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市场调查报告书
商品编码
1946000

全球下一代逻辑扩展技术市场：预测（至2034年）－按材料、节点尺寸、技术、应用、最终用户和地区分類的分析

Next-Gen Logic Scaling Technologies Market Forecasts to 2034 - Global Analysis By Material, Node Size, Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的研究，全球下一代逻辑缩放技术市场预计将在 2026 年达到 1,894 亿美元，并在预测期内以 6.4% 的复合年增长率成长，到 2034 年达到 3,126 亿美元。

下一代逻辑微缩技术是指突破传统电晶体小型化极限的先进半导体设计和製造方法，它能够提升运算效能、效率和整合密度。此技术融合了GAA（环栅）电晶体、奈米片结构、先进微影术和3D堆迭等创新技术，从而实现更小、更快、更节能的逻辑电路。透过克服小型化挑战，它为高效能运算、人工智慧和资料密集型应用提供了有力支援。下一代微缩技术确保了摩尔定律的持续发展，并推动了晶片功能、能源效率优化和系统整合的突破。

对更高性能的持续需求

对更高性能的持续需求是推动下一代逻辑微缩技术市场发展的主要动力。半导体製造商正努力满足日益增长的计算和处理需求。人工智慧、云端运算和高效能资料中心等应用需要速度更快、效率更高的逻辑装置。这一趋势正在推动先进微缩技术、创新光刻技术和新材料的应用，以提高晶体管密度和性能。对节能、高速运算的持续需求正在促进全球最先进半导体製造工厂的市场成长。

半导体製造成本飙升

在下一代逻辑微缩技术市场中，半导体製造成本飙升是限制其发展的主要因素。这主要是由于先进製程节点的复杂性日益增加。 5奈米以下和3奈米以下的製造工艺需要昂贵的微影术设备、精密材料和严格的製程控制。不断上涨的资本和营运成本会限制小规模半导体晶圆厂采用这些技术，并减缓大规模部署的速度。儘管尖端应用对高效能逻辑微缩解决方案的需求强劲，但这些财务障碍正在抑制短期市场成长。

采用3奈米以下技术

随着製造商们努力突破电晶体小型化的极限，采用3奈米以下製程技术为下一代逻辑微缩技术市场带来了巨大的机会。这些技术能够实现更高的电晶体密度、低耗电量和更优异的运算性能。人们对晶片整合、异质架构和节能设计的兴趣日益浓厚，正在推动这项技术的应用。随着半导体公司加大对3奈米以下製程节点的研发、製程开发和试生产投入，对配套工具、材料和先进微缩解决方案的需求预计将迅速增长。

硅物理小型化的极限

随着电晶体尺寸逼近原子级极限，硅的物理尺寸缩放极限对下一代逻辑微缩技术市场构成了重大威胁。短沟道效应、漏电流和温度控管限制等挑战阻碍了进一步的微型化。克服这些限制需要对替代材料、装置架构或创新微影术技术进行大量投资。如果无法解决这些物理尺寸缩放障碍，可能会阻碍效能提升和应用普及，进而影响下一代逻辑微缩技术的长期发展。

新冠疫情的影响：

新冠感染疾病透过暂时中断半导体製造、供应链延迟和计划进度延误，对下一代逻辑微缩技术市场造成了衝击。设备交付和晶圆生产面临物流挑战，减缓了技术普及。然而，在疫情后的復苏阶段，对高效能运算、云端基础设施和人工智慧应用的需求加速成长，再次凸显了先进逻辑微缩技术的必要性。这一新的成长动能正在推动市场发展，并凸显下一代微缩解决方案在半导体创新中的战略重要性。

在预测期内，先进硅材料细分市场预计将占据最大的市场份额。

由于先进硅材料在实现高性能逻辑装置发挥至关重要的作用，预计在预测期内，该细分市场将占据最大的市场份额。这些材料具有卓越的电学性能、热稳定性和与先进微影术刻製程的兼容性。在最先进的製程节点上采用这些材料可确保电晶体密度和装置可靠性的提升。对硅材料创新和製造支援的持续投入将推动其广泛应用，从而在预测期内占据逻辑微缩技术领域最大的市场份额。

预计在预测期内，5nm以上的製程将呈现最高的复合年增长率。

在预测期内，5奈米及以上製程製程预计将呈现最高的成长率，这反映了先进製程节点的快速普及。这些製程节点能够实现更高的电晶体密度、更低的功耗和更强的运算效能。人工智慧处理器、行动装置和高效能运算系统等领域的广泛应用将加速市场需求。对微影术技术、材料创新和製程优化的持续投入将支撑这一成长，使5奈米以上製程製程成为下一代逻辑微缩技术中成长最快的技术类别。

市占率最大的地区：

在整个预测期内，亚太地区预计将保持最大的市场份额，这得益于其强大的半导体製造生态系统。台湾、韩国、中国大陆和日本等国家和地区位置大型晶圆製造工厂和晶圆代工厂，能够大规模生产最先进的逻辑晶片。政府支持、策略性投资和持续的技术升级正在加速下一代微缩解决方案的普及应用。基础设施、政策支援和製造能力的结合将巩固该地区的市场主导地位，并确保在整个预测期内实现持续的收入成长。

复合年增长率最高的地区：

在预测期内，北美预计将呈现最高的复合年增长率，这主要得益于半导体研发和先进计算基础设施的大量投资。领先的晶片设计公司、无厂半导体公司以及高效能运算倡议的存在，正在加速下一代扩展解决方案的采用。政府支援、光刻和材料领域的持续创新，以及对人工智慧、云端运算和边缘处理应用日益增长的需求，将进一步推动市场成长，使北美在整个预测期内成为成长最快的区域市场。

免费客製化服务：

订阅本报告的用户可享有以下免费自订选项之一：

  • 公司简介
    • 对其他公司（最多 3 家公司）进行全面分析
    • 对主要企业进行SWOT分析（最多3家公司）
  • 区域分类
    • 根据客户兴趣量身定制的主要国家/地区的市场估算、预测和复合年增长率（註：基于可行性检查）
  • 竞争性标竿分析
    • 根据产品系列、地理覆盖范围和策略联盟对主要企业进行基准分析。

目录

第一章执行摘要

  • 市场概览及主要亮点
  • 成长要素、挑战与机会
  • 竞争格局概述
  • 战略考虑和建议

第二章：分析框架

  • 分析的目标和范围
  • 相关人员分析
  • 分析的前提条件与限制
  • 分析方法

第三章 市场动态与趋势分析

  • 市场定义与结构
  • 主要市场驱动因素
  • 市场限制与挑战
  • 投资成长机会和重点领域
  • 产业威胁与风险评估
  • 科技与创新趋势
  • 新兴市场和高成长市场
  • 监管和政策环境
  • 感染疾病的影响及恢復前景

第四章：竞争环境与策略评估

  • 波特五力分析
    • 供应商议价能力
    • 买方的议价能力
    • 替代产品的威胁
    • 新进入者的威胁
    • 竞争公司之间的竞争
  • 主要企业市占率分析
  • 产品基准评效和效能比较

第五章：全球下一代逻辑扩展技术市场：按材料划分

  • 高品质硅材料
  • 高介电常数材料
  • 金属门材料
  • 二维半导体材料
  • 化合物半导体材料

第六章 下一代逻辑扩展技术的全球市场：按节点尺寸划分

  • 5奈米或以上
  • 3nm节点
  • 2nm节点
  • 2nm 下列节点
  • 实验逻辑节点

第七章 全球新一代逻辑扩展技术市场：依技术划分

  • GAA（全环栅极）电晶体技术
  • 先进的FinFET微缩技术
  • 3D逻辑集成
  • 基于晶片组的扩展
  • 后CMOS逻辑技术

第八章 全球下一代逻辑扩展技术市场：按应用领域划分

  • 高效能运算
  • 人工智慧处理
  • 资料中心处理器
  • 高级家用电子电器
  • 自主系统

第九章：全球下一代逻辑扩展技术市场：按最终用户划分

  • 半导体晶圆代工厂
  • 集成设备製造商
  • 无晶圆厂晶片公司
  • 研究机构
  • 政府附属研发机构
  • 其他最终用户

第十章：全球下一代逻辑扩展技术市场：按地区划分

  • 北美洲
    • 我们
    • 加拿大
    • 墨西哥
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 荷兰
    • 比利时
    • 瑞典
    • 瑞士
    • 波兰
    • 其他欧洲国家
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 韩国
    • 澳洲
    • 印尼
    • 泰国
    • 马来西亚
    • 新加坡
    • 越南
    • 其他亚太地区
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥伦比亚
    • 智利
    • 秘鲁
    • 南美洲其他地区
  • 世界其他地区（RoW）
    • 中东
      • 沙乌地阿拉伯
      • 阿拉伯聯合大公国
      • 卡达
      • 以色列
      • 其他中东国家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲国家

第十一章 策略市场资讯

  • 产业加值网络与供应链评估
  • 空白区域和机会地图
  • 产品演进与市场生命週期分析
  • 通路、经销商和打入市场策略的评估

第十二章 产业趋势与策略倡议

  • 企业合併（M&A）
  • 伙伴关係、联盟和合资企业
  • 新产品发布和认证
  • 扩大生产能力和投资
  • 其他策略倡议

第十三章：公司简介

  • TSMC
  • Intel
  • Samsung Electronics
  • GlobalFoundries
  • Micron Technology
  • SK Hynix
  • Broadcom
  • Qualcomm
  • NVIDIA
  • AMD
  • ASML
  • Applied Materials
  • Lam Research
  • KLA Corporation
  • Tokyo Electron
  • Cadence Design Systems
  • Synopsys
Product Code: SMRC33771

According to Stratistics MRC, the Global Next-Gen Logic Scaling Technologies Market is accounted for $189.4 billion in 2026 and is expected to reach $312.6 billion by 2034 growing at a CAGR of 6.4% during the forecast period. Next-Gen Logic Scaling Technologies refer to advanced semiconductor design and manufacturing approaches that push beyond traditional transistor scaling limits to enhance computing performance, efficiency, and density. These technologies integrate innovations such as gate-all-around (GAA) transistors, nanosheet architectures, advanced lithography, and 3D stacking to enable smaller, faster, and more power-efficient logic circuits. By overcoming challenges of miniaturization, they support high-performance computing, artificial intelligence, and data-intensive applications. Next-gen scaling ensures continued progress in Moore's Law, driving breakthroughs in chip functionality, energy optimization, and system integration.

Market Dynamics:

Driver:

Continued demand for higher performance

Continued demand for higher performance is a key driver for the Next-Gen Logic Scaling Technologies Market as semiconductor manufacturers strive to meet growing computing and processing requirements. Applications such as AI, cloud computing, and high-performance data centers demand faster, more efficient logic devices. This trend encourages adoption of advanced scaling techniques, innovative lithography, and novel materials to enhance transistor density and performance. Sustained demand for energy-efficient, high-speed computing reinforces market growth across leading-edge semiconductor fabrication facilities worldwide.

Restraint:

Escalating semiconductor fabrication costs

Escalating semiconductor fabrication costs act as a major restraint in the Next-Gen Logic Scaling Technologies Market due to increasing complexity in advanced process nodes. Sub-5 nm and sub-3 nm fabrication requires expensive lithography equipment, precision materials, and stringent process control. Rising capital expenditure and operational costs can limit adoption for smaller semiconductor fabs and slow large-scale deployment. These financial barriers constrain short-term market growth despite strong demand for high-performance logic scaling solutions in leading-edge applications.

Opportunity:

Adoption of sub-3nm technologies

Adoption of sub-3 nm technologies presents a significant opportunity within the Next-Gen Logic Scaling Technologies Market as manufacturers push transistor miniaturization limits. These technologies enable higher transistor density, lower power consumption, and enhanced computing performance. Growing interest in chiplet integration, heterogeneous architectures, and energy-efficient designs supports adoption. As semiconductor companies invest in research, process development, and pilot production for sub-3 nm nodes, demand for supporting tools, materials, and advanced scaling solutions is expected to expand rapidly.

Threat:

Physical scaling limitations of silicon

Physical scaling limitations of silicon pose a notable threat to the Next-Gen Logic Scaling Technologies Market as transistor dimensions approach atomic-scale limits. Challenges such as short-channel effects, leakage currents, and thermal management constraints restrict further miniaturization. Overcoming these limitations requires significant investment in alternative materials, device architectures, or innovative lithography techniques. Failure to address physical scaling barriers may hinder performance improvements and adoption rates, impacting the long-term growth of next-generation logic scaling technologies.

Covid-19 Impact:

The COVID-19 pandemic affected the Next-Gen Logic Scaling Technologies Market through temporary disruptions in semiconductor fabrication, supply chain delays, and project timelines. Equipment deliveries and wafer production faced logistical challenges, slowing technology adoption. However, the post-pandemic recovery witnessed accelerated demand for high-performance computing, cloud infrastructure, and AI applications, reinforcing the need for advanced logic scaling. This renewed momentum has strengthened market growth, highlighting the strategic importance of next-generation scaling solutions in semiconductor innovation.

The advanced silicon materials segment is expected to be the largest during the forecast period

The advanced silicon materials segment is expected to account for the largest market share during the forecast period due to its critical role in enabling high-performance logic devices. These materials provide superior electrical characteristics, thermal stability, and compatibility with advanced lithography processes. Adoption in leading-edge nodes ensures improved transistor density and device reliability. Continuous investment in silicon material innovations and fabrication support drives widespread deployment, resulting in the largest market share across logic scaling technologies during the forecast period.

The 5 nm and above segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the 5 nm and above segment is predicted to witness the highest growth rate reflecting rapid adoption of leading-edge process nodes. These nodes deliver higher transistor density, lower power consumption, and enhanced computing performance. Increasing deployment in AI processors, mobile devices, and high-performance computing systems accelerates demand. Continued investment in lithography, material innovation, and process optimization supports growth, positioning the 5 nm and above segment as the fastest-growing technology category in next-generation logic scaling.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by its robust semiconductor manufacturing ecosystem. Countries such as Taiwan, South Korea, China, and Japan host leading wafer fabrication facilities and foundries, enabling high-volume production of advanced logic chips. Government support, strategic investments, and continuous technology upgrades drive widespread adoption of next-generation scaling solutions. This combination of infrastructure, policy backing, and manufacturing capability reinforces regional market dominance and ensures sustained revenue growth throughout the forecast period.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR driven by substantial investments in semiconductor R&D and advanced computing infrastructure. The presence of leading chip designers, fabless companies, and high-performance computing initiatives accelerates adoption of next-generation scaling solutions. Supportive government incentives, ongoing innovation in lithography and materials, and increasing demand for AI, cloud computing, and edge processing applications further fuel market growth, positioning North America as the fastest-growing regional market throughout the forecast period.

Key players in the market

Some of the key players in Next-Gen Logic Scaling Technologies Market include TSMC, Intel, Samsung Electronics, GlobalFoundries, Micron Technology, SK Hynix, Broadcom, Qualcomm, NVIDIA, AMD, ASML, Applied Materials, Lam Research, KLA Corporation, Tokyo Electron, Cadence Design Systems and Synopsys.

Key Developments:

In January 2026, TSMC advanced its next-generation logic scaling roadmap by expanding production of sub-3nm process technologies, supporting improved transistor density, power efficiency, and performance for high-performance computing and AI-driven applications.

In December 2025, Intel strengthened its logic scaling capabilities by introducing advanced transistor architectures and backside power delivery technologies, aiming to enhance power efficiency and yield performance in future-node semiconductor manufacturing.

In November 2025, Samsung Electronics expanded its next-gen logic scaling portfolio with gate-all-around transistor advancements, enabling improved performance-per-watt and supporting high-density logic chips for mobile and data center applications.

Materials Covered:

  • Advanced Silicon Materials
  • High-k Dielectric Materials
  • Metal Gate Materials
  • 2D Semiconductor Materials
  • Compound Semiconductor Materials

Node Sizes Covered:

  • 5 nm and Above
  • 3 nm Node
  • 2 nm Node
  • Sub-2 nm Nodes
  • Experimental Logic Nodes

Technologies Covered:

  • Gate-All-Around Transistor Technologies
  • Advanced FinFET Scaling
  • 3D Logic Integration
  • Chiplet-Based Scaling
  • Post-CMOS Logic Technologies

Applications Covered:

  • High-Performance Computing
  • Artificial Intelligence Processing
  • Data Center Processors
  • Advanced Consumer Electronics
  • Autonomous Systems

End Users Covered:

  • Semiconductor Foundries
  • Integrated Device Manufacturers
  • Fabless Chip Companies
  • Research Institutions
  • Government R&D Organizations
  • Other End Users

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
    • Saudi Arabia
    • United Arab Emirates
    • Qatar
    • Israel
    • Rest of Middle East
    • Africa
    • South Africa
    • Egypt
    • Morocco
    • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 3032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global Next-Gen Logic Scaling Technologies Market, By Material

  • 5.1 Advanced Silicon Materials
  • 5.2 High-k Dielectric Materials
  • 5.3 Metal Gate Materials
  • 5.4 2D Semiconductor Materials
  • 5.5 Compound Semiconductor Materials

6 Global Next-Gen Logic Scaling Technologies Market, By Node Size

  • 6.1 5 nm and Above
  • 6.2 3 nm Node
  • 6.3 2 nm Node
  • 6.4 Sub-2 nm Nodes
  • 6.5 Experimental Logic Nodes

7 Global Next-Gen Logic Scaling Technologies Market, By Technology

  • 7.1 Gate-All-Around Transistor Technologies
  • 7.2 Advanced FinFET Scaling
  • 7.3 3D Logic Integration
  • 7.4 Chiplet-Based Scaling
  • 7.5 Post-CMOS Logic Technologies

8 Global Next-Gen Logic Scaling Technologies Market, By Application

  • 8.1 High-Performance Computing
  • 8.2 Artificial Intelligence Processing
  • 8.3 Data Center Processors
  • 8.4 Advanced Consumer Electronics
  • 8.5 Autonomous Systems

9 Global Next-Gen Logic Scaling Technologies Market, By End User

  • 9.1 Semiconductor Foundries
  • 9.2 Integrated Device Manufacturers
  • 9.3 Fabless Chip Companies
  • 9.4 Research Institutions
  • 9.5 Government R&D Organizations
  • 9.6 Other End Users

10 Global Next-Gen Logic Scaling Technologies Market, By Geography

  • 10.1 North America
    • 10.1.1 United States
    • 10.1.2 Canada
    • 10.1.3 Mexico
  • 10.2 Europe
    • 10.2.1 United Kingdom
    • 10.2.2 Germany
    • 10.2.3 France
    • 10.2.4 Italy
    • 10.2.5 Spain
    • 10.2.6 Netherlands
    • 10.2.7 Belgium
    • 10.2.8 Sweden
    • 10.2.9 Switzerland
    • 10.2.10 Poland
    • 10.2.11 Rest of Europe
  • 10.3 Asia Pacific
    • 10.3.1 China
    • 10.3.2 Japan
    • 10.3.3 India
    • 10.3.4 South Korea
    • 10.3.5 Australia
    • 10.3.6 Indonesia
    • 10.3.7 Thailand
    • 10.3.8 Malaysia
    • 10.3.9 Singapore
    • 10.3.10 Vietnam
    • 10.3.11 Rest of Asia Pacific
  • 10.4 South America
    • 10.4.1 Brazil
    • 10.4.2 Argentina
    • 10.4.3 Colombia
    • 10.4.4 Chile
    • 10.4.5 Peru
    • 10.4.6 Rest of South America
  • 10.5 Rest of the World (RoW)
    • 10.5.1 Middle East
      • 10.5.1.1 Saudi Arabia
      • 10.5.1.2 United Arab Emirates
      • 10.5.1.3 Qatar
      • 10.5.1.4 Israel
      • 10.5.1.5 Rest of Middle East
    • 10.5.2 Africa
      • 10.5.2.1 South Africa
      • 10.5.2.2 Egypt
      • 10.5.2.3 Morocco
      • 10.5.2.4 Rest of Africa

11 Strategic Market Intelligence

  • 11.1 Industry Value Network and Supply Chain Assessment
  • 11.2 White-Space and Opportunity Mapping
  • 11.3 Product Evolution and Market Life Cycle Analysis
  • 11.4 Channel, Distributor, and Go-to-Market Assessment

12 Industry Developments and Strategic Initiatives

  • 12.1 Mergers and Acquisitions
  • 12.2 Partnerships, Alliances, and Joint Ventures
  • 12.3 New Product Launches and Certifications
  • 12.4 Capacity Expansion and Investments
  • 12.5 Other Strategic Initiatives

13 Company Profiles

  • 13.1 TSMC
  • 13.2 Intel
  • 13.3 Samsung Electronics
  • 13.4 GlobalFoundries
  • 13.5 Micron Technology
  • 13.6 SK Hynix
  • 13.7 Broadcom
  • 13.8 Qualcomm
  • 13.9 NVIDIA
  • 13.10 AMD
  • 13.11 ASML
  • 13.12 Applied Materials
  • 13.13 Lam Research
  • 13.14 KLA Corporation
  • 13.15 Tokyo Electron
  • 13.16 Cadence Design Systems
  • 13.17 Synopsys

List of Tables

  • Table 1 Global Next-Gen Logic Scaling Technologies Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global Next-Gen Logic Scaling Technologies Market Outlook, By Material (2023-2034) ($MN)
  • Table 3 Global Next-Gen Logic Scaling Technologies Market Outlook, By Advanced Silicon Materials (2023-2034) ($MN)
  • Table 4 Global Next-Gen Logic Scaling Technologies Market Outlook, By High-k Dielectric Materials (2023-2034) ($MN)
  • Table 5 Global Next-Gen Logic Scaling Technologies Market Outlook, By Metal Gate Materials (2023-2034) ($MN)
  • Table 6 Global Next-Gen Logic Scaling Technologies Market Outlook, By 2D Semiconductor Materials (2023-2034) ($MN)
  • Table 7 Global Next-Gen Logic Scaling Technologies Market Outlook, By Compound Semiconductor Materials (2023-2034) ($MN)
  • Table 8 Global Next-Gen Logic Scaling Technologies Market Outlook, By Node Size (2023-2034) ($MN)
  • Table 9 Global Next-Gen Logic Scaling Technologies Market Outlook, By 5 nm and Above (2023-2034) ($MN)
  • Table 10 Global Next-Gen Logic Scaling Technologies Market Outlook, By 3 nm Node (2023-2034) ($MN)
  • Table 11 Global Next-Gen Logic Scaling Technologies Market Outlook, By 2 nm Node (2023-2034) ($MN)
  • Table 12 Global Next-Gen Logic Scaling Technologies Market Outlook, By Sub-2 nm Nodes (2023-2034) ($MN)
  • Table 13 Global Next-Gen Logic Scaling Technologies Market Outlook, By Experimental Logic Nodes (2023-2034) ($MN)
  • Table 14 Global Next-Gen Logic Scaling Technologies Market Outlook, By Technology (2023-2034) ($MN)
  • Table 15 Global Next-Gen Logic Scaling Technologies Market Outlook, By Gate-All-Around Transistor Technologies (2023-2034) ($MN)
  • Table 16 Global Next-Gen Logic Scaling Technologies Market Outlook, By Advanced FinFET Scaling (2023-2034) ($MN)
  • Table 17 Global Next-Gen Logic Scaling Technologies Market Outlook, By 3D Logic Integration (2023-2034) ($MN)
  • Table 18 Global Next-Gen Logic Scaling Technologies Market Outlook, By Chiplet-Based Scaling (2023-2034) ($MN)
  • Table 19 Global Next-Gen Logic Scaling Technologies Market Outlook, By Post-CMOS Logic Technologies (2023-2034) ($MN)
  • Table 20 Global Next-Gen Logic Scaling Technologies Market Outlook, By Application (2023-2034) ($MN)
  • Table 21 Global Next-Gen Logic Scaling Technologies Market Outlook, By High-Performance Computing (2023-2034) ($MN)
  • Table 22 Global Next-Gen Logic Scaling Technologies Market Outlook, By Artificial Intelligence Processing (2023-2034) ($MN)
  • Table 23 Global Next-Gen Logic Scaling Technologies Market Outlook, By Data Center Processors (2023-2034) ($MN)
  • Table 24 Global Next-Gen Logic Scaling Technologies Market Outlook, By Advanced Consumer Electronics (2023-2034) ($MN)
  • Table 25 Global Next-Gen Logic Scaling Technologies Market Outlook, By Autonomous Systems (2023-2034) ($MN)
  • Table 26 Global Next-Gen Logic Scaling Technologies Market Outlook, By End User (2023-2034) ($MN)
  • Table 27 Global Next-Gen Logic Scaling Technologies Market Outlook, By Semiconductor Foundries (2023-2034) ($MN)
  • Table 28 Global Next-Gen Logic Scaling Technologies Market Outlook, By Integrated Device Manufacturers (2023-2034) ($MN)
  • Table 29 Global Next-Gen Logic Scaling Technologies Market Outlook, By Fabless Chip Companies (2023-2034) ($MN)
  • Table 30 Global Next-Gen Logic Scaling Technologies Market Outlook, By Research Institutions (2023-2034) ($MN)
  • Table 31 Global Next-Gen Logic Scaling Technologies Market Outlook, By Government R&D Organizations (2023-2034) ($MN)
  • Table 32 Global Next-Gen Logic Scaling Technologies Market Outlook, By Other End Users (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above. Global Next-Gen Logic Scaling Technologies Market, By End User