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闆对板连接器市场 - 2018-2028 年全球行业规模、份额、趋势、机会和预测（按类型、按排针、按间距、按应用、按地区、按竞争预测和机会细分）

Board-to-Board Connectors Market - Global Industry Size, Share, Trends, Opportunity, and Forecast Segmented By Type, By Pin Headers By Pitch, By Application, By Region, By Competition Forecast & Opportunities, 2018-2028
出版日期: | 出版商: TechSci Research | 英文 190 Pages | 商品交期: 2-3个工作天内

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简介目录

2022 年，全球闆对板连接器市场价值为 122 亿美元，预测期内复合年增长率为 5.45%。对电子设备不断增长的需求正在推动印刷电路连接器市场的发展。随着智慧型手机、平板电脑、笔记型电脑和物联网设备和其他电子系统的普及，需要高效的连接解决方案。电信、汽车和工业自动化、医疗保健和消费性电子等领域的技术进步需要先进的卡间连接器。

日益全球化导致新兴经济体提高了智慧型设备的渗透率。智慧型手机、个人电脑和摄影机的使用增加了对 BTB 连接器的需求。所有行业不断发展的数位化增加了医疗设备、资料中心、便携式和安全解决方案系统中对 BTB 连接器的使用和需求。 BTB连接器产量的不断成长，提高了BTB连接器市场的需求规格比。 2016年，BTB连接器的全球产量为387057万个，预计到2024年将达到510083万个。物联网（IoT）的日益普及推动了BTB连接器市场的成长。对自动化的需求不断增长，导致先进技术的出现，需要 BTB 连接器才能有效运作。随着未来电动车的推出，不断发展的汽车产业为 BTB 连接器提供了机会。在消费性电子市场，BTB连接器的消费量最高。不同品牌和市场参与者之间价格差异的缩小影响了BTB连接器的市场。产品性能的提升也增加了对BTB连接器的需求。不断变化的产品类型和出色的售后服务促进了 BTB 连接器市场的成长。研究发现，高阶或高阶市场在 BTB 连接器市场中占有最大份额。

主要市场驱动因素

市场概况
预测期 2024-2028
2022 年市场规模 122亿美元
2028 年市场规模 169.3亿美元
2023-2028 年复合年增长率 5.45%
成长最快的细分市场 插座
最大的市场 亚太

电子和消费性设备的快速进步：

目录

第 1 章：产品概述

  • 市场定义
  • 市场范围
    • 涵盖的市场
    • 考虑学习的年份
    • 主要市场区隔

第 2 章：研究方法

  • 研究目的
  • 基线方法
  • 主要产业伙伴
  • 主要协会和二手资料来源
  • 预测方法
  • 数据三角测量与验证
  • 假设和限制

第 3 章：执行摘要

第 4 章：客户之声

第 5 章：全球闆对板连接器市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按类型（排针和插座）
    • 按排针（堆迭式和屏蔽式）
    • 依间距（小于 1 毫米、1 毫米至 2 毫米、大于 2 毫米）
    • 按应用（消费性电子、工业自动化）
    • 按地区
  • 按公司划分 (2022)
  • 市场地图

第 6 章：北美闆对板连接器市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按类型
    • 透过排针
    • 按间距
    • 按应用
    • 按国家/地区
  • 北美：国家分析
    • 美国
    • 加拿大
    • 墨西哥

第 7 章：亚太地区闆对板连接器市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按类型
    • 透过排针
    • 按间距
    • 按应用
    • 按国家/地区
  • 亚太地区：国家分析
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲

第 8 章：欧洲闆对板连接器市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按类型
    • 透过排针
    • 按间距
    • 按应用
    • 按国家/地区
  • 欧洲：国家分析
    • 德国
    • 英国
    • 法国
    • 义大利
    • 西班牙

第 9 章：南美洲闆对板连接器市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按类型
    • 透过排针
    • 按间距
    • 按应用
    • 按国家/地区
  • 南美洲：国家分析
    • 巴西
    • 阿根廷
    • 哥伦比亚

第 10 章：中东和非洲闆对板连接器市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按组件
    • 按应用
    • 按最终用户
    • 按国家/地区
  • 中东和非洲：国家分析
    • 沙乌地阿拉伯
    • 南非
    • 阿联酋

第 11 章：市场动态

  • 司机
  • 挑战

第 12 章：市场趋势与发展

第 13 章：公司简介

  • ANSYS 公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 苯酚
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 莫仕
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 富士康
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 日本航空工程师协会
  • 德尔福
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 萨姆泰克
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 日本科学技术协会
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 广濑。
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services
  • 浩亭
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services

第 14 章：策略建议

第 15 章：关于我们与免责声明

简介目录
Product Code: 16160

The Global Board-to-Board Connectors Market was valued at USD 12.2 billion in 2022 and is growing at a CAGR of 5.45% during the forecast period. Growing demand for electronic devices is driving the market for printed circuit connectors. With the proliferation of smartphones, tablets, laptops and the Internet of Things devices and other electronic systems require efficient connectivity solutions. Technological advances in areas such as telecommunications, automobiles and industry automation, healthcare and consumer electronics require advanced connectors between cards.

Increasing globalization has led to emerging economies that have increased the penetration of smart devices. The increased use of smartphones, personal computers and video cameras has increased the demand for BTB connectors. Growing digitization in all industries has increased the use and demand for BTB connectors in medical devices, data centers, portable and security solutions systems. The growing production volume of BTB connectors has increased the demand-specification ratio of the BTB connectors market. The global production volume of BTB connectors was 3,870.57 million units in 2016 and is projected to reach 5,100.83 million units by 2024. The growing adoption of the Internet of Things (IoT) has driven the growth of the BTB connector market. The growing need for automation has led to the emergence of advanced technology that requires BTB connectors for efficient operation. The evolving automotive industry has provided opportunities for BTB connectors with the introduction of electric vehicles of the future. In the consumer electronics market, the consumption of BTB connectors was the highest. The reduction of the price difference between different brands and market players has affected the market for BTB connectors. The increase in product performance also increases the need for BTB connectors. Evolving product types and exemplary after-sales services have contributed to the growth of the BTB connector market. The premium or premium market was found to have the largest share of the BTB connector market.

Key Market Drivers

Market Overview
Forecast Period2024-2028
Market Size 2022USD 12.2 billion
Market Size 2028USD 16.93 billion
CAGR 2023-20285.45%
Fastest Growing SegmentSockets
Largest MarketAsia-Pacific

Rapid Advancements in Electronics and Consumer Devices:

Rapid advancements in electronics and the continuous evolution of consumer devices are among the primary drivers propelling the Global Board-to-Board Connectors Market. This driver is rooted in the dynamic and ever-changing landscape of technology, where innovations and upgrades in electronic devices are constant. Let's delve deeper into how these advancements are driving the demand for board-to-board connectors.

Consumer electronics, such as smartphones, tablets, laptops, wearables, and smart home devices, are at the forefront of technological innovation. These devices have become an integral part of modern life, and consumers expect them to be increasingly powerful, compact, and feature-rich. To meet these expectations, manufacturers must continuously advance the internal components, which necessitates smaller and more sophisticated board-to-board connectors. Consumers and industries alike demand smaller and more lightweight electronic devices. Whether it's a thinner smartphone, a sleeker laptop, or a compact wearable, miniaturization is a dominant trend. Board-to-board connectors are crucial in achieving miniaturization goals. These connectors allow for the stacking of printed circuit boards (PCBs) in tight spaces within a device, conserving precious real estate and enabling a sleek, compact design. Advancements in electronics often involve increasing the density of components on PCBs. As more functionality is packed into smaller areas, the interconnection between PCBs becomes more challenging. Board-to-board connectors play a pivotal role in ensuring reliable connections between densely populated PCBs, facilitating data transmission, power delivery, and signal integrity. Electronics manufacturers require board-to-board connectors that offer flexibility in design and customization. Different devices may have unique requirements for the positioning and orientation of PCBs. Connectors that can be tailored to specific design needs, such as right-angle connectors or mezzanine connectors, are essential in accommodating diverse electronic designs. Many consumer devices demand high-speed data transfer capabilities to handle large files, high-definition media streaming, and seamless connectivity. Board-to-board connectors designed for high-speed data transmission enable devices to meet these demands. They ensure minimal signal loss and maintain data integrity even at high data rates. Consumers expect their electronic devices to be reliable and durable. Board-to-board connectors must withstand the rigors of everyday use, including plugging and unplugging, temperature variations, and physical stress. Robust connectors contribute to the overall reliability and longevity of electronic products. Wearable devices and the Internet of Things (IoT) are driving a new wave of consumer electronics. These devices often have unique form factors and connectivity requirements. Board-to-board connectors are adapted to meet the specific needs of wearables and IoT devices, ensuring seamless integration and reliable performance.

In summary, the rapid advancements in electronics and consumer devices are driving the demand for board-to-board connectors that can keep pace with evolving technologies. These connectors are vital components that enable the miniaturization of devices, accommodate high-speed data transmission, offer flexibility in design, and ensure reliability and durability. As consumer expectations for smaller, more powerful, and feature-rich electronics continue to grow, board-to-board connectors play a critical role in making these innovations a reality..

Growing Demand for High-Speed Data Transmission:

The growing demand for high-speed data transmission is a significant driver fueling the Global Board-to-Board Connectors Market. This driver is closely linked to the increasing reliance on fast and efficient data exchange in various industries and applications. Let's explore how the demand for high-speed data transmission is shaping the board-to-board connectors market: In today's digital era, data-intensive applications have become ubiquitous across multiple sectors. Whether it's streaming high-definition videos, real-time gaming, cloud computing, or big data analytics, these applications require rapid data transmission to deliver a seamless user experience. Board-to-board connectors play a critical role in ensuring that data flows smoothly between interconnected components within electronic devices. The global rollout of 5G technology is a significant catalyst for the demand for high-speed data transmission. 5G networks offer dramatically increased data transfer rates, reduced latency, and enhanced network reliability. As 5G infrastructure expands, electronic devices need to be equipped with connectors capable of handling the higher data speeds. Board-to-board connectors designed for high-speed data transmission are essential components in 5G-enabled devices, including smartphones, IoT devices, and networking equipment. The automotive industry is undergoing a transformation with the development of autonomous vehicles. These vehicles require real-time data communication not only within the vehicle itself but also with other vehicles and infrastructure (V2X communication). High-speed board-to-board connectors facilitate the exchange of data between the various sensors, processors, and communication modules in autonomous vehicles, ensuring safe and efficient operation. The Internet of Things (IoT) ecosystem relies on seamless connectivity and rapid data transmission. IoT devices collect and transmit data from various sensors and sensors to central processing units or cloud servers. Edge computing, which processes data closer to the source rather than relying solely on centralized cloud servers, also demands fast data transmission. Board-to-board connectors enable these devices and systems to transmit data swiftly and efficiently, supporting real-time decision-making and data analysis. Data centers are the backbone of the digital world, hosting vast amounts of data and providing cloud services. Within data centers, board-to-board connectors facilitate high-speed data transmission between servers, storage devices, and networking equipment. The need for rapid data transfer within data centers is essential for delivering services with low latency and high availability. Industrial automation and robotics applications require real-time communication and precise synchronization. Board-to-board connectors used in these applications enable high-speed data transmission between control units, sensors, actuators, and robotic arms. Fast and reliable data exchange is crucial for achieving efficiency and precision in manufacturing and automation processes. In the aerospace and defense sectors, high-speed data transmission is essential for communication, surveillance, and mission-critical applications. Board-to-board connectors used in avionics, radar systems, and communication equipment must meet stringent requirements for data integrity and speed to ensure the success and safety of missions.

In summary, the growing demand for high-speed data transmission is a fundamental driver of the board-to-board connectors market. As technology continues to advance and data-intensive applications become more prevalent, the need for connectors capable of handling rapid data exchange is paramount. Board-to-board connectors play a pivotal role in supporting the development of cutting-edge technologies, from 5G networks and autonomous vehicles to IoT.

Key Market Challenges

The Global Board-to-Board Connectors Market is undoubtedly thriving due to the increasing demand for high-speed data transmission and the proliferation of electronic devices. However, like any other industry, it faces several challenges that must be addressed to sustain growth and innovation. Here are three significant challenges facing the Global Board-to-Board Connectors Market:

Miniaturization and High-Density Packaging:

Miniaturization and high-density packaging represent a significant challenge in the global Board-to-Board Connectors Market. As electronic devices continue to evolve towards smaller and more compact form factors while packing in greater functionality, the demand for connectors that can meet these requirements has surged. This challenge revolves around the need to create connectors that are not only smaller in size but also capable of handling high-speed data transmission, power delivery, and signal integrity without compromising performance or reliability.

Electronic devices, ranging from smartphones and tablets to wearables and IoT sensors, are becoming increasingly compact. As a result, the space available for components such as connectors is shrinking. In some cases, connectors need to fit into confined spaces within the device's casing, leaving minimal room for traditional connectors. This demands the development of miniature connectors that can function effectively within these tight constraints.

While devices are getting smaller, they are also becoming more feature-rich. This means that connectors need to accommodate a growing number of pins or contacts to support various functions, including data transmission, power supply, and sensor interfaces. These connectors must deliver high performance despite their reduced size, which adds to the complexity of design. The demand for high-speed data transmission is relentless, driven by the need for faster data processing and seamless connectivity. Board-to-board connectors must facilitate rapid data exchange, especially in applications involving video streaming, gaming, 5G connectivity, and high-performance computing. Achieving this in miniature connectors requires addressing signal integrity challenges, including impedance mismatches and signal loss. Miniaturization can exacerbate signal integrity issues, including crosstalk, electromagnetic interference (EMI), and attenuation. As connectors are placed closer together in high-density packaging, the risk of signal interference rises. Maintaining signal integrity is crucial to ensure reliable data transmission and prevent data corruption or loss. Manufacturing and assembling miniature connectors can be intricate and require advanced techniques. Handling tiny components with precision is a delicate process that demands specialized equipment and skilled labor. The assembly process needs to be efficient to keep production costs in check, but it must also ensure that connectors are correctly aligned and securely connected. Miniature connectors need to be constructed from materials that can withstand environmental factors, such as temperature fluctuations, moisture, and physical stress. Ensuring that these connectors are durable while remaining small and lightweight is a materials engineering challenge. Different applications require specific connector configurations, pin counts, orientations, and contact styles. This level of customization can be challenging to achieve while maintaining standardized and interoperable connectors. Balancing customization with the ability to plug and play connectors across various devices and systems is an ongoing challenge. Addressing the challenge of miniaturization and high-density packaging in the board-to-board connectors market requires a multi-faceted approach. Manufacturers need to invest in research and development to create innovative connector designs that optimize space, performance, and signal integrity. Advanced materials with low dielectric constants and controlled impedance characteristics play a crucial role in minimizing signal degradation. Additionally, the use of surface-mount technology (SMT) and precision molding can enhance the manufacturing process of miniature connectors. Collaboration between connector manufacturers and industries that rely on these components is essential. Manufacturers must work closely with electronics companies to understand their specific requirements and develop customized solutions that meet their needs. Standardization efforts within the industry can also help strike a balance between customization and interoperability.

In conclusion, the challenge of miniaturization and high-density packaging in the global Board-to-Board Connectors Market underscores the need for continuous innovation, advanced materials, and collaborative partnerships to meet the demands of modern electronic devices and applications..

Signal Integrity and Data Speeds:

With the increasing demand for high-speed data transmission, maintaining signal integrity has become a paramount challenge in the board-to-board connectors market. Signal integrity issues, such as impedance mismatches, crosstalk, and signal loss, can degrade data transmission quality and reliability. The connectors must be designed to minimize these issues, especially when dealing with data rates in the gigabit per second (Gbps) range or higher. Overcoming this challenge necessitates rigorous testing, simulation, and modeling of connector designs to ensure that they meet signal integrity requirements. Advanced materials with low dielectric constant and controlled impedance characteristics are used to minimize signal degradation. Additionally, connectors with improved shielding and grounding mechanisms can help mitigate signal integrity issues. As data speeds continue to increase, ongoing research and development efforts are essential to stay ahead of the curve.

Customization and Interoperability:

The demand for customization in board-to-board connectors has surged as various industries require connectors tailored to their specific applications and design requirements. However, customization can pose a challenge in terms of cost, lead times, and interoperability. Creating custom connectors can be time-consuming and expensive, and it may lead to difficulties in integrating these connectors into standardized systems or devices. To address this challenge, manufacturers are increasingly offering configurable connectors that strike a balance between customization and interoperability. These connectors allow customers to choose from a range of options, such as pin counts, orientations, and contact styles, to match their unique needs without the complexity of full customization. Standardization efforts and the adoption of industry standards for connectors also play a role in ensuring interoperability across different devices and systems. In conclusion, while the Global Board-to-Board Connectors Market is thriving due to the demand for high-speed data transmission and miniaturization, it faces challenges related to miniaturization and high-density packaging, signal integrity and data speeds, and customization and interoperability. Overcoming these challenges requires ongoing research, innovation in connector design and materials, and collaboration between manufacturers and industries to develop solutions that meet the evolving needs of electronic devices and applications.

Key Market Trends

High-Speed Data Transmission Requirements:

One of the prominent trends in the Global Board-to-Board Connectors Market is the increasing demand for high-speed data transmission capabilities. As electronic devices continue to incorporate features like 5G connectivity, high-definition video streaming, and real-time data processing, the need for connectors that can support rapid data exchange has surged.Applications such as data centers, telecommunications infrastructure, gaming consoles, and automotive electronics require connectors that can handle data rates in the gigabit and terabit per second range. This trend is pushing connector manufacturers to develop high-speed solutions with enhanced signal integrity and reduced latency.

Impedance Matching: To ensure minimal signal loss and avoid electromagnetic interference (EMI), connectors must offer precise impedance matching. Connectors designed for high-speed data transmission often incorporate controlled impedance features and low-loss materials to maintain signal integrity, making them suitable for emerging technologies like PCIe (Peripheral Component Interconnect Express) and Thunderbolt.

Parallel and Serial Interfaces: Connectors supporting high-speed data transmission are available in both parallel and serial configurations. While parallel interfaces allow for data transmission across multiple lanes simultaneously, serial interfaces offer more straightforward routing and lower latency, making them suitable for compact devices and high-speed backplanes...

Miniaturization and High-Density Packaging:

The relentless drive toward smaller and more compact electronic devices is another prevailing trend in the Board-to-Board Connectors Market. This trend aligns with the broader industry goal of achieving higher functionality within smaller form factors, whether in consumer electronics, medical devices, or industrial equipment. Miniaturization efforts have led to the development of miniature board-to-board connectors that occupy minimal space on PCBs. These connectors are essential for applications like smartphones, wearables, and IoT devices, where every millimeter of space is valuable.High-density packaging involves placing connectors closer together on PCBs, optimizing space utilization. This trend is particularly relevant in industries like aerospace, where weight and size constraints are critical, as well as data center equipment where space efficiency is paramount. To support miniaturization and high-density packaging, connector manufacturers are investing in advanced materials and manufacturing techniques. Materials with low dielectric constants and controlled impedance characteristics help mitigate signal integrity challenges associated with compact connectors. The demand for application-specific connectors and customized solutions is on the rise in the Board-to-Board Connectors Market. As industries diversify and develop specialized applications, connectors need to adapt to unique requirements. Various industries, including automotive, medical, aerospace, and industrial automation, require connectors tailored to their specific needs. For example, automotive connectors may need to withstand extreme temperature ranges and vibrations, while medical connectors must adhere to strict sterilization standards. Connector customization extends to factors such as pin counts, orientations (right-angle or vertical), and contact styles (surface-mount, through-hole, or press-fit). Custom connectors are designed to fit seamlessly into a particular device or system. While customization is essential, maintaining interoperability between different components and systems remains a challenge. Connector manufacturers must strike a balance between providing tailored solutions and ensuring compatibility with standardized interfaces. These trends in the Global Board-to-Board Connectors Market reflect the ongoing evolution of electronic devices and their connectivity needs. To remain competitive, connector manufacturers are investing in research and development to meet the demands of high-speed data transmission, miniaturization, and customization while upholding performance and reliability standards. Collaboration with industry stakeholders and adherence to global standards are vital for driving innovation in this dynamic market.

Segmental Insights

Type Insights

On the basis of type, the socket segment is expected to have the highest CAGR during the forecast period time period The socket segment is growing at the highest CAGR in the PCB connector market. The sockets offer great flexibility and interchangeability, which allows easy replacement and component reconfiguration. This feature is valuable for fields that change frequently or upgrading of electronic equipment is common, for example in consumer electronics or telecommunications. Card-to-board connectors are compatible with many card-to-board connectors, which makes them suitable for a wide range of applications and industries. Hence, growth in industries such as because consumer electronics have a positive impact on the demand for sockets.

Regional Insights

In 2022, the Asia-Pacific region emerged as the largest market for board-to-board connectors, accounting for the majority of the global market share. This dominance is anticipated to persist and even strengthen over the forecast period for several key reasons: Manufacturing Hub: APAC, particularly countries like China, Taiwan, South Korea, and Japan, serves as a global manufacturing hub for electronics and consumer devices. The region's robust electronics industry, which includes the production of smartphones, tablets, laptops, and other electronic gadgets, drives substantial demand for board-to-board connectors. APAC is at the forefront of technological innovation and adoption. The region continuously witnesses the introduction of cutting-edge electronic products that require advanced board-to-board connectors to enable seamless data transmission and power distribution. As consumer preferences shift toward high-performance, feature-rich devices, the demand for sophisticated connectors in APAC remains high. The automotive and industrial sectors in APAC are experiencing significant growth. These sectors increasingly rely on board-to-board connectors for applications like vehicle electronics, factory automation, robotics, and industrial control systems. The expansion of these industries further fuels the demand for connectors in the region. The rapid expansion of telecommunications networks, including the deployment of 5G infrastructure, drives demand for high-speed, reliable connectors. APAC countries are investing heavily in upgrading their telecommunications infrastructure, creating substantial opportunities for board-to-board connector manufacturers. APAC has a large and growing consumer electronics market. With a rising middle-class population and increased disposable income, consumers in the region are adopting a wide range of electronic gadgets. This surge in consumer electronics, including smartphones, smart TVs, and wearable devices, contributes significantly to the demand for connectors. APAC boasts a well-established manufacturing ecosystem that includes semiconductor fabrication, PCB manufacturing, and assembly. The proximity of these manufacturing facilities to connector suppliers fosters collaboration and cost-effective production, further driving the dominance of APAC in the board-to-board connectors market.

Given these factors, the Asia-Pacific region is expected to maintain its leading position in the Global Board-to-Board Connectors Market in the coming years. The region's vibrant electronics industry, technological advancements, and expanding application areas will continue to propel the demand for board-to-board connectors, making APAC a focal point for market growth and innovation..

Key Market Players

ANSYS, Inc

AMPHENOL

Molex

Foxconn

JAE

DELPHI

Samtec

JST

Hirose.

HARTING

Report Scope:

In this report, the Global Board-to-Board Connectors Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Global Board-to-Board Connectors Market, By Type:

  • Pin Headers
  • Sockets

Global Board-to-Board Connectors Market, By Pin Headers:

  • Stacked
  • Shrouded

Global Board-to-Board Connectors Market, By End User:

  • Less Than 1 mm
  • 1 mm to 2mm
  • Greater Than 2 mm

Global Board-to-Board Connectors Market, By Application:

  • Consumer Electronics
  • Industrial Automation

Global Hazard Control Market, By Region:

  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
  • Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • South America
  • Brazil
  • Argentina
  • Colombia
  • Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

  • Company Profiles: Detailed analysis of the major companies present in the Global Board-to-Board Connectors Market.

Available Customizations:

  • Global Board-to-Board Connectors Market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

4. Voice of Customers

5. Global Board-to-Board Connectors Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (Pin Headers, and Sockets)
    • 5.2.2. By Pin Headers (Stacked & Shrouded)
    • 5.2.3. By Pitch (Less Than 1 mm, 1 mm to 2mm, Greater Than 2 mm)
    • 5.2.4. By Application (Consumer Electronics, Industrial Automation)
    • 5.2.5. By Region
  • 5.3. By Company (2022)
  • 5.4. Market Map

6. North America Board-to-Board Connectors Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Pin Headers
    • 6.2.3. By Pitch
    • 6.2.4. By Application
    • 6.2.5. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Board-to-Board Connectors Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Pin Headers
        • 6.3.1.2.3. By Pitch
        • 6.3.1.2.4. By Application
    • 6.3.2. Canada Board-to-Board Connectors Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Pin Headers
        • 6.3.2.2.3. By Pitch
        • 6.3.2.2.4. By Application
    • 6.3.3. Mexico Board-to-Board Connectors Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Pin Headers
        • 6.3.3.2.3. By Pitch
        • 6.3.3.2.4. By Application

7. Asia-Pacific Board-to-Board Connectors Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Pin Headers
    • 7.2.3. By Pitch
    • 7.2.4. By Application
    • 7.2.5. By Country
  • 7.3. Asia-Pacific: Country Analysis
    • 7.3.1. China Board-to-Board Connectors Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Pin Headers
        • 7.3.1.2.3. By Pitch
        • 7.3.1.2.4. By Application
    • 7.3.2. India Board-to-Board Connectors Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Pin Headers
        • 7.3.2.2.3. By Pitch
        • 7.3.2.2.4. By Application
    • 7.3.3. Japan Board-to-Board Connectors Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Pin Headers
        • 7.3.3.2.3. By Pitch
        • 7.3.3.2.4. By Application
    • 7.3.4. South Korea Board-to-Board Connectors Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Pin Headers
        • 7.3.4.2.3. By Pitch
        • 7.3.4.2.4. By Application
    • 7.3.5. Australia Board-to-Board Connectors Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Pin Headers
        • 7.3.5.2.3. By Pitch
        • 7.3.5.2.4. By Application

8. Europe Board-to-Board Connectors Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Pin Headers
    • 8.2.3. By Pitch
    • 8.2.4. By Application
    • 8.2.5. By Country
  • 8.3. Europe: Country Analysis
    • 8.3.1. Germany Board-to-Board Connectors Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Pin Headers
        • 8.3.1.2.3. By Pitch
        • 8.3.1.2.4. By Application
    • 8.3.2. United Kingdom Board-to-Board Connectors Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Pin Headers
        • 8.3.2.2.3. By Pitch
        • 8.3.2.2.4. By Application
    • 8.3.3. France Board-to-Board Connectors Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Pin Headers
        • 8.3.3.2.3. By Pitch
        • 8.3.3.2.4. By Application
    • 8.3.4. Italy Board-to-Board Connectors Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By Pin Headers
        • 8.3.4.2.3. By Pitch
        • 8.3.4.2.4. By Application
    • 8.3.5. Spain Board-to-Board Connectors Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By Pin Headers
        • 8.3.5.2.3. By Pitch
        • 8.3.5.2.4. By Application

9. South America Board-to-Board Connectors Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Pin Headers
    • 9.2.3. By Pitch
    • 9.2.4. By Application
    • 9.2.5. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Board-to-Board Connectors Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Pin Headers
        • 9.3.1.2.3. By Pitch
        • 9.3.1.2.4. By Application
    • 9.3.2. Argentina Board-to-Board Connectors Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Pin Headers
        • 9.3.2.2.3. By Pitch
        • 9.3.2.2.4. By Application
    • 9.3.3. Colombia Board-to-Board Connectors Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Pin Headers
        • 9.3.3.2.3. By Pitch
        • 9.3.3.2.4. By Application

10. Middle East & Africa Board-to-Board Connectors Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Component
    • 10.2.2. By Application
    • 10.2.3. By End User
    • 10.2.4. By Country
  • 10.3. Middle East & Africa: Country Analysis
    • 10.3.1. Saudi Arabia Board-to-Board Connectors Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Pin Headers
        • 10.3.1.2.3. By Pitch
        • 10.3.1.2.4. By Application
    • 10.3.2. South Africa Board-to-Board Connectors Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Pin Headers
        • 10.3.2.2.3. By Pitch
        • 10.3.2.2.4. By Application
    • 10.3.3. UAE Board-to-Board Connectors Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Pin Headers
        • 10.3.3.2.3. By Pitch
        • 10.3.3.2.4. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenge

12. Market Trends & Developments

13. Company Profiles

  • 13.1. ANSYS, Inc
    • 13.1.1. Business Overview
    • 13.1.2. Key Revenue and Financials
    • 13.1.3. Recent Developments
    • 13.1.4. Key Personnel
    • 13.1.5. Key Product/Services
  • 13.2. AMPHENOL
    • 13.2.1. Business Overview
    • 13.2.2. Key Revenue and Financials
    • 13.2.3. Recent Developments
    • 13.2.4. Key Personnel
    • 13.2.5. Key Product/Services
  • 13.3. Molex
    • 13.3.1. Business Overview
    • 13.3.2. Key Revenue and Financials
    • 13.3.3. Recent Developments
    • 13.3.4. Key Personnel
    • 13.3.5. Key Product/Services
  • 13.4. Foxconn
    • 13.4.1. Business Overview
    • 13.4.2. Key Revenue and Financials
    • 13.4.3. Recent Developments
    • 13.4.4. Key Personnel
    • 13.4.5. Key Product/Services
  • 13.5. JAE
  • 13.6. DELPHI
    • 13.6.1. Business Overview
    • 13.6.2. Key Revenue and Financials
    • 13.6.3. Recent Developments
    • 13.6.4. Key Personnel
    • 13.6.5. Key Product/Services
  • 13.7. Samtec
    • 13.7.1. Business Overview
    • 13.7.2. Key Revenue and Financials
    • 13.7.3. Recent Developments
    • 13.7.4. Key Personnel
    • 13.7.5. Key Product/Services
  • 13.8. JST
    • 13.8.1. Business Overview
    • 13.8.2. Key Revenue and Financials
    • 13.8.3. Recent Developments
    • 13.8.4. Key Personnel
    • 13.8.5. Key Product/Services
  • 13.9. Hirose.
    • 13.9.1. Business Overview
    • 13.9.2. Key Revenue and Financials
    • 13.9.3. Recent Developments
    • 13.9.4. Key Personnel
    • 13.9.5. Key Product/Services
  • 13.10. HARTING
    • 13.10.1. Business Overview
    • 13.10.2. Key Revenue and Financials
    • 13.10.3. Recent Developments
    • 13.10.4. Key Personnel
    • 13.10.5. Key Product/Services

14. Strategic Recommendations

15. About Us & Disclaimer