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CMP浆料垫全球市场分析（2023-2024）
市场调查报告书
商品编码
1413688

CMP浆料垫全球市场分析（2023-2024）

CMP Slurry & Pads Market Report (a Critical Materials Report) 2023-2024
出版日期: | 出版商: TECHCET | 英文 341 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

CMP 浆料垫在半导体製造中极为重要。製程整合需要生产薄的、均匀的平面层，以在半导体晶圆上建构装置结构。随着每一代新一代元件技术的发展，CMP 製程步骤的数量不断增加。新装置技术的特点是更多的层数、新材料、更严格的製程控制要求以及先进封装的新技术。这些製造挑战需要 CMP 浆料和抛光垫的新开发。

本报告对半导体装置製造中使用的CMP耗材（特别是CMP浆料和抛光垫）市场和供应链进行了分析，提供了产品概述、市场基本结构和最新情况、主要市场推动和限制因素、我们将为您提供市场规模和应用份额、趋势展望以及主要供应商概述等资讯。

有关 CMP 耗材市场最新资讯和报告亮点的专题新闻稿：

目录

第一章执行摘要

第二章 研究范围、目的与研究方法

第三章 半导体产业市场现况与展望

  • 世界经济
    • 连结半导体产业与全球经济
    • 半导体销售额成长率
    • 台湾月度销售趋势
    • 2023年高度不确定性－半导体收入成长预计将放缓至负值
  • 晶片销售：以电子领域分类
    • 手机
    • PC 出货量
    • 伺服器/IT市场
  • 半导体製造业的成长与扩张
    • 铸造厂扩建公告：概述
    • 透过在世界各地扩大铸造厂来加速成长
    • 资本支出趋势
    • 技术路线图
    • 代工投资评估
  • 政策和贸易趋势及影响
  • 半导体材料概述
    • 晶片生产进度可能受到材料产能限制
    • 持续的物流问题：对西方世界的负面影响
    • TECHCET晶圆投入量预测（至2027年）
    • TECHCET材料预测

第四章 CMP耗材发展趋势

  • CMP消费趋势
  • 技术因素/材料变化与转变
    • 3D NAND路线图
    • 3D NAND 堆迭
    • 先进封装技术趋势
    • TSV 的 CMP
  • 化合物半导体技术趋势
    • 碳化硅CMP
    • 碳化硅缺陷
    • 碳化硅的 CMP 挑战
  • 按地区划分的趋势
    • 区域趋势和驱动因素
  • EHS（健康、卫生和安全）和物流问题
    • 新材料EHS问题
    • 物流问题
    • 与浆料处置、回收和回收相关的 EHS 问题

第五章 CMP浆料供应商市占率

  • CMP浆料预测（收入基础，5年）
  • CMP浆料预测（基于数量，5年）
  • CMP浆料市场领导者
    • 整体浆料市场占有率
    • 氧化物（二氧化铈）浆料市场
    • HKMG泥浆市场
    • 多晶硅浆料市场
    • 氧化物（二氧化硅）浆料市场
    • 钨浆市场
    • 铜散装浆料市场
    • 铜阻隔浆料市场
    • 新型金属浆料市场
    • 铜埋地电力轨（BPR）浆料市场
  • CMP 浆料产业的企业併购 (M&A) 活动、公告和业务联盟
  • CMP浆料工厂关闭
  • 新进入者
  • 供应商或零件/产品线面临停产风险
  • CMP浆料价格走势
  • TECHCET 分析师对 CMP 浆料市场的评估

第六章 CMP 抛光垫市场统计与预测

  • CMP 抛光垫预测（收入基础，5 年）
    • CMP抛光垫获利预测（5年）
  • CMP 抛光垫预测（基于数量，5 年）
  • CMP 抛光垫工厂关闭
  • 新进入者
  • 供应商或零件/产品线面临停产风险
  • CMP Pad 的企业併购 (M&A) 活动/公告或业务联盟
  • CMP抛光垫价格趋势
  • TECHCET分析师评级

第七章 下层原料供应

  • 磨料供应商
  • 垂直整合供应商
  • 原料供应链的破坏者
  • 原料併购活动
  • 磨料供应链中的 EHS 与物流问题
  • 磨料供应链的新进入者
  • 磨料供应链工厂最新资讯 - 新
  • 磨料供应链工厂关闭
  • 磨料供应链的趋势
  • 下游供应链：TECHCET 分析师评估

第八章 供应商简介

  • NANOPHASE TECHNOLOGIES CORPORATION
  • 3M COMPANY
  • ABRASIVE TECHNOLOGY
  • ACE NANOCHEM
  • ANJI MICRO SHANGHAI
  • ASAHI GLASS
  • 其他20多家企业

第9章附录

简介目录

This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. CMP CONSUMABLES MARKET OVERVIEW
  • 1.2. CMP CONSUMABLES REVENUE TRENDS
  • 1.3. MARKET TRENDS IMPACTING CMP CONSUMABLES OUTLOOK
  • 1.4. YEAR 2022 IN REVIEW
  • 1.5. CMP CONSUMABLES FORECASTS BY MATERIAL SEGMENT
    • 1.5.1. CMP SLURRIES 5-YEAR REVENUE FORECAST
    • 1.5.2. CMP PADS 5-YEAR REVENUE FORECAST
  • 1.6. TECHNOLOGY TRENDS
    • 1.6.1. BACKSIDE TECHNOLOGY TRENDS
  • 1.7. SLURRY SUPPLIER COMPETITIVE LANDSCAPE
  • 1.8. PAD SUPPLIER COMPETITIVE LANDSCAPE
  • 1.9. ANALYST ASSESSMENT

2. SCOPE, PURPOSE AND METHODOLOGY

  • 2.1. SCOPE
  • 2.2. PURPOSE
  • 2.3. METHODOLOGY
  • 2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

  • 3.1. WORLDWIDE ECONOMY
    • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2. SEMICONDUCTOR SALES GROWTH
    • 3.1.3. TAIWAN MONTHLY SALES TRENDS
    • 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMICONDUCTOR REVENUE GROWTH EXPECTED
  • 3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
    • 3.2.1. SMARTPHONES
    • 3.2.2. PC UNIT SHIPMENTS
    • 3.2.3. SERVERS / IT MARKET
  • 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
    • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
    • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
    • 3.3.3. EQUIPMENT SPENDING TRENDS
    • 3.3.4. TECHNOLOGY ROADMAPS
    • 3.3.5. FAB INVESTMENT ASSESSMENT
  • 3.4. POLICY & TRADE TRENDS AND IMPACT
  • 3.5. SEMICONDUCTOR MATERIALS OVERVIEW
    • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
    • 3.5.2. LOGISTICS ISSUES EASED DOWN
    • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
    • 3.5.4. TECHCET'S MATERIAL FORECAST

4. CMP CONSUMABLES MARKET TRENDS

  • 4.1. CMP CONSUMABLES MARKET TRENDS
  • 4.2. TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
    • 4.2.1. 3D NAND ROADMAP
    • 4.2.2. 3D NAND STACKING
    • 4.2.3. TECHNICAL TRENDS IN ADVANCED PACKAGING
    • 4.2.4. CMP FOR TSV
  • 4.3. TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR
    • 4.3.1. CMP OF SILICON CARBIDE
    • 4.3.2. SILICON CARBIDE DEFECTS
    • 4.3.3. CMP CHALLENGES IN SILICON CARBIDE
  • 4.4. REGIONAL TRENDS
    • 4.4.1. REGIONAL TRENDS AND DRIVERS
  • 4.5. EHS AND LOGISTIC ISSUES
    • 4.5.1. EHS ISSUES FOR NEW MATERIALS
    • 4.5.2. LOGISTIC ISSUES
    • 4.5.3. EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM

5. CMP SLURRY SUPPLIER MARKET SHARES

  • 5.1. CMP SLURRIES 5-YEAR REVENUE FORECAST
  • 5.2. CMP SLURRIES 5-YEAR FORECAST BY UNITS
  • 5.3. CMP SLURRY MARKET LEADERS
    • 5.3.1. TOTAL SLURRY MARKET SHARE
    • 5.3.2. OXIDE (CERIA) SLURRY MARKET
    • 5.3.3. HKMG SLURRY MARKET
    • 5.3.4. POLYSILICON SLURRY MARKET
    • 5.3.5. OXIDE (SILICA) SLURRY MARKET
    • 5.3.6. TUNGSTEN SLURRY MARKET
    • 5.3.7. CU BULK SLURRY MARKET
    • 5.3.8. COPPER BARRIER SLURRY MARKET
    • 5.3.9. NEW METALS SLURRY MARKET
    • 5.3.10. CU BURIED POWER RAIL (BPR) SLURRY MARKET
  • 5.4. CMP SLURRY M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
  • 5.5. CMP SLURRY PLANT CLOSURES
  • 5.6. NEW ENTRANTS
  • 5.7. SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF DISCONTINUATIONS
  • 5.8. CMP SLURRY PRICING TRENDS
  • 5.9. TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET

6. CMP PAD MARKET STATISTICS & FORECASTS

  • 6.1. CMP PADS 5-YEAR REVENUE FORECAST
    • 6.1.1. CMP PADS 5-YEAR REVENUE FORECAST
  • 6.2. CMP PADS 5-YEAR FORECAST BY UNITS
  • 6.3. CMP PAD PLANT CLOSURES
  • 6.4. NEW ENTRANTS
  • 6.5. SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF DISCONTINUATIONS
  • 6.6. CMP PAD M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
  • 6.7. CMP PAD PRICING TRENDS
  • 6.8. TECHCET ANALYST ASSESSMENT

7. MATERIAL SUB-TIER SUPPLY

  • 7.1. ABRASIVE SUPPLIERS
  • 7.2. VERTICALLY INTEGRATED SUPPLIERS
  • 7.3. RAW SUPPLY CHAIN DISRUPTORS
  • 7.4. RAW MATERIALS M&A ACTIVITY
  • 7.5. ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
  • 7.6. ABRASIVE SUPPLY CHAIN "NEW" ENTRANTS
  • 7.7. ABRASIVE SUPPLY-CHAIN PLANTS UPDATES-NEW
  • 7.8. ABRASIVE SUPPLY-CHAIN PLANT CLOSURES
  • 7.9. ABRASIVE SUPPLY-CHAIN PRICING TRENDS
  • 7.10. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

8. SUPPLIER PROFILES

  • NANOPHASE TECHNOLOGIES CORPORATION
  • 3M COMPANY
  • ABRASIVE TECHNOLOGY
  • ACE NANOCHEM
  • ANJI MICRO SHANGHAI
  • ASAHI GLASS
  • ...and 20+ more

9. APPENDIX

  • APPENDIX A: CMP CONSUMABLES OVERVIEW
  • APPENDIX B: TECHNICAL TRENDS IN SIC
  • APPENDIX C: PAD MANUFACTURING COST DRIVERS

TABLE OF FIGURES

  • FIGURE 1: FORECASTED 2023 MARKET SIZE
  • FIGURE 2: CMP CONSUMABLES FORECAST
  • FIGURE 3: CMP STEPS FOR ADVANCED DEVICES
  • FIGURE 4: 2022 CMP CONSUMABLES REVENUE
  • FIGURE 5: CMP CONSUMABLES REVENUE BY APPLICATION
  • FIGURE 6: CMP SLURRY REVENUE BY APPLICATION
  • FIGURE 7: CMP PAD REVENUE BY APPLICATION
  • FIGURE 8: CMOS TECHNOLOGY ROADMAP
  • FIGURE 9: LIMITATIONS OF FS-PDN
  • FIGURE 10: 2D DEVICE ARCHITECTURE EVOLUTION
  • FIGURE 11: 2022 SLURRY SUPPLIER MARKET SHARES
  • FIGURE 12: 2022 PAD SUPPLIER MARKET SHARES
  • FIGURE 13: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
  • FIGURE 14: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 15: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)*
  • FIGURE 16: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
  • FIGURE 17: 2022 SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 18: MOBILE PHONE SHIPMENTS WW ESTIMATES
  • FIGURE 19: WORLDWIDE PC AND TABLET FORECAST
  • FIGURE 20: ELECTRIFICATION TREND BY WORLD REGION
  • FIGURE 21: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
  • FIGURE 22: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B
  • FIGURE 23: CHIP EXPANSIONS 2022-2027 US$366 B
  • FIGURE 24: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 25: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
  • FIGURE 26: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
  • FIGURE 27: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
  • FIGURE 28: EUROPE CHIP EXPANSION UPSIDE
  • FIGURE 29: PORT OF LA
  • FIGURE 30: TECHCET WAFER START FORECAST BY NODE SEGMENTS**
  • FIGURE 31: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
  • FIGURE 32: CMP CONSUMABLES REVENUE FOR 2022
  • FIGURE 33: NUMBER OF CMP STEPS FOR ADVANCED TECHNOLOGY NODES
  • FIGURE 34: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
  • FIGURE 35: 14NM VS. 7NM METALLIZATION TECHNIQUES
  • FIGURE 36: 3D NAND ROADMAP BY NODE
  • FIGURE 37: STACKING FOR 3D NAND
  • FIGURE 38: CMP OPPORTUNITIES IN ADVANCED PACKAGING
  • FIGURE 39: KEY TRENDS IN ADVANCED PACKAGING
  • FIGURE 40: CMP OPPORTUNITIES IN ADVANCED PACKAGING
  • FIGURE 41: SILICON CARBIDE-BASED POWER DEVICE
  • FIGURE 42: DEFECTS IN SILICON CARBIDE SUBSTRATES AND EPI WAFERS
  • FIGURE 43: SILICON CARBIDE DEFECTS
  • FIGURE 44: BATCH POLISH VS. CMP
  • FIGURE 45: SLURRY AND PAD REVENUE BY HQ REGION
  • FIGURE 46: CMP SLURRY REVENUE BY APPLICATION
  • FIGURE 47: FORECASTED SLURRY VOLUME DEMAND
  • FIGURE 48: SLURRY SUPPLIER MARKET SHARES IN 2022
  • FIGURE 49: OXIDE (CERIA) SLURRY MARKET SHARES
  • FIGURE 50: STI CMP PROCESS
  • FIGURE 51: HKMG/FRONT-END SLURRY MARKET SHARES
  • FIGURE 52: POLYSILICON SLURRY MARKET SHARES
  • FIGURE 53: MEMS CMP CROSS SECTION
  • FIGURE 54: OXIDE (SILICA) SLURRY MARKET SHARES
  • FIGURE 55: TUNGSTEN SLURRY MARKET SHARES
  • FIGURE 56: CU-BULK SLURRY MARKET SHARES
  • FIGURE 57: CU-BARRIER CMP SLURRY MARKET SHARE
  • FIGURE 58: NEW METALS SLURRY MARKET SHARES
  • FIGURE 59: CU BPR SLURRY MARKET SHARES
  • FIGURE 60: CMP PAD REVENUE BY APPLICATION
  • FIGURE 61: CMP PAD REVENUE BY WAFER SIZE
  • FIGURE 62: FORECASTED PAD USAGE
  • FIGURE 63: CMP FOR IC MANUFACTURING PROCESS
  • FIGURE 64: IC1000 LIKE PAD CROSS-SECTION
  • FIGURE 65: IC1000 SEM CROSS-SECTION

TABLES

  • TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
  • TABLE 2: IMF ECONOMIC OUTLOOK*
  • TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
  • TABLE 4 & 5: SILICON CARBIDE WAFER MANUFACTURERS AND CONSUMABLES SUPPLIERS
  • TABLE 6: REGIONAL WAFER MARKETS
  • TABLE 7: REGIONAL WAFER MARKETS BY SUPPLIER HEADQUARTER REGION
  • TABLE 8: 2022 SLURRY MARKET LEADERS AND TAM BY APPLICATION
  • TABLE 9: PAD SUPPLIERS
  • TABLE 10: ABRASIVE SUPPLIERS
  • TABLE 11: VERTICALLY INTEGRATED SUPPLIERS
  • TABLE 12: PHYSICAL AND ELECTRICAL PROPERTY COMPARISON OF SI AND SIC