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1406469

无线通讯晶片组市场 - 2018-2028 年全球产业规模、份额、趋势、机会和预测，按产品、类型、最终用户应用、地区和竞争细分

Wireless Communication Chipset Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product, By Type, By End User Application, By Region, and By Competition, 2018-2028
出版日期: | 出版商: TechSci Research | 英文 178 Pages | 商品交期: 2-3个工作天内

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简介目录

由于各种应用对无缝连接的需求不断增长，全球无线通讯晶片组市场正在蓬勃发展。随着技术进步不断彻底改变我们与周围世界沟通、工作和互动的方式，无线通讯晶片组处于实现这一转变的最前沿。

该市场的主要驱动因素包括5G 技术的快速部署、物联网(IoT) 生态系统的扩展、Wi-Fi 和蓝牙在组合晶片组中的融合，以及无线连接在消费性电子产品、智慧家庭和工业领域的日益普及。自动化。这些驱动因素共同推动了市场的成长，为晶片组製造商创造了创新和满足不同产业需求的机会。

此外，无线通讯晶片组的影响力扩展到各个领域，包括消费性电子、医疗保健、汽车和工业应用。从智慧型手机和穿戴式装置到智慧家庭和连网工厂，晶片组是连接、提高效率、生产力和便利性的关键。

市场概况
预测期 2024-2028
2022 年市场规模 167.2亿美元
2028 年市场规模 318.1亿美元
2023-2028 年CAGR 11.15%
成长最快的细分市场 嵌入式无线模组
最大的市场 北美洲

儘管市场潜力巨大，但并非没有挑战。复杂的标准和协议、频谱分配限制、安全问题以及对节能解决方案的需求给晶片组製造商带来了持续的挑战。此外，监管合规性和新兴技术的动态特性需要不断适应。

目录

第 1 章：产品概述

  • 市场定义
  • 市场范围
    • 涵盖的市场
    • 考虑学习的年份
    • 主要市场区隔

第 2 章：研究方法

  • 基线方法
  • 主要产业伙伴
  • 主要协会和二手资料来源
  • 预测方法
  • 数据三角测量与验证
  • 假设和限制

第 3 章：执行摘要

第 4 章：COVID-19 对全球无线通讯晶片组市场的影响

第 5 章：客户之声

第 6 章：全球无线通讯晶片组市场概述

第 7 章：全球无线通讯晶片组市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 依产品分类（路由器方案无线模组、嵌入式无线模组）
    • 按类型（Wi-Fi 独立式、蓝牙独立式、Wi-Fi 和蓝牙组合、低功耗无线 IC）
    • 按最终用户应用（消费者、企业、手机、汽车、工业、其他）
    • 按地区（北美、欧洲、南美、中东和非洲、亚太地区）
  • 按公司划分 (2022)
  • 市场地图

第 8 章：北美无线通讯晶片组市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按产品分类
    • 按类型
    • 按最终用户应用程式
    • 按国家/地区

第 9 章：欧洲无线通讯晶片组市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按产品分类
    • 按类型
    • 按最终用户应用程式
    • 按国家/地区

第10章：南美无线通讯晶片组市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按产品分类
    • 按类型
    • 按最终用户应用程式
    • 按国家/地区

第 11 章：中东和非洲无线通讯晶片组市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 按产品分类
    • 按类型
    • 按最终用户应用程式
    • 按国家/地区

第12章：亚太地区无线通讯晶片组市场展望

  • 市场规模及预测
    • 按价值
  • 市场规模及预测
    • 按产品分类
    • 按类型
    • 按最终用户应用程式
    • 按国家/地区

第 13 章：市场动态

  • 司机
  • 挑战

第 14 章：市场趋势与发展

第 15 章：公司简介

  • 高通科技公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • 博通公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • 联发科公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • 英特尔公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • 德州仪器公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • 恩智浦半导体公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • 三星电子有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • 意法半导体公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • Skyworks 解决方案公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered
  • Qorvo 公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel
    • Key Product/Services Offered

第 16 章：策略建议

第 17 章：关于我们与免责声明

简介目录
Product Code: 19486

The Global Wireless Communication Chipset Market is thriving, driven by the increasing demand for seamless connectivity across a wide spectrum of applications. As technological advancements continue to revolutionize the way we communicate, work, and interact with the world around us, wireless communication chipsets are at the forefront of enabling this transformation.

Key drivers of this market include the rapid deployment of 5G technology, expanding Internet of Things (IoT) ecosystems, the convergence of Wi-Fi and Bluetooth in combo chipsets, and the growing adoption of wireless connectivity in consumer electronics, smart homes, and industrial automation. These drivers collectively fuel the growth of the market, creating opportunities for chipset manufacturers to innovate and cater to diverse industry needs.

Moreover, the influence of wireless communication chipsets extends to a variety of sectors, including consumer electronics, healthcare, automotive, and industrial applications. From smartphones and wearables to smart homes and connected factories, chipsets are the linchpin of connectivity, driving efficiency, productivity, and convenience.

Market Overview
Forecast Period2024-2028
Market Size 2022USD 16.72 Billion
Market Size 2028USD 31.81 Billion
CAGR 2023-202811.15%
Fastest Growing SegmentEmbedded Wireless Module
Largest MarketNorth America

While the market's potential is vast, it is not without its challenges. Complex standards and protocols, spectrum allocation constraints, security concerns, and the need for power-efficient solutions pose ongoing challenges for chipset manufacturers. Additionally, regulatory compliance and the dynamic nature of emerging technologies require constant adaptation.

Key Market Drivers

Proliferation of 5G Technology and Devices

The widespread adoption of 5G technology and devices represents a significant driver for the global Wireless Communication Chipset market. 5G, the fifth generation of wireless communication technology, promises a quantum leap in network performance, including dramatically higher data speeds, lower latency, and increased device connectivity. This advancement is set to revolutionize a wide range of industries, from telecommunications and healthcare to automotive and manufacturing.

Wireless communication chipsets form the core components of 5G infrastructure and devices, enabling them to harness the full potential of this technology. Chipset manufacturers have been diligently working on developing and commercializing 5G-ready chipsets that can support the high-frequency bands, massive data throughput, and low-latency requirements of 5G networks.

As the global rollout of 5G continues, the demand for compatible chipsets is poised to soar. Beyond smartphones and tablets, 5G chipsets will find applications in connected cars, smart cities, augmented reality (AR) and virtual reality (VR) devices, and industrial IoT solutions. The evolving 5G landscape is a driving force behind innovation in the Wireless Communication Chipset market, propelling the development of chipsets with enhanced capabilities to support this transformative technology.

Internet of Things (IoT) Proliferation

The rapid expansion of the Internet of Things (IoT) ecosystem is a major driver of the global Wireless Communication Chipset market. IoT encompasses a vast array of connected devices, ranging from smart thermostats and wearables to industrial sensors and agricultural equipment. These devices rely on wireless communication chipsets to enable connectivity and data exchange.

The demand for IoT connectivity is steadily rising across multiple sectors, including healthcare, agriculture, logistics, and smart cities. Wireless communication chipsets designed for IoT applications must strike a balance between power efficiency, range, and data throughput to support various use cases.

Moreover, IoT deployment extends beyond traditional urban environments, necessitating chipsets that can operate in diverse and challenging conditions, such as remote agricultural fields or industrial facilities. As the IoT landscape continues to expand, chipset manufacturers are driven to develop specialized chipsets that cater to a wide range of IoT applications, fostering growth in the market.

Evolving Wi-Fi Standards: Wi-Fi 6 and Wi-Fi 6E

The evolution of Wi-Fi standards, including Wi-Fi 6 (802.11ax) and Wi-Fi 6E, is driving innovation and growth in the Wireless Communication Chipset market. These standards offer enhanced network efficiency, increased capacity, reduced latency, and improved overall performance compared to previous generations.

Wi-Fi 6E, in particular, operates in the 6 GHz frequency band, providing additional spectrum for high-performance wireless communication. This extended bandwidth facilitates faster data rates, making it well-suited for applications like video streaming, online gaming, and IoT.

Consumers and businesses are increasingly adopting Wi-Fi 6 and Wi-Fi 6E routers and devices to benefit from improved connectivity and speed. Chipset manufacturers are responding to this demand by developing chipsets that support these standards, ensuring that users can fully exploit the advantages of these advanced Wi-Fi technologies.

Rise of Edge Computing and Edge AI

Edge computing and edge artificial intelligence (AI) are emerging as transformative technologies, creating new opportunities for the Wireless Communication Chipset market. Edge computing involves processing data closer to the source of data generation, reducing latency and enabling real-time decision-making.

Wireless communication chipsets play a crucial role in enabling edge devices to communicate efficiently and process data locally. These chipsets are integral to tasks such as image recognition, video analytics, and predictive maintenance at the network edge.

Moreover, edge AI is becoming increasingly essential for tasks like voice recognition, facial recognition, and natural language processing. Chipsets with AI acceleration capabilities are driving the development of innovative applications that can perform advanced AI processing on devices with limited computing resources.

As industries embrace the potential of edge computing and edge AI, chipset manufacturers are developing chipsets that can handle AI workloads at the edge, opening new growth avenues in various sectors, including manufacturing, healthcare, and autonomous vehicles.

Growing Demand for Wearables and Smart Devices

The growing demand for wearables, smart devices, and connected consumer electronics is a significant driver of the global Wireless Communication Chipset market. These devices include smartwatches, fitness trackers, earbuds, and smart home gadgets.

Consumers seek seamless connectivity and integration between their devices, and wireless communication chipsets enable this connectivity. Chipset manufacturers are continuously innovating to deliver chipsets that are power-efficient, compact, and capable of supporting various connectivity standards such as Bluetooth, Wi-Fi, and cellular technologies.

The wearables market, in particular, has witnessed substantial growth, with consumers increasingly adopting fitness trackers, health monitoring devices, and smartwatches. These devices rely on wireless communication chipsets to connect to smartphones and cloud services, facilitating data synchronization and enhancing user experiences.

In addition to consumer applications, smart devices are expanding into healthcare, industrial, and commercial sectors. As these markets continue to evolve, the demand for specialized chipsets tailored to the unique requirements of wearables and smart devices is expected to rise, driving growth in the Wireless Communication Chipset market.

Key Market Challenges

Complex Standards and Protocols

The global Wireless Communication Chipset market operates in a complex environment characterized by multiple wireless communication standards and protocols. These standards, such as Wi-Fi, Bluetooth, 4G LTE, 5G, and various IoT protocols, differ in terms of frequency bands, data rates, power consumption, and network coverage. Developing chipsets that support these diverse standards and ensuring interoperability among devices remains a significant challenge.

Manufacturers must invest in extensive research and development to keep up with evolving standards and protocols. They face the challenge of designing chipsets that are versatile enough to handle multiple communication technologies while optimizing power efficiency and minimizing interference. This complexity adds to the cost and time-to-market pressures, making it challenging for chipset manufacturers to meet the diverse requirements of their customers.

Spectrum Allocation and Congestion

As the demand for wireless communication continues to grow, the allocation of radio frequency spectrum becomes increasingly competitive and congested. Governments and regulatory bodies worldwide manage the allocation of spectrum to various wireless communication technologies, including cellular networks, Wi-Fi, and IoT devices.

The challenge for chipset manufacturers lies in designing chipsets that can operate efficiently within crowded spectrum bands. Ensuring robust communication, reducing interference, and optimizing network performance are ongoing challenges. As the demand for wireless connectivity intensifies, chipset manufacturers must also advocate for innovative spectrum management policies and technologies to address these challenges.

Power Consumption and Battery Life

Power consumption is a critical challenge in the development of wireless communication chipsets, particularly for devices with limited battery life, such as smartphones, wearables, and IoT sensors. Consumers and industries demand longer battery life to ensure uninterrupted device operation.

Chipset manufacturers face the constant challenge of developing energy-efficient chipsets that consume minimal power during transmission and reception. Balancing the need for high performance with low power consumption is a delicate task. Additionally, as devices become more complex and capable, addressing power efficiency challenges becomes increasingly intricate.

Efforts are ongoing to design chipsets that incorporate advanced power management features, low-power modes, and optimized algorithms to extend battery life. However, this challenge persists as consumers and industries continue to raise expectations for prolonged device operation.

Security and Privacy Concerns

The proliferation of wireless communication has raised significant security and privacy concerns. Wireless communication chipsets are vulnerable to a wide range of security threats, including eavesdropping, data breaches, and cyberattacks. Ensuring the confidentiality, integrity, and authenticity of transmitted data is paramount.

Manufacturers must continually invest in robust security features within chipsets, including encryption, authentication, and secure boot mechanisms. Moreover, the challenge extends to addressing evolving cybersecurity threats and vulnerabilities.

Privacy is another critical concern, especially with the growing use of wireless communication in IoT devices and smart homes. Data collected and transmitted by these devices must be protected to safeguard user privacy. Regulatory frameworks, such as GDPR, impose strict requirements on data protection, adding complexity to chipset development.

Regulatory Compliance and Certification

The global Wireless Communication Chipset market operates within a complex regulatory landscape that varies from one region to another. Chipset manufacturers must ensure that their products comply with regulatory requirements, including emissions, safety, and frequency allocation rules.

Obtaining the necessary certifications, such as FCC (Federal Communications Commission) certification in the United States or CE (Conformite Europeenne) marking in Europe, is a time-consuming and costly process. Failure to meet regulatory compliance can result in costly recalls, legal issues, and damage to a company's reputation.

Furthermore, emerging technologies and standards may lack established regulatory frameworks, creating uncertainty for chipset manufacturers. They must navigate these challenges while bringing innovative products to market, often requiring significant coordination with regulatory authorities and industry standards bodies.

Key Market Trends

Emergence of 5G Technology and Infrastructure

The rapid rollout of 5G technology and infrastructure represents a transformative trend in the global Wireless Communication Chipset market. 5G, the fifth generation of wireless communication technology, promises significantly higher data speeds, lower latency, and increased connectivity. To support these capabilities, wireless communication chipsets must evolve.

Wireless communication chip manufacturers are developing and commercializing 5G-ready chipsets to meet the growing demand for faster and more reliable connectivity. These chipsets are crucial for enabling a wide range of applications, from enhanced mobile broadband and IoT to smart cities and autonomous vehicles. As 5G networks expand globally, the demand for compatible chipsets is expected to surge, shaping the market's growth trajectory.

IoT Expansion and the Demand for Low-Power Chipsets

The Internet of Things (IoT) continues to expand across industries, connecting billions of devices and sensors. This trend has fueled the demand for low-power wireless communication chipsets, which are essential for IoT devices with limited battery life and processing capabilities.

In response, chipset manufacturers are developing power-efficient solutions, such as narrowband IoT (NB-IoT) and Low-Power Wide-Area Network (LPWAN) chipsets. These chips enable long-range communication with minimal power consumption, making them suitable for a wide range of IoT applications, including smart meters, asset tracking, and environmental monitoring.

As IoT adoption continues to grow, the demand for low-power chipsets will persist, presenting opportunities for innovation in energy-efficient wireless communication technologies.

Integration of AI and ML into Chipsets

Artificial intelligence (AI) and machine learning (ML) are becoming integral to wireless communication chipsets. These technologies enable chipsets to enhance performance, optimize network management, and improve user experiences. For example, AI-powered chipsets can intelligently allocate network resources, reduce interference, and predict network congestion.

Furthermore, AI and ML capabilities in chipsets are enabling advanced features in smartphones and other devices, including voice recognition, image processing, and real-time language translation. This trend is not only enhancing user experiences but also opening new avenues for the development of AI-driven applications that rely on efficient wireless communication.

Increasing Demand for Wi-Fi 6 and Wi-Fi 6E Chipsets

Wi-Fi 6 (802.11ax) and its extended version, Wi-Fi 6E, have gained significant traction in the wireless communication chipset market. These standards offer faster speeds, improved network efficiency, and reduced latency compared to previous Wi-Fi generations. Wi-Fi 6E, in particular, operates in the 6 GHz frequency band, providing additional spectrum for high-performance wireless communication.

The demand for Wi-Fi 6 and Wi-Fi 6E chipsets is driven by the need for enhanced connectivity in homes, offices, and public spaces, especially as remote work and online activities become more prevalent. Chipset manufacturers are racing to produce Wi-Fi 6 and Wi-Fi 6E solutions to meet this demand, contributing to the overall growth of the market.

Expansion of Edge Computing and Edge AI

Edge computing and edge artificial intelligence (AI) are gaining prominence in the wireless communication chipset market. Edge devices, such as routers, gateways, and edge servers, are increasingly equipped with AI capabilities to process data locally, reducing latency and enhancing real-time decision-making.

Wireless communication chipsets that support edge AI are essential for enabling tasks like image recognition, video analytics, and predictive maintenance at the network edge. As industries harness the power of edge computing to drive efficiency and innovation, the demand for chipsets that can handle AI workloads at the edge is on the rise.

Segmental Insights

Product Insights

Router scheme wireless module segment dominates in the global wireless communication chipset market in 2022. The Router Scheme Wireless Module segment comprises chipsets that are specifically designed for routers, gateways, and network infrastructure devices. These chipsets are engineered to provide high-performance wireless connectivity, offering advanced features such as dual-band Wi-Fi, multi-user support, and secure network management. As such, they play a pivotal role in ensuring seamless and reliable wireless network connections for homes, offices, and industrial settings.

Several factors contribute to the dominance of this segment:

With the proliferation of connected devices and the increasing reliance on the internet for work, education, entertainment, and IoT applications, the demand for high-speed wireless internet has surged. Router scheme wireless modules are at the core of Wi-Fi routers, enabling users to enjoy faster and more stable internet connections.

The consumer market for routers and home networking solutions has been a significant driver for this segment. The need for robust Wi-Fi coverage within homes and offices has led to continuous advancements in router scheme wireless modules. These chipsets enable features like mesh networking, which extends coverage and enhances connectivity.

Type Insights

Wi-Fi & Bluetooth Combo segment dominates in the global wireless communication chipset market in 2022. The Wi-Fi & Bluetooth Combo segment comprises chipsets that integrate both Wi-Fi and Bluetooth connectivity into a single chipset. This integration offers several advantages, making it the preferred choice for a broad range of wireless communication applications.

Several key factors contribute to the dominance of this segment:

Wi-Fi and Bluetooth are two of the most widely used wireless communication technologies globally. The integration of both technologies into a single chipset provides seamless connectivity for a variety of devices, from smartphones and tablets to smart home appliances and IoT devices. This dual functionality simplifies the user experience, enabling devices to connect effortlessly to both Wi-Fi networks and Bluetooth peripherals.

The consumer electronics sector has been a major driver of the Wi-Fi & Bluetooth Combo segment. Smartphones, tablets, laptops, and smart TVs frequently employ these chipsets to enable internet access through Wi-Fi and connectivity with headphones, speakers, and other peripherals via Bluetooth. The convergence of these two technologies enhances the overall user experience, making it a popular choice among consumers.

The IoT landscape heavily relies on Wi-Fi & Bluetooth Combo chipsets for seamless device connectivity and data exchange. These chipsets facilitate communication between IoT devices and the cloud, enabling real-time data monitoring and control. Whether it's smart thermostats, doorbell cameras, or health monitoring wearables, the combination of Wi-Fi and Bluetooth ensures comprehensive IoT device compatibility.

Regional Insights

North America dominates the Global Wireless Communication Chipset Market in 2022. North America, particularly the United States, is home to some of the world's leading technology companies and research institutions. Silicon Valley, in California, is a renowned hub for technology innovation and serves as the birthplace of many cutting-edge technologies. This ecosystem fosters constant innovation in wireless communication chipsets, driving the development of advanced chipsets that set global standards.

North America boasts a robust research and development ecosystem, with significant investments in academia and industry. Leading universities and research institutions collaborate closely with technology companies to drive advancements in wireless communication chipsets. This research-driven approach fuels the development of next-generation chipsets, keeping North American companies at the forefront of the market.

North America has a history of early adoption of emerging wireless technologies. This includes the rapid deployment of 5G networks, the expansion of IoT applications, and the incorporation of wireless communication into various industries. This early adoption not only creates a significant market for wireless communication chipsets but also encourages domestic manufacturers to innovate and develop specialized chipsets to meet diverse demands.

Key Market Players

Qualcomm Technologies, Inc.

Broadcom Inc.

MediaTek Inc.

Intel Corporation

Texas Instruments Incorporated

NXP Semiconductors N.V.

Samsung Electronics Co., Ltd.

STMicroelectronics N.V.

Skyworks Solutions Inc.

Qorvo, Inc.

Report Scope:

In this report, the Global Wireless Communication Chipset Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Wireless Communication Chipset Market, By Product:

  • Router Scheme Wireless Module
  • Embedded Wireless Module

Wireless Communication Chipset Market, By Type:

  • Wi-Fi Standalone
  • Bluetooth Standalone
  • Wi-Fi & Bluetooth Combo
  • Low-power Wireless IC

Wireless Communication Chipset Market, By End User Application:

  • Consumer
  • Enterprise
  • Mobile Handsets
  • Automotive
  • Industrial
  • Others

Wireless Communication Chipset Market, By Region:

  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • South America
  • Brazil
  • Argentina
  • Colombia
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Competitive Landscape

  • Company Profiles: Detailed analysis of the major companies present in the Global Wireless Communication Chipset Market.

Available Customizations:

  • Global Wireless Communication Chipset Market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Baseline Methodology
  • 2.2. Key Industry Partners
  • 2.3. Major Association and Secondary Sources
  • 2.4. Forecasting Methodology
  • 2.5. Data Triangulation & Validation
  • 2.6. Assumptions and Limitations

3. Executive Summary

4. Impact of COVID-19 on Global Wireless Communication Chipset Market

5. Voice of Customer

6. Global Wireless Communication Chipset Market Overview

7. Global Wireless Communication Chipset Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Product (Router Scheme Wireless Module, Embedded Wireless Module)
    • 7.2.2. By Type (Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi & Bluetooth Combo, Low-power Wireless IC)
    • 7.2.3. By End User Application (Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, Others)
    • 7.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
  • 7.3. By Company (2022)
  • 7.4. Market Map

8. North America Wireless Communication Chipset Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Product
    • 8.2.2. By Type
    • 8.2.3. By End User Application
    • 8.2.4. By Country
      • 8.2.4.1. United States Wireless Communication Chipset Market Outlook
        • 8.2.4.1.1. Market Size & Forecast
        • 8.2.4.1.1.1. By Value
        • 8.2.4.1.2. Market Share & Forecast
        • 8.2.4.1.2.1. By Product
        • 8.2.4.1.2.2. By Type
        • 8.2.4.1.2.3. By End User Application
      • 8.2.4.2. Canada Wireless Communication Chipset Market Outlook
        • 8.2.4.2.1. Market Size & Forecast
        • 8.2.4.2.1.1. By Value
        • 8.2.4.2.2. Market Share & Forecast
        • 8.2.4.2.2.1. By Product
        • 8.2.4.2.2.2. By Type
        • 8.2.4.2.2.3. By End User Application
      • 8.2.4.3. Mexico Wireless Communication Chipset Market Outlook
        • 8.2.4.3.1. Market Size & Forecast
        • 8.2.4.3.1.1. By Value
        • 8.2.4.3.2. Market Share & Forecast
        • 8.2.4.3.2.1. By Product
        • 8.2.4.3.2.2. By Type
        • 8.2.4.3.2.3. By End User Application

9. Europe Wireless Communication Chipset Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Product
    • 9.2.2. By Type
    • 9.2.3. By End User Application
    • 9.2.4. By Country
      • 9.2.4.1. Germany Wireless Communication Chipset Market Outlook
        • 9.2.4.1.1. Market Size & Forecast
        • 9.2.4.1.1.1. By Value
        • 9.2.4.1.2. Market Share & Forecast
        • 9.2.4.1.2.1. By Product
        • 9.2.4.1.2.2. By Type
        • 9.2.4.1.2.3. By End User Application
      • 9.2.4.2. France Wireless Communication Chipset Market Outlook
        • 9.2.4.2.1. Market Size & Forecast
        • 9.2.4.2.1.1. By Value
        • 9.2.4.2.2. Market Share & Forecast
        • 9.2.4.2.2.1. By Product
        • 9.2.4.2.2.2. By Type
        • 9.2.4.2.2.3. By End User Application
      • 9.2.4.3. United Kingdom Wireless Communication Chipset Market Outlook
        • 9.2.4.3.1. Market Size & Forecast
        • 9.2.4.3.1.1. By Value
        • 9.2.4.3.2. Market Share & Forecast
        • 9.2.4.3.2.1. By Product
        • 9.2.4.3.2.2. By Type
        • 9.2.4.3.2.3. By End User Application
      • 9.2.4.4. Italy Wireless Communication Chipset Market Outlook
        • 9.2.4.4.1. Market Size & Forecast
        • 9.2.4.4.1.1. By Value
        • 9.2.4.4.2. Market Share & Forecast
        • 9.2.4.4.2.1. By Product
        • 9.2.4.4.2.2. By Type
        • 9.2.4.4.2.3. By End User Application
      • 9.2.4.5. Spain Wireless Communication Chipset Market Outlook
        • 9.2.4.5.1. Market Size & Forecast
        • 9.2.4.5.1.1. By Value
        • 9.2.4.5.2. Market Share & Forecast
        • 9.2.4.5.2.1. By Product
        • 9.2.4.5.2.2. By Type
        • 9.2.4.5.2.3. By End User Application

10. South America Wireless Communication Chipset Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Product
    • 10.2.2. By Type
    • 10.2.3. By End User Application
    • 10.2.4. By Country
      • 10.2.4.1. Brazil Wireless Communication Chipset Market Outlook
        • 10.2.4.1.1. Market Size & Forecast
        • 10.2.4.1.1.1. By Value
        • 10.2.4.1.2. Market Share & Forecast
        • 10.2.4.1.2.1. By Product
        • 10.2.4.1.2.2. By Type
        • 10.2.4.1.2.3. By End User Application
      • 10.2.4.2. Colombia Wireless Communication Chipset Market Outlook
        • 10.2.4.2.1. Market Size & Forecast
        • 10.2.4.2.1.1. By Value
        • 10.2.4.2.2. Market Share & Forecast
        • 10.2.4.2.2.1. By Product
        • 10.2.4.2.2.2. By Type
        • 10.2.4.2.2.3. By End User Application
      • 10.2.4.3. Argentina Wireless Communication Chipset Market Outlook
        • 10.2.4.3.1. Market Size & Forecast
        • 10.2.4.3.1.1. By Value
        • 10.2.4.3.2. Market Share & Forecast
        • 10.2.4.3.2.1. By Product
        • 10.2.4.3.2.2. By Type
        • 10.2.4.3.2.3. By End User Application

11. Middle East & Africa Wireless Communication Chipset Market Outlook

  • 11.1. Market Size & Forecast
    • 11.1.1. By Value
  • 11.2. Market Share & Forecast
    • 11.2.1. By Product
    • 11.2.2. By Type
    • 11.2.3. By End User Application
    • 11.2.4. By Country
      • 11.2.4.1. Saudi Arabia Wireless Communication Chipset Market Outlook
        • 11.2.4.1.1. Market Size & Forecast
        • 11.2.4.1.1.1. By Value
        • 11.2.4.1.2. Market Share & Forecast
        • 11.2.4.1.2.1. By Product
        • 11.2.4.1.2.2. By Type
        • 11.2.4.1.2.3. By End User Application
      • 11.2.4.2. UAE Wireless Communication Chipset Market Outlook
        • 11.2.4.2.1. Market Size & Forecast
        • 11.2.4.2.1.1. By Value
        • 11.2.4.2.2. Market Share & Forecast
        • 11.2.4.2.2.1. By Product
        • 11.2.4.2.2.2. By Type
        • 11.2.4.2.2.3. By End User Application
      • 11.2.4.3. South Africa Wireless Communication Chipset Market Outlook
        • 11.2.4.3.1. Market Size & Forecast
        • 11.2.4.3.1.1. By Value
        • 11.2.4.3.2. Market Share & Forecast
        • 11.2.4.3.2.1. By Product
        • 11.2.4.3.2.2. By Type
        • 11.2.4.3.2.3. By End User Application

12. Asia Pacific Wireless Communication Chipset Market Outlook

  • 12.1. Market Size & Forecast
    • 12.1.1. By Value
  • 12.2. Market Size & Forecast
    • 12.2.1. By Product
    • 12.2.2. By Type
    • 12.2.3. By End User Application
    • 12.2.4. By Country
      • 12.2.4.1. China Wireless Communication Chipset Market Outlook
        • 12.2.4.1.1. Market Size & Forecast
        • 12.2.4.1.1.1. By Value
        • 12.2.4.1.2. Market Share & Forecast
        • 12.2.4.1.2.1. By Product
        • 12.2.4.1.2.2. By Type
        • 12.2.4.1.2.3. By End User Application
      • 12.2.4.2. India Wireless Communication Chipset Market Outlook
        • 12.2.4.2.1. Market Size & Forecast
        • 12.2.4.2.1.1. By Value
        • 12.2.4.2.2. Market Share & Forecast
        • 12.2.4.2.2.1. By Product
        • 12.2.4.2.2.2. By Type
        • 12.2.4.2.2.3. By End User Application
      • 12.2.4.3. Japan Wireless Communication Chipset Market Outlook
        • 12.2.4.3.1. Market Size & Forecast
        • 12.2.4.3.1.1. By Value
        • 12.2.4.3.2. Market Share & Forecast
        • 12.2.4.3.2.1. By Product
        • 12.2.4.3.2.2. By Type
        • 12.2.4.3.2.3. By End User Application
      • 12.2.4.4. South Korea Wireless Communication Chipset Market Outlook
        • 12.2.4.4.1. Market Size & Forecast
        • 12.2.4.4.1.1. By Value
        • 12.2.4.4.2. Market Share & Forecast
        • 12.2.4.4.2.1. By Product
        • 12.2.4.4.2.2. By Type
        • 12.2.4.4.2.3. By End User Application
      • 12.2.4.5. Australia Wireless Communication Chipset Market Outlook
        • 12.2.4.5.1. Market Size & Forecast
        • 12.2.4.5.1.1. By Value
        • 12.2.4.5.2. Market Share & Forecast
        • 12.2.4.5.2.1. By Product
        • 12.2.4.5.2.2. By Type
        • 12.2.4.5.2.3. By End User Application

13. Market Dynamics

  • 13.1. Drivers
  • 13.2. Challenges

14. Market Trends and Developments

15. Company Profiles

  • 15.1. Qualcomm Technologies, Inc.
    • 15.1.1. Business Overview
    • 15.1.2. Key Revenue and Financials
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. Key Product/Services Offered
  • 15.2. Broadcom Inc.
    • 15.2.1. Business Overview
    • 15.2.2. Key Revenue and Financials
    • 15.2.3. Recent Developments
    • 15.2.4. Key Personnel
    • 15.2.5. Key Product/Services Offered
  • 15.3. MediaTek Inc.
    • 15.3.1. Business Overview
    • 15.3.2. Key Revenue and Financials
    • 15.3.3. Recent Developments
    • 15.3.4. Key Personnel
    • 15.3.5. Key Product/Services Offered
  • 15.4. Intel Corporation
    • 15.4.1. Business Overview
    • 15.4.2. Key Revenue and Financials
    • 15.4.3. Recent Developments
    • 15.4.4. Key Personnel
    • 15.4.5. Key Product/Services Offered
  • 15.5. Texas Instruments Incorporated
    • 15.5.1. Business Overview
    • 15.5.2. Key Revenue and Financials
    • 15.5.3. Recent Developments
    • 15.5.4. Key Personnel
    • 15.5.5. Key Product/Services Offered
  • 15.6. NXP Semiconductors N.V.
    • 15.6.1. Business Overview
    • 15.6.2. Key Revenue and Financials
    • 15.6.3. Recent Developments
    • 15.6.4. Key Personnel
    • 15.6.5. Key Product/Services Offered
  • 15.7. Samsung Electronics Co., Ltd.
    • 15.7.1. Business Overview
    • 15.7.2. Key Revenue and Financials
    • 15.7.3. Recent Developments
    • 15.7.4. Key Personnel
    • 15.7.5. Key Product/Services Offered
  • 15.8. STMicroelectronics N.V.
    • 15.8.1. Business Overview
    • 15.8.2. Key Revenue and Financials
    • 15.8.3. Recent Developments
    • 15.8.4. Key Personnel
    • 15.8.5. Key Product/Services Offered
  • 15.9. Skyworks Solutions Inc.
    • 15.9.1. Business Overview
    • 15.9.2. Key Revenue and Financials
    • 15.9.3. Recent Developments
    • 15.9.4. Key Personnel
    • 15.9.5. Key Product/Services Offered
  • 15.10. Qorvo, Inc.
    • 15.10.1. Business Overview
    • 15.10.2. Key Revenue and Financials
    • 15.10.3. Recent Developments
    • 15.10.4. Key Personnel
    • 15.10.5. Key Product/Services Offered

16. Strategic Recommendations

17. About Us & Disclaimer