全球介电前驱体市场分析（2023-2024）

本报告分析了全球CVD/ALD电介质和SOD前驱体市场趋势和技术趋势。我们还讨论了新型前驱物的开发途径和路线图，以及目前的 EHS（环境、健康和安全）以及将这些材料投入大批量生产 (HVM) 的监管障碍。为所有类型的前驱物提供预测，特别关注先进的前端电介质和导电材料，包括牺牲层、低 k 电介质、硬掩模、心轴和蚀刻停止层。这些製程领域与先进逻辑（sub-45nm、28nm至10/7nm节点、未来5nm和3nm节点）、先进DRAM和3DNAND易失性和非挥发性记忆体相关的高成长潜力正在引起关注。

主要优点

• 提供 CVD、ALD 和 SOD 应用的有机和无机前驱物（包括 ILD、低 k 电介质、硬掩模、侧壁间隔物和蚀刻停止层）的市场和技术趋势资讯。
• 为供应链经理、流程整合、研发 (R&D) 总监、业务开发和财务分析师提供重点资讯。
• 涵盖主要电介质前驱物和供应商的资讯、材料供应链中的问题和趋势、供应商市场估计和预测以及电子材料领域的预测。
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CVD/电介质前驱市场最新资讯与分析：概述 - 特色新闻稿：

目录

第一章执行摘要

第 2 章范围、目的与方法

第三章 半导体产业市场现况与展望

• 世界经济
  • 连结半导体产业与全球经济
  • 半导体销售额成长率
  • 台湾月度销售趋势
  • 2023年高度不确定性－半导体收入成长预计将放缓至负值
• 晶片销售趋势：按电子设备细分市场
  • 手机
  • PC 出货量
  • 伺服器/IT市场
• 半导体製造业的成长与扩张
  • 铸造厂扩建公告：概述
  • 透过在世界各地扩大铸造厂来加速成长
  • 资本支出趋势
  • 技术路线图
  • 代工投资评估
• 政策和贸易趋势及影响
• 半导体材料概述
  • 晶片生产进度可能受到材料产能限制
  • 减少物流问题
  • 晶圆市场趋势预测（至2027年）
  • 材料市场预测

第四章 前驱体市场走势

• 市场趋势
  • 市场趋势 - 晶圆启动
  • 市场趋势 - 晶圆启动（逻辑）
  • 市场趋势 - 晶圆起始 (DRAM)
  • 市场趋势 - 晶圆起始 (NAND)
• 供给能力、需求和投资
  • WF6 的需求驱动因素
• 供给能力、需求和投资
• 区域趋势 - 电介质前驱体
  • 区域趋势和驱动因素
• CVD/ALD设备市场
  • 市场预测：所有类型
  • 市场预测：层压、蚀刻/清洁、光刻、计量等。
• 技术驱动因素/材料变化与转变：依设备类型
  • 过去10年整体趋势：从PVD/LPCVD到PECVD/ALD
  • 高阶逻辑节点HVM的估计
  • DRAM节点HVM估计
  • 3D NAND 节点 HVM 估计
  • 按设备细分市场划分的机会：概述
• 半导体製程和材料的趋势
  • 按元件类型划分的蚀刻製程：原子层蚀刻
  • 区域选择性沉积
  • 定向自组装 (DSA) 和 EUV
  • 直接自组装 (DSA) 和 EUV
  • 2D TDM（过渡金属二硫化物）
  • EUV 干抗蚀剂
  • EUV抗蚀剂下层
  • 其他用途：光学
• EHS 和物流问题
  • 半导体製造产生的温室气体
  • EUV 和能源
  • 评估原子层沉积 (ALD) 製程的环境影响以及减少影响的途径
• 标准套件/阀门类型变更

第五章市场统计与预测：按细分市场

• 前驱体市场表现及预测（5年）
• 电介质前驱体收入（百万美元，2021-2027）
  • 介电前驱体的评价
• 併购 (M&A) 活动
  • 併购活动 - MERCK & MECARO
• 新工厂
• 供应商工厂关闭 - 未报告
• 新加入者 - 干阻联盟

第六章 下层材料供应链

• 下游供应链：概述
• 后勤
• 下游供应链的新进入者 - 未报告
• 下游供应链工厂最新资讯（新）-无报告
• 下游供应链：TechCET 分析师评估

第七章 供应商简介

• ADEKA CORPORATION
• AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
• AZMAX CO., LTD.
• CITY CHEMICAL LLC
• DNF CO., LTD.
• 其他20多家企业

This report provides market and technical trend information CVD/ALD dielectric and SOD precursors. For the last 20 years, there have been many research papers and patents published regarding ALD and CVD precursors specifically for the semiconductor industry. This report includes detail on the development path and roadmaps for new precursors and any current EHS and regulatory hurdles for these materials to enter into high volume manufacturing (HVM). Forecasts are provided on precursors of all types, with a focus is on the leading-edge front end of the line insulating and conductive materials, including sacrificial layers, low-k dielectrics, hard masks, mandrel, and etch stop layers. These process areas are of interest because of the high growth potential associated with leading-edge logic <45 nm, 28 nm to 10/7 nm nodes, and the future 5 & 3 nm nodes, as well as advanced DRAM and 3DNAND volatile and non-volatile memories.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

• 1.1. REGIONAL TRENDS-DIELECTRIC PRECURSORS
• 1.2. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
• 1.3. DIELECTRIC PRECURSOR REVENUE 2021 TO 2027 (M USD)
• 1.4. TECHNOLOGY TRENDS DIELECTRIC PRECURSORS
• 1.5. CVD AND ALD EQUIPMENT MARKET
• 1.6. ANALYST ASSESSMENT-PRECURSORS

2. SCOPE, PURPOSE, AND METHODOLOGY

• 2.1. SCOPE
• 2.2. PURPOSE
• 2.3. METHODOLOGY
• 2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

• 3.1. WORLDWIDE ECONOMY
  • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 3.1.2. SEMICONDUCTOR SALES GROWTH
  • 3.1.3. TAIWAN MONTHLY SALES TRENDS
  • 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMICONDUCTOR REVENUE GROWTH EXPECTED
• 3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
  • 3.2.1. SMARTPHONES
  • 3.2.2. PC UNIT SHIPMENTS
  • 3.2.3. SERVERS / IT MARKET
• 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
  • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
  • 3.3.3. EQUIPMENT SPENDING TRENDS
  • 3.3.4. TECHNOLOGY ROADMAPS
  • 3.3.5. FAB INVESTMENT ASSESSMENT
• 3.4. POLICY & TRADE TRENDS AND IMPACT
• 3.5. SEMICONDUCTOR MATERIALS OVERVIEW
  • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
  • 3.5.2. LOGISTICS ISSUES EASED DOWN
  • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
  • 3.5.4. TECHCET'S MATERIAL FORECAST

4. PRECURSOR MARKET TRENDS

• 4.1. MARKET TRENDS
  • 4.1.1. MARKET TRENDS-WAFER STARTS
  • 4.1.2. MARKET TRENDS-WAFER STARTS LOGIC
  • 4.1.3. MARKET TRENDS-WAFER STARTS DRAM
  • 4.1.4. MARKET TRENDS-WAFER STARTS NAND
• 4.2. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
  • 4.2.1. WF6 DEMAND DRIVERS
• 4.3. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
• 4.4. REGIONAL TRENDS-DIELECTRIC PRECURSORS
  • 4.4.1. REGIONAL TRENDS AND DRIVERS
• 4.5. CVD AND ALD EQUIPMENT MARKET
  • 4.5.1. WFE FORECAST: ALL TYPES
  • 4.5.2. WFE FORECAST: DEPOSITION, ETCH & CLEAN, LITHOGRAPHY, METROLOGY ETC.
• 4.6. TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS BY DEVICE TYPE
  • 4.6.1. GENERAL TREND LAST DECADE GOING FROM PVD & LPCVD TO PECVD & ALD
  • 4.6.2. ADVANCED LOGIC NODE HVM ESTIMATE
  • 4.6.3. DRAM NODE HVM ESTIMATE
  • 4.6.4. 3D NAND NODE HVM ESTIMATE
  • 4.6.5. SUMMARY OF OPPORTUNITIES BY DEVICE SEGMENT
• 4.7. SEMICONDUCTOR PROCESS & MATERIALS TRENDS
  • 4.7.1. ETCH PROCESS BY DEVICE TYPE-ATOMIC LAYER ETCHING ALE
  • 4.7.2. AREA SELECTIVE DEPOSITION
  • 4.7.3. DIRECTED SELF ASSEMBLY (DSA) AND EUV
  • 4.7.4. DIRECT SELF ASSEMBLY (DSA) AND EUV
  • 4.7.5. 2D TRANSITION METAL DICHALCOGENIDES (TMD)
  • 4.7.6. DRY RESIST FOR EUV
  • 4.7.7. UNDERLAYERS FOR EUV RESIST
  • 4.7.8. OTHER APPLICATIONS-OPTICS
• 4.8. EHS AND LOGISTIC ISSUES
  • 4.8.1. GREEN HOUSE GASES FROM SEMICONDUCTOR PRODUCTION
  • 4.8.2. EUV AND ENERGY
  • 4.8.3. ASSESSING THE ENVIRONMENTAL IMPACT OF ATOMIC LAYER DEPOSITION (ALD) PROCESSES AND PATHWAYS TO LOWER IT
• 4.9. CHANGES IN STANDARD PACKAGING/VALVE TYPES

5. SEGMENT MARKET STATISTICS AND FORECASTS

• 5.1. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
• 5.2. DIELECTRIC PRECURSOR REVENUE 2021 TO 2027 (M USD)
  • 5.2.1. ASSESSMENT DIELECTRIC PRECURSORS
• 5.3. M&A ACTIVITIES
  • 5.3.1. M&A ACTIVITIES-MERCK & MECARO
• 5.4. NEW PLANTS
• 5.5. SUPPLIER PLANT CLOSURES-NONE REPORTED
• 5.6. NEW ENTRANTS-DRY RESIST CONSORTIUM

6. SUB TIER MATERIAL SUPPLY CHAIN

• 6.1. SUB-TIER SUPPLY-CHAIN: INTRODUCTION
• 6.2. LOGISTICS
  • 6.2.1. LOGISTICS, CONTINUED
• 6.3. SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS-NONE REPORTED
• 6.4. SUB-TIER SUPPLY-CHAIN PLANTS UPDATES-NEW-NONE REPORTED
• 6.5. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7. SUPPLIER PROFILES

• ADEKA CORPORATION
• AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
• AZMAX CO., LTD.
• CITY CHEMICAL LLC
• DNF CO., LTD.
• ...and 20+ more

FIGURES

• FIGURE 1: HARDMASK, LOW K DIELECTRIC PRECURSORS REGIONAL SHARES 2022
• FIGURE 2: TOTAL PRECURSOR MARKET, M USD
• FIGURE 3 DIELECTRIC PRECURSOR MARKET 2021 TO 2027
• FIGURE 4: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
• FIGURE 5: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
• FIGURE 6: WORLDWIDE SEMICONDUCTOR SALES
• FIGURE 7: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)*
• FIGURE 8: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
• FIGURE 9: 2022 SEMICONDUCTOR CHIP APPLICATIONS
• FIGURE 10: MOBILE PHONE SHIPMENTS WW ESTIMATES
• FIGURE 11: WORLDWIDE PC AND TABLET FORECAST
• FIGURE 12: ELECTRIFICATION TREND BY WORLD REGION
• FIGURE 13: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
• FIGURE 14: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B
• FIGURE 15: CHIP EXPANSIONS 2022-2027 US$366 B
• FIGURE 16: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
• FIGURE 17: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
• FIGURE 18: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
• FIGURE 19: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
• FIGURE 20: EUROPE CHIP EXPANSION UPSIDE
• FIGURE 21: PORT OF LA
• FIGURE 22: TECHCET WAFER START FORECAST BY NODE SEGMENTS**
• FIGURE 23: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
• FIGURE 24: FORECASTS - WAFER STARTS 2021 TO 2027
• FIGURE 25: FORECASTS - WAFER STARTS LOGIC 300 MM
• FIGURE 26: FORECASTS - WAFER STARTS DRAM 300 MM
• FIGURE 27: FORECASTS - WAFER STARTS NAND 300 MM
• FIGURE 28: 3DNAND MARKET SHARE 2022
• FIGURE 29: HARDMASK, LOW K DIELECTRIC PRECURSORS REGIONAL SHARES 2022
• FIGURE 30: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
• FIGURE 31: SEMI 2022 SEMICONDUCTOR EQUIPMENT FORECAST
• FIGURE 32: 2022 TECHINSIGHTS WFE SPENDING (TOP) AND 2022 GARTNER WFE SPENDING PER NODE (BOTTOM)
• FIGURE 33: 3D DEVICE ARCHITECTURES
• FIGURE 34: LOGIC TECHNOLOGY NODE ROADMAP FOR LEADING IDMS
• FIGURE 35: SAMSUNG START 3 NM PILOT RAMP USING GAA-FET TECHNOLOGY JUNE 2022
• FIGURE 36: IMEC 2022 LOGIC ROADMAP
• FIGURE 37: SCALING AND LITHOGRAPHY TRENDS - A HIGH COST IN CAPITAL EXPENDITURE, ENERGY AND EMISSIONS
• FIGURE 38: APPLIED MATERIALS CENTURA PATTERN SHAPING CLUSTER
• FIGURE 39: DRAM TECHNOLOGY ROADMAP FOR LEADING IDMS
• FIGURE 40: IP FILING IN THE FIELD OF 3DRAM IS ACCELERATING
• FIGURE 41: NAND TECHNOLOGY ROADMAP FOR LEADING IDMS
• FIGURE 42: PATHWAYS FOR CONTINUED 3D NAND SCALING
• FIGURE 43: 3DNAND STACK TRENDS FROM <100L TO 4 STACKS
• FIGURE 44: MEMORY STACK CHALLENGES FOR V-NAND
• FIGURE 45A: FINFET TO GAA TRANSISTOR DIAGRAMS SHOWING SELECTIVE ETCHING IS NEEDED TO ADD RESS DEVICE COMPLEXITY
• FIGURE 45B: ALE PROCESS CYCLE
• FIGURE 46: PERIOD TABLE INDICATING CANDIDATES FOR ALE (ISOTROPIC ETCHING)
• FIGURE 47: APPLICATION OF ALE (ISOTROPIC ETCH)
• FIGURE 48: ALD AND ALE COMBO PROCESS
• FIGURE 49: PLASMA AND THERMAL ALE PROCESSES
• FIGURE 50: LAM ALE PROCESS
• FIGURE 51: ALD / ALE PROCESS ROADMAP
• FIGURE 52: ALE PATENT ACTIVITY BY COMPANY THROUGH 2022
• FIGURE 53: AREA SELECTIVE SIN DEPOSITION BY ALD (AVS ASD2022)
• FIGURE 54: DSA AND EUS PROCESSES
• FIGURE 55: RESIST RECTIFICATION WITH DSA
• FIGURE 56: TEM AND ARTIST RENDERING OF MONOLAYER CHANNEL FORMATION
• FIGURE 57: EUV LITHOGRAPHY ENABLING GATE STRUCTURES AND PITCH SCALING
• FIGURE 58: DRY RESIST FOR EUV SEM IMAGE
• FIGURE 59: SPIN ON CARBON (SOC) DIELECTRIC FOR EUV METAL OXIDE RESISTS PATTERNS AFTER LITHO
• FIGURE 60: UNDERLAYER (DIELECTRIC) HARDMASKS TRENDS FOR NIGH NA EUV
• FIGURE 61: SPIN ON PRIMER (SOC) VS. HMDS PRIMER
• FIGURE 62: GREENHOUSE GAS CONTRIBUTIONS OF CHIP FAB MATERIALS AND EQUIPMENT
• FIGURE 63: ENVIRONMENTAL IMPACT (GWP) OF VARIOUS PROCESSES AND GASES
• FIGURE 64: CO2EQ OUTPUT FROM ETCH GASES
• FIGURE 65: TOTAL EMISSIONS AND ENERGY USE PROJECTION PER LOGIC NODE
• FIGURE 66: ENVIRONMENTAL IMPACT OF ALD
• FIGURE 67: SEGMENTATION OF THE AMPOULE FLEET 2020 BASED ON NUMBER OF UNITS IN THE FIELD
• FIGURE 68: TOTAL PRECURSOR MARKET, M USD
• FIGURE 69: DIELECTRIC PRECURSOR MARKET 2021 TO 2027
• FIGURE 70: TEOS
• FIGURE 71: WHAT IS EUV DRY RESIST?
• FIGURE 72: TYPICAL NON-HALIDE LIGANDS USED FOR ALD PRECURSORS
• FIGURE 73: EXAMPLES OF PRECURSORS SUPPLIED BY SHIP
• FIGURE 74: OCEAN CONTAINER PRICE INDEX - JULY '20 TO MARCH '23

TABLES

• TABLE 1: DIELECTRIC PRECURSOR REVENUES BY REGION (US$ M)
• TABLE 2: 2017 TO 2027 5-YEAR CAGRS
• TABLE 3: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
• TABLE 4: IMF ECONOMIC OUTLOOK*
• TABLE 5: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
• TABLE 6: DIELECTRIC PRECURSOR MARKET SIZE BY REGION
• TABLE 7: REGIONAL WAFER MARKETS
• TABLE 8: REGIONAL PRECURSOR MARKETS
• TABLE 9: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR LOGIC DEVICES
• TABLE 10: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR DRAM
• TABLE 11: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR 3DNAND
• TABLE 12: GAS TRENDS AND OPPORTUNITIES BY DEVICE TYPE
• TABLE 13: PRECURSOR 5-YEAR CAGR COMPARISON