3D 列印电子市场：2023 年 - 市场研究与预测

3D电子列印（3DEP）的市场规模预计在未来几年将显着成长。 这得益于3D电子列印应用的持续开发和演示，以及列印技术和平台能力的进步。 预计该市场10年复合年增长率为37%。 3D电子列印的市场规模也不断扩大，预计2023年市场规模将达3亿美元，2033年将扩大至79亿美元。

本报告检视了 3D 列印电子市场，并解释了市场成长面临的挑战、进入市场的主要参与者以及详细的市场数据和预测。

目录

执行摘要

第一章趋势、机会、挑战

• 本报告的背景与背景
• 阅读本报告
• 3D列印电子领域的趋势、机会与挑战
• 3D列印电子技术和应用的当前和未来可能性
• 当前竞争格局图
• 预测产业的未来和成长机会
• 目前的 3D 列印电子领域
• 内部 PCB 原型设计
• 影响产业方向的显着趋势
• 永续发展
• 减少原型製作过程中的材料消耗
• 设计上的可回收性
• 透过小型化设备减少对生命週期的影响
• 供应链安全与压缩
• 透过传统 3D 列印支援半导体製造
• 《半导体生产有益激励法》(CHIP)
• 机会
• 物联网
• 物联网设备内天线的保形印刷
• 大规模物联网
• 灵活的物联网
• 多品种、小批量的电子产品将变得越来越可能
• 电子设备小型化
• 互连
• 被动
• 嵌入式和堆迭元件以及垂直整合IC
• 透过过渡到内部原型设计来保护智慧财产权
• 设计自由
• 顶部、底部和侧面安装的组件为您的电路板增添了另一个角度
• 透过多向通孔进行高密度布线
• 作业
• 批量生产
• 透过印刷流程中的 SMT 整合克服产量问题
• 继续材料开发
• 为 3D 列印电子产品建立无缝数位主线
• 电子设计辅助设计和机械辅助设计之间的界线变得模糊
• 新的软体解决方案填补了空白

第二章技术、应用、市场

• 技术
• 导电材料印刷技术
• 聚合物粉末床熔融
• 还原光聚合
• 除静电材料印刷技术
• 聚合物粉末床熔融
• 还原光聚合
• 材料挤出
• 3D电子列印技术
• 喷墨列印
• 气溶胶喷射印刷
• 基于挤出的印刷
• 材料
• 导电油墨
• 银奈米颗粒墨水
• 挤压材料和限制
• 介电油墨和树脂
• 申请
• 印刷电路板
• 3D列印多层PCB
• 印刷电路板的未来
• 连接器和互连
• 天线、放大器、收发器
• 3DEP 支援先进的天线生产
• 下一代天线的多材料列印
• 6G的崛起
• 电容器
• 感测器
• 量子感测器
• 超越 PCB：下一代元件和应用中的 3DEP 创新
• 光电
• 电池
• 晶片实验室

第三章市场进入公司

• Nano Dimension
• Technology-Dragonfly IV
• Optomec
• Aerosol Jet
• Bot Factory
• Ceradrop
• Chemcubed
• NeoTech
• PV Nanocell
• Voltera
• Fujifilm Corporation
• Panasonic
• Additive Electronics
• Notion Systems
• nScrypt
• Nano3DPrint

第 4 章 10 年预测

• 调查方法
• 定价
• 服务收入
• 行业
• 3D印表机的分类
• 整个市场
• 关于积层製造研究
• 关于分析师
• 本报告中使用的首字母缩写词和缩写词

The 3D electronics printing (3DEP) market is expected to experience significant growth in the coming years. This is due to the advancements in printing technology and platform capability, alongside the ongoing development and demonstration of the applications of 3D electronics printing. The market is projected to achieve a 10-year CAGR of 37%. The market size for 3D electronics printing is also expanding, with an estimated total market value of $0.3 billion in 2023, which is expected to increase to $7.9 billion by 2033.

This report describes the value propositions of 3DEP, the challenges to market growth, key players in the 3DEP space, and detailed market data and forecasting.

Companies or organizations covered in this report include, but are not limited to: Ceradrop, Nano Dimension, NeoTech, Optomec, FujiFilm, Voltera, BotFactory, nScrypt, J.A.M.E.S., NextFlex, ChemCubed, PV Nanocell, Panasonic, Additive Electronics, Nano3DPrint, and Notion Systems.

Table of Contents

Executive Summary

• Defining the value propositions of 3D Electronics Printing
• Miniaturisation
• Design Freedom
• Reshoring and localisation9
• Sustainability
• Challenges to market growth
• Key players in the 3D Electronics Printing Space
• The industry remains consolidated around a small number of player
• Low-cost 3DEP providers reduce barriers to entry
• Forecasting the growth of the market

Chapter One: Trends, opportunities and challenges

• Background and context to this report
• Reading this report
• Trends, Opportunities, and challenges in the 3D printing electronics space
• The current and future potential for 3D printing electronics technologies and applications
• Mapping the current competitive landscape
• Building a future view of the industry and forecasting its opportunity for growth
• The current 3D printing electronics space
• 3D Electronics Printing prepares to move from the lab to the factory
• Electronics prototyping remains the go-to application
• Moving PCB prototyping in-house
• Standing at the precipice of commercial 3D printed electronics
• Notable trends driving the direction of the industry
• Sustainability
• Reducing material consumption in prototyping
• Recyclability through design
• Miniaturisation of devices reducing life cycle impact
• Supply Chain security and compression
• Supporting Semiconductor production using conventional 3D printing
• Creating helpful incentives to produce semiconductors (CHIPs) act
• Opportunities
• Internet of things
• Conformal printing of antenna within IoT devices
• Volumetric IoT
• Flexible IoT
• Low volume, high mix electronics become increasingly viable
• Miniaturisation of electronics
• Off-setting the limitations of physics through compact circuit design
• Interconnects
• Passives
• Embedded and stacked components and vertically integrated ICs
• Protecting Intellectual Property via moving to in-house prototyping
• Freedom of Design
• Top, bottom and side-mounted components, adding another angle to circuit boards
• Higher density routing with multi-directional vias
• Challenges
• Volume production
• Overcoming production volume with SMT integration in the print process
• Continuing materials development
• Building a seamless digital thread for 3D printed electronics
• Delineation of electronic computer-aided design and mechanical computer-aided design begin to blur
• Emerging software solutions to bridge the gap

Chapter Two: Technology, Applications and Markets

• Technologies
• Technologies capable of printing conductive materials
• Polymer Powder Bed Fusion
• Vat Photopolymerization
• Technologies capable of printing static-dissipative materials
• Polymer Powder Bed Fusion
• Vat Photopolymerisation
• Material Extrusion
• 3D Electronic Printing Technologies
• Inkjet Printing
• Aerosol Jet Printing
• Extrusion-Based Printing
• Materials
• Conductive Inks
• Silver Nanoparticle Inks
• Extrusion materials and limitations
• Dielectric inks and resins
• Applications
• PCBs
• 3D printed multi-layer PCBs
• Future of printed PCBs
• Connectors and Interconnects
• Antennas, Amplifiers and Transceiver
• 3DEP supporting advanced antenna production
• Multi-material printing of next-generation antenna
• Rise of 6G
• Capacitors
• Sensors
• Quantum sensors
• Beyond the PCB: 3DEP innovations in next-generation components and applications
• Optoelectronics
• Batteries
• Lab-on-chips

Chapter Three: Market players

• Nano Dimension, Israel, 2012
• Nano Dimensions attempts to acquire Stratasys
• Financial performance
• Technology-Dragonfly IV
• Materials
• Partnerships
• Optomec, United States, 1997
• Technology
• Aerosol Jet Printer Portfolio
• Aerosol jet HD2
• Aerosol Jet AJ Flex
• Aerosol Jet Print Engine
• Bot Factory, United States, 2013
• Ceradrop, France, 2006
• Ceradrop Technology
• F-serie
• X-Serie
• Industrial platform
• Chemcubed, United States, 2014
• NeoTech, Germany, 2006
• Technology
• 15X BT
• 45XG4
• PV Nanocell, Israel, 2010
• Voltera, Canada, 2013
• Fujifilm Corporation, Japan, 1934
• Technology
• Panasonic, Japan, 1918
• Additive Electronics, Germany, 2022
• Notion Systems, Germany, 2012
• nScrypt, United States, 2002
• Nano3DPrint, United States, 2013
• Entry into the professional space with the D4200S

Chapter Four: Ten year forecasts

• Methodology
• Pricing
• Service revenue
• Industry
• 3D printer categorisation
• Total market
  • Exhibit 4.1: Total market for 3D Electronics Printing, by USD$ revenue
  • Exhibit 4.2: Total market for 3D Electronics Printing, by USD$ share
  • Exhibit 4.3: Total market for 3D Electronics Printing, by YoY growth change Hardware
  • Exhibit 4.4: 3D Electronics Printing Hardware Growth, by revenue and YoY change
  • Exhibit 4.5: 3D Electronics Printing Hardware Growth, by printer type
  • Exhibit 4.6: 3D Electronics Printing Hardware Shipments and Install Base
  • Exhibit 4.7: 3D Electronics Printing Hardware Shipments by Printer Category
  • Exhibit 4.8: 3D Electronics Printing Install Base by Printer Category
  • Exhibit 4.9: 3D Electronics Printing Hardware, by Industry
  • Exhibit 4.10: 3D Electronics Printing Hardware, by Industry Share Material
  • Exhibit 4.11: 3D Electronics Printing Material Revenue Growth and Year-on-Year Growth
  • Exhibit 4.12: 3D Electronics Printing Material Revenue by Material Type
  • Exhibit 4.13: 3D Electronics Printing Material Revenue Share by Type
  • Exhibit 4.14: 3D Electronics Printing Material Revenue by Printer Category
  • Exhibit 4.15: 3D Electronics Printing Material Revenue by Printer Category Share
  • Exhibit 4.16: 3D Electronics Printing Material Revenue by industry Services
  • Exhibit 4.17: 3D Electronics Printing Service Revenue Growth and Year-on-Year Growth
  • Exhibit 4.18: 3D Electronics Printing Service Revenue by provider
  • Exhibit 4.19: 3D Electronics Printing Service Revenue by Share
• About Additive Manufacturing Research
• About the Analyst
• Acronyms and Abbreviations Used In this Report