ALD/high-k金属前驱体（重要材料）的全球市场，2024-2025

ALD / High K Metal Precursors Market Report 2024-2025 (Critical Materials Report)

出版日期: 2024年06月01日 | 出版商:

TECHCET | 英文 170 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录

本报告涵盖了半导体装置製造中使用的前驱物的市场前景和供应链。它还包括有关主要供应商的资讯，材料供应链中的问题和趋势，供应商市场占有率的估计和预测以及材料细分市场的预测。

范例视图

世界经济与展望
- 半导体产业与全球经济的联繫
- 半导体销售额成长
- 台湾外包厂商每月销售趋势
晶片销售趋势：以电子产品领域划分
- 电子产品的前景
- 汽车产业的前景
- 智慧型手机前景
- 电脑展望
- 伺服器/IT 市场
半导体製造业的成长与扩张
- 在晶片扩张方面投入巨资
- 美国新厂
- 全球工厂扩编推动成长
- 资本投资趋势
- 先进逻辑技术路线图
- 工厂投资评估
政策/贸易趋势及其影响
半导体材料概述
- 引进的晶圆数量：未来预测（~2028年）
- 材料市场预测（~2028年）

第4章材料市场趋势

CVD/ALD 金属/high-k/先进电介质前驱体的市场趋势
- 前驱市场（2023年）：与2024年的联繫
- 前驱体市场前景
- 金属和high-k前驱物的出货量预测：依细分市场（未来 5年）
前驱供应能力、需求与投资
- 主要供应商金属及high-k前驱体产能
- 金属/high-k产量：依地区划分
- 扩大 ALD/CVD 材料产能
- 投资公告：概述
- 前驱供需平衡：概述
价格趋势
技术趋势/技术推广因素：概述
- 前驱体的整体技术概述：技术趋势
- 客户驱动的技术
- NAND 路线图与挑战：堆迭/分层 3D NAND 级别
- 3D NAND 製程需要进步
- 新材料和蚀刻化学物质可实现 3D NAND 微缩－PF3（G）和 MOO2CL2（S）
- 钼：基于 Lam 研究的半导体金属化新前沿
- 需要在 DRAM 製程方面取得进展
- DRAM 未来的技术问题
- Micron推出突破性 NVDRAM：双层 32 GB 非挥发性铁电记忆体，具有类似 DRAM 的效能
- 先进逻辑路线图与挑战：逻辑电晶体EST.Roadmap
- 高阶逻辑（Foundry）节点 HVM 估算
- 需要改进 ADV 逻辑流程
- 高阶逻辑：未来的技术挑战
- 光刻技术进步的影响
- CFET 架构：CFET 扩展的优势
- 无机 EUV 光阻：ALD 沉积
- 分子层沉积（MLD）
- 区域选择性沉积（ASD）
- 特殊/新兴金属及其用途
- 特殊/新兴HIGH-K及其应用
区域考虑因素：金属/high-k
- 区域因素与驱动因素
EHS 与贸易/物流问题：金属、high-k、电介质
- ESH金属
- ESH high-k
- ESH 回收
贸易/物流问题：金属材料
- 贸易/物流问题：high-k材料
分析师对high-k市场趋势的评估
- 分析师对金属市场趋势的评估

第5章供给面市场情势

前驱体材料的市占率
- 最新季活动：MERCK
- 最新季活动：AIR LIQUIDE
- 最新季活动：ENTEGRIS
- ADEKA
併购（M&A）活动与合作伙伴关係
工厂关闭
新进入公司
- MSP 推出 TURBO II（TM）蒸发器：半导体製造的下一代效率
- 新型 ZR 前驱体晶圆级二氧化锆薄膜
- 钼薄膜的进展：新型液体前驱体促进气相沉积
- Hanwha为记忆体应用提供钼沉积 ALD 设备
供应商或零件/产品线面临停产风险
分析师对领先供应商的评估

第6章下游供应链：前驱物

下游（次级）供应链：供应商与市场概览
- 下游供应链：供应商和市场概述－二级范例：NOURYON 和 GELEST
- 下游供应链：供应商和市场概况－化学品和气体管理系统
- 下游供应链：供应商与市场概况－化学品配送柜
- 下游供应链：供应商和市场概览－阀门歧管盒（VMB）
- 下游供应链：供应商和市场概况－散装规格气体系统
- 下游供应链：供应商和市场概况－气柜
- 下游供应链：供应商和市场概况－成型气体和掺杂剂气体混合器
- 下游供应链：供应商和市场概览：化学品－监测和分析系统
底层材质：CVD/ALD 前驱体的趋势
底层材质：工业级与半导体级
半导体级底层材料供应商的国际网络：Merck
半导体级底层材料供应商的国际网路：Air Liquide
半导体级下层材料供应商最新讯息
下游供应链中断
下游供应链工厂最新讯息
下游供应链工厂的最新资讯：HAFNIA 和 REO（DUBBO PROJECT）
对半导体产业所使用的矿物的依赖
下游供应链的趋势：钴
下游供应链的趋势：锆/铪
下游供应链的趋势：铪
下游供应链的趋势：镓
铝
钛
钨
钼
铌钽
稀土
下游供应链的趋势：PGM
下游供应链的趋势：锗
下游供应链：分析师评估

第7章供应商简介

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
20家以上其他公司

简介目录

This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.

SAMPLE VIEW

1 EXECUTIVE SUMMARY

1.1 PRECURSORS BUSINESS - MARKET OVERVIEW
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: METAL AND HIGH-K PRECURSORS
1.4 PRECURSOR TRENDS
1.5 PRECURSOR TECHNOLOGY TRENDS
1.6 COMPETITIVE LANDSCAPE METAL & HIGH-K PRECURSORS
1.7 PRECURSOR EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.8 ANALYST ASSESSMENT OF METAL AND HIGH-K PRECURSORS

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 METHODOLOGY
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

3.1 WORLDWIDE ECONOMY AND OUTLOOK
- 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2 SEMICONDUCTOR SALES GROWTH
- 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1 ELECTRONICS OUTLOOK
- 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
  - 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3 SMARTPHONE OUTLOOK
- 3.2.4 PC OUTLOOK
- 3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2 NEW FABS IN THE US
- 3.3.3 WW FAB EXPANSION DRIVING GROWTH
- 3.3.4 EQUIPMENT SPENDING TRENDS
- 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
  - 3.3.5.1 DRAM TECHNOLOGY ROADMAPS
  - 3.3.5.2 3D NAND TECHNOLOGY ROADMAPS
- 3.3.6 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 MATERIAL MARKET TRENDS

4.1 CVD, ALD METAL & HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS
- 4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024
- 4.1.2 PRECURSOR MARKET OUTLOOK
- 4.1.3 METAL AND HIGH-K PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
4.2 PRECURSORS SUPPLY CAPACITY AND DEMAND, INVESTMENTS
- 4.2.1 METAL & HIGH-K PRECURSOR PRODUCTION CAPACITY OF TOP SUPPLIERS
- 4.2.2 METAL & HIGH-K PRODUCTION BY REGION
- 4.2.3 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS
- 4.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW
- 4.2.5 PRECURSORS SUPPLY VS. DEMAND BALANCE - OVERVIEW
4.3 PRICING TRENDS
4.4 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
- 4.4.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS
- 4.4.2 CUSTOMER DRIVEN TECHNOLOGIES
- 4.4.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
- 4.4.4 3D NAND PROCESS ADVANCES REQUIRED
- 4.4.5 NEW MATERIALS AND ETCH CHEMISTRIES ENABLE 3D NAND SCALING - PF3(G) AND MOO2CL2(S)
- 4.4.6 MOLYBDENUM: THE NEW FRONTIER IN SEMICONDUCTOR METALLIZATION ACCORDING TO LAM RESEARCH
- 4.4.7 DRAM PROCESS ADVANCES REQUIRED
- 4.4.8 DRAM FUTURE TECHNOLOGY CHALLENGES
- 4.4.9 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
- 4.4.10 ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
- 4.4.11 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
- 4.4.12 ADV LOGIC PROCESS ADVANCES REQUIRED
  - 4.4.12.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
- 4.4.13 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
- 4.4.14 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
  - 4.4.14.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
  - 4.4.14.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
  - 4.4.14.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION
- 4.4.15 CFET ARCHITECTURE: CFET SCALING ADVANTAGE
  - 4.4.15.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)
  - 4.4.15.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS
- 4.4.16 INORGANIC EUV RESIST - ALD DEPOSITED
- 4.4.17 MOLECULAR LAYER DEPOSITION (MLD)
  - 4.4.17.1 TREND IS MLD COMBINED WITH ALD
  - 4.4.17.2 DIFFERENT TYPES OF MLD PRECURSORS AND MATERIALS
  - 4.4.17.3 MLD APPLICATIONS
- 4.4.18 AREA SELECTIVE DEPOSITION (ASD)
  - 4.4.18.1 AREA SELECTIVE DEPOSITION (ASD) - ADEKA PRESENT ASD HF-PRECURSOR
  - 4.4.18.2 AREA SELECTIVE DEPOSITION (ASD) - TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
- 4.4.20 SPECIALTY/EMERGING METAL AND APPLICATIONS
- 4.4.21 SPECIALTY/EMERGING HIGH-K AND APPLICATIONS
4.5 REGIONAL CONSIDERATIONS - METAL AND HIGH-K
- 4.5.1 REGIONAL ASPECTS AND DRIVERS
4.6 EHS AND TRADE/LOGISTIC ISSUES - METALS, HIGH-K AND DIELECTRICS
- 4.6.1 ESH METALS
- 4.6.2 ESH HIGH-K
- 4.6.3 ESH RECYCLING
4.7 TRADE/LOGISTICS ISSUES - METAL MATERIALS
- 4.7.1 TRADE/LOGISTICS ISSUES - HIGH-K MATERIALS
4.8 ANALYST ASSESSMENT OF HIGH-K MARKET TRENDS
- 4.8.1 ANALYST ASSESSMENT OF METAL MARKET TRENDS

5 SUPPLY-SIDE MARKET LANDSCAPE

5.1 PRECURSOR MATERIAL MARKET SHARE
- 5.1.1 CURRENT QUARTER ACTIVITY - MERCK
  - 5.1.1.1 MERCK
- 5.1.2 CURRENT QUARTER ACTIVITY - AIR LIQUIDE
  - 5.1.2.1 AIR LIQUIDE
- 5.1.3 CURRENT QUARTER ACTIVITY -ENTEGRIS
  - 5.1.3.1 ENTEGRIS
- 5.1.4 ADEKA
  - 5.1.4.1 ADEKA
5.2 M&A ACTIVITY AND PARTNERSHIPS
5.3 PLANT CLOSURES
5.4 NEW ENTRANTS
- 5.4.1 MSP LAUNCHES TURBO II(TM) VAPORIZERS: NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION
- 5.4.2 A NEW ZR PRECURSOR WAFER-SCALE ZIRCONIUM DIOXIDE FILMS
- 5.4.3 ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION
- 5.4.4 HANWHA TO SUPPLY ALD EQUIPMENT FOR MOLYBDENUM DEPOSITION FOR MEMORY APPLICATIONS
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS

6 SUB-TIER SUPPLY-CHAIN, PRECURSORS

6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW
- 6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - TIER 2 EXAMPLES NOURYON AND GELEST
- 6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL & GAS MANAGEMENT SYSTEMS
- 6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - CHEMICAL DELIVERY CABINETS
- 6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW VALVE MANIFOLD BOXES (VMB)
- 6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - BULK SPEC GAS SYSTEMS
- 6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - GAS CABINETS
- 6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW - FORMING GAS & DOPANT GAS BLENDERS
- 6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS
6.2 SUB-TIER MATERIAL CVD & ALD PRECURSOR TRENDS
6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE
6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK
6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE
6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS
6.7 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS
6.8 SUB-TIER SUPPLY-CHAIN PLANT UPDATES
6.9 SUB-TIER SUPPLY-CHAIN PLANT UPDATES - HAFNIA AND REO FROM THE DUBBO PROJECT
6.10 MINERAL USED IN THE SEMICONDUCTOR INDUSTRY DEPENDENCIES
6.11 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - COBALT
6.12 SUB-TIER SUPPLY-CHAIN PRICING TRENDS: ZIRCONIUM AND HAFNIUM
6.13 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - HAFNIUM
6.14 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - GALLIUM
6.15 ALUMINUM
6.16 TITANIUM
6.17 TUNGSTEN
6.18 MOLYBDENUM
6.19 NIOBIUM AND TANTALUM
6.20 RARE EARTHS
6.21 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - PGM
6.22 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - GERMANIUM
6.23 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7 SUPPLIER PROFILES

ADEKA CORPORATION
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
AZMAX CO., LTD
CITY CHEMICAL LLC
DNF CO., LTD
...AND 20+ MORE

FIGURES

FIGURE 1.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 1.2: WW MARKET SHARE - METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT
FIGURE 4.2: MEMORY SUPPLY/DEMAND SITUATION 2024
FIGURE 4.3: WW MARKET SHARE - METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)
FIGURE 4.4: REGIONAL MARKET SHARES
FIGURE 4.5: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES
FIGURE 4.6: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME
FIGURE 4.7: 3D NAND PROGRESSION
FIGURE 4.8: ETCH DEPTH PERFORMANCE
FIGURE 4.9: TOKYO ELECTRON'S NEW CRYOGENIC ETCH TOOL
FIGURE 4.10: DRAM MESH BY MICRON
FIGURE 4.11: IMEC CAPACITORLESS IGZO CELL FOR 3D STACKED DRAM
FIGURE 4.12: TRANSITION FROM 2D TO 3D DRAM
FIGURE 4.13: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS
FIGURE 4.14: GATE STRUCTURE ROADMAP
FIGURE 4.15: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP
FIGURE 4.16: LOGIC TRANSISTOR PROGRESSION
FIGURE 4.17: RIBBON FET
FIGURE 4.18: MONO LAYER NANO SHEETS CHANNELS
FIGURE 4.19: NANO IMPRINT LITHOGRAPHY PROCESS FLOW
FIGURE 4.20: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY
FIGURE 4.21: DIRECTED SELF-ASSEMBLY
FIGURE 4.22: DSA PATENT FILING BY COMPANY
FIGURE 4.23: DSA PATEN FILING SINCE 2023
FIGURE 4.24: WHAT IS PATTERN SHAPING?
FIGURE 4.25: REFINING EUV PATTERNING BY APPLIED MATERIALS
FIGURE 4.26: COMPLEMENTARY FET (CFET)
FIGURE 4.27: CFET IMPROVES PERFORMANCE IN TRACK SCALING
FIGURE 4.28: MONOLITHIC CFET PROCESS FLOW EXAMPLE
FIGURE 4.29: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION
FIGURE 4.30: LOW TEMPERATURE GATE STACK OPTION EXAMPLES
FIGURE 4.31: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES
FIGURE 4.32: BSPDN ADVANTAGE: IR DROP REDUCTION
FIGURE 4.33: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET
FIGURE 4.34: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS
FIGURE 4.35: PATENT FILING FOR MLD DEPOSITED EUV RESIST - SEARCH PERFORMED IN PATBASE
FIGURE 4.36: MOLECULAR LAYER DEPOSITION VS ATOMIC LAYER DEPOSITION
FIGURE 4.37: INCREASING TREND OF ALD/MLD PUBLICATIONS
FIGURE 4.38: ADEKA ASD-HF PRECURSORS
FIGURE 4.39: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT
FIGURE 4.40: SPECIALTY/EMERGING METAL APPLICATIONS
FIGURE 4.41: SPECIALTY/EMERGING HIGH-K APPLICATIONS - NVM DRAM (MICRON IEDM2023)
FIGURE 4.42: 2023 METAL & HIGH-K REVENUE SHARE BY REGION
FIGURE 4.43: EHS ISSUES - HIGH-K: MINING IN CHINA
FIGURE 4.44: SK HYNIX'S RECYCLED AND RENEWABLE MATERIALS TARGETS
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT - SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR)
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY)
FIGURE 5.6: NEW ZIRCONIUM PRECURSOR CLASS
FIGURE 5.7: ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024)
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024)
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA)
FIGURE 6.5: PRICE TREND IN COBALT
FIGURE 6.6: HAFNIUM 5-YEAR PRICING
FIGURE 6.7: GALLIUM PRICE, 5 YEAR HISTORICAL
FIGURE 6.8: RUTHENIUM AND PLATINUM, 5-YEAR HISTORICAL PRICING
FIGURE 6.9: GERMANIUM PRICE, 5-YEAR HISTORICAL