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市场调查报告书
商品编码
1836410

汽车电力电子市场预测（至 2032 年）：按组件、材料、车辆类型、分销管道、应用和地区进行的全球分析

Automotive Power Electronics Market Forecasts to 2032 - Global Analysis By Component, Material, Vehicle Type, Distribution Channel, Application, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球汽车电力电子市场预计在 2025 年达到 51 亿美元，到 2032 年将达到 78 亿美元，预测期内的复合年增长率为 6.2%。

汽车电力电子包括管理电动、混合动力汽车和传统汽车中能量转换、分配和控制的设备和系统。关键组件包括逆变器、转换器、感测器和电池管理系统。电动车的普及、排放法规的日益严格以及对节能可靠车载系统日益增长的需求推动了汽车电力电子的成长。宽能带隙半导体、高效能转换器和温度控管解决方案的进步正在推动市场扩张。

根据国际能源总署（IEA）统计，全球电动车保有量已超过3000万辆，单年销量超过1000万辆。

汽车电气化

汽车电气化是汽车电力电子的主要成长引擎。随着原始设备製造商 (OEM) 从内燃机平台向电池电动和混合动力架构转型，对高效逆变器、车载充电器、DC-DC 转换器和牵引模组的需求正在显着增长。此外，减少二氧化碳排放的监管压力以及消费者对清洁出行方式的偏好，正在加速全球汽车电气化计画的进展。因此，先进封装技术正优先整合更有效率的拓朴结构、先进封装和宽能带隙半导体，以满足下一代电动动力传动系统所需的性能、尺寸和成本目标。这种结构性转变正在支持整个价值链的资本投资以及供应商和原始设备製造商之间的伙伴关係。

温度控管挑战

高开关频率、更高功率密度以及宽能带隙元件的整合增加了紧凑模组内的热通量。此外，不均匀的温度梯度和散热不足会加速材料劣化，增加故障率，并迫使系统采用保守的降额运作。冷却系统会增加重量、复杂性和成本，而封装限制也使散热路径更加复杂。製造商必须追求先进的散热材料、液体冷却以及热电架构的协同设计，才能达到所需的使用寿命和效率目标。

无线充电技术的发展

导引和谐振系统透过为乘用车和商用车实现无缝、免持的能源传输，减少了驾驶者的摩擦。此外，整合紧凑型电力电子设备和对准辅助装置可提高效率，并将用例从私人车库扩展到城市路边和共用旅游枢纽。标准化工作和试点部署正在推动投资，而模组化电源转换器和控制电子设备正在为可扩展部署建立供应商手册。虽然应用时间表取决于基础设施投资和监管支持，但商业试点表明，全球范围内的加速发展势头正在增强。

网路安全风险

如果软体和通讯未被强化，电力​​电子介面（包括充电系统、Vehicle-to-Grid模组）将面临新的攻击面。成功的入侵可能会扰乱充电运行，危及车辆安全，甚至窃取敏感数据，损害消费者信任。此外，电动车生态系统中 OT（营运技术）和 IT（资讯技术）的整合，使原始设备製造商、供应商和基础设施营运商之间的责任更加复杂。应对这些风险需要安全的电子设备、强大的身份验证和协调一致的事件回应能力。

COVID-19的影响：

新冠疫情衝击了供应链，扰乱了汽车电力电子系统。尤其是半导体短缺和生产延迟，限制了模组供应，并推迟了车辆的上市。封锁和物流瓶颈延长了关键基板和封装材料的前置作业时间，推高了成本，并迫使设计优先顺序重新调整。然而，电气化需求仍保持韧性，迫使製造商实现供应商多元化，并加速在地采购策略，以增强未来的韧性。这些调整促使整个产业加强了长期采购和库存规划。

预计电源模组市场在预测期内将占据最大份额

预计在预测期内，功率模组将占据最大的市场份额，因为它们将分立离散半导体、被动元件和封装整合到紧凑的功能单元中，用于牵引和辅助应用。功率模组具有系统级优势，例如缩短组装时间、提高可靠性以及简化热电集成，对寻求扩充性解决方案的原始设备製造商 (OEM) 具有吸引力。此外，逆变式动力传动系统的日益普及，增加了对车载充电器和直流-直流转换器处理更高电流的需求，也支撑了模组需求。因此，供应商正在投资模组小型化、改进热路径和整合感测技术，以抓住这一重要的市场机会。

预计碳化硅 (SiC) 领域在预测期内将以最高复合年增长率成长

预计碳化硅 (SiC) 领域将在预测期内实现最高成长率，这得益于 SiC 在高压、高效功率转换方面的固有材料优势。 SiC 装置比传统硅元件具有更低的开关损耗、更高的开关频率，并且能够承受更高的动作温度，从而实现更小的滤波器和更轻的热系统。追求更长续航里程和更快充电速度的汽车製造商越来越多地在牵引逆变器和车载充电器中采用 SiC。此外，晶圆成本下降、规模化生产以及供应商生态系统的完善正在加速 SiC 在汽车平台中的应用。这些趋势使 SiC 成为整个电动车领域的首选。

占比最大的地区：

在预测期内，亚太地区预计将占据最大的市场份额，这得益于其製造规模、强劲的国内电动车需求以及扶持性政策框架。中国庞大的电池和半导体生态系统、印度新兴的电动车计画以及日本和韩国成熟的供应链，为电力电子产品的生产创造了密集的区域能力。此外，积极的电气化目标和电动车普及奖励正在支撑持续的零件需求。因此，亚太地区仍然是电力电子产品的主要製造和消费中心，吸引全球供应商的投资和在地化努力。

复合年增长率最高的地区：

预计北美将在预测期内实现最高的复合年增长率，这得益于快速的技术应用、强大的研发生态系统以及广泛的电气化奖励。快速充电器的部署不断扩大、商用交通工具电气化的不断提升以及对国内半导体製造产能的政策支持，正在推动该地区的成长。此外，原始设备製造商 (OEM)、一级供应商和新兴企业之间更紧密的合作正在加速宽能带隙装置和先进模组的商业化。这些因素，加上供应链在地化和资本投资的增加，正在推动北美的复合年增长率。

免费客製化服务：

此报告的订阅者可以使用以下免费自订选项之一：

  • 公司简介
    • 全面分析其他市场参与者（最多 3 家公司）
    • 主要企业的SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户兴趣对主要国家进行的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章全球汽车电力电子市场（按组件）

  • 电源模组
  • 功率分离式元件
  • 微控制器和 DSP
  • 感应器
  • 闸极驱动器积体电路
  • 其他组件

6. 全球汽车电力电子市场（依材料）

  • 硅（Si）
  • 碳化硅（SiC）
  • 氮化镓（GaN）
  • 其他成分

7. 全球汽车电力电子市场（依车型）

  • 搭乘用车
  • 轻型商用车（LCV）
  • 重型商用车（HCV）

8. 全球汽车电力电子市场（依分销管道）

  • 原始设备製造商（OEM）
  • 售后市场

9. 全球汽车电力电子市场（按应用）

  • 动力传动系统和底盘
    • 逆变器
    • DC-DC转换器
    • 车用充电器（OBC）
    • 电池管理系统（BMS）
    • 电动方向盘（EPS）
  • 车身电子
    • 照明系统
    • 暖通空调系统
    • 电动车窗和座椅
    • 车身控制模组
  • 安全与安保系统
    • ADAS 感测器
    • 安全气囊控制单元
    • 防锁死煞车系统（ABS）
  • 资讯娱乐和远端资讯处理
    • 主机
    • 展示
    • 远端资讯处理控制单元（TCU）

第 10 章全球汽车电力电子市场（按地区）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第 12 章：公司概况

  • Robert Bosch GmbH
  • Continental AG
  • Infineon Technologies AG
  • STMicroelectronics International NV
  • ON Semiconductor Corporation
  • NXP Semiconductors NV
  • Denso Corporation
  • Mitsubishi Electric Corporation
  • Renesas Electronics Corporation
  • Danfoss A/S
  • BorgWarner Inc.
  • Vishay Intertechnology, Inc.
  • Analog Devices, Inc.
  • Toshiba Corporation
  • Texas Instruments Incorporated
  • ABB Ltd.
  • Magna International Inc.
  • Hyundai Mobis
  • Panasonic Corporation
  • LG Electronics Inc.
Product Code: SMRC31534

According to Stratistics MRC, the Global Automotive Power Electronics Market is accounted for $5.1 billion in 2025 and is expected to reach $7.8 billion by 2032 growing at a CAGR of 6.2% during the forecast period. Automotive power electronics involves devices and systems managing energy conversion, distribution, and control in electric, hybrid, and conventional vehicles. Key components include inverters, converters, sensors, and battery management systems. Growth is fueled by increasing adoption of electric vehicles, stricter emission regulations, and rising demand for energy-efficient and reliable automotive systems. Advancements in wide-bandgap semiconductors, high-efficiency converters, and thermal management solutions are accelerating market expansion.

According to the International Energy Agency (IEA), the global electric car stock surpassed 30 million vehicles, with sales exceeding 10 million in a single year.

Market Dynamics:

Driver:

Electrification of Vehicles

Electrification of vehicles has become the primary growth engine for automotive power electronics. As OEMs transition from internal-combustion platforms to battery-electric and hybrid architectures, demand for efficient inverters, onboard chargers, DC-DC converters, and traction modules is rising markedly. Additionally, regulatory pressure to reduce CO2 emissions and consumer preference for cleaner mobility are accelerating vehicle electrification programs worldwide. Suppliers are therefore prioritizing higher-efficiency topologies, advanced packaging, and integration of wide-bandgap semiconductors to meet performance, size, and cost targets required by next-generation electric powertrains. This structural shift underpins capital investment and supplier-OEM partnerships across the value chain.

Restraint:

Thermal Management Challenges

High switching frequencies, greater power densities, and integration of wide-bandgap devices intensify heat fluxes within compact modules. Moreover, uneven temperature gradients and inadequate heat sinking can accelerate material degradation, elevate failure rates, and force conservatively derated operation. Cooling systems add weight, complexity, and cost, while packaging limits complicate thermal paths. Manufacturers must pursue advanced heat-spreading materials, liquid cooling, and co-design of thermal and electrical architectures to achieve required lifetime and efficiency targets.

Opportunity:

Development of Wireless Charging Technologies

Inductive and resonant systems reduce driver friction by enabling seamless, hands-free energy transfer for passenger cars and commercial fleets. Furthermore, integration of compact power electronics and alignment aides can improve efficiency and broaden use cases from private garages to urban curbside and shared mobility hubs. Standards work and pilot deployments are attracting investment, while modular power converters and control electronics create supplier playbooks for scalable rollouts. Adoption timelines hinge on infrastructure investment and regulatory support, but commercial pilots indicate accelerating momentum globally.

Threat:

Cybersecurity Risks

Power electronics interfaces including charging systems, inverters, and vehicle-to-grid modules can expose new attack surfaces if software and communications are not hardened. Successful intrusions could disrupt charging operations, degrade vehicle safety, or enable theft of sensitive data, undermining consumer trust. Moreover, the convergence of OT and IT within EV ecosystems complicates responsibility across OEMs, suppliers, and infrastructure operators. Addressing these risks requires secure-by-design electronics, robust authentication, and coordinated incident response capabilities.

Covid-19 Impact:

The COVID-19 pandemic disrupted automotive power electronics through supply-chain shocks, most notably semiconductor shortages and production delays that constrained module availability and slowed vehicle launches. Lockdowns and logistics bottlenecks amplified lead times for key substrates and packaging materials, raising costs and forcing design reprioritization. However, demand for electrification remained resilient, prompting manufacturers to diversify suppliers and accelerate local sourcing strategies to improve future resilience. These adjustments strengthened long-term procurement and inventory planning across the industry.

The power modules segment is expected to be the largest during the forecast period

The power modules segment is expected to account for the largest market share during the forecast period because modules aggregate discrete semiconductors, passive components, and packaging into compact functional units ready for traction and auxiliary applications. Power modules offer system-level advantages reduced assembly time, higher reliability, and simplified thermal and electrical integration which appeal to OEMs seeking scalable solutions. Additionally, rising adoption of inverterized drivetrains and the need for high-current handling in onboard chargers and DC-DC converters sustain module demand. Suppliers are therefore investing in module miniaturization, improved thermal paths, and integrated sensing to capture this sizable market opportunity.

The silicon carbide (SiC) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the silicon carbide (SiC) segment is predicted to witness the highest growth rate due to SiC's intrinsic material advantages for high-voltage, high-efficiency power conversion. SiC devices reduce switching losses, enable higher switching frequencies, and tolerate greater operating temperatures than legacy silicon, allowing smaller filters and lighter thermal systems. Automakers seeking extended range and faster charging are increasingly specifying SiC in traction inverters and onboard chargers. Furthermore, falling wafer costs, manufacturing scale-up, and supplier ecosystems are accelerating SiC adoption in vehicle platforms. These trends position SiC as the preferred choice across EV segments.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share driven by a combination of manufacturing scale, strong domestic EV demand, and supportive policy frameworks. China's large battery and semiconductor ecosystems, India's emerging EV programs, and established supply chains in Japan and South Korea create dense regional capabilities for power electronics production. Additionally, aggressive electrification targets and incentives for EV adoption underpin sustained component demand. Consequently, Asia Pacific remains the primary manufacturing and consumption hub for power electronics, attracting supplier investments and localization efforts globally.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR due to rapid technology adoption, strong R&D ecosystems, and sizeable electrification incentives. Growing deployments of fast chargers, rising fleet electrification in commercial transport, and policy support for domestic semiconductor capacity bolster regional growth. Furthermore, close collaboration between OEMs, Tier-1 suppliers, and startups accelerates commercialization of wide-bandgap devices and advanced modules. These factors, combined with improving supply-chain localization and capital investment, position North America for accelerated compound annual growth.

Key players in the market

Some of the key players in Automotive Power Electronics Market include Robert Bosch GmbH, Continental AG, Infineon Technologies AG, STMicroelectronics International N.V., ON Semiconductor Corporation, NXP Semiconductors N.V., Denso Corporation, Mitsubishi Electric Corporation, Renesas Electronics Corporation, Danfoss A/S, BorgWarner Inc., Vishay Intertechnology, Inc., Analog Devices, Inc., Toshiba Corporation, Texas Instruments Incorporated, ABB Ltd., Magna International Inc., Hyundai Mobis, Panasonic Corporation, and LG Electronics Inc.

Key Developments:

In September 2025, Mitsubishi Electric Corporation announced that it has developed a new compact version of its DIPIPM power semiconductor modules specifically for use in consumer and industrial equipment such as packaged air conditioners and heat pump heating and hot water systems. The new Compact DIPIPM series of products comprises the PSS30SF1F6 (rated current 30A / rated voltage 600V) and the PSS50SF1F6 (rated current 50A / rated voltage 600V), and samples will begin shipping on September 22.

In August 2025, Dream Incubator Inc. and DENSO CORPORATION are pleased to announce that their joint initiative, "Digital Platform Development for Mobility Circular Economy and Integrated Manufacturing for India by Collaboration with Open API Network in India and Japan", has been selected under United Nations Industrial Development Organization's "Industrial cooperation programme in the Global South through technology transfer from Japan".

In December 2024, The U.S. Commerce Department reached a preliminary agreement to provide US $225 million in subsidies to Bosch for a planned transformation of its California facility into a silicon carbide (SiC) power semiconductor manufacturing plant. Bosch aims to start producing SiC chips on 200 mm wafers by 2026.

Components Covered:

  • Power Modules
  • Power Discrete
  • Microcontrollers & DSPs
  • Sensors
  • Gate Driver Ics
  • Other Components

Materials Covered:

  • Silicon (Si)
  • Silicon Carbide (SiC)
  • Gallium Nitride (GaN)
  • Other Materials

Vehicle Types Covered:

  • Passenger Cars
  • Light Commercial Vehicles (LCVs)
  • Heavy Commercial Vehicles (HCVs)

Distribution Channels Covered:

  • Original Equipment Manufacturer (OEM)
  • Aftermarket

Applications Covered:

  • Powertrain & Chassis
  • Body Electronics
  • Safety & Security Systems
  • Infotainment & Telematics

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Automotive Power Electronics Market, By Component

  • 5.1 Introduction
  • 5.2 Power Modules
  • 5.3 Power Discrete
  • 5.4 Microcontrollers & DSPs
  • 5.5 Sensors
  • 5.6 Gate Driver Ics
  • 5.7 Other Components

6 Global Automotive Power Electronics Market, By Material

  • 6.1 Introduction
  • 6.2 Silicon (Si)
  • 6.3 Silicon Carbide (SiC)
  • 6.4 Gallium Nitride (GaN)
  • 6.5 Other Materials

7 Global Automotive Power Electronics Market, By Vehicle Type

  • 7.1 Introduction
  • 7.2 Passenger Cars
  • 7.3 Light Commercial Vehicles (LCVs)
  • 7.4 Heavy Commercial Vehicles (HCVs)

8 Global Automotive Power Electronics Market, By Distribution Channel

  • 8.1 Introduction
  • 8.2 Original Equipment Manufacturer (OEM)
  • 8.3 Aftermarket

9 Global Automotive Power Electronics Market, By Application

  • 9.1 Introduction
  • 9.2 Powertrain & Chassis
    • 9.2.1 Inverter
    • 9.2.2 DC-DC Converter
    • 9.2.3 On-Board Charger (OBC)
    • 9.2.4 Battery Management System (BMS)
    • 9.2.5 Electric Power Steering (EPS)
  • 9.3 Body Electronics
    • 9.3.1 Lighting Systems
    • 9.3.2 HVAC Systems
    • 9.3.3 Power Windows & Seats
    • 9.3.4 Body Control Modules
  • 9.4 Safety & Security Systems
    • 9.4.1 ADAS Sensors
    • 9.4.2 Airbag Control Units
    • 9.4.3 Anti-lock Braking System (ABS)
  • 9.5 Infotainment & Telematics
    • 9.5.1 Head Units
    • 9.5.2 Displays
    • 9.5.3 Telematics Control Units (TCU)

10 Global Automotive Power Electronics Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Robert Bosch GmbH
  • 12.2 Continental AG
  • 12.3 Infineon Technologies AG
  • 12.4 STMicroelectronics International N.V.
  • 12.5 ON Semiconductor Corporation
  • 12.6 NXP Semiconductors N.V.
  • 12.7 Denso Corporation
  • 12.8 Mitsubishi Electric Corporation
  • 12.9 Renesas Electronics Corporation
  • 12.10 Danfoss A/S
  • 12.11 BorgWarner Inc.
  • 12.12 Vishay Intertechnology, Inc.
  • 12.13 Analog Devices, Inc.
  • 12.14 Toshiba Corporation
  • 12.15 Texas Instruments Incorporated
  • 12.16 ABB Ltd.
  • 12.17 Magna International Inc.
  • 12.18 Hyundai Mobis
  • 12.19 Panasonic Corporation
  • 12.20 LG Electronics Inc.

List of Tables

  • Table 1 Global Automotive Power Electronics Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Automotive Power Electronics Market Outlook, By Region (2024-2032) ($MN)
  • Table 3 Global Automotive Power Electronics Market Outlook, By Component (2024-2032) ($MN)
  • Table 4 Global Automotive Power Electronics Market Outlook, By Power Modules (2024-2032) ($MN)
  • Table 5 Global Automotive Power Electronics Market Outlook, By Power Discrete (2024-2032) ($MN)
  • Table 6 Global Automotive Power Electronics Market Outlook, By Microcontrollers & DSPs (2024-2032) ($MN)
  • Table 7 Global Automotive Power Electronics Market Outlook, By Sensors (2024-2032) ($MN)
  • Table 8 Global Automotive Power Electronics Market Outlook, By Gate Driver ICs (2024-2032) ($MN)
  • Table 9 Global Automotive Power Electronics Market Outlook, By Other Components (2024-2032) ($MN)
  • Table 10 Global Automotive Power Electronics Market Outlook, By Material (2024-2032) ($MN)
  • Table 11 Global Automotive Power Electronics Market Outlook, By Silicon (Si) (2024-2032) ($MN)
  • Table 12 Global Automotive Power Electronics Market Outlook, By Silicon Carbide (SiC) (2024-2032) ($MN)
  • Table 13 Global Automotive Power Electronics Market Outlook, By Gallium Nitride (GaN) (2024-2032) ($MN)
  • Table 14 Global Automotive Power Electronics Market Outlook, By Other Materials (2024-2032) ($MN)
  • Table 15 Global Automotive Power Electronics Market Outlook, By Vehicle Type (2024-2032) ($MN)
  • Table 16 Global Automotive Power Electronics Market Outlook, By Passenger Cars (2024-2032) ($MN)
  • Table 17 Global Automotive Power Electronics Market Outlook, By Light Commercial Vehicles (LCVs) (2024-2032) ($MN)
  • Table 18 Global Automotive Power Electronics Market Outlook, By Heavy Commercial Vehicles (HCVs) (2024-2032) ($MN)
  • Table 19 Global Automotive Power Electronics Market Outlook, By Distribution Channel (2024-2032) ($MN)
  • Table 20 Global Automotive Power Electronics Market Outlook, By Original Equipment Manufacturer (OEM) (2024-2032) ($MN)
  • Table 21 Global Automotive Power Electronics Market Outlook, By Aftermarket (2024-2032) ($MN)
  • Table 22 Global Automotive Power Electronics Market Outlook, By Application (2024-2032) ($MN)
  • Table 23 Global Automotive Power Electronics Market Outlook, By Powertrain & Chassis (2024-2032) ($MN)
  • Table 24 Global Automotive Power Electronics Market Outlook, By Inverter (2024-2032) ($MN)
  • Table 25 Global Automotive Power Electronics Market Outlook, By DC-DC Converter (2024-2032) ($MN)
  • Table 26 Global Automotive Power Electronics Market Outlook, By On-Board Charger (OBC) (2024-2032) ($MN)
  • Table 27 Global Automotive Power Electronics Market Outlook, By Battery Management System (BMS) (2024-2032) ($MN)
  • Table 28 Global Automotive Power Electronics Market Outlook, By Electric Power Steering (EPS) (2024-2032) ($MN)
  • Table 29 Global Automotive Power Electronics Market Outlook, By Body Electronics (2024-2032) ($MN)
  • Table 30 Global Automotive Power Electronics Market Outlook, By Lighting Systems (2024-2032) ($MN)
  • Table 31 Global Automotive Power Electronics Market Outlook, By HVAC Systems (2024-2032) ($MN)
  • Table 32 Global Automotive Power Electronics Market Outlook, By Power Windows & Seats (2024-2032) ($MN)
  • Table 33 Global Automotive Power Electronics Market Outlook, By Body Control Modules (2024-2032) ($MN)
  • Table 34 Global Automotive Power Electronics Market Outlook, By Safety & Security Systems (2024-2032) ($MN)
  • Table 35 Global Automotive Power Electronics Market Outlook, By ADAS Sensors (2024-2032) ($MN)
  • Table 36 Global Automotive Power Electronics Market Outlook, By Airbag Control Units (2024-2032) ($MN)
  • Table 37 Global Automotive Power Electronics Market Outlook, By Anti-lock Braking System (ABS) (2024-2032) ($MN)
  • Table 38 Global Automotive Power Electronics Market Outlook, By Infotainment & Telematics (2024-2032) ($MN)
  • Table 39 Global Automotive Power Electronics Market Outlook, By Head Units (2024-2032) ($MN)
  • Table 40 Global Automotive Power Electronics Market Outlook, By Displays (2024-2032) ($MN)
  • Table 41 Global Automotive Power Electronics Market Outlook, By Telematics Control Units (TCU) (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.