晶载冷却竞争:TSMC，Samsung，Intel的策略分析

On-Chip Cooling Race: TSMC, Samsung, Intel Strategies Analysis

出版日期: 2025年08月29日 | 出版商:

TrendForce | 英文 26 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录

人工智慧应用的快速普及推动了半导体产业的发展和成长，同时也带来了新的挑战。除了先进製程技术接近物理极限、製程小型化难度日益增加之外，散热也成为各大半导体代工厂面临的主要难题。

用于人工智慧伺服器（尤其是GPU）的晶片效能不断提升，导致单一晶片的热设计功耗（TDP）达到千瓦级。传统的风冷技术已接近其物理极限，为液冷技术的崛起铺平了道路。同时，半导体产业及相关学术研究机构正积极投入研发晶片级液冷解决方案。

主要亮点

先进製程的热管理挑战
片上冷却技术的兴起
片上嵌入式冷却
嵌入式片上冷却将成为未来重要的冷却技术
主要晶圆代工厂（台积电/三星/英特尔）的片上冷却解决方案部署
主要晶圆代工厂的片上冷却解决方案部署

样品

The surge in AI applications has fueled the development and growth of the semiconductor industry but has also brought new challenges. Apart from advanced process technology nearing physical limits and the increasing difficulty of process miniaturization, heat dissipation has emerged as a primary concern for major semiconductor foundries.

Chips used in AI servers, particularly GPUs, continue to improve in terms of performance. Consequently, the thermal design power (TDP) of individual chips has reached kilowatt levels. The traditional air cooling technology is approaching its physical limits, making way for the rise of liquid cooling technology. At the same time, the semiconductor industry and related academic research institutions are actively investing in the development of embedded liquid cooling solutions within chips.

Key Highlights:

Thermal Management Challenges Brought by Advanced Processes.
Emergence of On-Chip Cooling Technology.
On-Chip Embedded Cooling.
Embedded On-Chip Cooling to Become a Key Cooling Technology in the Future.
Deployment in On-Chip Cooling Solutions among Major Foundries (TSMC / Samsung / Intel).
Deployment in On-Chip Cooling Solutions among Major Foundries.

SAMPLE VIEW

1. AI Chips Are Getting Hotter and Hotter

Table 1: Foundry Processes and Maximum TDP of NVIDIA's AI Chips

2. Thermal Management Challenges Brought by Advanced Processes

Figure 1: Traditional Cooling Architecture for Semiconductor Chip and Temperature Variations
Figure 2: Simulation Test Results from IMEC

3. Latest Developments in Cooling Technologies

Table 2: Comparison of Current Cooling Technologies

4. Emergence of On-Chip Cooling Technology

Figure 3: Srikanth Rangarajan and Research Team Segmented Cooling Technology of Chips from Inside Out into T1-T4
Figure 4: Structural Schematics of TED Embedded Thermoelectric Component
Figure 5: Structural Schematics of Embedded Micro-Jet Cooling
Figure 6: Comparison of Cooling Effect between Traditional Liquid-Cooling and Embedded Micro-Jet Cooling under the Same 500micrometer Unit
Figure 7: Microchannel Cooling Embedded in Power Electronic Chips
Figure 8: Cross-Sectional Comparison of Traditional Cold Plates and Microchannel Cooling Components
Figure 9: Technical Advancement of Next-Gen HBM Cooling
Figure 10: KAIST's Projection on Various Technical Nodes and Corresponding Cooling Technology of HBM

5. Deployment in On-Chip Cooling Solutions among Major Foundries

Figure 11: TSMC's IMC-Si Process
Table 3: Comparison of Samsung's FOWLP Technology
Figure 12: Intel's Package-Level Liquid-Cooling Technology
Figure 13: Intel Showcasing TIM Solutions Corresponding to Various Application Scenarios and Cost