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市场调查报告书
商品编码
1662888
溅镀靶材和沉淀材料市场预测至 2030 年:按产品类型、材料、技术、应用和地区进行的全球分析Sputtering Targets & Evaporation Materials Market Forecasts to 2030 - Global Analysis By Product Type (Sputtering Targets and Evaporation Materials), Material (Metal, Ceramic, Alloy and Advanced Materials), Technology, Application and By Geography |
根据 Stratistics MRC 的数据,全球溅镀靶材和沉淀材料市场规模预计在 2024 年达到 31 亿美元,到 2030 年将达到 43 亿美元,预测期内的复合年增长率为 5.1%。
物理气相淀积中使用的真空室内被高能量离子轰击的固体材料称为溅镀靶。轰击使原子从目标表面脱落,并沉积在基板上形成薄膜。蒸发是发生在液体表面的一种汽化。当液体分子碰撞并交换能量时,靠近表面的分子会获得足够的能量来克服蒸气压力,并以气体的形式逸出到周围的空气中。
根据日本电子情报技术产业协会(JEITA)的数据,预计2022年全球电子和IT产业产值将达到34,368亿美元。
电子产品需求不断成长
电子产品需求的不断成长是溅镀靶和沉淀材料市场发展的主要驱动力。智慧型手机、平板电脑和穿戴式装置等家用电子电器产品的进步推动了对高性能材料的需求,以使这些设备更加可靠和高效。随着电子设备变得越来越小且功能越来越丰富,使用溅镀靶和沉淀材料的薄膜形成过程变得越来越必要。此外,半导体製造和可再生能源技术的成长进一步推动了市场需求。
价格波动
技术发展、复杂的製造流程和原料采购成本直接影响最终产品的价格。全球供需波动加剧了这个问题,使製造商难以保持盈利。这种成本波动限制了中小企业的进入,并增加了整个价值链定价策略的压力,从而限制了市场成长。
策略联盟
製造商、研究机构和技术提供者之间的伙伴关係推动了材料配方和沈积技术的创新。这些合作有助于解决成本效率、材料纯度和永续性等挑战。此外,该合资企业将使该公司扩大其地理覆盖范围,以服务亚太地区等新兴市场,这些市场对先进电子产品和可再生能源解决方案的需求正在迅速增长。
技术挑战
实现均匀薄膜沉淀和优化材料利用率的技术挑战威胁着溅镀靶和沉淀材料市场的成长。沉积效率低、废品率高以及生产规模的限制阻碍了半导体和太阳能板等应用的进步。此外,技术的快速进步需要持续投资研发才能保持竞争力。如果无法有效应对这些挑战,采用率可能会放缓,市场扩张也可能受到限制。
COVID-19 疫情扰乱了全球供应链,导致溅镀靶材和沉淀材料的生产和采购延迟。封锁导致劳动力减少,并停止了电子等关键产业的製造活动。此外,对非必需品的限制暂时影响了需求。然而,疫情加速了数位化趋势,增加了对半导体和电子产品的长期需求。疫情过后,随着各行各业透过远距工作和供应链多元化进行适应,市场开始变得良好復苏。
预计预测期内溅镀靶材部分将成为最大的部分。
由于溅镀靶材广泛应用于半导体、电子和太阳能等行业的薄膜沉淀工艺,预计在预测期内将占据最大的市场占有率。高纯度金属靶材能够实现对微晶片、显示器和太阳能电池至关重要的精密涂层。该领域的成长得益于对先进製造技术的投资增加和对小型电子元件的需求不断增长。溅镀靶材由于能够生产性能优异的均匀薄膜而占据了市场的主导地位。
预计预测期内金属部分将以最高的复合年增长率成长。
在预测期内,由于金属在半导体、电子和可再生能源产业的广泛应用,预计金属部分将呈现最高的成长率。铝、铜和金等金属因其优异的电导性、热稳定性和形成均匀薄膜的能力而受到重视。 5G网路和太阳能板等先进技术的日益普及也进一步推动了对金属基溅镀镀靶材的需求。材料科学的创新也促进了这一领域的快速成长。
在预测期内,亚太地区预计将占据最大的市场占有率,因为它在半导体製造和电子产品生产方面占据主导地位。中国、日本、韩国和台湾等国家在技术进步和研发投资方面处于领先地位。该地区强大的工业基础支持家用电子电器、太阳能电池板和汽车应用领域的溅镀靶和沉淀材料的大量生产。这个强大的生态系统巩固了主导地位。
在预测期内,由于对可再生能源计划和半导体製造设施的投资增加,预计亚太地区将呈现最高的复合年增长率。印度等国的政府都在「印度製造」等倡议下透过优惠政策推动国内製造业的发展。此外,消费者对先进电子设备的需求不断增长,进一步推动了该地区的成长。不断扩大的基础设施和战略投资相结合确保了亚太市场的快速扩张。
According to Stratistics MRC, the Global Sputtering Targets & Evaporation Materials Market is accounted for $3.1 billion in 2024 and is expected to reach $4.3 billion by 2030 growing at a CAGR of 5.1% during the forecast period. A solid substance used in physical vapor deposition that is subjected to high-energy ion bombardment in a vacuum chamber is called a sputtering target. Atoms that have been dislodged from the target surface by the bombardment move and deposit onto a substrate to create thin films. One kind of vaporization that takes place on liquid surfaces is evaporation. Molecules close to the surface that acquire sufficient energy to overcome vapor pressure escape into the surrounding air as gas when liquid molecules collide and exchange energy.
According to Japan Electronics and Information Technology Industries Association (JEITA), the production by the global electronics and IT industry was estimated at USD 3,436.8 billion in 2022.
Growing demand for electronics
The increasing demand for electronics is a key driver for the sputtering targets and evaporation materials market. With advancements in consumer electronics such as smartphones, tablets, and wearables, there is a rising need for high-performance materials that enhance device reliability and efficiency. The push for miniaturization and multifunctionality in electronics necessitates thin-film deposition processes using sputtering targets and evaporation materials. Additionally, the growth of semiconductor manufacturing and renewable energy technologies further boosts market demand.
Price volatility
The costs of technological development, complex manufacturing processes, and raw material procurement directly impact the end product's price. Fluctuating global supply-demand dynamics exacerbate this issue, making it challenging for manufacturers to maintain profitability. This cost variability restricts market growth by limiting accessibility for smaller players and increasing pressure on pricing strategies across the value chain.
Strategic collaborations
Partnerships between manufacturers, research institutions, and technology providers facilitate innovation in material formulations and deposition techniques. These collaborations help address challenges such as cost efficiency, material purity, and sustainability. Moreover, joint ventures enable companies to expand their geographic reach and cater to emerging markets like Asia-Pacific, where demand for advanced electronics and renewable energy solutions is rapidly growing.
Technological challenges
Technological challenges in achieving uniform thin-film deposition and optimizing material utilization threaten the growth of the sputtering targets and evaporation materials market. Issues such as low deposition efficiency, high wastage rates, and limitations in scaling up production hinder advancements in applications like semiconductors and solar panels. Additionally, rapid technological evolution requires continuous R&D investments to stay competitive. These challenges can delay adoption rates and limit market expansion if not addressed effectively.
The COVID-19 pandemic disrupted global supply chains, causing delays in production and procurement of sputtering targets and evaporation materials. Lockdowns led to reduced workforce availability and halted manufacturing activities in key sectors like electronics. Additionally, restrictions on non-essential goods affected demand temporarily. However, the pandemic accelerated digitalization trends, increasing long-term demand for semiconductors and electronic devices. As industries adapted through remote operations and supply chain diversification, the market began recovering steadily post-pandemic.
The sputtering targets segment is expected to be the largest during the forecast period
The sputtering targets segment is expected to account for the largest market share during the forecast period due to its extensive use in thin-film deposition processes across industries like semiconductors, electronics, and solar energy. High-purity metal targets enable precise coatings critical for microchips, displays, and photovoltaic cells. The segment's growth is driven by increasing investments in advanced manufacturing technologies and rising demand for miniaturized electronic components. Sputtering targets' versatility in creating uniform films with superior properties ensures their leading position in the market.
The metal segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the metal segment is predicted to witness the highest growth rate owing to its widespread application in semiconductors, electronics, and renewable energy industries. Metals like aluminum, copper and gold are valued for their excellent conductivity, thermal stability, and ability to form homogeneous thin films. The growing adoption of advanced technologies such as 5G networks and solar panels further drives demand for metal-based sputtering targets. Innovations in material science also contribute to this segment's rapid growth.
During the forecast period, the Asia Pacific region is expected to hold the largest market share due to its dominance in semiconductor manufacturing and electronics production. Countries like China, Japan, South Korea, and Taiwan lead in technological advancements and R&D investments. The region's strong industrial base supports high-volume production of sputtering targets and evaporation materials used in consumer electronics, solar panels, and automotive applications. This robust ecosystem solidifies Asia Pacific's leadership position.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR due to increasing investments in renewable energy projects and semiconductor manufacturing facilities. Governments across countries like India are promoting domestic production through favorable policies under initiatives like "Make in India." Additionally, rising consumer demand for advanced electronic devices drives regional growth further. The combination of expanding infrastructure and strategic investments ensures Asia Pacific's rapid market expansion.
Key players in the market
Some of the key players in Sputtering Targets & Evaporation Materials Market include Materion Corporation, ULVAC, Inc., Plansee SE, Tosoh Corporation, Hitachi Metals Ltd., JX Nippon Mining & Metals Corporation, Praxair Surface Technologies, Honeywell International, Inc., Heraeus Holding GmbH, Kurt J. Lesker Company, SCI Engineered Materials, Konfoong Materials International Co., Ltd., Soleras Advanced Coatings, Nichia Corporation, Umicore, Treibachner Industrie AG, Furuya Metal Co., Ltd. and Grinm Advanced Materials Co., Ltd.
In November 2024, Tosoh Corporation has unveiled its development of a gallium nitride (GaN) sputtering target, a new product being manufactured at Tosoh Specialty Materials Corporation, a subsidiary based in Yamagata City, Japan. GaN, a thin film semiconductor material, is widely used in applications like LED lighting and compact rapid chargers due to its lower energy loss compared to other materials. GaN thin films are gaining traction in energy-efficient power semiconductors, especially for data centers, as well as in micro-LED technology for wearable displays.
In April 2024, JX Nippon Mining & Metals USA, Inc., an industry leader in semiconductor materials, announced the completion of a $29 Million land acquisition deal in Mesa, Arizona. The 65-acre greenfield site will serve as JX's new base of operations for its semiconductor sputtering target business serving the North American and European markets. Furthermore, it will propel JX's business development and become the center for advanced materials in North America.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.