HBM全球市场预测（2026）：人工智慧主导的需求与HBM4生产趋势

2026 Global HBM Market Forecast: AI-Driven Demand and HBM4 Production Trends

出版日期: 2026年02月06日 | 出版商:

TrendForce | 英文 28 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录

DRAM 产业预计将专注于扩大 HBM 产能，但中国供应商将受到製造设备相关法规的限制。三星、SK 海力士和美光等主要企业正优先考虑技术转型和人工智慧应用，随着 HBM4检验将决定市场份额，HBM 市场的竞争日益激烈。同时，传统 DRAM 的成长则依赖技术升级。

主要亮点

中国供应商受到设备法规的限制，阻碍了其资本投资的扩张。
DRAM产能扩张以HBM为重点，其特点是竞争加剧、全球产能稳定成长以及TSV比例逐步上升。
三星等主要供应商专注于技术转型和精细化生产，而SK海力士和美光则优先考虑HBM和先进技术。
供应商预计 HBM3e 将继续成为主流材料，并将产能转向人工智慧相关应用。
由于供不应求和需求增加，DRAM 的合约价格持续上涨，也导致了 HBM 价格的上涨。

DRAM industry will focus on HBM capacity expansion, with Chinese suppliers limited by equipment restrictions; major players like Samsung, SK hynix, and Micron emphasize tech migration and AI applications, intensifying HBM competition where HBM4 validation will shape market shares, while conventional DRAM relies on tech upgrades for growth.

Key Highlights

Chinese suppliers are constrained by equipment restrictions, hindering capex growth.
DRAM capacity expansions emphasize HBM, with intensified competition, steady global capacity rise, and gradual TSV ratio increase.
Key suppliers like Samsung focus on tech migration and conservative output, while SK hynix and Micron prioritize HBM and advanced tech.
Suppliers direct capacity toward AI-related applications, expecting HBM3e to remain dominant.
DRAM contract prices continue rising amid shortages and demand, contributing to upward HBM pricing.