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市场调查报告书
商品编码
1372561
东南亚再分布层材料市场规模和预测、区域份额、趋势和成长机会分析报告范围:按类型和应用Southeast Asia Redistribution Layer Material Market Size and Forecasts, Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type and Application |
东南亚再分布层材料市场预计将从2022年的5,451万美元成长到2030年的1.5011亿美元;预计2022年至2030年复合年增长率为13.5%。
再分布层 (RDL) 是用于在积体电路 (IC) 或半导体装置内路由和重新分布电讯号的导电材料薄膜或层。此层对于连接 IC 内的电晶体、电容器和电阻器等组件并确保讯号可以在它们之间有效流动至关重要。东南亚的战略定位是从这项需求中受益。该地区已成为半导体製造和组装中心,马来西亚、越南和泰国等国家拥有重要设施。这些生产中心靠近关键产业,这意味着采购再分布层材料既高效又具有成本效益。此外,汽车和电信业的经济成长对整个供应链产生连锁反应。研发、技术和基础设施的投资不断增加,培育了有利于再分布层材料领域创新和发展的环境。这一趋势的特征是产量增加、先进封装技术、小型化要求、该地区的战略供应链地位以及对整个生态系统的正面经济影响。这些因素共同推动了东南亚再分布层材料市场的成长。
为了降低成本,半导体产业一直致力于开发创新解决方案。领先的半导体厂商目前考虑的一种方法是从晶圆和条带尺寸迁移到专用于 IC 组装的大尺寸面板。效率和规模经济是这条道路的附加价值。将扇出封装製造从晶圆、扇出晶圆级封装 (FOWLP) 转移到大规模面板、扇出面板级封装 (FOPLP),可能是更广泛采用的解决方案。随着消费性电子产品、汽车系统和工业设备变得更加紧凑和复杂,对先进半导体封装技术的需求不断增长。重新分布层是此过程不可或缺的一部分,它可以实现更小的外形尺寸、增加功能并提高效能。东南亚的製造商准备透过生产和供应必要的材料来利用这一趋势。包装产业的进步,特别是 2.5D 和 3D 包装技术的采用,有望成为东南亚再分布层材料市场成长的重要推手。 2.5D和3D封装技术显着提高了晶片密度和功能。透过将多个半导体晶片彼此堆迭或并列堆迭,这些技术可以实现更坚固、更紧凑的电子设备。重新分布层对于在这些堆迭或相邻晶片之间建立互连至关重要,从而确保高效的资料传输和电气连接。东南亚可以利用半导体製造专业知识来供应这些先进封装技术所需的关键重新分布层材料。
这些封装技术在提高效能和能源效率方面具有显着的优势。透过 2.5D 和 3D 封装,更短的互连长度和更少的讯号路径有助于更快的资料处理和更低的功耗。因此,对能够保持讯号完整性和热管理的重新分布层材料的需求变得更加重要。东南亚可以在提供这些先进材料以满足全球产业需求方面发挥关键作用。此外,汽车产业正在采用 2.5D 和 3D 封装,以实现先进驾驶辅助系统 (ADAS) 和自动驾驶技术的整合。这些应用依赖紧密整合的高性能半导体封装,需要可靠的再分布层材料。东南亚在汽车电子製造领域的强大影响力使其成为东南亚再分布层材料市场成长的关键贡献者。
全球製造商正在开发新的包装技术。例如,2021年5月,三星电子推出了I-Cube4,用于人工智慧、5G、云端和大型资料中心的高效能运算(HPC)、快速通信,并透过异质整合提高逻辑和记忆体之间的功率效率。此外,2023年9月,ASIC设计服务和IP供应商智原科技宣布推出2.5D/3D先进封装服务。 2.5D封装技术用于实现最高效能,针对HPC,如AI加速器、图形处理单元和网路处理器。封装技术的此类进步预计将促进东南亚再分布层材料市场的成长。
东南亚再分布层材料市场的几个主要参与者包括先进半导体工程公司 (Advanced Semiconductor Engineering, Inc);安靠科技;富士胶片公司;杜邦公司;英飞凌科技股份公司;恩智浦半导体;三星电子有限公司;信越化学股份有限公司; SK海力士公司;东南亚再分布层材料市场的参与者高度专注于开发高品质和创新的产品以满足客户的需求。
东南亚整体再分布层材料市场规模是使用主要和次要来源得出的。我们利用内部和外部来源进行了详细的次要研究,以获得与东南亚再分布层材料市场相关的定性和定量资讯。此外,我们还与行业参与者进行了多次初步访谈,以验证资料并获得对该主题的更多分析见解。这个过程的参与者包括行业专家,如副总裁、业务开发经理、市场情报经理和国家销售经理,以及外部顾问,如估值专家、研究分析师和关键意见领袖,专门从事东南亚再分配层材料市场。
The Southeast Asia redistribution layer material market is expected to grow from US$ 54.51 million in 2022 to US$ 150.11 million by 2030; it is expected to grow at a CAGR of 13.5% from 2022 to 2030.
The redistribution layer (RDL) is the thin film or layer of conductive material used to route and redistribute electrical signals within an integrated circuit (IC) or semiconductor device. This layer is essential for connecting components, such as transistors, capacitors, and resistors, within the IC and ensuring that signals can flow efficiently between them. Southeast Asia is strategically positioned to benefit from this demand. The region has emerged as a semiconductor manufacturing and assembly hub, with countries such as Malaysia, Vietnam, and Thailand hosting significant facilities. The proximity of these production centers to the key industries means that sourcing redistribution layer materials is efficient and cost-effective. Additionally, the economic growth of the automotive and telecommunications sectors has a ripple effect on the entire supply chain. Investments in research and development, technology, and infrastructure are increasing, fostering an environment conducive to innovation and development in the field of redistribution layer materials. This trend is characterized by increased production, advanced packaging technologies, miniaturization requirements, the region's strategic supply chain position, and a positive economic impact on the entire ecosystem. These factors collectively propel the Southeast Asia redistribution layer material market growth.
In the quest for cost reduction, the semiconductor industry has always been involved in developing innovative solutions. One approach currently considered by the leading semiconductor players is the migration from wafer and strip size to large-size panels dedicated to IC assembly. Efficiency and economies of scale are the added value of this path. Moving fan-out package manufacturing from a wafer, Fan-Out Wafer Level Packaging (FOWLP) to a large-scale panel, Fan-Out Panel Level Packaging (FOPLP), could be the solution for a wider adoption. As consumer electronics, automotive systems, and industrial devices become more compact and complex, there is a growing need for advanced semiconductor packaging technologies. Redistribution layers are integral to this process, it enables the creasing of smaller form factors, increases functionality and improves performance. Manufacturers in Southeast Asia are positioned to capitalize on this trend by producing and supplying the necessary materials. Advancements in the packaging industries, specifically the adoption of 2.5D and 3D packaging technologies, are poised to be significant drivers of the Southeast Asia redistribution layer material market growth. 2.5D and 3D packaging technologies significantly increase chip density and functionality. By stacking multiple semiconductors die on each other or side by side, these technologies allow for more robust and compact electronic devices. Redistribution layers are essential for creating interconnections between these stacked or adjacent dies, ensuring efficient data transfer and electrical connectivity. Southeast Asia can leverage semiconductor manufacturing expertise to supply the critical redistribution layer materials required for these advanced packaging techniques.
These packaging technologies offer notable advantages in terms of improved performance and energy efficiency. With 2.5D and 3D packaging, shorter interconnect lengths and reduced signal paths contribute to faster data processing and lower power consumption. As a result, demand for redistribution layer materials capable of maintaining signal integrity and thermal management becomes even more crucial. Southeast Asia can play a pivotal role in delivering these advanced materials to meet global industry demands. Furthermore, the automotive industry is embracing 2.5D and 3D packaging to enable the integration of advanced driver-assistance systems (ADAS) and autonomous driving technologies. These applications rely on tightly integrated, high-performance semiconductor packages that demand reliable redistribution layer materials. Southeast Asia's strong presence in automotive electronics manufacturing positions it as a key contributor to the Southeast Asia redistribution layer material market growth.
Manufacturers across the globe are developing new packaging technologies. For instance, in May 2021, Samsung Electronics launched I-Cube4, for High-Performance Computing (HPC) to AI, 5G, cloud, and large data center, fast communication, and improving power efficiency between logic & memory through heterogeneous integration. In addition, in September 2023, Faraday Technology Corporation, an ASIC design service, and IP provider, announced the launch of its 2.5D/3D advanced package service. The 2.5D package technology is used for achieving the highest performance, targeting HPC such as AI accelerator, graph processing unit, and networking processor. Such advancements in packaging technology are expected to bolster the Southeast Asia redistribution layer material market growth.
A few key players operating in the Southeast Asia redistribution layer material market are Advanced Semiconductor Engineering, Inc; Amkor Technology; Fujifilm Corporation; DuPont; Infineon Technologies AG; NXP Semiconductors; Samsung Electronics Co., Ltd; Shin-Etsu Chemical Co., Ltd; SK Hynix Inc; and Jiangsu Changjiang Electronics Technology Co., Ltd. Players operating in the Southeast Asia redistribution layer material market are highly focused on developing high-quality and innovative product offerings to fulfill customers' requirements.
The overall Southeast Asia redistribution layer material market size has been derived using both primary and secondary sources. Exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the Southeast Asia redistribution layer material market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights into the topic. The participants of this process include industry experts, such as VPs, business development managers, market intelligence managers, and national sales managers-along with external consultants, such as valuation experts, research analysts, and key opinion leaders-specializing in the Southeast Asia redistribution layer material market.