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市场调查报告书
商品编码
1896160

基于晶片组的处理器市场预测至2032年：按晶片组类型、整合架构、封装技术、应用、最终用户和地区分類的全球分析

Chiplet-Based Processor Market Forecasts to 2032 - Global Analysis By Chiplet Type, Integration Architecture, Packaging Technology, Application, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的一项研究，预计到 2025 年，全球基于晶片的处理器市场规模将达到 99 亿美元，到 2032 年将达到 191 亿美元，在预测期内的复合年增长率为 9.8%。

基于晶片组的处理器是一种模组化半导体架构，它将多个小型功能晶片（晶片组）整合到单一封装中，以执行复杂的运算任务。与单片设计相比，这种方法提高了产量比率、可扩展性和成本优化。晶片组架构广泛应用于资料中心、高效能运算和高阶消费性电子产品，能够加快创新週期、实现异质整合并提高电源效率。

对高效能运算架构的需求

对高效能运算 (HPC) 架构日益增长的需求正在推动基于晶片组的处理器普及。人工智慧、云端运算和进阶分析需要大规模的平行处理能力、频宽和能源效率。晶片组支援模组化扩展，可将 CPU、GPU 和加速器整合到异构封装中。这种架构降低了延迟并提高了吞吐量，使其成为资料中心、科学研究和企业工作负载的理想选择。随着各产业不断突破运算能力的极限，基于晶片组的设计正成为全球下一代 HPC 系统的基础。

复杂的整合和设计挑战

儘管发展势头强劲，但基于晶片组的处理器仍面临整合和设计方面的挑战。为了实现异构晶片组之间的无缝互连，需要采用混合键结和硅中介层等先进的封装技术。设计复杂性会增加​​检验成本并延长开发週期。确保跨厂商相容性以及在高负载下保持可靠性也是额外的障碍。这些挑战限制了中小企业采用该技术，并延缓了其商业化进程，其中整合复杂性是限制基于晶片组架构在全球推广的主要因素。

异构运算和可扩展性优势

基于晶片组的处理器凭藉其异构运算和可扩展性展现出巨大的潜力。透过将 CPU、GPU、AI 加速器和记忆体整合到模组化封装中，製造商可以针对不同的工作负载最佳化效能。这种柔软性支援从边缘 AI 到超大规模资料中心等广泛的应用。可扩展性还可透过在不同产品线中重复使用检验的晶片组来降低成本。随着对自适应运算的需求不断增长，晶片组架构提供了一条清晰的创新路径，能够为多个行业和应用场景提供客製化解决方案。

单片式晶片设计的进展。

单片式晶片设计不断发展，对基于晶片组的架构构成威胁。极紫外线 (EUV) 微影技术和 2nm 製程节点的进步正在提高单晶片的电晶体密度、性能和能效。这些创新降低了某些应用中对模组化整合的需求，挑战了晶片组的价值提案。如果单晶片设计能够实现与晶片组相当的可扩展性和成本效益，那么对基于晶片组的处理器的需求可能会下降，迫使供应商透过封装创新来实现差异化。

新冠疫情的影响

新冠疫情扰乱了半导体供应链，导致封装和中介层生产延误。然而，疫情也加速了数位转型，推动了对人工智慧、云端运算和高效能运算系统的需求。随着企业寻求可扩展的解决方案来应对快速增长的工作负载，基于晶片组的处理器获得了广泛关注。疫情后的復苏阶段，企业加大了对弹性供应链和本地化製造的投资。这次危机也凸显了模组化架构在应对需求突变方面的重要性，从而增强了晶片组处理器的长期成长前景。

预计在预测期内，CPU晶片组细分市场将占据最大份额。

由于CPU晶片在运算架构中扮演核心角色，预计将主导市场。模组化CPU晶片能够实现跨消费级、企业级和高效能运算（HPC）系统的可扩展性，并提供效能和成本方面的柔软性。与GPU和加速器的整合可提高整体系统效率。随着对自适应运算需求的不断增长，CPU晶片仍将是异质架构的基础，预计在预测期内将占据最大的市场份额。

预计在预测期内，模组化SoC架构细分市场将实现最高的复合年增长率。

由于模组化SoC架构能够将各种晶片整合到统一的平台中，预计其复合年增长率将最高。这些架构透过将CPU、GPU、记忆体和加速器整合到客製化封装中，支援人工智慧、物联网和边缘运算。其可扩展性降低了设计成本并加快了产品上市速度。随着各行业寻求灵活、高效能的解决方案，模组化SoC将推动成长，并成为基于晶片的处理器市场中成长最快的细分市场。

比最大的地区

亚太地区预计将占据最大的市场份额，这主要得益于台湾、韩国、中国大陆和日本强大的半导体製造基地。该地区正受惠于对晶圆代工厂、封装厂和研发中心的强劲投资。消费性电子、汽车和人工智慧等产业的需求进一步巩固了其主导地位。政府主导的各项倡议和供应链整合正在增强亚太地区的优势，使其成为基于晶片组的处理器生产和应用的全球中心。

预计年复合成长率最高的地区

这与人工智慧、云端运算和国防领域的强劲需求密切相关。大型科技公司和半导体创新者的涌入正在推动晶片组架构的快速普及。政府对国内晶片製造的资助以及为减少进口依赖而采取的战略倡议，进一步促进了这一增长。北美地区专注于高效能运算和下一代人工智慧处理器，预计将成为该市场成长最快的地区。

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目录

第一章执行摘要

第二章 前言

  • 摘要
  • 相关利益者
  • 调查范围
  • 调查方法
  • 研究材料

第三章 市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的感染疾病

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球以晶片组为基础的处理器市场（以晶片组类型划分）

  • CPU晶片组
  • GPU晶片
  • I/O晶片
  • 记忆体晶片
  • 加速晶片
  • 客製化晶片

6. 全球以晶片组为基础的处理器市场（以整合架构划分）

  • 模组化SoC架构
  • 异质整合平台
  • 分散式运算架构
  • 多晶粒网状结构

7. 全球晶片级处理器市场（依封装技术划分）

  • 3D IC封装
  • 扇出包装
  • 系统级封装
  • 嵌入式晶片封装
  • 高阶中介层

8. 全球以晶片组为基础的处理器市场（依应用领域划分）

  • 资料中心
  • 高效能运算
  • 人工智慧
  • 网路装置
  • 边缘运算
  • 家用电器

9. 全球以晶片组为基础的处理器市场（以最终用户划分）

  • 半导体公司
  • 云端服务供应商
  • 通讯业者
  • 企业IT
  • OEM
  • 国防/航太

第十章 区域晶片处理器市场

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美国家
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 併购
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十二章：企业概况

  • Advanced Micro Devices（AMD）
  • Intel Corporation
  • NVIDIA Corporation
  • Taiwan Semiconductor Manufacturing Company
  • Samsung Electronics
  • Marvell Technology Group
  • Broadcom Inc.
  • Qualcomm Incorporated
  • Apple Inc.
  • IBM Corporation
  • MediaTek Inc.
  • Arm Holdings
  • ASE Technology Holding
  • Amkor Technology
  • Cadence Design Systems
  • Synopsys Inc.
Product Code: SMRC32848

According to Stratistics MRC, the Global Chiplet-Based Processor Market is accounted for $9.9 billion in 2025 and is expected to reach $19.1 billion by 2032 growing at a CAGR of 9.8% during the forecast period. Chiplet-Based Processors are modular semiconductor architectures that integrate multiple smaller functional chips, or chiplets, into a single package to perform complex computing tasks. This approach enhances yield, scalability, and cost optimization compared to monolithic designs. Widely adopted in data centers, high-performance computing, and advanced consumer electronics, chiplet architectures enable faster innovation cycles, heterogeneous integration, and improved power-performance efficiency.

Market Dynamics:

Driver:

Demand for high-performance computing architectures

The rising demand for high-performance computing (HPC) architectures is driving adoption of chiplet-based processors. AI, cloud computing, and advanced analytics require massive parallelism, bandwidth, and energy efficiency. Chiplets enable modular scaling, integrating CPUs, GPUs, and accelerators into heterogeneous packages. This architecture reduces latency and improves throughput, making it ideal for data centers, scientific research, and enterprise workloads. As industries push computational boundaries, chiplet-based designs are becoming the cornerstone of next-generation HPC systems worldwide.

Restraint:

Complex integration and design challenges

Despite strong momentum, chiplet-based processors face integration and design challenges. Achieving seamless interconnectivity between heterogeneous chiplets requires advanced packaging technologies, such as hybrid bonding and silicon interposers. Design complexity increases validation costs and lengthens development cycles. Ensuring compatibility across multiple vendors and maintaining reliability under high workloads adds further hurdles. These challenges limit adoption among smaller firms and delay commercialization, making integration complexity a key restraint in scaling chiplet-based architectures globally.

Opportunity:

Heterogeneous computing and scalability advantages

Chiplet-based processors offer significant opportunities through heterogeneous computing and scalability. By combining CPUs, GPUs, AI accelerators, and memory into modular packages, manufacturers can tailor performance for diverse workloads. This flexibility supports applications ranging from edge AI to hyperscale data centers. Scalability also reduces costs by reusing validated chiplets across product lines. As demand for adaptive computing grows, chiplet architectures provide a clear pathway to innovation, enabling customized solutions for multiple industries and use cases.

Threat:

Advances in monolithic chip designs

Monolithic chip designs continue to evolve, posing a threat to chiplet-based architectures. Advances in extreme ultraviolet (EUV) lithography and 2nm process nodes are improving transistor density, performance, and energy efficiency in single-die chips. These innovations reduce the need for modular integration in certain applications, challenging the value proposition of chiplets. If monolithic designs achieve comparable scalability and cost efficiency, they may erode demand for chiplet-based processors, pressuring vendors to differentiate through packaging innovation.

Covid-19 Impact:

The COVID-19 pandemic disrupted semiconductor supply chains, delaying packaging and interposer production. However, it also accelerated digital transformation, boosting demand for AI, cloud computing, and HPC systems. Chiplet-based processors gained traction as enterprises sought scalable solutions to meet surging workloads. Post-pandemic recovery reinforced investments in resilient supply chains and localized manufacturing. The crisis ultimately highlighted the importance of modular architectures in adapting to rapid shifts in demand, strengthening long-term growth prospects for chiplet processors.

The CPU chiplets segment is expected to be the largest during the forecast period

The CPU chiplets segment is expected to dominate the market, resulting from their central role in computing architectures. Modular CPU chiplets enable scalability across consumer, enterprise, and HPC systems, offering flexibility in performance and cost. Their integration with GPUs and accelerators enhances overall system efficiency. As demand for adaptive computing grows, CPU chiplets remain the backbone of heterogeneous architectures, ensuring they capture the largest market share during the forecast period.

The modular SoC architectures segment is expected to have the highest CAGR during the forecast period

Modular SoC architectures are projected to register the highest CAGR, propelled by their ability to integrate diverse chiplets into unified platforms. These architectures support AI, IoT, and edge computing by combining CPUs, GPUs, memory, and accelerators in customizable packages. Their scalability reduces design costs and accelerates time-to-market. As industries demand flexible, high-performance solutions, modular SoCs are expected to lead growth, making them the fastest-expanding segment in the chiplet-based processor market.

Region with largest share:

Asia Pacific is expected to hold the largest market share, attributed to its strong semiconductor manufacturing base in Taiwan, South Korea, China, and Japan. The region benefits from robust investments in foundries, packaging facilities, and R&D centers. Demand from consumer electronics, automotive, and AI-driven industries further strengthens its leadership. Government-backed initiatives and supply chain integration reinforce Asia Pacific's dominance, positioning it as the global hub for chiplet-based processor production and adoption.

Region with highest CAGR:

associated with strong demand from AI, cloud computing, and defense sectors. The presence of leading technology companies and semiconductor innovators drives rapid adoption of chiplet architectures. Government funding for domestic chip manufacturing and strategic initiatives to reduce reliance on imports further accelerate growth. With emphasis on high-performance computing and next-gen AI processors, North America is poised to be the fastest-growing region in this market.

Key players in the market

Some of the key players in Chiplet-Based Processor Market include Advanced Micro Devices (AMD), Intel Corporation, NVIDIA Corporation, Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Marvell Technology Group, Broadcom Inc., Qualcomm Incorporated, Apple Inc., IBM Corporation, MediaTek Inc., Arm Holdings, ASE Technology Holding, Amkor Technology, Cadence Design Systems and Synopsys Inc.

Key Developments:

In November 2025, AMD (Advanced Micro Devices) unveiled its Zen 6 chiplet architecture, integrating CPU and GPU cores with advanced interconnects, targeting AI and HPC workloads with improved scalability.

In October 2025, Intel Corporation expanded its Foveros Direct 3D packaging technology, enabling tighter chiplet integration for next-generation server processors, reducing latency and boosting energy efficiency.

In September 2025, NVIDIA Corporation introduced chiplet-based GPU modules for AI inference accelerators, leveraging modular design to scale performance across cloud and enterprise deployments.

Chiplet Types Covered:

  • CPU Chiplets
  • GPU Chiplets
  • I/O Chiplets
  • Memory Chiplets
  • Accelerator Chiplets
  • Custom Chiplets

Integration Architectures Covered:

  • Modular SoC Architectures
  • Heterogeneous Integration Platforms
  • Disaggregated Compute Architectures
  • Multi-Die Mesh Architectures

Packaging Technologies Covered:

  • 3D IC Packaging
  • Fan-Out Packaging
  • System-in-Package
  • Embedded Die Packaging
  • Advanced Interposers

Applications Covered:

  • Data Centers
  • High-Performance Computing
  • Artificial Intelligence
  • Networking Equipment
  • Edge Computing
  • Consumer Electronics

End Users Covered:

  • Semiconductor Companies
  • Cloud Service Providers
  • Telecom Operators
  • Enterprise IT
  • Automotive OEMs
  • Defense & Aerospace

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Chiplet-Based Processor Market, By Chiplet Type

  • 5.1 Introduction
  • 5.2 CPU Chiplets
  • 5.3 GPU Chiplets
  • 5.4 I/O Chiplets
  • 5.5 Memory Chiplets
  • 5.6 Accelerator Chiplets
  • 5.7 Custom Chiplets

6 Global Chiplet-Based Processor Market, By Integration Architecture

  • 6.1 Introduction
  • 6.2 Modular SoC Architectures
  • 6.3 Heterogeneous Integration Platforms
  • 6.4 Disaggregated Compute Architectures
  • 6.5 Multi-Die Mesh Architectures

7 Global Chiplet-Based Processor Market, By Packaging Technology

  • 7.1 Introduction
  • 7.2 3D IC Packaging
  • 7.3 Fan-Out Packaging
  • 7.4 System-in-Package
  • 7.5 Embedded Die Packaging
  • 7.7 Advanced Interposers

8 Global Chiplet-Based Processor Market, By Application

  • 8.1 Introduction
  • 8.2 Data Centers
  • 8.3 High-Performance Computing
  • 8.4 Artificial Intelligence
  • 8.5 Networking Equipment
  • 8.6 Edge Computing
  • 8.8 Consumer Electronics

9 Global Chiplet-Based Processor Market, By End User

  • 9.1 Introduction
  • 9.2 Semiconductor Companies
  • 9.3 Cloud Service Providers
  • 9.4 Telecom Operators
  • 9.5 Enterprise IT
  • 9.6 Automotive OEMs
  • 9.7 Defense & Aerospace

10 Global Chiplet-Based Processor Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Advanced Micro Devices (AMD)
  • 12.2 Intel Corporation
  • 12.3 NVIDIA Corporation
  • 12.4 Taiwan Semiconductor Manufacturing Company
  • 12.5 Samsung Electronics
  • 12.6 Marvell Technology Group
  • 12.7 Broadcom Inc.
  • 12.8 Qualcomm Incorporated
  • 12.9 Apple Inc.
  • 12.10 IBM Corporation
  • 12.11 MediaTek Inc.
  • 12.12 Arm Holdings
  • 12.13 ASE Technology Holding
  • 12.14 Amkor Technology
  • 12.15 Cadence Design Systems
  • 12.16 Synopsys Inc.

List of Tables

  • Table 1 Global Chiplet-Based Processor Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Chiplet-Based Processor Market Outlook, By Chiplet Type (2024-2032) ($MN)
  • Table 3 Global Chiplet-Based Processor Market Outlook, By CPU Chiplets (2024-2032) ($MN)
  • Table 4 Global Chiplet-Based Processor Market Outlook, By GPU Chiplets (2024-2032) ($MN)
  • Table 5 Global Chiplet-Based Processor Market Outlook, By I/O Chiplets (2024-2032) ($MN)
  • Table 6 Global Chiplet-Based Processor Market Outlook, By Memory Chiplets (2024-2032) ($MN)
  • Table 7 Global Chiplet-Based Processor Market Outlook, By Accelerator Chiplets (2024-2032) ($MN)
  • Table 8 Global Chiplet-Based Processor Market Outlook, By Custom Chiplets (2024-2032) ($MN)
  • Table 9 Global Chiplet-Based Processor Market Outlook, By Integration Architecture (2024-2032) ($MN)
  • Table 10 Global Chiplet-Based Processor Market Outlook, By Modular SoC Architectures (2024-2032) ($MN)
  • Table 11 Global Chiplet-Based Processor Market Outlook, By Heterogeneous Integration Platforms (2024-2032) ($MN)
  • Table 12 Global Chiplet-Based Processor Market Outlook, By Disaggregated Compute Architectures (2024-2032) ($MN)
  • Table 13 Global Chiplet-Based Processor Market Outlook, By Multi-Die Mesh Architectures (2024-2032) ($MN)
  • Table 14 Global Chiplet-Based Processor Market Outlook, By Packaging Technology (2024-2032) ($MN)
  • Table 15 Global Chiplet-Based Processor Market Outlook, By 3D IC Packaging (2024-2032) ($MN)
  • Table 16 Global Chiplet-Based Processor Market Outlook, By Fan-Out Packaging (2024-2032) ($MN)
  • Table 17 Global Chiplet-Based Processor Market Outlook, By System-in-Package (2024-2032) ($MN)
  • Table 18 Global Chiplet-Based Processor Market Outlook, By Embedded Die Packaging (2024-2032) ($MN)
  • Table 19 Global Chiplet-Based Processor Market Outlook, By Advanced Interposers (2024-2032) ($MN)
  • Table 20 Global Chiplet-Based Processor Market Outlook, By Application (2024-2032) ($MN)
  • Table 21 Global Chiplet-Based Processor Market Outlook, By Data Centers (2024-2032) ($MN)
  • Table 22 Global Chiplet-Based Processor Market Outlook, By High-Performance Computing (2024-2032) ($MN)
  • Table 23 Global Chiplet-Based Processor Market Outlook, By Artificial Intelligence (2024-2032) ($MN)
  • Table 24 Global Chiplet-Based Processor Market Outlook, By Networking Equipment (2024-2032) ($MN)
  • Table 25 Global Chiplet-Based Processor Market Outlook, By Edge Computing (2024-2032) ($MN)
  • Table 26 Global Chiplet-Based Processor Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 27 Global Chiplet-Based Processor Market Outlook, By End User (2024-2032) ($MN)
  • Table 28 Global Chiplet-Based Processor Market Outlook, By Semiconductor Companies (2024-2032) ($MN)
  • Table 29 Global Chiplet-Based Processor Market Outlook, By Cloud Service Providers (2024-2032) ($MN)
  • Table 30 Global Chiplet-Based Processor Market Outlook, By Telecom Operators (2024-2032) ($MN)
  • Table 31 Global Chiplet-Based Processor Market Outlook, By Enterprise IT (2024-2032) ($MN)
  • Table 32 Global Chiplet-Based Processor Market Outlook, By Automotive OEMs (2024-2032) ($MN)
  • Table 33 Global Chiplet-Based Processor Market Outlook, By Defense & Aerospace (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.