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市场调查报告书
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航太印刷电路板市场 - 全球产业规模、份额、趋势机会和预测，按平台类型、产品类型、层压材料类型、地区、竞争细分，2019-2029F

Aerospace Printed Circuit Board Market - Global Industry Size, Share, Trends Opportunity, and Forecast, Segmented By Platform Type, By Product Type, By Laminate Material Type, By Region, Competition, 2019-2029F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

2023年，全球航太印刷电路板市场规模达13.8亿美元，预估至2029年复合年增长率为6.54%。了航空航太和国防领域的发展。 PCB 在实现航空电子设备、通讯系统、导航设备和整合到飞机结构中的各种其他电子元件的功能方面发挥关键作用。该市场的特点是对精密、可靠的 PCB 的需求不断增长，这是由于航空航天技术日益复杂以及现代飞机中最先进的电子系统的整合所必需的。

推动航空航天 PCB 市场向前发展的主要催化剂是航空电子和电子技术的不断进步。航空航太业正在经历数位转型，优先考虑轻质、紧凑和高性能的电子系统。因此，对能够满足严格的航空航天规范（包​​括可靠性、耐用性和遵守安全协议）的 PCB 的需求不断增加。

此外，全球范围内商用和军用飞机产量的激增也决定了市场动态。随着航空旅行需求的不断升级和各国国防能力的增强，对电子系统的需求也随之增加，从而推动了对先进航空航天 PCB 的需求。此外，电动和混合动力飞机的发展趋势进一步增强了为满足这些推进系统的独特需求而量身定制的创新 PCB 解决方案的必要性。

在航空航太产业，PCB 製造商注重品质和可靠性，并遵守严格的标准和认证。客製化在航空航天 PCB 市场中至关重要，因为製造商会客製化其产品以满足不同飞机型号的特定要求。此外，人们越来越关注利用材料和製造流程来提高 PCB 性能，同时确保符合法规和安全标准。

从地理来看，北美、欧洲、亚太等主要航空航太製造地区对全球航空航太PCB市场贡献显着。北美主要航空航太公司集中，在技术创新方面处于领先地位。欧洲是着名飞机製造商的所在地，优先考虑永续发展和技术进步。同时，在航空旅行扩张和国防大量投资的推动下，航空航太业蓬勃发展的亚太地区正成为关键参与者。

主要市场驱动因素

航空电子设备的技术进步

商用飞机产量的成长

对轻量化和紧凑型电子系统的需求

向电动和混合动力电动飞机的过渡

严格的安全和监管标准

增加国防和军事开支

针对特定航太应用的客製化

航太製造的全球扩张

主要市场挑战

严格的认证和合规要求

航太应用的复杂性

高成本製造和材料费用

快速的技术变革

供应链中断和零件短缺

环境法规和材料永续性

网路安全问题

全球经济的不确定性

主要市场趋势

多层 PCB 技术的进步

采用高密度互连 (HDI)

柔性和刚柔结合 PCB 的快速成长

嵌入式组件的集成

专注高频材料

采用3D列印技术

更加重视环境永续性

航太物联网和连接的兴起

细分市场洞察

依平台类型

区域洞察

目录

第 1 章：简介_

  • 产品概述
  • 报告的主要亮点
  • 市场覆盖范围
  • 涵盖的细分市场
  • 考虑研究任期

第 2 章：研究方法

第 3 章：执行摘要

第 4 章：COVID-19 对全球航太印刷电路板市场的影响

第 5 章：全球航太印刷电路板市场展望

  • 市场规模预测
    • 按价值
  • 市占率预测
    • 依平台类型（商用飞机、支线飞机、通用航空、军用飞机、直升机、无人机）
    • 依产品类型（刚性 1,2 面、标准多层、柔性、刚柔结合、高密度互连/微孔/组合/IC 基板等）
    • 依层压材料类型（FR4、聚酰亚胺等）
    • 按区域市占率分析
    • 按公司划分（前 5 名公司、其他 - 按价值，2023 年）
  • 全球航太印刷电路板市场地图机会评估
    • 按平台类型市场测绘机会评估
    • 按产品类型市场测绘机会评估
    • 按层压材料类型市场映射机会评估
    • 透过区域市场映射机会评估

第 6 章：亚太航空航太印刷电路板市场展望

  • 市场规模预测
    • 按价值
  • 市占率预测
    • 依平台类型
    • 依产品类型
    • 按层压板材料类型
    • 按国家/地区
  • 亚太地区：国家分析
    • 中国
    • 印度
    • 日本
    • 印尼
    • 泰国
    • 韩国
    • 澳洲

第 7 章：欧洲 CIS航太印刷电路板市场展望

  • 市场规模预测
    • 按价值
  • 市占率预测
    • 依平台类型
    • 依产品类型
    • 按层压板材料类型
    • 按国家/地区
  • 欧洲独联体：国家分析
    • 德国航太印刷电路板
    • 西班牙航太印刷电路板
    • 法国航太印刷电路板
    • 俄罗斯航太印刷电路板
    • 义大利航太印刷电路板
    • 英国航太印刷电路板
    • 比利时航太印刷电路板

第 8 章：北美航太印刷电路板市场展望

  • 市场规模预测
    • 按价值
  • 市占率预测
    • 依平台类型
    • 依产品类型
    • 按层压板材料类型
    • 按国家/地区
  • 北美：国家分析
    • 美国
    • 墨西哥
    • 加拿大

第 9 章：南美洲航太印刷电路板市场展望

  • 市场规模预测
    • 按价值
  • 市占率预测
    • 依平台类型
    • 依产品类型
    • 按层压板材料类型
    • 按国家/地区
  • 南美洲：国家分析
    • 巴西
    • 哥伦比亚
    • 阿根廷

第10章：中东非洲航太印刷电路板市场展望

  • 市场规模预测
    • 按价值
  • 市占率预测
    • 依平台类型
    • 依产品类型
    • 按层压板材料类型
    • 按国家/地区
  • 中东非洲：国家分析
    • 土耳其航太印刷电路板
    • 伊朗航太印刷电路板
    • 沙乌地阿拉伯航太印刷电路板
    • 阿联酋航太印刷电路板

第 11 章：SWOT 分析

  • 力量
  • 弱点
  • 机会
  • 威胁

第 12 章：市场动态

  • 市场驱动因素
  • 市场挑战

第 13 章：市场趋势与发展

第14章：竞争格局

  • 公司简介（最多10家主要公司）
    • TTM Technologies Inc.
    • Sanmina Corporation
    • Amphenol Corporation
    • ATS
    • Advanced Circuits, Inc.

第 15 章：策略建议

  • 重点关注领域
    • 按地区分類的目标
    • 按平台类型分類的目标
    • 按层压材料类型分類的目标

第 16 章：关于我们免责声明

简介目录
Product Code: 22770

The Global Aerospace Printed Circuit Board Marketsize reached USD 1.38 Billion in 2023 and is expected to grow with a CAGR of 6.54% through 2029.The global aerospace printed circuit board (PCB) market serves as a vital component within the aerospace and defense sector, facilitating essential electronic connectivity for aircraft systems. PCBs play a critical role in enabling the functionality of avionics, communication systems, navigation equipment, and various other electronic components integrated into aircraft structures. This market is characterized by an escalating demand for sophisticated and dependable PCBs, necessitated by the increasing complexity of aerospace technology and the integration of state-of-the-art electronic systems in modern aircraft.

A primary catalyst propelling the aerospace PCB market forward is the relentless pace of technological progress in avionics and electronics. The aerospace industry is undergoing a digital metamorphosis, prioritizing lightweight, compact, and high-performance electronic systems. Consequently, there's a heightened need for PCBs capable of meeting stringent aerospace specifications, including reliability, durability, and adherence to safety protocols.

Moreover, the market dynamics are shaped by the surging production of both commercial and military aircraft on a global scale. As the demand for air travel escalates and nations bolster their defense capabilities, there's a simultaneous uptick in the requirement for electronic systems, thereby propelling the demand for advanced aerospace PCBs. Additionally, the trend towards the development of electric and hybrid-electric aircraft further amplifies the necessity for innovative PCB solutions tailored to accommodate the unique demands of these propulsion systems.

In the aerospace industry, emphasis is placed on quality and reliability, with PCB manufacturers adhering to stringent standards and certifications. Customization is paramount within the aerospace PCB market, as manufacturers tailor their offerings to meet the specific requirements of different aircraft models. Furthermore, there's a growing focus on leveraging materials and manufacturing processes that enhance PCB performance while ensuring compliance with regulatory and safety standards.

Geographically, key aerospace manufacturing regions such as North America, Europe, and the Asia-Pacific contribute significantly to the global aerospace PCB market. North America, boasting a concentration of major aerospace corporations, leads in technological innovation. Europe, home to prominent aircraft manufacturers, prioritizes sustainability and technological advancements. Meanwhile, the Asia-Pacific region, experiencing a burgeoning aerospace industry, emerges as a key player, fueled by the expansion of air travel and substantial investments in defense..

Key Market Drivers

Technological Advancements in Avionics

The aerospace printed circuit board (PCB) market is propelled by continuous technological advancements in avionics. As aircraft systems become more sophisticated and digitally driven, the demand for advanced PCBs with higher processing capabilities, reduced size, and enhanced reliability increases. The evolution of avionic technologies, including communication systems, navigation equipment, and flight control systems, drives the need for innovative PCB solutions capable of supporting these intricate electronic functions.

Rise in Commercial Aircraft Production

The global increase in commercial aircraft production is a major driver for the aerospace PCB market. With a growing middle-class population and escalating air travel demand, major aircraft manufacturers are expanding their production capabilities. This surge in aircraft production directly translates to a higher demand for PCBs, as they are integral to the electronic systems that power modern commercial aircraft, ranging from cockpit displays to in-flight entertainment systems.

Demand for Lightweight and Compact Electronic Systems

The industry-wide pursuit of lightweight and compact electronic systems in aerospace applications significantly influences the aerospace PCB market. Lightweighting is crucial for improving fuel efficiency and overall aircraft performance. PCBs, being fundamental to electronic components, must adhere to stringent weight constraints while ensuring reliability. This demand drives the development of PCBs using advanced materials and miniaturization techniques, aligning with the broader trend towards lightweight aircraft design.

Transition to Electric and Hybrid-Electric Aircraft

The increasing focus on electric and hybrid-electric aircraft is a prominent driver for the aerospace PCB market. Electric propulsion systems require sophisticated electronic controls, necessitating PCBs that can handle the unique demands of these propulsion architectures. As the aviation industry explores more sustainable alternatives, the demand for specialized PCBs capable of supporting electric aircraft systems contributes to market growth.

Stringent Safety and Regulatory Standards

Stringent safety and regulatory standards in the aerospace industry drive the demand for high-quality and reliable PCBs. Compliance with industry-specific certifications and safety protocols is paramount. PCB manufacturers in the aerospace sector must adhere to rigorous standards to ensure the integrity and functionality of electronic systems. The need for adherence to safety regulations acts as a driving force for advancements in PCB technologies and materials.

Increasing Defense and Military Spending

The rise in defense and military spending globally significantly influences the aerospace PCB market. Military aircraft require advanced electronic systems for communication, surveillance, and navigation. As nations invest in modernizing their defense capabilities, there is a parallel demand for ruggedized and high-performance PCBs that can withstand the challenges of military applications, contributing to the growth of the aerospace PCB market.

Customization for Specific Aerospace Applications

The aerospace PCB market is driven by the need for customization to meet specific aerospace applications. Different aircraft types, whether commercial, military, or unmanned aerial vehicles (UAVs), have unique electronic requirements. PCB manufacturers cater to this diversity by offering customized solutions that align with the specific needs of various aerospace platforms. This flexibility and adaptability contribute to the market's responsiveness to evolving aerospace technologies.

Global Expansion of Aerospace Manufacturing

The global expansion of aerospace manufacturing, particularly in regions like Asia-Pacific, influences the aerospace PCB market. As emerging economies increase their contributions to aircraft production, there is a corresponding surge in the demand for electronic components, including PCBs. The global distribution of aerospace manufacturing facilities creates opportunities for PCB manufacturers to supply their products to a broader range of aerospace companies, fostering market growth.

Key Market Challenges

Stringent Certification and Compliance Requirements

One of the primary challenges facing the global aerospace printed circuit board (PCB) market is the stringent certification and compliance requirements imposed by aviation authorities. Aerospace electronic systems must adhere to rigorous safety and quality standards, and PCB manufacturers face the challenge of obtaining certifications such as AS9100 and meeting the stringent guidelines set by organizations like the Federal Aviation Administration (FAA) and the European Aviation Safety Agency (EASA). The certification process adds complexity and time to PCB development, impacting time-to-market and overall manufacturing costs.

Complexity of Aerospace Applications

The complexity of aerospace applications poses a significant challenge for PCB manufacturers. Aircraft systems involve a diverse range of electronic components with varying functionalities, including communication systems, avionics, radar, and navigation equipment. Designing PCBs to meet the specific requirements of these diverse applications while ensuring compatibility and reliability presents a complex engineering challenge. Customization for different aircraft types adds intricacy to the manufacturing process, requiring expertise in addressing varied technical specifications.

High-Cost Manufacturing and Material Expenses

Aerospace PCBs are subject to high manufacturing and material expenses, contributing to elevated overall production costs. The use of advanced materials and manufacturing processes, as well as the need for compliance with strict aerospace standards, amplifies the cost of producing high-quality PCBs. Additionally, the aerospace industry's insistence on lightweight and high-performance materials further intensifies the cost challenge for PCB manufacturers, requiring investments in cutting-edge technologies to remain competitive.

Rapid Technological Changes

The rapid pace of technological changes in the aerospace industry presents a constant challenge for PCB manufacturers. As avionics and electronic systems evolve, PCBs must keep pace with new requirements and incorporate the latest technologies. This challenge is heightened by the need for quick adaptation to emerging trends such as the Internet of Things (IoT), artificial intelligence, and advanced connectivity solutions. PCB manufacturers must invest in research and development to stay at the forefront of technological advancements, adding complexity to product development and production processes.

Supply Chain Disruptions and Component Shortages

The aerospace PCB market is vulnerable to supply chain disruptions and component shortages, which can arise from factors such as geopolitical uncertainties, natural disasters, and global crises. Dependence on specific materials and components for PCB manufacturing makes the supply chain susceptible to interruptions, impacting production timelines and creating challenges in meeting the demands of the aerospace industry. Robust supply chain management becomes crucial to mitigate these risks.

Environmental Regulations and Material Sustainability

Increasing emphasis on environmental regulations and sustainability poses a challenge for the aerospace PCB market. The industry's move towards eco-friendly and recyclable materials demands a shift in traditional manufacturing practices. PCB manufacturers must navigate the complexities of adopting sustainable materials without compromising on performance and safety standards. Balancing environmental responsibility with stringent aerospace requirements requires continuous innovation and adaptation.

Cybersecurity Concerns

The growing interconnectedness of aircraft systems raises cybersecurity concerns for aerospace PCBs. With electronic systems becoming more integrated and reliant on digital connectivity, the vulnerability to cyber threats increases. PCB manufacturers need to prioritize cybersecurity measures in the design and manufacturing processes to safeguard electronic systems from potential breaches. This challenge becomes even more critical as the industry embraces smart and connected aircraft technologies.

Global Economic Uncertainties

Global economic uncertainties, including economic downturns and geopolitical tensions, present challenges for the aerospace PCB market. Fluctuations in economic conditions can impact investments in aviation and defense projects, leading to uncertainties in demand forecasting for PCBs. PCB manufacturers must navigate these economic uncertainties, adapting their strategies to mitigate risks associated with market volatility and ensuring sustainable growth in the face of unpredictable global economic conditions.

Key Market Trends

Advancements in Multilayer PCB Technology

A notable trend in the global aerospace printed circuit board (PCB) market is the continuous advancements in multilayer PCB technology. As electronic systems within aircraft become more sophisticated, there is a growing demand for PCBs with increased layer counts to accommodate complex circuitry. The trend towards higher layer counts enhances the capabilities of aerospace PCBs, allowing for greater integration of components and improved signal integrity, essential for modern avionic systems.

High-Density Interconnect (HDI) Adoption

The aerospace PCB market is witnessing a significant trend towards the adoption of High-Density Interconnect (HDI) technology. HDI PCBs offer enhanced electrical performance, reduced size, and increased reliability. This trend aligns with the aerospace industry's focus on miniaturization and lightweight design. HDI technology enables the creation of intricate circuit patterns in a smaller space, contributing to the development of compact and high-performance electronic systems in aircraft.

Rapid Growth in Flex and Rigid-Flex PCBs

Flex and rigid-flex PCBs are experiencing rapid growth as a trend in the aerospace industry. These flexible PCB solutions offer advantages in terms of space savings, weight reduction, and improved reliability in applications where traditional rigid PCBs may be impractical. The trend towards incorporating flex and rigid-flex PCBs in aerospace designs reflects the industry's quest for innovative solutions that address the challenges of limited space and complex geometries within aircraft.

Integration of Embedded Components

The integration of embedded components within PCBs is emerging as a key trend in the aerospace sector. Embedding passive and active components directly into the PCB structure enhances overall system performance, reduces the need for additional components, and contributes to weight reduction. This trend supports the development of more compact and efficient aerospace electronic systems, aligning with the industry's constant pursuit of lightweight design for improved fuel efficiency.

Focus on High-Frequency Materials

With the increasing demand for high-frequency communication and radar systems in aerospace applications, there is a growing trend towards the use of specialized high-frequency materials in PCB manufacturing. These materials offer improved signal integrity and reduced signal loss, catering to the requirements of advanced avionic systems. The trend reflects the industry's need for PCBs that can support the higher frequencies associated with radar, satellite communication, and other critical aerospace applications.

Adoption of 3D Printing Technology

The aerospace PCB market is experiencing the adoption of 3D printing technology for PCB fabrication. This trend allows for the creation of complex and customized PCB designs with reduced lead times and improved design flexibility. 3D printing enables the production of intricately shaped PCBs that align with the specific contours of aircraft structures, contributing to the overall efficiency of electronic system integration in aerospace applications.

Increased Emphasis on Environmental Sustainability

Environmental sustainability is a growing trend influencing the aerospace PCB market. Manufacturers are increasingly focusing on the use of environmentally friendly materials and manufacturing processes. This trend aligns with the broader industry push towards sustainability, meeting regulatory requirements, and addressing the demand for greener aviation technologies. PCB manufacturers are exploring eco-friendly alternatives without compromising on performance and safety standards.

Rise of Aerospace IoT and Connectivity

The rise of the Internet of Things (IoT) and connectivity solutions is influencing the aerospace PCB market. Aircraft are becoming more connected, with an increasing number of sensors and communication devices. This trend demands PCBs that can facilitate seamless connectivity, data transfer, and communication between various onboard systems. The integration of IoT capabilities in aerospace PCBs contributes to improved aircraft monitoring, diagnostics, and overall operational efficiency.

Segmental Insights

By Platform Type

The commercial aircraft segment is a pivotal component of the aerospace industry, driving demand for a diverse range of printed circuit boards (PCBs). These PCBs are integral to the avionic systems that ensure the safety, communication, and navigation of large passenger and cargo planes. The trend in this segment focuses on lightweight, high-performance PCBs that cater to the increasing complexity of in-flight entertainment, navigation, and communication systems in modern commercial aircraft. As air travel demand continues to rise globally, the commercial aircraft segment's requirements for advanced PCB technologies are expected to grow steadily.

Regional aircraft, serving shorter routes and connecting smaller airports, have specific PCB requirements tailored to their operational needs. The trend in the regional aircraft segment involves the adoption of compact, space-efficient PCBs that offer reliability and efficiency in constrained environments. As regional air travel expands, there is an increasing demand for PCBs that support the avionic systems of these aircraft, contributing to enhanced safety and communication capabilities. The trend reflects a focus on adapting PCB technologies to the unique challenges and opportunities presented by regional aviation.

The general aviation segment encompasses a diverse range of aircraft used for private, recreational, and business purposes. In this segment, PCBs play a crucial role in supporting communication, navigation, and safety systems for smaller planes and private jets. The trend in general aviation emphasizes the development of customized, cost-effective PCB solutions that meet the specific requirements of individual aircraft. The demand for lightweight and reliable PCBs in general aviation is driven by a growing number of private aircraft owners seeking advanced avionic capabilities for their planes.

Military aircraft, characterized by their specialized mission requirements and stringent performance standards, drive distinct trends in the aerospace PCB market. The trend in this segment revolves around ruggedized PCBs capable of withstanding harsh environmental conditions, electromagnetic interference, and high levels of vibration. The military aircraft segment places a premium on the integration of advanced technologies, such as embedded components and high-frequency materials, to enhance communication, radar, and electronic warfare systems. As military aviation evolves, the demand for cutting-edge PCB technologies tailored to these specific applications is expected to persist.

Helicopters, used in various roles including transport, search and rescue, and military operations, have unique PCB requirements due to their design and operational characteristics. The trend in the helicopter segment involves the development of compact, lightweight PCBs that can withstand the vibrations and environmental challenges associated with rotary-wing aircraft. PCBs in helicopters support critical systems such as avionics, communication, and navigation, contributing to the efficiency and safety of helicopter operations. The trend underscores the importance of tailoring PCB solutions to the distinct needs of rotary-wing aircraft.

The Unmanned Aerial Vehicle (UAV) segment, encompassing drones and remotely piloted aircraft, is experiencing a notable trend in the adoption of miniaturized and lightweight PCB technologies. UAVs often operate in dynamic environments and require PCBs that balance compactness with advanced functionality. The trend focuses on the development of PCBs that enable communication, navigation, and sensor integration for UAVs. As the demand for UAVs increases across various sectors, including military, surveillance, and commercial applications, the trend in UAV-specific PCB solutions is expected to evolve to meet diverse mission requirements.

In summary, the aerospace PCB market adapts to the unique requirements of different platform types, including commercial aircraft, regional aircraft, general aviation, military aircraft, helicopters, and unmanned aerial vehicles. The trends within each segment reflect a commitment to tailoring PCB solutions to the specific operational needs, size constraints, and environmental challenges posed by different categories of aircraft.

Regional Insights

North America stands as a dominant force in the global aerospace PCB market, housing key aerospace industry players and major manufacturers. The region, led by the United States, boasts a robust aerospace sector marked by continuous technological innovation and research. North America is a significant consumer and producer of aerospace PCBs, driven by the presence of major aircraft manufacturers, defense contractors, and a comprehensive supply chain. The region's emphasis on advanced avionics and electronic systems fuels the demand for high-performance PCBs, making it a leading contributor to the global aerospace PCB market. Additionally, stringent safety standards and a focus on technological advancements further solidify North America's influence in shaping the trajectory of the aerospace PCB industry.

Europe plays a pivotal role in the global aerospace PCB market, anchored by the presence of major aerospace companies, including Airbus. The region is characterized by a rich aerospace heritage, engineering excellence, and a commitment to sustainability. European countries like the United Kingdom, France, Germany, and Italy contribute significantly to the demand for aerospace PCBs, driven by both commercial and military aviation needs. Europe's focus on reducing environmental impact aligns with the adoption of advanced PCB technologies that support eco-friendly aviation solutions. Collaborative efforts between aerospace manufacturers and PCB suppliers contribute to Europe's prominence in shaping the trends and developments within the aerospace PCB market.

The Asia-Pacific region is emerging as a dynamic player in the global aerospace PCB market, reflecting the rapid growth of the aerospace industry in countries such as China, Japan, and India. The increasing demand for air travel, expansion of aerospace manufacturing capabilities, and rising defense investments contribute to the region's influence. Asia-Pacific's ascent is marked by a focus on indigenous research and development, technological innovation, and the establishment of manufacturing hubs. The region's substantial market potential is driven by the growth of commercial aviation, leading to heightened demand for aerospace PCBs. As Asia-Pacific nations continue to strengthen their aerospace capabilities, they play a pivotal role in shaping the global dynamics of the aerospace PCB market.

The Middle East and Africa contribute to the global aerospace PCB market, with the United Arab Emirates (UAE) serving as a notable aerospace hub. The region's strategic geographical location, coupled with substantial investments in defense and commercial aviation, influences the demand for aerospace PCBs. While the aerospace industry in Africa is still evolving, the Middle East's influence is pronounced, particularly in defense applications. The adoption of advanced avionic systems and the modernization of aircraft fleets contribute to the region's significance in the aerospace PCB market. The Middle East's commitment to technological advancements and sustainability further positions it as a key player shaping the regional dynamics.

Key Market Players

TTM Technologies Inc.

Sanmina Corporation

Amphenol Corporation

ATS

Advanced Circuits, Inc.

Report Scope:

In this report, the Global Aerospace Printed Circuit Board Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Aerospace Printed Circuit Board Market, By Platform Type:

  • Commercial Aircraft
  • Regional Aircraft
  • General Aviation
  • Military Aircraft
  • Helicopter
  • Unmanned Aerial Vehicle

Aerospace Printed Circuit Board Market, By Product Type:

  • Rigid 1,2-Sided
  • Standard Multilayer
  • Flexible
  • Rigid-Flex
  • High-Density Interconnect/Microvia/Build-Up/IC Substrate
  • Others

Aerospace Printed Circuit Board Market,By Laminate Material Type:

  • FR4
  • Polyimide
  • Others

Aerospace Printed Circuit Board Market, By Region:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe CIS
    • Germany
    • Spain
    • France
    • Russia
    • Italy
    • United Kingdom
    • Belgium
  • Asia-Pacific
    • China
    • India
    • Japan
    • Indonesia
    • Thailand
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East Africa
    • Turkey
    • Iran
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Aerospace Printed Circuit Board Market.

Available Customizations:

Global Aerospace Printed Circuit Board Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1.Introduction_

  • 1.1.Product Overview
  • 1.2.Key Highlights of the Report
  • 1.3.Market Coverage
  • 1.4.Market Segments Covered
  • 1.5.Research Tenure Considered

2.Research Methodology

  • 2.1.Methodology Landscape
  • 2.2.Objective of the Study
  • 2.3.Baseline Methodology
  • 2.4.Formulation of the Scope
  • 2.5.Assumptions and Limitations
  • 2.6.Sources of Research
  • 2.7.Approach for the Market Study
  • 2.8.Methodology Followed for Calculation of Market Size Market Shares
  • 2.9.Forecasting Methodology

3.Executive Summary

  • 3.1.
  • 3.2.Market Forecast
  • 3.3.Key Regions
  • 3.4.Key Segments

4.Impact of COVID-19 on Global Aerospace Printed Circuit Board Market

5.Global Aerospace Printed Circuit Board Market Outlook

  • 5.1.Market Size Forecast
    • 5.1.1.By Value
  • 5.2.Market Share Forecast
    • 5.2.1.By Platform Type Market Share Analysis (Commercial Aircraft, Regional Aircraft, General Aviation, Military Aircraft, Helicopter, and Unmanned Aerial Vehicle)
    • 5.2.2.By Product Type Market Share Analysis (Rigid 1,2-Sided, Standard Multilayer, Flexible, Rigid-Flex, High-Density Interconnect/Microvia/Build-Up/IC Substrate, and Others)
    • 5.2.3.By Laminate Material Type Market Share Analysis (FR4, Polyimide, and Others)
    • 5.2.4.By RegionalMarket Share Analysis
      • 5.2.4.1.Asia-Pacific Market Share Analysis
      • 5.2.4.2.Europe CIS Market Share Analysis
      • 5.2.4.3.North America Market Share Analysis
      • 5.2.4.4.South America Market Share Analysis
      • 5.2.4.5.Middle East Africa Market Share Analysis
    • 5.2.5.By Company Market Share Analysis (Top 5 Companies, Others - By Value, 2023)
  • 5.3.Global Aerospace Printed Circuit Board MarketMapping Opportunity Assessment
    • 5.3.1.By Platform Type MarketMapping Opportunity Assessment
    • 5.3.2.By Product Type Market Mapping Opportunity Assessment
    • 5.3.3.By Laminate Material Type Market Mapping Opportunity Assessment
    • 5.3.4.By Regional Market Mapping Opportunity Assessment

6.Asia-Pacific Aerospace Printed Circuit Board Market Outlook

  • 6.1.Market Size Forecast
    • 6.1.1.By Value
  • 6.2.Market Share Forecast
    • 6.2.1.By Platform Type Market Share Analysis
    • 6.2.2.By Product Type Market Share Analysis
    • 6.2.3.By Laminate Material Type Market Share Analysis
    • 6.2.4.By Country Market Share Analysis
      • 6.2.4.1.China Market Share Analysis
      • 6.2.4.2.India Market Share Analysis
      • 6.2.4.3.Japan Market Share Analysis
      • 6.2.4.4.Indonesia Market Share Analysis
      • 6.2.4.5.Thailand Market Share Analysis
      • 6.2.4.6.South Korea Market Share Analysis
      • 6.2.4.7.Australia Market Share Analysis
      • 6.2.4.8.Rest of Asia-Pacific Market Share Analysis
  • 6.3.Asia-Pacific: Country Analysis
    • 6.3.1.China Aerospace Printed Circuit Board Market Outlook
      • 6.3.1.1.Market Size Forecast
        • 6.3.1.1.1.By Value
      • 6.3.1.2.Market Share Forecast
        • 6.3.1.2.1.By Platform Type Market Share Analysis
        • 6.3.1.2.2.By Product Type Market Share Analysis
        • 6.3.1.2.3.By Laminate Material Type MarketShare Analysis
    • 6.3.2.India Aerospace Printed Circuit Board Market Outlook
      • 6.3.2.1.Market Size Forecast
        • 6.3.2.1.1.By Value
      • 6.3.2.2.Market Share Forecast
        • 6.3.2.2.1.By Platform Type Market Share Analysis
        • 6.3.2.2.2.By Product Type Market Share Analysis
        • 6.3.2.2.3.By Laminate Material Type MarketShare Analysis
    • 6.3.3.Japan Aerospace Printed Circuit Board Market Outlook
      • 6.3.3.1.Market Size Forecast
        • 6.3.3.1.1.By Value
      • 6.3.3.2.Market Share Forecast
        • 6.3.3.2.1.By Platform Type Market Share Analysis
        • 6.3.3.2.2.By Product Type Market Share Analysis
        • 6.3.3.2.3.By Laminate Material Type MarketShare Analysis
    • 6.3.4.Indonesia Aerospace Printed Circuit Board Market Outlook
      • 6.3.4.1.Market Size Forecast
        • 6.3.4.1.1.By Value
      • 6.3.4.2.Market Share Forecast
        • 6.3.4.2.1.By Platform Type Market Share Analysis
        • 6.3.4.2.2.By Product Type Market Share Analysis
        • 6.3.4.2.3.By Laminate Material Type Market Share Analysis
    • 6.3.5.Thailand Aerospace Printed Circuit Board Market Outlook
      • 6.3.5.1.Market Size Forecast
        • 6.3.5.1.1.By Value
      • 6.3.5.2.Market Share Forecast
        • 6.3.5.2.1.By Laminate Material Type Market Share Analysis
        • 6.3.5.2.2.By Product Type Market Share Analysis
        • 6.3.5.2.3.By Laminate Material Type Market Share Analysis
    • 6.3.6.South Korea Aerospace Printed Circuit Board Market Outlook
      • 6.3.6.1.Market Size Forecast
        • 6.3.6.1.1.By Value
      • 6.3.6.2.Market Share Forecast
        • 6.3.6.2.1.By Platform Type Market Share Analysis
        • 6.3.6.2.2.By Product Type Market Share Analysis
        • 6.3.6.2.3.By Laminate Material Type Market Share Analysis
    • 6.3.7.Australia Aerospace Printed Circuit Board Market Outlook
      • 6.3.7.1.Market Size Forecast
        • 6.3.7.1.1.By Value
      • 6.3.7.2.Market Share Forecast
        • 6.3.7.2.1.By Platform Type Market Share Analysis
        • 6.3.7.2.2.By Product Type Market Share Analysis
        • 6.3.7.2.3.By Laminate Material Type Market Share Analysis

7.Europe CIS Aerospace Printed Circuit Board Market Outlook

  • 7.1.Market Size Forecast
    • 7.1.1.By Value
  • 7.2.Market Share Forecast
    • 7.2.1.By Platform Type Market Share Analysis
    • 7.2.2.By Product Type Market Share Analysis
    • 7.2.3.By Laminate Material Type Market Share Analysis
    • 7.2.4.By Country Market Share Analysis
      • 7.2.4.1.Germany Market Share Analysis
      • 7.2.4.2.Spain Market Share Analysis
      • 7.2.4.3.France Market Share Analysis
      • 7.2.4.4.Russia Market Share Analysis
      • 7.2.4.5.Italy Market Share Analysis
      • 7.2.4.6.United Kingdom Market Share Analysis
      • 7.2.4.7.Belgium Market Share Analysis
      • 7.2.4.8.Rest of Europe CIS Market Share Analysis
  • 7.3.Europe CIS: Country Analysis
    • 7.3.1.Germany Aerospace Printed Circuit Board Market Outlook
      • 7.3.1.1.Market Size Forecast
        • 7.3.1.1.1.By Value
      • 7.3.1.2.Market Share Forecast
        • 7.3.1.2.1.By Platform Type Market Share Analysis
        • 7.3.1.2.2.By Product Type Market Share Analysis
        • 7.3.1.2.3.By Laminate Material Type Market Share Analysis
    • 7.3.2.Spain Aerospace Printed Circuit Board Market Outlook
      • 7.3.2.1.Market Size Forecast
        • 7.3.2.1.1.By Value
      • 7.3.2.2.Market Share Forecast
        • 7.3.2.2.1.By Platform Type Market Share Analysis
        • 7.3.2.2.2.By Product Type Market Share Analysis
        • 7.3.2.2.3.By Laminate Material Type Market Share Analysis
    • 7.3.3.France Aerospace Printed Circuit Board Market Outlook
      • 7.3.3.1.Market Size Forecast
        • 7.3.3.1.1.By Value
      • 7.3.3.2.Market Share Forecast
        • 7.3.3.2.1.By Platform Type Market Share Analysis
        • 7.3.3.2.2.By Product Type Market Share Analysis
        • 7.3.3.2.3.By Laminate Material Type Market Share Analysis
    • 7.3.4.Russia Aerospace Printed Circuit Board Market Outlook
      • 7.3.4.1.Market Size Forecast
        • 7.3.4.1.1.By Value
      • 7.3.4.2.Market Share Forecast
        • 7.3.4.2.1.By Platform Type Market Share Analysis
        • 7.3.4.2.2.By Product Type Market Share Analysis
        • 7.3.4.2.3.By Laminate Material Type Market Share Analysis
    • 7.3.5.Italy Aerospace Printed Circuit Board Market Outlook
      • 7.3.5.1.Market Size Forecast
        • 7.3.5.1.1.By Value
      • 7.3.5.2.Market Share Forecast
        • 7.3.5.2.1.By Platform Type Market Share Analysis
        • 7.3.5.2.2.By Product Type Market Share Analysis
        • 7.3.5.2.3.By Laminate Material Type Market Share Analysis
    • 7.3.6.United Kingdom Aerospace Printed Circuit Board Market Outlook
      • 7.3.6.1.Market Size Forecast
        • 7.3.6.1.1.By Value
      • 7.3.6.2.Market Share Forecast
        • 7.3.6.2.1.By Platform Type Market Share Analysis
        • 7.3.6.2.2.By Product Type Market Share Analysis
        • 7.3.6.2.3.By Laminate Material Type Market Share Analysis
    • 7.3.7.Belgium Aerospace Printed Circuit Board Market Outlook
      • 7.3.7.1.Market Size Forecast
        • 7.3.7.1.1.By Value
      • 7.3.7.2.Market Share Forecast
        • 7.3.7.2.1.By Platform Type Market Share Analysis
        • 7.3.7.2.2.By Product Type Market Share Analysis
        • 7.3.7.2.3.By Laminate Material Type Market Share Analysis

8.North America Aerospace Printed Circuit Board Market Outlook

  • 8.1.Market Size Forecast
    • 8.1.1.By Value
  • 8.2.Market Share Forecast
    • 8.2.1.By Platform Type Market Share Analysis
    • 8.2.2.By Product Type Market Share Analysis
    • 8.2.3.By Laminate Material Type Market Share Analysis
    • 8.2.4.By Country Market Share Analysis
      • 8.2.4.1.United States Market Share Analysis
      • 8.2.4.2.Mexico Market Share Analysis
      • 8.2.4.3.Canada Market Share Analysis
  • 8.3.North America: Country Analysis
    • 8.3.1.United States Aerospace Printed Circuit Board Market Outlook
      • 8.3.1.1.Market Size Forecast
        • 8.3.1.1.1.By Value
      • 8.3.1.2.Market Share Forecast
        • 8.3.1.2.1.By Platform Type Market Share Analysis
        • 8.3.1.2.2.By Product Type Market Share Analysis
        • 8.3.1.2.3.By Laminate Material Type Market Share Analysis
    • 8.3.2.Mexico Aerospace Printed Circuit Board Market Outlook
      • 8.3.2.1.Market Size Forecast
        • 8.3.2.1.1.By Value
      • 8.3.2.2.Market Share Forecast
        • 8.3.2.2.1.By Platform Type Market Share Analysis
        • 8.3.2.2.2.By Product Type Market Share Analysis
        • 8.3.2.2.3.By Laminate Material Type Market Share Analysis
    • 8.3.3.Canada Aerospace Printed Circuit Board Market Outlook
      • 8.3.3.1.Market Size Forecast
        • 8.3.3.1.1.By Value
      • 8.3.3.2.Market Share Forecast
        • 8.3.3.2.1.By Platform Type Market Share Analysis
        • 8.3.3.2.2.By Product Type Market Share Analysis
        • 8.3.3.2.3.By Laminate Material Type Market Share Analysis

9.South America Aerospace Printed Circuit Board Market Outlook

  • 9.1.Market Size Forecast
    • 9.1.1.By Value
  • 9.2.Market Share Forecast
    • 9.2.1.By Platform Type Market Share Analysis
    • 9.2.2.By Product Type Market Share Analysis
    • 9.2.3.By Laminate Material Type Market Share Analysis
    • 9.2.4.By Country Market Share Analysis
      • 9.2.4.1.Brazil Market Share Analysis
      • 9.2.4.2.Argentina Market Share Analysis
      • 9.2.4.3.Colombia Market Share Analysis
      • 9.2.4.4.Rest of South America Market Share Analysis
  • 9.3.South America: Country Analysis
    • 9.3.1.Brazil Aerospace Printed Circuit Board Market Outlook
      • 9.3.1.1.Market Size Forecast
        • 9.3.1.1.1.By Value
      • 9.3.1.2.Market Share Forecast
        • 9.3.1.2.1.By Platform Type Market Share Analysis
        • 9.3.1.2.2.By Product Type Market Share Analysis
        • 9.3.1.2.3.By Laminate Material Type Market Share Analysis
    • 9.3.2.Colombia Aerospace Printed Circuit Board Market Outlook
      • 9.3.2.1.Market Size Forecast
        • 9.3.2.1.1.By Value
      • 9.3.2.2.Market Share Forecast
        • 9.3.2.2.1.By Platform Type Market Share Analysis
        • 9.3.2.2.2.By Product Type Market Share Analysis
        • 9.3.2.2.3.By Laminate Material Type Market Share Analysis
    • 9.3.3.Argentina Aerospace Printed Circuit Board Market Outlook
      • 9.3.3.1.Market Size Forecast
        • 9.3.3.1.1.By Value
      • 9.3.3.2.Market Share Forecast
        • 9.3.3.2.1.By Platform Type Market Share Analysis
        • 9.3.3.2.2.By Product Type Market Share Analysis
        • 9.3.3.2.3.By Laminate Material Type Market Share Analysis

10.Middle East Africa Aerospace Printed Circuit Board Market Outlook

  • 10.1.Market Size Forecast
    • 10.1.1.By Value
  • 10.2.Market Share Forecast
    • 10.2.1.By Platform Type Market Share Analysis
    • 10.2.2.By Product Type Market Share Analysis
    • 10.2.3.By Laminate Material Type Market Share Analysis
    • 10.2.4.By Country Market Share Analysis
      • 10.2.4.1.Turkey Market Share Analysis
      • 10.2.4.2.Iran Market Share Analysis
      • 10.2.4.3.Saudi Arabia Market Share Analysis
      • 10.2.4.4.UAE Market Share Analysis
      • 10.2.4.5.Rest of Middle East Africa Market ShareAnalysis
  • 10.3.Middle East Africa: Country Analysis
    • 10.3.1.Turkey Aerospace Printed Circuit Board Market Outlook
      • 10.3.1.1.Market Size Forecast
        • 10.3.1.1.1.By Value
      • 10.3.1.2.Market Share Forecast
        • 10.3.1.2.1.By Platform Type Market Share Analysis
        • 10.3.1.2.2.By Product Type Market Share Analysis
        • 10.3.1.2.3.By Laminate Material Type Market Share Analysis
    • 10.3.2.Iran Aerospace Printed Circuit Board Market Outlook
      • 10.3.2.1.Market Size Forecast
        • 10.3.2.1.1.By Value
      • 10.3.2.2.Market Share Forecast
        • 10.3.2.2.1.By Platform Type Market Share Analysis
        • 10.3.2.2.2.By Product Type Market Share Analysis
        • 10.3.2.2.3.By Laminate Material Type Market Share Analysis
    • 10.3.3.Saudi Arabia Aerospace Printed Circuit Board Market Outlook
      • 10.3.3.1.Market Size Forecast
        • 10.3.3.1.1.By Value
      • 10.3.3.2.Market Share Forecast
        • 10.3.3.2.1.By Platform Type Market Share Analysis
        • 10.3.3.2.2.By Product Type Market Share Analysis
        • 10.3.3.2.3.By Laminate Material Type Market Share Analysis
    • 10.3.4.UAE Aerospace Printed Circuit Board Market Outlook
      • 10.3.4.1.Market Size Forecast
        • 10.3.4.1.1.By Value
      • 10.3.4.2.Market Share Forecast
        • 10.3.4.2.1.By Platform Type Market Share Analysis
        • 10.3.4.2.2.By Product Type Market Share Analysis
        • 10.3.4.2.3.By Laminate Material Type Market Share Analysis

11.SWOT Analysis

  • 11.1.Strength
  • 11.2.Weakness
  • 11.3.Opportunities
  • 11.4.Threats

12.Market Dynamics

  • 12.1.Market Drivers
  • 12.2.Market Challenges

13.Market Trends and Developments

14.Competitive Landscape

  • 14.1.Company Profiles (Up to 10 Major Companies)
    • 14.1.1.TTM Technologies Inc.
      • 14.1.1.1.Company Details
      • 14.1.1.2.Key Product Offered
      • 14.1.1.3.Financials (As Per Availability)
      • 14.1.1.4.Recent Developments
      • 14.1.1.5.Key Management Personnel
    • 14.1.2.Sanmina Corporation
      • 14.1.2.1.Company Details
      • 14.1.2.2.Key Product Offered
      • 14.1.2.3.Financials (As Per Availability)
      • 14.1.2.4.Recent Developments
      • 14.1.2.5.Key Management Personnel
    • 14.1.3.Amphenol Corporation
      • 14.1.3.1.Company Details
      • 14.1.3.2.Key Product Offered
      • 14.1.3.3.Financials (As Per Availability)
      • 14.1.3.4.Recent Developments
      • 14.1.3.5.Key Management Personnel
    • 14.1.4.ATS
      • 14.1.4.1.Company Details
      • 14.1.4.2.Key Product Offered
      • 14.1.4.3.Financials (As Per Availability)
      • 14.1.4.4.Recent Developments
      • 14.1.4.5.Key Management Personnel
    • 14.1.5.Advanced Circuits, Inc.
      • 14.1.5.1.Company Details
      • 14.1.5.2.Key Product Offered
      • 14.1.5.3.Financials (As Per Availability)
      • 14.1.5.4.Recent Developments
      • 14.1.5.5.Key Management Personnel

15.Strategic Recommendations

  • 15.1.Key Focus Areas
    • 15.1.1.Target By Regions
    • 15.1.2.Target By Platform Type
    • 15.1.3.Target By Laminate Material Type

16. About Us Disclaimer