全球介电前驱体(关键材料)市场,2024-2025
市场调查报告书
商品编码
1498832

全球介电前驱体(关键材料)市场,2024-2025

Dielectric Precursors Market Report 2024-2025 (Critical Materials Report)

出版日期: | 出版商: TECHCET | 英文 134 Pages | 商品交期: 最快1-2个工作天内

价格

该报告涵盖了半导体装置製造中使用的前驱物的市场趋势和供应链。包含主要供应商的资讯、材料供应链的问题和趋势、供应商市场占有率的估计和预测、材料细分市场的预测等。

样本视图

目录

第1章 内容提要

第2章 研究范围、目的与方法

第3章 半导体产业:市场现况与前景

  • 世界经济与展望
    • 半导体产业与全球经济的连结
    • 半导体销售额成长
    • 台湾外包厂商每月销售趋势
  • 晶片销售额:依电子产品领域划分
    • 电子展望
    • 汽车产业展望
    • 智慧型手机前景
    • 电脑展望
    • 伺服器/IT市场
  • 半导体製造业的成长与扩张
    • 晶片扩产投入大量资金
    • 美国新工厂
    • 世界各地製造工厂的扩张推动成长
    • 资本投资趋势
    • 先进逻辑技术路线图
    • 评估製造工厂投资
  • 政策/贸易趋势和影响
  • 半导体材料概述
    • 预测引入的晶圆数量(到 2028 年)
    • 材料市场预测(~2028)

第4章 材料市场趋势

  • CVD/ALD/金属:High-K和先进电介质前驱体市场趋势
    • 2023 年前驱体市场:与 2024 年的联繫
    • 开拓市场前景
    • 电介质前驱体出货量预测:依细分市场(未来 5 年)
    • 顶级供应商电介质产量
    • 电介质产量:依地区划分
    • 扩大ALD/CVD材料产能
    • 投资公告摘要
  • 价格趋势
  • 技术趋势/技术推动因素—概述
    • 前驱物的整体技术概述:技术趋势
    • 客户驱动的技术
    • NAND 路线图与课题:堆迭/分层 3D NAND 级别
    • 3D NAND 製程需要进步
    • Micron推出突破性 NVDRAM:双层 32 GB 非挥发性铁电记忆体,具有类似 DRAM 的效能
    • 先进逻辑路线图与课题:逻辑电晶体EST.Roadmap
    • 高阶逻辑(代工)节点 HVM 估算
    • 高阶逻辑:未来的技术课题
    • 光刻技术进步的影响
    • CFET 架构:CFET 扩展的优势
    • 无机 EUV 光阻:旋涂沉积
    • SADP(自对准多重模式)
    • EUV/多重图案化/地缘政治
    • 区域选择性沉积(ASD)
    • 特殊/新兴介电材料及应用领域
    • 区域考虑因素:电介质
    • 区域因素和驱动因素
  • EHS 与贸易/物流问题 - 金属、高 K、电介质
  • 分析师对介电市场趋势的评估

第5章 供给侧市场情势

  • 前驱体材料市占率
    • 当前季度活动 - MERCK
    • 当前季度活动 - 液化空气集团
    • 本季活动 - ENTEGRIS
    • ADEKA
  • 併购活动和伙伴关係
  • 工厂关闭
  • 新进入者
    • MSP 推出 TURBO II (TM) 蒸发器:半导体製造的下一代效率
  • 供应商或零件/产品线面临停产风险
  • 领先供应商的分析师评估

第6章 次级(下层)供应链/前体

  • 细分供应链:供应商与市场概述
    • 次级供应链:供应商和市场概况 - 二级案例研究 (NOURYON/GELEST)
    • Subtier 供应链:供应商和市场概况 - 化学品和气体管理系统
    • Subtier 供应链:供应商和市场概览 - 化学品交付柜
    • Subtier 供应链:供应商和市场概览 - 阀门歧管盒 (VMB)
    • Subtier 供应链:供应商和市场概况 - 散装规格气体系统
    • Subtier 供应链:供应商和市场概况 - 气柜
    • Subtier 供应链:供应商和市场概况 - 成型气体和掺杂气体混合器
    • Subtier 供应链:供应商和市场概况 - 化学监测和分析系统
  • 高级材料:CVD-ALD 前驱体的趋势
  • 精细材质:工业级与半导体级
  • 半导体级次级材料供应商的国际网络:Merck
  • 半导体级次级材料供应商的国际网路:Air Liquide
  • 半导体级次级材料供应商最新讯息
  • 供应链颠覆者
  • 次级供应链T:分析师评估

第七章 供应商简介

  • ADEKA CORPORATION
  • AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
  • AZMAX CO., LTD
  • CITY CHEMICAL LLC
  • DNF CO., LTD
  • 其他20多家企业

This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.

SAMPLE VIEW

Table of Contents

1 Executive Summary

  • 1.1 PRECURSORS BUSINESS - MARKET OVERVIEW
  • 1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK
  • 1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: DIELECTRIC PRECURSORS
  • 1.4 PRECURSOR TRENDS
  • 1.5 PRECURSOR TECHNOLOGY TRENDS
  • 1.6 COMPETITIVE LANDSCAPE DIELECTRIC PRECURSORS
  • 1.7 ANALYST ASSESSMENT OF DIELECTRIC PRECURSORS

2 Scope, Purpose, and Methodology

  • 2.1 SCOPE
  • 2.2 METHODOLOGY
  • 2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS

3 Semiconductor Industry Market Status & Outlook

  • 3.1 WORLDWIDE ECONOMY AND OUTLOOK
    • 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2 SEMICONDUCTOR SALES GROWTH
    • 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
  • 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
    • 3.2.1 ELECTRONICS OUTLOOK
    • 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
      • 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
      • 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
    • 3.2.3 SMARTPHONE OUTLOOK
    • 3.2.4 PC OUTLOOK
    • 3.2.5 SERVERS / IT MARKET
  • 3.3 SEMICONDUCTOR FABRICATION GROWTH - EXPANSION
    • 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
    • 3.3.2 NEW FABS IN THE US
    • 3.3.3 WW FAB EXPANSION DRIVING GROWTH
    • 3.3.4 EQUIPMENT SPENDING TRENDS
    • 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
      • 3.3.5.1 DRAM TECHNOLOGY ROADMAPS
      • 3.3.5.2 3D NAND TECHNOLOGY ROADMAPS
    • 3.3.6 FAB INVESTMENT ASSESSMENT
  • 3.4 POLICY & TRADE TRENDS AND IMPACT
  • 3.5 SEMICONDUCTOR MATERIALS OVERVIEW
    • 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
    • 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 Material Market Trends

  • 4.1 CVD, ALD METAL - HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS
    • 4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024
    • 4.1.2 PRECURSOR MARKET OUTLOOK
    • 4.1.3 DIELECTRIC PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
    • 4.1.4 DIELECTRIC PRODUCTION OF TOP SUPPLIERS
    • 4.1.5 DIELECTRIC PRODUCTION BY REGION
    • 4.1.6 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS
    • 4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW
  • 4.2 PRICING TRENDS
  • 4.3 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
    • 4.3.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW - TECHNOLOGY TRENDS
    • 4.3.2 CUSTOMER DRIVEN TECHNOLOGIES
    • 4.3.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
    • 4.3.4 3D NAND PROCESS ADVANCES REQUIRED
    • 4.3.5 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILEFERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
    • 4.3.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
    • 4.3.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
      • 4.3.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
    • 4.3.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
    • 4.3.9 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
      • 4.3.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
      • 4.3.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
      • 4.3.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION
    • 4.3.10 CFET ARCHITECTURE: CFET SCALING ADVANTAGE
      • 4.3.10.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)
      • 4.3.10.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS
    • 4.3.11 INORGANIC EUV RESIST - SPIN ON DEPOSITION
      • 4.3.11.1 INORGANIC EUV RESIST - ALD DEPOSITED
    • 4.3.12 SELF ALIGNED MULTI PATTERNING - SADP
      • 4.3.12.1 SELF ALIGNED MULTI PATTERNING - SAQP
      • 4.3.12.2 SELF ALIGNED MULTI PATTERNING - PEALD EQUIPMENT
      • 4.3.12.3 SELF ALIGNED MULTI PATTERNING - CAN SAQP BYPASS EUV BEYOND 7 NM?
    • 4.3.13 EUV, MULTI PATTERNING AND GEOPOLITICS
    • 4.3.14 AREA SELECTIVE DEPOSITION (ASD)
      • 4.3.14.1 AREA SELECTIVE DEPOSITION (ASD) - TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
    • 4.3.15 SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS
    • 4.3.16 REGIONAL CONSIDERATIONS - DIELECTRICS
    • 4.3.17 REGIONAL ASPECTS AND DRIVERS
  • 4.4 EHS AND TRADE/LOGISTIC ISSUES - METALS, HIGH-K AND DIELECTRICS
  • 4.5 ANALYST ASSESSMENT OF DIELECTRIC MARKET TRENDS

5 Supply-Side Market Landscape

  • 5.1 PRECURSOR MATERIAL MARKET SHARE
    • 5.1.1 CURRENT QUARTER ACTIVITY - MERCK
      • 5.1.1.1 MERCK
    • 5.1.2 CURRENT QUARTER ACTIVITY - AIR LIQUIDE
      • 5.1.2.1 AIR LIQUIDE
    • 5.1.3 CURRENT QUARTER ACTIVITY -ENTEGRIS
      • 5.1.3.1 ENTEGRIS
    • 5.1.4 ADEKA
      • 5.1.4.1 ADEKA
  • 5.2 M-A ACTIVITY AND PARTNERSHIPS
  • 5.3 PLANT CLOSURES
  • 5.4 NEW ENTRANTS
    • 5.4.1 MSP LAUNCHES TURBO II(TM) VAPORIZERS: NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION
  • 5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
  • 5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS

6 Sub Tier Supply Chain, Precursors

  • 6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
    • 6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - TIER 2 EXAMPLES NOURYON AND GELEST
    • 6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL & GAS MANAGEMENT SYSTEMS
    • 6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL DELIVERY CABINETS
    • 6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - VALVE MANIFOLD BOXES (VMB)
    • 6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - BULK SPEC GAS SYSTEMS
    • 6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - GAS CABINETS
    • 6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - FORMING GAS & DOPANT GAS BLENDERS
    • 6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS
  • 6.2 SUB-TIER MATERIAL CVD - ALD PRECURSOR TRENDS
  • 6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE
  • 6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK
  • 6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE
  • 6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS
  • 6.7 SUB-TIER SUPPLY-CHAIN DISRUPTORS
  • 6.8 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 Supplier profiles

  • ADEKA CORPORATION
  • AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
  • AZMAX CO., LTD
  • CITY CHEMICAL LLC
  • DNF CO., LTD
  • ...and 20+ more

LIST OF FIGURES

  • FIGURE 1.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
  • FIGURE 1.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023
  • FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
  • FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)
  • FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
  • FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
  • FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
  • FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
  • FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
  • FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
  • FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
  • FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
  • FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
  • FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
  • FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
  • FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
  • FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
  • FIGURE 4.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
  • FIGURE 4.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023
  • FIGURE 4.3: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023
  • FIGURE 4.4: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES
  • FIGURE 4.5: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME
  • FIGURE 4.6: 3D NAND PROGRESSION
  • FIGURE 4.7: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS
  • FIGURE 4.8: GATE STRUCTURE ROADMAP
  • FIGURE 4.9: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP
  • FIGURE 4.10: RIBBON FET
  • FIGURE 4.11: MONO LAYER NANO SHEETS CHANNELS
  • FIGURE 4.12: NANO IMPRINT LITHOGRAPHY PROCESS FLOW
  • FIGURE 4.13: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY
  • FIGURE 4.14: DIRECTED SELF-ASSEMBLY
  • FIGURE 4.15: DSA PATENT FILING BY COMPANY
  • FIGURE 4.16: DSA PATEN FILING SINCE 2023
  • FIGURE 4.17: WHAT IS PATTERN SHAPING?
  • FIGURE 4.18: REFINING EUV PATTERNING BY APPLIED MATERIALS
  • FIGURE 4.19: COMPLEMENTARY FET (CFET)
  • FIGURE 4.20: CFET IMPROVES PERFORMANCE IN TRACK SCALING
  • FIGURE 4.21: MONOLITHIC CFET PROCESS FLOW EXAMPLE
  • FIGURE 4.22: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION
  • FIGURE 4.23: LOW TEMPERATURE GATE STACK OPTION EXAMPLES
  • FIGURE 4.24: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES
  • FIGURE 4.25: BSPDN ADVANTAGE: IR DROP REDUCTION
  • FIGURE 4.26: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET
  • FIGURE 4.27: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS
  • FIGURE 4.28: INPRIA EUV MOR
  • FIGURE 4.29: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST
  • FIGURE 4.30: PATENT FILING FOR MLD DEPOSITED EUV RESIST SEARCH PERFORMED IN PATBASE
  • FIGURE 4.31: SADP PROCESS FLOW USING ALD SPACER
  • FIGURE 4.32: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW
  • FIGURE 4.33: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
  • FIGURE 4.34: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS)
  • FIGURE 4.35: 2023 DIELECTRIC REVENUE SHARE BY REGION
  • FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE
  • FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT - SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT
  • FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR)
  • FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST
  • FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY)
  • FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION
  • FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024)
  • FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024)
  • FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA)

LIST OF TABLES

  • TABLE 1.1: DIELECTRIC PRECURSOR REVENUES AND GROWTH RATES
  • TABLE 1.2: ESTIMATED DIELECTRIC PRECURSOR MARKET SHARE BY SUPPLIER 2023
  • TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
  • TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024)
  • TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
  • TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023
  • TABLE 4.1: PRECURSORS REVENUE AND GROWTH RATES
  • TABLE 4.2: DIELECTRIC PRECURSOR REVENUES AND GROWTH RATES
  • TABLE 4.3: ESTIMATED DIELECTRIC PRECURSOR MARKET SHARE BY SUPPLIER 2023
  • TABLE 4.4: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023
  • TABLE 4.5: OVERVIEW OF ANNOUNCED 2023/2024 MATERIAL SUPPLIER INVESTMENTS
  • TABLE 4.6: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL)
  • TABLE 4.7: MULTIPATTERNING AT 7NM BY TSMC
  • TABLE 4.8: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS
  • TABLE 4.9: REGIONAL PRECURSOR MATERIAL MARKETS
  • TABLE 4.10: REGIONAL PRECURSOR MATERIAL MARKETS, CONTINUED
  • TABLE 5.1: MERCK QUARTER FINANCIALS
  • TABLE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS
  • TABLE 5.3: ENTEGRIS SUPPLIER CURRENT QUARTER FINANCIALS
  • TABLE 6.1: CVD AND ALD PRECURSOR