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市场调查报告书
商品编码
1871904

全球套模电子市场：预测（至2032年）－按类型、材料、製程、应用、最终用户和地区分類的分析

In-Mold Electronics Market Forecasts to 2032 - Global Analysis By Type (Decorative In-Mold Electronics, Functional In-Mold Electronics, and Other Types), Material, Process, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的一项研究，预计到 2025 年，全球套模电子市场规模将达到 2.7733 亿美元，到 2032 年将达到 17.3089 亿美元，预测期内复合年增长率为 29.9%。

套模电子（IME）是一种创新工艺，它将印刷电子电路和装饰图案嵌入到模塑塑胶的表面。透过在模塑过程中整合触控控制、照明和感测器等电子功能，IME 省去了额外的组装步骤，从而製造出更轻巧、更紧凑、外观更时尚的零件。这项技术正被广泛应用于汽车、家电和消费性电子等领域，提高了产品效率和设计灵活性，并将智慧功能整合到时尚实用的表面之中。

汽车业就业人数不断成长

汽车製造商正将整合式电子元件（IME）整合到曲面中，以实现触控功能，从而提升美观性和实用性。这项变革顺应了智慧内装和联网汽车的整体趋势。电容式触控感应器和印刷天线等新兴技术能够将IME无缝整合到复杂形状中。随着电动车的兴起，IME为传统的线路和机械开关提供了一种轻巧、节能的替代方案。设计灵活性和电子功能的结合正在加速IME在高阶和中阶汽车平台上的应用。

材料相容性和应力下的可靠性

印刷电子产品需要与多种基板黏合，包括聚碳酸酯和PET，而这些基材在高温模塑条件下可能会劣化。多层设计中油墨黏合性和导电性的差异会使性能一致性变得复杂。应力引起的剥离和微裂纹会损害电路完整性，尤其是在汽车和工业环境中。製造商正在投资先进的测试通讯协定和混合材料配方以降低这些风险。然而，缺乏标准化的耐久性评估标准仍然是其广泛商业化的一大障碍。

人工智慧在设计和原型製作的应用

人工智慧驱动的模拟工具正在优化复杂三维曲面的电路布局，从而缩短试验週期。新兴的设计演算法正在帮助工程师探索新的形状和材料组合。机器学习也被应用于生产过程中的缺陷检测和品管。Start-Ups和原始设备製造商 (OEM) 正在利用人工智慧加快产品上市速度并降低开发成本。随着数位双胞胎和虚拟原型製作的兴起，人工智慧正成为积体电路製造 (IME) 创新的基石。

特殊材料供应链波动

全球物流和原料采购中断导致前置作业时间难以预测，成本波动剧烈。对银基油墨和耐热薄膜等小众供应商的依赖加剧了这种脆弱性。地缘政治紧张局势和出口限制进一步复杂化了筹资策略。企业正寻求透过垂直整合和区域采购来增强抵御风险的能力。然而，如果没有多元化的供应商网络，IME製造商仍将容易受到系统性衝击的影响。

新冠疫情的感染疾病：

疫情导致工厂关闭、劳动力短缺和关键材料供应有限，扰乱了整合製造电子（IME）的生产週期。汽车和家用电子电器的需求最初下降，导致新产品发布和设计週期延迟。然而，这场危机也激发了人们对非接触式介面和卫生表面的兴趣，提升了IME在医疗保健和公共基础设施领域的重要性。远端协作工具和数位原型製作平台迅速普及，使得研发工作能够在物理限制下持续进行。监管机构放宽了部分测试通讯协定，以促进医疗和安全领域的创新。后疫情时代的策略强调自动化、供应链区域化和适应性製造，以增强IME的韧性。

预计在预测期内，导电油墨细分市场将占据最大的市场份额。

由于导电油墨在模塑表面印刷电路形成中发挥至关重要的作用，预计在预测期内，导电油墨领域将占据最大的市场份额。银基油墨具有高导电性和与柔性基板的兼容性，使其成为汽车、家用电子电器和医疗应用的理想选择。奈米颗粒分散和低温烧结技术的创新正在拓展其在复杂几何形状中的应用。製造商也正在探索碳和铜的替代材料，以降低成本和环境影响。该领域正受惠于对油墨流变性能和附着力的持续研发。

预计在预测期内，医疗保健产业将实现最高的复合年增长率。

在预测期内，医疗产业预计将保持最高的成长率，这主要得益于市场对紧凑、可消毒且操作直觉的介面设备的需求。 IME（整合印刷电子技术）能够将感测器和控制设备无缝整合到医疗设备中，从而提升易用性和卫生水平。穿戴式健康监测器、智慧型贴片和诊断工具越来越多地采用印刷电子技术来实现柔性外形设计。监管机构对远端患者监护和远端医疗的支持正在推动创新。新兴趋势包括专为皮肤接触应用而设计的生物相容性油墨和可拉伸基板。随着个人化医疗和数位医疗的扩展，IME有望改变下一代医疗设备的设计。

占比最大的地区：

亚太地区预计将在预测期内保持最大的市场份额，这主要得益于中国、日本、韩国和台湾地区强大的电子製造业生态系统。区域各国政府正投资智慧工厂和先进材料，以增强自身竞争力。日本和中国的主要汽车製造商正在将整合式电子製造技术（IME）融入下一代汽车内饰，从而推动大规模生产需求。该地区也受益于成本效益高的劳动力和接近性原材料产地的优势。全球当地企业之间的策略合作正在加速技术转移和创新。

复合年增长率最高的地区：

在预测期内，北美预计将实现最高的复合年增长率，这主要得益于强劲的研发投入和新兴技术的早期应用。总部位于美国的Start-Ups和研究机构正主导人工智慧驱动设计和永续材料领域的突破性发展。该地区的汽车和医疗行业正在快速整合整合製造电子技术（IME），用于智慧表面和诊断工具。监管机构正在简化医疗和工业应用领域印刷电子产品的核准流程。创业投资和政府津贴正在支持整个价值链的创新。

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    • 基于产品系列、地域覆盖和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 引言

  • 概述
  • 相关利益者
  • 分析范围
  • 分析方法
  • 分析材料

第三章 市场趋势分析

  • 介绍
  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代产品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章 全球套模电子市场（按类型划分）

  • 装饰性套模电子装置
  • 功能性套模电子装置
  • 其他类型

6. 全球套模电子市场（依材料划分）

  • 导电油墨
  • 基材
  • 黏合剂
  • 覆膜
  • 其他成分

7. 全球套模电子市场（依工艺划分）

  • 网版印刷
  • 射出成型
  • 薄膜嵌入成型（FIM）
  • 热成型
  • 固化和组装

第八章 全球套模电子市场（按应用领域划分）

  • 控制面板
  • 触摸感应器
  • 照明系统
  • 天线
  • 显示介面
  • 智慧表面
  • 其他用途

9. 全球套模电子市场（依最终用户划分）

  • 车
  • 家用电器
  • 家用电子电器
  • 医疗保健
  • 产业
  • 航太/国防
  • 其他最终用户

第十章 全球套模电子市场（按地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章：主要趋势

  • 合约、商业伙伴关係和合资企业
  • 企业合併（M&A）
  • 新产品上市
  • 业务拓展
  • 其他关键策略

第十二章：公司简介

  • TactoTek
  • Antolin
  • Nissha
  • Dycotec Materials
  • DuPont de Nemours
  • YOMURA
  • GenesInk
  • Pulse Electronics
  • Butler Technologies
  • nScrypt
  • DuraTech Industries
  • Optomec
  • Golden Valley Products
  • MesoScribe Technologies
  • InMold Solutions
Product Code: SMRC32274

According to Stratistics MRC, the Global In-Mold Electronics Market is accounted for $277.33 million in 2025 and is expected to reach $1730.89 million by 2032 growing at a CAGR of 29.9% during the forecast period. In-Mold Electronics (IME) refers to an innovative process that embeds printed electronic circuits and decorative designs within molded plastic surfaces. By incorporating electronic functions such as touch controls, lighting, and sensors during molding, IME eliminates additional assembly requirements. This results in lighter, more compact, and visually refined components. The technology enhances product efficiency and design versatility, making it popular across sectors like automotive, home appliances, and consumer electronics for integrating smart features into sleek, functional surfaces.

Market Dynamics:

Driver:

Growing adoption in automotive sector

OEMs are integrating IME into curved surfaces for touch-sensitive controls, enhancing both aesthetics and functionality. This shift supports the broader trend toward smart interiors and connected vehicles. Emerging technologies such as capacitive touch sensors and printed antennas are enabling seamless integration into complex geometries. As electric vehicles gain traction, IME offers a lightweight, energy-efficient alternative to traditional wiring and mechanical switches. The convergence of design flexibility and electronic functionality is accelerating IME adoption across premium and mid-range automotive platforms.

Restraint:

Material compatibility and reliability under stress

Printed electronics must adhere to diverse substrates like polycarbonate and PET, which can degrade under high-temperature molding. Variability in ink adhesion and conductivity across multilayer designs complicates performance consistency. Stress-induced delamination and microcracking can compromise circuit integrity, especially in automotive and industrial environments. Manufacturers are investing in advanced testing protocols and hybrid material formulations to mitigate these risks. However, the lack of standardized durability benchmarks continues to hinder broader commercialization.

Opportunity:

AI in design and prototyping

AI-powered simulation tools are optimizing circuit layouts for complex 3D surfaces, reducing trial-and-error cycles. Generative design algorithms are helping engineers explore novel form factors and material combinations. Machine learning is also being applied to defect detection and quality control during production. Startups and OEMs are leveraging AI to accelerate time-to-market and reduce development costs. As digital twins and virtual prototyping gain traction, AI is becoming a cornerstone of innovation in IME manufacturing.

Threat:

Supply chain volatility for specialty materials

Global disruptions in logistics and raw material sourcing have led to unpredictable lead times and cost fluctuations. The reliance on niche suppliers for silver-based inks and heat-resistant films exacerbates vulnerability. Geopolitical tensions and export restrictions further complicate procurement strategies. Companies are exploring vertical integration and regional sourcing to build resilience. Nonetheless, without diversified supplier networks, IME manufacturers remain exposed to systemic shocks.

Covid-19 Impact:

The pandemic disrupted IME production cycles due to factory shutdowns, labor shortages, and constrained access to critical materials. Automotive and consumer electronics demand dipped initially, delaying new product launches and design cycles. However, the crisis catalyzed interest in touchless interfaces and hygienic surfaces, boosting IME relevance in healthcare and public infrastructure. Remote collaboration tools and digital prototyping platforms gained prominence, enabling continued R&D despite physical constraints. Regulatory bodies relaxed certain testing protocols to expedite innovation in medical and safety applications. Post-Covid strategies now emphasize automation, supply chain localization, and adaptive manufacturing for IME resilience.

The conductive inks segment is expected to be the largest during the forecast period

The conductive inks segment is expected to account for the largest market share during the forecast period, due to its foundational role in enabling printed circuitry across molded surfaces. Silver-based inks offer high conductivity and compatibility with flexible substrates, making them ideal for automotive, consumer electronics, and medical applications. Innovations in nanoparticle dispersion and low-temperature sintering are expanding their use in complex geometries. Manufacturers are also developing carbon and copper alternatives to reduce costs and environmental impact. The segment benefits from continuous R&D in ink rheology and adhesion properties.

The healthcare segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the healthcare segment is predicted to witness the highest growth rate, driven by the need for compact, sterilizable, and intuitive interfaces. IME enables seamless integration of sensors and controls into medical devices, enhancing usability and hygiene. Wearable health monitors, smart patches, and diagnostic tools are increasingly leveraging printed electronics for flexible form factors. Regulatory support for remote patient monitoring and telehealth is accelerating innovation. Emerging trends include biocompatible inks and stretchable substrates tailored for skin-contact applications. As personalized medicine and digital health expand, IME is poised to transform next-gen medical device design.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, supported by robust electronics manufacturing ecosystems in China, Japan, South Korea, and Taiwan. Regional governments are investing in smart factories and advanced materials to boost competitiveness. Automotive giants in Japan and China are integrating IME into next-gen vehicle interiors, driving volume demand. The region also benefits from cost-effective labor and proximity to raw material suppliers. Strategic collaborations between global players and local firms are accelerating technology transfer and innovation.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, fueled by strong R&D investments and early adoption of emerging technologies. U.S.-based startups and research institutions are pioneering breakthroughs in AI-driven design and sustainable materials. The region's automotive and healthcare sectors are rapidly integrating IME for smart surfaces and diagnostic tools. Regulatory bodies are streamlining approval pathways for printed electronics in medical and industrial applications. Venture capital funding and government grants are supporting innovation across the value chain.

Key players in the market

Some of the key players in In-Mold Electronics Market include TactoTek, Antolin, Nissha, Dycotec M, DuPont de, YOMURA, GenesInk, Pulse Elec, Butler Tech, nScrypt, DuraTech, Optomec, Golden Va, MesoScrib, and InMold S.

Key Developments:

In October 2025, Inova Semiconductors, the driving force behind the ISELED(R) Alliance, and TactoTek, the pioneer of In-Mold Structural Electronics (IMSE(R)), are joining forces to accelerate the development of intelligent, space-efficient, conformal lighting solutions for the automotive sector. The collaboration builds on a shared vision: to make electronics and lighting smarter, simpler, and seamlessly integrated into form.

In July 2025, Antolin has signed a partnership with MIT Art Design and Technology University in India. This strategic partnership aims to foster innovation and experiential learning in the field of automotive design. The collaboration paves the way for joint projects in automotive interior design. Students from MIT ADT University will have the opportunity to work alongside Antolin experts, gaining practical insights and contributing to cutting-edge design solutions.

Types Covered:

  • Decorative In-Mold Electronics
  • Functional In-Mold Electronics
  • Other Types

Materials Covered:

  • Conductive Inks
  • Substrates
  • Adhesives
  • Overlays and Films
  • Other Materials

Processes Covered:

  • Screen Printing
  • Injection Molding
  • Film Insert Molding (FIM)
  • Thermoforming
  • Curing and Assembly

Applications Covered:

  • Control Panels
  • Touch Sensors
  • Lighting Systems
  • Antennas
  • Displays and Interfaces
  • Smart Surfaces
  • Other Applications

End Users Covered:

  • Automotive
  • Home Appliances
  • Consumer Electronics
  • Healthcare
  • Industrial
  • Aerospace & Defense
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global In-Mold Electronics Market, By Type

  • 5.1 Introduction
  • 5.2 Decorative In-Mold Electronics
  • 5.3 Functional In-Mold Electronics
  • 5.4 Other Types

6 Global In-Mold Electronics Market, By Material

  • 6.1 Introduction
  • 6.2 Conductive Inks
  • 6.3 Substrates
  • 6.4 Adhesives
  • 6.5 Overlays and Films
  • 6.6 Other Materials

7 Global In-Mold Electronics Market, By Process

  • 7.1 Introduction
  • 7.2 Screen Printing
  • 7.3 Injection Molding
  • 7.4 Film Insert Molding (FIM)
  • 7.5 Thermoforming
  • 7.6 Curing and Assembly

8 Global In-Mold Electronics Market, By Application

  • 8.1 Introduction
  • 8.2 Control Panels
  • 8.3 Touch Sensors
  • 8.4 Lighting Systems
  • 8.5 Antennas
  • 8.6 Displays and Interfaces
  • 8.7 Smart Surfaces
  • 8.8 Other Applications

9 Global In-Mold Electronics Market, By End User

  • 9.1 Introduction
  • 9.2 Automotive
  • 9.3 Home Appliances
  • 9.4 Consumer Electronics
  • 9.5 Healthcare
  • 9.6 Industrial
  • 9.7 Aerospace & Defense
  • 9.8 Other End Users

10 Global In-Mold Electronics Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 TactoTek
  • 12.2 Antolin
  • 12.3 Nissha
  • 12.4 Dycotec Materials
  • 12.5 DuPont de Nemours
  • 12.6 YOMURA
  • 12.7 GenesInk
  • 12.8 Pulse Electronics
  • 12.9 Butler Technologies
  • 12.10 nScrypt
  • 12.11 DuraTech Industries
  • 12.12 Optomec
  • 12.13 Golden Valley Products
  • 12.14 MesoScribe Technologies
  • 12.15 InMold Solutions

List of Tables

  • Table 1 Global In-Mold Electronics Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global In-Mold Electronics Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global In-Mold Electronics Market Outlook, By Decorative In-Mold Electronics (2024-2032) ($MN)
  • Table 4 Global In-Mold Electronics Market Outlook, By Functional In-Mold Electronics (2024-2032) ($MN)
  • Table 5 Global In-Mold Electronics Market Outlook, By Other Types (2024-2032) ($MN)
  • Table 6 Global In-Mold Electronics Market Outlook, By Material (2024-2032) ($MN)
  • Table 7 Global In-Mold Electronics Market Outlook, By Conductive Inks (2024-2032) ($MN)
  • Table 8 Global In-Mold Electronics Market Outlook, By Substrates (2024-2032) ($MN)
  • Table 9 Global In-Mold Electronics Market Outlook, By Adhesives (2024-2032) ($MN)
  • Table 10 Global In-Mold Electronics Market Outlook, By Overlays and Films (2024-2032) ($MN)
  • Table 11 Global In-Mold Electronics Market Outlook, By Other Materials (2024-2032) ($MN)
  • Table 12 Global In-Mold Electronics Market Outlook, By Process (2024-2032) ($MN)
  • Table 13 Global In-Mold Electronics Market Outlook, By Screen Printing (2024-2032) ($MN)
  • Table 14 Global In-Mold Electronics Market Outlook, By Injection Molding (2024-2032) ($MN)
  • Table 15 Global In-Mold Electronics Market Outlook, By Film Insert Molding (FIM) (2024-2032) ($MN)
  • Table 16 Global In-Mold Electronics Market Outlook, By Thermoforming (2024-2032) ($MN)
  • Table 17 Global In-Mold Electronics Market Outlook, By Curing and Assembly (2024-2032) ($MN)
  • Table 18 Global In-Mold Electronics Market Outlook, By Application (2024-2032) ($MN)
  • Table 19 Global In-Mold Electronics Market Outlook, By Control Panels (2024-2032) ($MN)
  • Table 20 Global In-Mold Electronics Market Outlook, By Touch Sensors (2024-2032) ($MN)
  • Table 21 Global In-Mold Electronics Market Outlook, By Lighting Systems (2024-2032) ($MN)
  • Table 22 Global In-Mold Electronics Market Outlook, By Antennas (2024-2032) ($MN)
  • Table 23 Global In-Mold Electronics Market Outlook, By Displays and Interfaces (2024-2032) ($MN)
  • Table 24 Global In-Mold Electronics Market Outlook, By Smart Surfaces (2024-2032) ($MN)
  • Table 25 Global In-Mold Electronics Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 26 Global In-Mold Electronics Market Outlook, By End User (2024-2032) ($MN)
  • Table 27 Global In-Mold Electronics Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 28 Global In-Mold Electronics Market Outlook, By Home Appliances (2024-2032) ($MN)
  • Table 29 Global In-Mold Electronics Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 30 Global In-Mold Electronics Market Outlook, By Healthcare (2024-2032) ($MN)
  • Table 31 Global In-Mold Electronics Market Outlook, By Industrial (2024-2032) ($MN)
  • Table 32 Global In-Mold Electronics Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 33 Global In-Mold Electronics Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.