全球介电前驱体（关键材料）市场，2024-2025

Dielectric Precursors Market Report 2024-2025 (Critical Materials Report)

出版日期: 2024年06月01日 | 出版商:

TECHCET | 英文 134 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录图表

该报告涵盖了半导体装置製造中使用的前驱物的市场趋势和供应链。包含主要供应商的资讯、材料供应链的问题和趋势、供应商市场占有率的估计和预测、材料细分市场的预测等。

样本视图

世界经济与展望
- 半导体产业与全球经济的连结
- 半导体销售额成长
- 台湾外包厂商每月销售趋势
晶片销售额：依电子产品领域划分
- 电子展望
- 汽车产业展望
- 智慧型手机前景
- 电脑展望
- 伺服器/IT市场
半导体製造业的成长与扩张
- 晶片扩产投入大量资金
- 美国新工厂
- 世界各地製造工厂的扩张推动成长
- 资本投资趋势
- 先进逻辑技术路线图
- 评估製造工厂投资
政策/贸易趋势和影响
半导体材料概述
- 预测引入的晶圆数量（到 2028 年）
- 材料市场预测（~2028）

第4章材料市场趋势

CVD/ALD/金属：High-K和先进电介质前驱体市场趋势
- 2023 年前驱体市场：与 2024 年的联繫
- 开拓市场前景
- 电介质前驱体出货量预测：依细分市场（未来 5 年）
- 顶级供应商电介质产量
- 电介质产量：依地区划分
- 扩大ALD/CVD材料产能
- 投资公告摘要
价格趋势
技术趋势/技术推动因素—概述
- 前驱物的整体技术概述：技术趋势
- 客户驱动的技术
- NAND 路线图与课题：堆迭/分层 3D NAND 级别
- 3D NAND 製程需要进步
- Micron推出突破性 NVDRAM：双层 32 GB 非挥发性铁电记忆体，具有类似 DRAM 的效能
- 先进逻辑路线图与课题：逻辑电晶体EST.Roadmap
- 高阶逻辑（代工）节点 HVM 估算
- 高阶逻辑：未来的技术课题
- 光刻技术进步的影响
- CFET 架构：CFET 扩展的优势
- 无机 EUV 光阻：旋涂沉积
- SADP（自对准多重模式）
- EUV/多重图案化/地缘政治
- 区域选择性沉积（ASD）
- 特殊/新兴介电材料及应用领域
- 区域考虑因素：电介质
- 区域因素和驱动因素
EHS 与贸易/物流问题 - 金属、高 K、电介质
分析师对介电市场趋势的评估

第5章供给侧市场情势

前驱体材料市占率
- 当前季度活动 - MERCK
- 当前季度活动 - 液化空气集团
- 本季活动 - ENTEGRIS
- ADEKA
併购活动和伙伴关係
工厂关闭
新进入者
- MSP 推出 TURBO II (TM) 蒸发器：半导体製造的下一代效率
供应商或零件/产品线面临停产风险
领先供应商的分析师评估

第6章次级（下层）供应链/前体

细分供应链：供应商与市场概述
- 次级供应链：供应商和市场概况 - 二级案例研究 (NOURYON/GELEST)
- Subtier 供应链：供应商和市场概况 - 化学品和气体管理系统
- Subtier 供应链：供应商和市场概览 - 化学品交付柜
- Subtier 供应链：供应商和市场概览 - 阀门歧管盒 (VMB)
- Subtier 供应链：供应商和市场概况 - 散装规格气体系统
- Subtier 供应链：供应商和市场概况 - 气柜
- Subtier 供应链：供应商和市场概况 - 成型气体和掺杂气体混合器
- Subtier 供应链：供应商和市场概况 - 化学监测和分析系统
高级材料：CVD-ALD 前驱体的趋势
精细材质：工业级与半导体级
半导体级次级材料供应商的国际网络：Merck
半导体级次级材料供应商的国际网路：Air Liquide
半导体级次级材料供应商最新讯息
供应链颠覆者
次级供应链T：分析师评估

第七章供应商简介

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
其他20多家企业

简介目录图表

This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.

SAMPLE VIEW

1 Executive Summary

1.1 PRECURSORS BUSINESS - MARKET OVERVIEW
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: DIELECTRIC PRECURSORS
1.4 PRECURSOR TRENDS
1.5 PRECURSOR TECHNOLOGY TRENDS
1.6 COMPETITIVE LANDSCAPE DIELECTRIC PRECURSORS
1.7 ANALYST ASSESSMENT OF DIELECTRIC PRECURSORS

2 Scope, Purpose, and Methodology

2.1 SCOPE
2.2 METHODOLOGY
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS

3 Semiconductor Industry Market Status & Outlook

3.1 WORLDWIDE ECONOMY AND OUTLOOK
- 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2 SEMICONDUCTOR SALES GROWTH
- 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1 ELECTRONICS OUTLOOK
- 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
  - 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3 SMARTPHONE OUTLOOK
- 3.2.4 PC OUTLOOK
- 3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH - EXPANSION
- 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2 NEW FABS IN THE US
- 3.3.3 WW FAB EXPANSION DRIVING GROWTH
- 3.3.4 EQUIPMENT SPENDING TRENDS
- 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
  - 3.3.5.1 DRAM TECHNOLOGY ROADMAPS
  - 3.3.5.2 3D NAND TECHNOLOGY ROADMAPS
- 3.3.6 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 Material Market Trends

4.1 CVD, ALD METAL - HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS
- 4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024
- 4.1.2 PRECURSOR MARKET OUTLOOK
- 4.1.3 DIELECTRIC PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
- 4.1.4 DIELECTRIC PRODUCTION OF TOP SUPPLIERS
- 4.1.5 DIELECTRIC PRODUCTION BY REGION
- 4.1.6 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS
- 4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW
4.2 PRICING TRENDS
4.3 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
- 4.3.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW - TECHNOLOGY TRENDS
- 4.3.2 CUSTOMER DRIVEN TECHNOLOGIES
- 4.3.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
- 4.3.4 3D NAND PROCESS ADVANCES REQUIRED
- 4.3.5 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILEFERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
- 4.3.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
- 4.3.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
  - 4.3.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
- 4.3.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
- 4.3.9 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
  - 4.3.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
  - 4.3.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
  - 4.3.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION
- 4.3.10 CFET ARCHITECTURE: CFET SCALING ADVANTAGE
  - 4.3.10.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)
  - 4.3.10.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS
- 4.3.11 INORGANIC EUV RESIST - SPIN ON DEPOSITION
  - 4.3.11.1 INORGANIC EUV RESIST - ALD DEPOSITED
- 4.3.12 SELF ALIGNED MULTI PATTERNING - SADP
  - 4.3.12.1 SELF ALIGNED MULTI PATTERNING - SAQP
  - 4.3.12.2 SELF ALIGNED MULTI PATTERNING - PEALD EQUIPMENT
  - 4.3.12.3 SELF ALIGNED MULTI PATTERNING - CAN SAQP BYPASS EUV BEYOND 7 NM?
- 4.3.13 EUV, MULTI PATTERNING AND GEOPOLITICS
- 4.3.14 AREA SELECTIVE DEPOSITION (ASD)
  - 4.3.14.1 AREA SELECTIVE DEPOSITION (ASD) - TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
- 4.3.15 SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS
- 4.3.16 REGIONAL CONSIDERATIONS - DIELECTRICS
- 4.3.17 REGIONAL ASPECTS AND DRIVERS
4.4 EHS AND TRADE/LOGISTIC ISSUES - METALS, HIGH-K AND DIELECTRICS
4.5 ANALYST ASSESSMENT OF DIELECTRIC MARKET TRENDS

5 Supply-Side Market Landscape

5.1 PRECURSOR MATERIAL MARKET SHARE
- 5.1.1 CURRENT QUARTER ACTIVITY - MERCK
  - 5.1.1.1 MERCK
- 5.1.2 CURRENT QUARTER ACTIVITY - AIR LIQUIDE
  - 5.1.2.1 AIR LIQUIDE
- 5.1.3 CURRENT QUARTER ACTIVITY -ENTEGRIS
  - 5.1.3.1 ENTEGRIS
- 5.1.4 ADEKA
  - 5.1.4.1 ADEKA
5.2 M-A ACTIVITY AND PARTNERSHIPS
5.3 PLANT CLOSURES
5.4 NEW ENTRANTS
- 5.4.1 MSP LAUNCHES TURBO II(TM) VAPORIZERS: NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS

6 Sub Tier Supply Chain, Precursors

6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
- 6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - TIER 2 EXAMPLES NOURYON AND GELEST
- 6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL & GAS MANAGEMENT SYSTEMS
- 6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL DELIVERY CABINETS
- 6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - VALVE MANIFOLD BOXES (VMB)
- 6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - BULK SPEC GAS SYSTEMS
- 6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - GAS CABINETS
- 6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - FORMING GAS & DOPANT GAS BLENDERS
- 6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS
6.2 SUB-TIER MATERIAL CVD - ALD PRECURSOR TRENDS
6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE
6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK
6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE
6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS
6.7 SUB-TIER SUPPLY-CHAIN DISRUPTORS
6.8 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 Supplier profiles

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
...and 20+ more

简介目录图表

LIST OF FIGURES

FIGURE 1.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 1.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 4.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023
FIGURE 4.3: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023
FIGURE 4.4: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES
FIGURE 4.5: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME
FIGURE 4.6: 3D NAND PROGRESSION
FIGURE 4.7: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS
FIGURE 4.8: GATE STRUCTURE ROADMAP
FIGURE 4.9: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP
FIGURE 4.10: RIBBON FET
FIGURE 4.11: MONO LAYER NANO SHEETS CHANNELS
FIGURE 4.12: NANO IMPRINT LITHOGRAPHY PROCESS FLOW
FIGURE 4.13: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY
FIGURE 4.14: DIRECTED SELF-ASSEMBLY
FIGURE 4.15: DSA PATENT FILING BY COMPANY
FIGURE 4.16: DSA PATEN FILING SINCE 2023
FIGURE 4.17: WHAT IS PATTERN SHAPING?
FIGURE 4.18: REFINING EUV PATTERNING BY APPLIED MATERIALS
FIGURE 4.19: COMPLEMENTARY FET (CFET)
FIGURE 4.20: CFET IMPROVES PERFORMANCE IN TRACK SCALING
FIGURE 4.21: MONOLITHIC CFET PROCESS FLOW EXAMPLE
FIGURE 4.22: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION
FIGURE 4.23: LOW TEMPERATURE GATE STACK OPTION EXAMPLES
FIGURE 4.24: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES
FIGURE 4.25: BSPDN ADVANTAGE: IR DROP REDUCTION
FIGURE 4.26: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET
FIGURE 4.27: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS
FIGURE 4.28: INPRIA EUV MOR
FIGURE 4.29: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST
FIGURE 4.30: PATENT FILING FOR MLD DEPOSITED EUV RESIST SEARCH PERFORMED IN PATBASE
FIGURE 4.31: SADP PROCESS FLOW USING ALD SPACER
FIGURE 4.32: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW
FIGURE 4.33: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
FIGURE 4.34: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS)
FIGURE 4.35: 2023 DIELECTRIC REVENUE SHARE BY REGION
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT - SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR)
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY)
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024)
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024)
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA)