongoing dominance in the WLP market.

Region with highest CAGR:

The Wafer Level Packaging (WLP) market is anticipated to grow at the highest CAGR in the North American region. The demand for sophisticated semiconductor packaging is rising in sectors like consumer electronics, healthcare, automotive, and telecommunications, especially as 5G, driverless cars, and the Internet of Things (IoT) become more prevalent. Numerous top semiconductor companies and research institutes that are at the forefront of packaging technology innovation are based in North America. Moreover, the need for sophisticated WLP solutions is further accelerated by the expanding use of data centers, artificial intelligence (AI), and high-performance computing.

Key players in the market

Some of the key players in Wafer Level Packaging market include Amkor Technology, Inc., Fujitsu Limited, Nordson Corporation, Toshiba Corporation, Lam Research Corporation, Qualcomm Technologies, Inc., Siliconware Precision Industries Co., Ltd., Deca Technologies, Inc, Nemotek Technology Inc., Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company Limited, KLA Corporation, Applied Materials, Inc., ChipMOS Technologies Inc. and Tokyo Electron Ltd.

Key Developments:

In September 2024, Fujitsu Limited and Stellar Science Foundation, a General Incorporated Association have entered into a partnership focused on discovering and supporting the next generation of scientific researchers and fostering the creation of cutting-edge research topics.

In May 2024, Nordson Corporation announced that it has entered into a definitive agreement to acquire Atrion Corporation, a leader in proprietary medical infusion fluid delivery and niche cardiovascular solutions, for $460.00 per share in cash. This reflects a valuation of 15X Atrion's 2024 full-year estimated EBITDA, inclusive of synergies Nordson expects to generate in the first two years of its ownership.

In May 2024, Amkor Technology, Inc. announced that it has entered into a strategic long-term agreement with IBM for semiconductor assembly and test services. Under the long-term supply agreement, Amkor will receive the substantial majority of IBM's subcontract wire bond and flip chip assembly and final test.

Package Types Covered:

  • Fan-in Wafer Level Packaging (FI-WLP)
  • Fan-out Wafer Level Packaging (FO-WLP)
  • 3D TSV WLP
  • 2.5D TSV WLP
  • Wafer Level Chip Scale Package (WLCSP)

Interconnect Technologies Covered:

  • Through-Silicon Via (TSV)
  • Solder Bumping
  • Copper Pillar
  • Flip Chip

End Users Covered:

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Healthcare
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Wafer Level Packaging Market, By Package Type

  • 5.1 Introduction
  • 5.2 Fan-in Wafer Level Packaging (FI-WLP)
  • 5.3 Fan-out Wafer Level Packaging (FO-WLP)
  • 5.4 3D TSV WLP
  • 5.5 2.5D TSV WLP
  • 5.6 Wafer Level Chip Scale Package (WLCSP)

6 Global Wafer Level Packaging Market, By Interconnect Technology

  • 6.1 Introduction
  • 6.2 Through-Silicon Via (TSV)
  • 6.3 Solder Bumping
  • 6.4 Copper Pillar
  • 6.5 Flip Chip

7 Global Wafer Level Packaging Market, By End User

  • 7.1 Introduction
  • 7.2 Consumer Electronics
  • 7.3 IT and Telecommunication
  • 7.4 Automotive
  • 7.5 Industrial
  • 7.6 Aerospace & Defense
  • 7.7 Healthcare
  • 7.8 Other End Users

8 Global Wafer Level Packaging Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Amkor Technology, Inc.
  • 10.2 Fujitsu Limited
  • 10.3 Nordson Corporation
  • 10.4 Toshiba Corporation
  • 10.5 Lam Research Corporation
  • 10.6 Qualcomm Technologies, Inc.
  • 10.7 Siliconware Precision Industries Co., Ltd.
  • 10.8 Deca Technologies, Inc
  • 10.9 Nemotek Technology Inc.
  • 10.10 Infineon Technologies AG
  • 10.11 Taiwan Semiconductor Manufacturing Company Limited
  • 10.12 KLA Corporation
  • 10.13 Applied Materials, Inc.
  • 10.14 ChipMOS Technologies Inc.
  • 10.15 Tokyo Electron Ltd.

List of Tables

  • Table 1 Global Wafer Level Packaging Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 3 Global Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 4 Global Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 5 Global Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 6 Global Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 7 Global Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 8 Global Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 9 Global Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 10 Global Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 11 Global Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 12 Global Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 13 Global Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 14 Global Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 15 Global Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 16 Global Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 17 Global Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 18 Global Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 19 Global Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 20 Global Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 21 North America Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 22 North America Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 23 North America Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 24 North America Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 25 North America Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 26 North America Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 27 North America Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 28 North America Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 29 North America Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 30 North America Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 31 North America Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 32 North America Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 33 North America Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 34 North America Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 35 North America Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 36 North America Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 37 North America Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 38 North America Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 39 North America Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 40 North America Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 41 Europe Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 42 Europe Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 43 Europe Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 44 Europe Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 45 Europe Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 46 Europe Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 47 Europe Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 48 Europe Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 49 Europe Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 50 Europe Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 51 Europe Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 52 Europe Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 53 Europe Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 54 Europe Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 55 Europe Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 56 Europe Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 57 Europe Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 58 Europe Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 59 Europe Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 60 Europe Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 61 Asia Pacific Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 62 Asia Pacific Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 63 Asia Pacific Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 64 Asia Pacific Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 65 Asia Pacific Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 66 Asia Pacific Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 67 Asia Pacific Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 68 Asia Pacific Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 69 Asia Pacific Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 70 Asia Pacific Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 71 Asia Pacific Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 72 Asia Pacific Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 73 Asia Pacific Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 74 Asia Pacific Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 75 Asia Pacific Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 76 Asia Pacific Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 77 Asia Pacific Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 78 Asia Pacific Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 79 Asia Pacific Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 80 Asia Pacific Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 81 South America Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 82 South America Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 83 South America Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 84 South America Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 85 South America Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 86 South America Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 87 South America Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 88 South America Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 89 South America Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 90 South America Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 91 South America Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 92 South America Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 93 South America Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 94 South America Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 95 South America Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 96 South America Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 97 South America Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 98 South America Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 99 South America Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 100 South America Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 101 Middle East & Africa Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
  • Table 102 Middle East & Africa Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
  • Table 103 Middle East & Africa Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
  • Table 104 Middle East & Africa Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
  • Table 105 Middle East & Africa Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
  • Table 106 Middle East & Africa Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
  • Table 107 Middle East & Africa Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
  • Table 108 Middle East & Africa Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
  • Table 109 Middle East & Africa Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 110 Middle East & Africa Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
  • Table 111 Middle East & Africa Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
  • Table 112 Middle East & Africa Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
  • Table 113 Middle East & Africa Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 114 Middle East & Africa Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 115 Middle East & Africa Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
  • Table 116 Middle East & Africa Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 117 Middle East & Africa Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 118 Middle East & Africa Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 119 Middle East & Africa Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 120 Middle East & Africa Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)