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市场调查报告书
商品编码
1833601

2032 年雷射和微波辅助剥离市场预测：按技术、应用和地区分類的全球分析

Laser & Microwave Assisted Delamination Market Forecasts to 2032 - Global Analysis By Technology, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球雷射和微波辅助剥皮市场预计在 2025 年达到 26.3 亿美元，到 2032 年将达到 55.4 亿美元，预测期内的复合年增长率为 11.2%。

雷射和微波辅助脱键是一种先进的分离技术，可有效地从废弃电子组件中回收半导体材料、晶片和分层组件。该方法利用高精度雷射和微波工艺，最大限度地减少损伤，减少化学品使用，并支持对有价值材料的环保回收。随着各行各业优先考虑永续电子製造、资源回收和减少电子废弃物，该市场正在不断扩大。消费性电子、汽车和可再生能源应用领域的日益普及推动了该技术的需求，使其成为循环经济主导的半导体加工解决方案的关键组成部分。

精准高效

与传统机械方法不同，这些先进技术能够实现精准的非接触式材料分离，从而显着减少对贵重底层零件的损坏。这在电子产品回收和半导体製造等行业至关重要，因为在这些行业中，保持回收材料和精密电路的完整性对于盈利至关重要。由此带来的更高产量比率和更少的废弃物直接转化为显着的营运成本节约和製程可靠性的提升，促使製造商纷纷采用这些技术。

初期投资高

雷射和微波脱键设备所需的巨额资本支出阻碍了市场扩张。这些系统整合了复杂的组件，包括高功率雷射和精密控制设备，製造成本高。对于中小型企业而言，高昂的入门成本构成了采用这些设备的巨大经济障碍。此外，总拥有成本不仅包括初始购买价格，还包括专业操作员的培训和维护，这使得投资的商业可行性成为一个重大障碍，并减缓了市场采用，尤其是在成本敏感的地区。

电动汽车（EV）市场的成长

雷射和微波辅助脱键设备所需的巨额资本支出阻碍了市场扩张。这些系统整合了高功率雷射和精密控制设备等复杂组件，製造成本高。对于中小型企业而言，高昂的入门成本构成了采用这些设备的巨大经济障碍。此外，总拥有成本不仅包括初始购买价格，还包括专业操作员的培训和维护，这使得投资的商业可行性成为一个重大障碍，并可能减缓市场采用速度，尤其是在成本敏感的地区。

与替代技术的竞争

竞争技术，例如先进的化学製程和改进的机械分离技术，正在不断改进，以提高成本效益和效率。如果这些替代技术能够以显着降低的成本实现相当的性能，它们就有可能获得市场份额，尤其是在对超高精度要求不高的应用中。这种竞争压力迫使雷射和微波技术供应商不断创新，并证明其高端价值提案性，以保持竞争力。

COVID-19的影响：

疫情最初扰乱了市场，导致严重的供应链瓶颈和汽车、电子製造等关键终端行业的暂时停工，导致计划延期，并导致资本设备采购短期减少。然而，这场危机也加速了自动化的普及，凸显了非接触式高效流程的价值。随着全球市场復苏，强劲的需求以及对高科技回收和先进电子製造的重新关注，推动了强劲的復苏，为疫情后市场的成长奠定了基础。

雷射辅助剥离细分市场预计将成为预测期内最大的细分市场

雷射辅助脱键技术凭藉其卓越的精度和在高价值行业中成熟的应用历史，预计将在预测期内占据最大的市场份额。对于需要绝对控制的复杂任务，例如半导体晶圆回收和电子显示器的精密维修，它是首选技术。此外，它能够无缝整合到自动化生产和回收生产线中，这使得它在大规模工业应用中越来越具有吸引力。这种广泛的适用性和成熟的技术确保了其主导地位。

预计汽车（电动车电池拆卸）领域在预测期内将实现最高的复合年增长率。

预计汽车（电动车电池拆解）领域将在预测期内达到最高成长率。这直接源自于全球电气化进程，这催生了对高效安全的电池回收解决方案的迫切需求。雷射脱粘技术非常适合这项任务，因为它可以精确地分离电池单元和模组，而不会造成短路或热失控。此外，新推出的严格环境法规强制要求电池回收，这迫使汽车製造商和回收商投资这项先进技术，从而刺激了该领域的显着增长。

占比最大的地区：

在预测期内，北美预计将占据最大的市场份额，这得益于其强大的研发基础设施、自动化技术的早期应用以及电子和航太行业领先企业的存在。此外，鼓励电子废弃物回收的明确法律规范和强大的电动车生态系统为雷射和微波剥离系统的部署创造了有利条件。该地区在技术创新方面的大量投资和成熟的工业基础，为其提供了一个稳定、高价值的市场，确保了其在全球市场的主导地位。

复合年增长率最高的地区：

预计亚太地区在预测期内将呈现最高的复合年增长率，这得益于其作为全球电子製造中心的地位以及电动车生产的快速扩张，尤其是在中国、韩国和日本。这些国家的政府正积极支持国内电动车和半导体供应链的发展，包括对先进回收技术的投资。庞大的工业基础，加上日益增强的环保意识和扶持政策，为雷射和微波分离系统的应用创造了极高的成长环境。

免费客製化服务：

订阅此报告的用户可获得以下免费自订选项之一：

  • 公司简介
    • 对最多三家其他市场公司进行全面分析
    • 主要企业的SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户兴趣对主要国家进行的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 抑制因素
  • 机会
  • 威胁
  • 技术类型
  • 应用分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球雷射和微波辅助剥离市场（按技术）

  • 雷射辅助脱粘
  • 微波辅助去皮

6. 全球雷射和微波辅助剥离市场（依应用）

  • 电子製造和半导体封装
  • 电子设备回收（电子废弃物）
  • 汽车（电动车电池拆卸）
  • 航太与国防（复合材料修復）
  • 其他用途

7. 全球雷射和微波辅助剥离市场（按地区）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第八章：主要进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第九章：企业概况

  • TRUMPF
  • Laserax
  • Laser Photonics
  • IPG Photonics
  • Coherent
  • nLIGHT
  • Han's Laser
  • HGLASER
  • Adapt Laser
  • Laser Technologies Inc.
  • Sairem
  • GR3N
  • Resynergi
  • ScanCAD Intl.
  • Hymson Laser
Product Code: SMRC31434

According to Stratistics MRC, the Global Laser & Microwave Assisted Delamination Market is accounted for $2.63 billion in 2025 and is expected to reach $5.54 billion by 2032 growing at a CAGR of 11.2% during the forecast period. Laser & Microwave Assisted Delamination involves advanced separation technologies enabling efficient recovery of semiconductor materials, chips, and layered components from used electronic assemblies. Utilizing high-precision laser and microwave processes, this method minimizes damage, reduces chemical usage, and supports eco-friendly recycling of valuable materials. The market is expanding as industries prioritize sustainable electronics manufacturing, resource recovery, and reduced e-waste. Growing adoption across consumer electronics, automotive, and renewable energy applications is fueling demand, positioning this technology as a cornerstone for circular economy-driven semiconductor processing solutions.

Market Dynamics:

Driver:

Precision and Efficiency

Unlike traditional mechanical methods, these advanced techniques enable targeted, non-contact material separation, drastically minimizing damage to valuable underlying components. This is critical in sectors like electronics recycling and semiconductor manufacturing, where preserving the integrity of reclaimed materials or delicate circuits is paramount for profitability. The resulting higher yield rates and reduced waste translate directly into significant operational cost savings and enhanced process reliability, compelling manufacturers to adopt these technologies.

Restraint:

High Initial Investment

Market expansion is tempered by the substantial capital expenditure required for laser and microwave delamination equipment. These systems incorporate sophisticated components, including high-power lasers and precise control units, which incur significant manufacturing costs. For small and medium-sized enterprises, this high entry cost presents a major financial barrier to adoption. Furthermore, the total cost of ownership extends beyond the initial purchase to include specialized operator training and maintenance, making the return-on-investment calculation a considerable hurdle that can slow down widespread market penetration, particularly in cost-sensitive regions.

Opportunity:

Growth in Electric Vehicle (EV) Market

Market expansion is tempered by the substantial capital expenditure required for laser and microwave delamination equipment. These systems incorporate sophisticated components, including high-power lasers and precise control units, which incur significant manufacturing costs. For small and medium-sized enterprises, this high entry cost presents a major financial barrier to adoption. Furthermore, the total cost of ownership extends beyond the initial purchase to include specialized operator training and maintenance, making the return-on-investment calculation a considerable hurdle that can slow down widespread market penetration, particularly in cost-sensitive regions.

Threat:

Competition from Alternative Technologies

Competing technologies, such as advanced chemical processes or improved mechanical separation techniques, are constantly being refined to become more cost-effective and efficient. If these alternatives achieve performance parity at a significantly lower cost, they could capture market share, especially in applications where ultra-high precision is less critical. This competitive pressure forces laser and microwave technology providers to continuously innovate and justify their premium value proposition to maintain relevance.

Covid-19 Impact:

The pandemic initially disrupted the market through severe supply chain bottlenecks and temporary shutdowns in key end-use industries like automotive and electronics manufacturing. This led to project delays and a short-term decline in capital equipment purchases. However, the crisis also accelerated the adoption of automation, highlighting the value of contactless, efficient processes. As global markets recovered, pent-up demand and a renewed focus on high-tech recycling and advanced electronics manufacturing spurred a strong rebound, positioning the market for post-pandemic growth.

The laser-assisted delamination segment is expected to be the largest during the forecast period

The laser-assisted delamination segment is expected to account for the largest market share during the forecast period attributed to its superior precision and established application history in high-value industries. It is the technology of choice for intricate tasks such as semiconductor wafer reclamation and the delicate repair of electronic displays, where absolute control is non-negotiable. Furthermore, its ability to be seamlessly integrated into automated production and recycling lines enhances its appeal for large-scale industrial applications. This widespread applicability and technological maturity ensure its leading position.

The automotive (EV Battery Disassembly) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the automotive (EV Battery Disassembly) segment is predicted to witness the highest growth rate. This is a direct consequence of the global push towards electrification, creating an urgent need for efficient and safe battery recycling solutions. Laser delamination is uniquely suited for this task, as it allows for the precise separation of battery cells and modules without causing short circuits or thermal runaway. Moreover, stringent new environmental regulations mandating battery recycling are compelling automakers and recyclers to invest in this advanced technology, fueling its remarkable growth rate.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share driven by a strong confluence of advanced R&D infrastructure, the early adoption of automation technologies, and the presence of major electronics and aerospace industry players. Additionally, well-defined regulatory frameworks promoting electronics waste recycling and a robust electric vehicle ecosystem create a fertile ground for the deployment of laser and microwave delamination systems. The region's significant investment in technological innovation and its mature industrial base provide a stable and high-value market, ensuring its dominant position in the global landscape.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR fueled by its position as the global hub for electronics manufacturing and its rapidly expanding electric vehicle production, particularly in China, South Korea, and Japan. Governments in these countries are actively supporting the development of domestic EV and semiconductor supply chains, which includes investing in advanced recycling technologies. This massive industrial base, combined with increasing environmental awareness and supportive policies, creates an exceptionally high-growth environment for the adoption of laser and microwave delamination systems.

Key players in the market

Some of the key players in Laser & Microwave Assisted Delamination Market include TRUMPF, Laserax, Laser Photonics, IPG Photonics, Coherent, nLIGHT, Han's Laser, HGLASER, Adapt Laser, Laser Technologies Inc., Sairem, GR3N, Resynergi, ScanCAD Intl., and Hymson Laser.

Key Developments:

In June 2025, IPG Photonics launched new high-power rack-integrated (RI) fiber lasers requiring 60% less floor space. These lasers provide consistent processing results, reduced setup time, and robust operation in humid environments.

In April 2025, TRUMPF introduced a new AI-driven "Cutting Assistant" application that improves laser cutting edge quality by optimizing parameters based on edge photos, targeting better productivity and precision in laser manufacturing.

In November 2024, nLIGHT announced the global launch of a 2 kW dynamic beam-shaping laser (Corona(TM) AFX-2000) designed for significantly faster laser powder bed fusion metal printing with high stability and multiple beam profiles.

Technologies Covered:

  • Laser-Assisted Delamination
  • Microwave-Assisted Delamination

Applications Covered:

  • Electronics Manufacturing & Semiconductor Packaging
  • Electronics Recycling (E-Waste)
  • Automotive (EV Battery Disassembly)
  • Aerospace & Defense (Composite Repair)
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Type
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Laser & Microwave Assisted Delamination Market, By Technology

  • 5.1 Introduction
  • 5.2 Laser-Assisted Delamination
  • 5.3 Microwave-Assisted Delamination

6 Global Laser & Microwave Assisted Delamination Market, By Application

  • 6.1 Introduction
  • 6.2 Electronics Manufacturing & Semiconductor Packaging
  • 6.3 Electronics Recycling (E-Waste)
  • 6.4 Automotive (EV Battery Disassembly)
  • 6.5 Aerospace & Defense (Composite Repair)
  • 6.6 Other Applications

7 Global Laser & Microwave Assisted Delamination Market, By Geography

  • 7.1 Introduction
  • 7.2 North America
    • 7.2.1 US
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 UK
    • 7.3.3 Italy
    • 7.3.4 France
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 Japan
    • 7.4.2 China
    • 7.4.3 India
    • 7.4.4 Australia
    • 7.4.5 New Zealand
    • 7.4.6 South Korea
    • 7.4.7 Rest of Asia Pacific
  • 7.5 South America
    • 7.5.1 Argentina
    • 7.5.2 Brazil
    • 7.5.3 Chile
    • 7.5.4 Rest of South America
  • 7.6 Middle East & Africa
    • 7.6.1 Saudi Arabia
    • 7.6.2 UAE
    • 7.6.3 Qatar
    • 7.6.4 South Africa
    • 7.6.5 Rest of Middle East & Africa

8 Key Developments

  • 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 8.2 Acquisitions & Mergers
  • 8.3 New Product Launch
  • 8.4 Expansions
  • 8.5 Other Key Strategies

9 Company Profiling

  • 9.1 TRUMPF
  • 9.2 Laserax
  • 9.3 Laser Photonics
  • 9.4 IPG Photonics
  • 9.5 Coherent
  • 9.6 nLIGHT
  • 9.7 Han's Laser
  • 9.8 HGLASER
  • 9.9 Adapt Laser
  • 9.10 Laser Technologies Inc.
  • 9.11 Sairem
  • 9.12 GR3N
  • 9.13 Resynergi
  • 9.14 ScanCAD Intl.
  • 9.15 Hymson Laser

List of Tables

  • Table 1 Global Laser & Microwave Assisted Delamination Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Laser & Microwave Assisted Delamination Market Outlook, By Technology (2024-2032) ($MN)
  • Table 3 Global Laser & Microwave Assisted Delamination Market Outlook, By Laser-Assisted Delamination (2024-2032) ($MN)
  • Table 4 Global Laser & Microwave Assisted Delamination Market Outlook, By Microwave-Assisted Delamination (2024-2032) ($MN)
  • Table 5 Global Laser & Microwave Assisted Delamination Market Outlook, By Application (2024-2032) ($MN)
  • Table 6 Global Laser & Microwave Assisted Delamination Market Outlook, By Electronics Manufacturing & Semiconductor Packaging (2024-2032) ($MN)
  • Table 7 Global Laser & Microwave Assisted Delamination Market Outlook, By Electronics Recycling (E-Waste) (2024-2032) ($MN)
  • Table 8 Global Laser & Microwave Assisted Delamination Market Outlook, By Automotive (EV Battery Disassembly) (2024-2032) ($MN)
  • Table 9 Global Laser & Microwave Assisted Delamination Market Outlook, By Aerospace & Defense (Composite Repair) (2024-2032) ($MN)
  • Table 10 Global Laser & Microwave Assisted Delamination Market Outlook, By Other Applications (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.