封面
市场调查报告书
商品编码
1763846

覆铜板市场-全球产业规模、份额、趋势、机会及预测(细分、按应用、按材料类型、按製造工艺、按地区、按竞争,2020-2030 年)

Copper Clad Laminates Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented, By Application, By Material Type, By Manufacturing Process, By Region, By Competition, 2020-2030F

出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

2024年,全球覆铜板市场规模达159.7亿美元,预计2030年将达217.1亿美元,复合年增长率为5.09%。覆铜板(CCL)是印刷电路板(PCB)製造的基础材料,其绝缘芯材(例如玻璃纤维、纸或复合环氧树脂)单面或双面覆盖铜箔。这些覆铜板为各种电子应用中的电路提供必要的导电性、结构支撑和热稳定性。随着电子产品不断发展,对更高效能和更紧凑设计的需求不断增长,CCL在消费性电子、电信、汽车电子等领域的相关性和应用范围显着扩大。

市场概览
预测期 2026-2030
2024年市场规模 159.7亿美元
2030年市场规模 217.1亿美元
2025-2030 年复合年增长率 5.09%
成长最快的领域 电源电路板
最大的市场 北美洲

关键市场驱动因素

消费性电子产品和小型化设备的需求不断增长

主要市场挑战

原物料价格波动与供应链中断

主要市场趋势

高密度互连 (HDI) 技术和电子产品小型化推动需求激增

目录

第 1 章:产品概述

第二章:研究方法

第三章:执行摘要

第四章:顾客之声

第五章:全球覆铜板市场展望

  • 市场规模和预测
    • 按价值
  • 市场占有率和预测
    • 依应用(高速数位电路板、电源电路板、汽车电路板、消费性电子电路板、医疗电路板、工业电路板)
    • 依材料类型(FR-4、CEM-1、CEM-3、FR-2、FR-5、聚酰亚胺、PTFE)
    • 依製造流程分类(层压树脂压机、高压层压压机、双面胶带层压、冷层压压机、高频层压压机)
    • 按地区
  • 按公司分类(2024)
  • 市场地图

第六章:北美覆铜板市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 北美:国家分析
    • 美国
    • 加拿大
    • 墨西哥

第七章:欧洲覆铜板市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 欧洲:国家分析
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙

第八章:亚太覆铜板市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 亚太地区:国家分析
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲

第九章:南美洲覆铜板市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 南美洲:国家分析
    • 巴西
    • 阿根廷
    • 哥伦比亚

第十章:中东与非洲覆铜板市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 中东和非洲:国家分析
    • 南非
    • 沙乌地阿拉伯
    • 阿联酋
    • 科威特
    • 土耳其

第 11 章:市场动态

  • 驱动程式
  • 挑战

第 12 章:市场趋势与发展

  • 合併与收购(如有)
  • 产品发布(如有)
  • 最新动态

第十三章:公司简介

  • Kingboard Laminates Holdings Ltd.
  • Nan Ya Plastics Corporation
  • Panasonic Corporation
  • ITEQ Corporation
  • Shengyi Technology Co., Ltd. (SYTECH)
  • Isola Group
  • Doosan Corporation Electro-Materials
  • Nippon Mektron, Ltd.
  • Ventec International Group
  • Rogers Corporation

第 14 章:策略建议

第15章调查会社について・免责事项

简介目录
Product Code: 29665

The Global Copper Clad Laminates Market was valued at USD 15.97 billion in 2024 and is projected to reach USD 21.71 billion by 2030, growing at a CAGR of 5.09%. Copper Clad Laminates (CCLs) serve as foundational materials in the manufacturing of printed circuit boards (PCBs), comprising an insulating core-such as glass fiber, paper, or composite epoxy-coated with copper foil on one or both sides. These laminates provide essential electrical conductivity, structural support, and thermal stability for circuit pathways in a wide array of electronic applications. As electronics continue to evolve with demand for higher performance and compact designs, the relevance and adoption of CCLs have significantly expanded across consumer devices, telecommunications, automotive electronics, and more.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 15.97 Billion
Market Size 2030USD 21.71 Billion
CAGR 2025-20305.09%
Fastest Growing SegmentPower Circuit Boards
Largest MarketNorth America

Key Market Drivers

Rising Demand for Consumer Electronics and Miniaturized Devices

The rapid growth of the global consumer electronics sector is significantly propelling the copper clad laminates (CCL) market, with widespread usage in devices such as smartphones, tablets, wearables, laptops, smart home appliances, and gaming consoles. As consumer preferences shift toward faster, slimmer, and multifunctional devices, manufacturers are driven to deliver compact and high-performance products. Copper clad laminates, being a crucial component in printed circuit boards (PCBs), play a pivotal role in achieving these objectives by offering robust electrical conductivity, insulation, and structural integrity needed in compact device architecture.

Key Market Challenges

Volatility in Raw Material Prices and Supply Chain Disruptions

The Copper Clad Laminates (CCL) market faces notable challenges due to fluctuating raw material prices, particularly for copper and epoxy resins, which directly influence production expenses and profitability. Copper's price volatility stems from factors such as global supply-demand imbalances, geopolitical instability, mining limitations, and currency shifts. This unpredictability places cost pressures on manufacturers who may struggle to maintain margins or be forced to pass costs to customers, potentially affecting demand. Additionally, resin and glass fabric costs are impacted by crude oil price movements, adding to the financial uncertainty. The situation is compounded by global supply chain vulnerabilities triggered by events like the COVID-19 pandemic, geopolitical conflicts, and maritime disruptions in regions like the Red Sea and Suez Canal. These issues have led to longer delivery timelines, rising freight costs, and sporadic raw material availability, particularly affecting manufacturers in the Asia Pacific. As a result, securing stable long-term material contracts has become increasingly difficult, making pricing and production planning highly unpredictable.

Key Market Trends

Surge in Demand Driven by High-Density Interconnect (HDI) Technology and Miniaturization in Electronics

The transition toward compact, high-efficiency, and multi-layer printed circuit boards (PCBs) is accelerating demand for copper clad laminates as High-Density Interconnect (HDI) technology becomes standard in modern electronics. With the rise of space-saving consumer products such as smartphones, tablets, and wearables, PCBs must accommodate dense circuitry while ensuring thermal and signal performance. To meet these specifications, CCL manufacturers are developing advanced laminates featuring ultra-thin prepregs, high Tg materials, low-loss substrates, and premium copper foil types like RTF and HTE. These innovations offer superior dielectric characteristics, dimensional reliability, and enhanced adhesion-critical for supporting microvias, blind/buried vias, and fine-line routing. Moreover, the growth of 5G infrastructure, electric vehicle electronics, IoT solutions, and ADAS technologies is fueling further adoption of HDI and multilayer board designs, boosting the overall CCL market.

Key Market Players

  • Kingboard Laminates Holdings Ltd.
  • Nan Ya Plastics Corporation
  • Panasonic Corporation
  • ITEQ Corporation
  • Shengyi Technology Co., Ltd. (SYTECH)
  • Isola Group
  • Doosan Corporation Electro-Materials
  • Nippon Mektron, Ltd.
  • Ventec International Group
  • Rogers Corporation

Report Scope:

In this report, the Global Copper Clad Laminates Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Copper Clad Laminates Market, By Application:

  • High-Speed Digital Circuit Boards
  • Power Circuit Boards
  • Automotive Circuit Boards
  • Consumer Electronics Circuit Boards
  • Medical Circuit Boards
  • Industrial Circuit Boards

Copper Clad Laminates Market, By Material Type:

  • FR-4
  • CEM-1
  • CEM-3
  • FR-2
  • FR-5
  • Polyimide
  • PTFE

Copper Clad Laminates Market, By Manufacturing Process:

  • Laminating Resin Press
  • High-Pressure Laminating Press
  • Double-Sided Tape Lamination
  • Cold Lamination Press
  • High-Frequency Lamination Press

Copper Clad Laminates Market, By Region:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE
    • Kuwait
    • Turkey

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Copper Clad Laminates Market.

Available Customizations:

Global Copper Clad Laminates Market report with the given Market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional Market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
  • 1.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Formulation of the Scope
  • 2.4. Assumptions and Limitations
  • 2.5. Sources of Research
    • 2.5.1. Secondary Research
    • 2.5.2. Primary Research
  • 2.6. Approach for the Market Study
    • 2.6.1. The Bottom-Up Approach
    • 2.6.2. The Top-Down Approach
  • 2.7. Methodology Followed for Calculation of Market Size & Market Shares
  • 2.8. Forecasting Methodology
    • 2.8.1. Data Triangulation & Validation

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Copper Clad Laminates Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Application (High-Speed Digital Circuit Boards, Power Circuit Boards, Automotive Circuit Boards, Consumer Electronics Circuit Boards, Medical Circuit Boards, Industrial Circuit Boards)
    • 5.2.2. By Material Type (FR-4, CEM-1, CEM-3, FR-2, FR-5, Polyimide, PTFE)
    • 5.2.3. By Manufacturing Process (Laminating Resin Press, High-Pressure Laminating Press, Double-Sided Tape Lamination, Cold Lamination Press, High-Frequency Lamination Press)
    • 5.2.4. By Region
  • 5.3. By Company (2024)
  • 5.4. Market Map

6. North America Copper Clad Laminates Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Application
    • 6.2.2. By Material Type
    • 6.2.3. By Manufacturing Process
    • 6.2.4. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Copper Clad Laminates Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Application
        • 6.3.1.2.2. By Material Type
        • 6.3.1.2.3. By Manufacturing Process
    • 6.3.2. Canada Copper Clad Laminates Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Application
        • 6.3.2.2.2. By Material Type
        • 6.3.2.2.3. By Manufacturing Process
    • 6.3.3. Mexico Copper Clad Laminates Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Application
        • 6.3.3.2.2. By Material Type
        • 6.3.3.2.3. By Manufacturing Process

7. Europe Copper Clad Laminates Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Application
    • 7.2.2. By Material Type
    • 7.2.3. By Manufacturing Process
    • 7.2.4. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Copper Clad Laminates Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Application
        • 7.3.1.2.2. By Material Type
        • 7.3.1.2.3. By Manufacturing Process
    • 7.3.2. United Kingdom Copper Clad Laminates Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Application
        • 7.3.2.2.2. By Material Type
        • 7.3.2.2.3. By Manufacturing Process
    • 7.3.3. Italy Copper Clad Laminates Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Application
        • 7.3.3.2.2. By Material Type
        • 7.3.3.2.3. By Manufacturing Process
    • 7.3.4. France Copper Clad Laminates Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Application
        • 7.3.4.2.2. By Material Type
        • 7.3.4.2.3. By Manufacturing Process
    • 7.3.5. Spain Copper Clad Laminates Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Application
        • 7.3.5.2.2. By Material Type
        • 7.3.5.2.3. By Manufacturing Process

8. Asia-Pacific Copper Clad Laminates Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Application
    • 8.2.2. By Material Type
    • 8.2.3. By Manufacturing Process
    • 8.2.4. By Country
  • 8.3. Asia-Pacific: Country Analysis
    • 8.3.1. China Copper Clad Laminates Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Application
        • 8.3.1.2.2. By Material Type
        • 8.3.1.2.3. By Manufacturing Process
    • 8.3.2. India Copper Clad Laminates Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Application
        • 8.3.2.2.2. By Material Type
        • 8.3.2.2.3. By Manufacturing Process
    • 8.3.3. Japan Copper Clad Laminates Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Application
        • 8.3.3.2.2. By Material Type
        • 8.3.3.2.3. By Manufacturing Process
    • 8.3.4. South Korea Copper Clad Laminates Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Application
        • 8.3.4.2.2. By Material Type
        • 8.3.4.2.3. By Manufacturing Process
    • 8.3.5. Australia Copper Clad Laminates Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Application
        • 8.3.5.2.2. By Material Type
        • 8.3.5.2.3. By Manufacturing Process

9. South America Copper Clad Laminates Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Application
    • 9.2.2. By Material Type
    • 9.2.3. By Manufacturing Process
    • 9.2.4. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Copper Clad Laminates Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Application
        • 9.3.1.2.2. By Material Type
        • 9.3.1.2.3. By Manufacturing Process
    • 9.3.2. Argentina Copper Clad Laminates Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Application
        • 9.3.2.2.2. By Material Type
        • 9.3.2.2.3. By Manufacturing Process
    • 9.3.3. Colombia Copper Clad Laminates Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Application
        • 9.3.3.2.2. By Material Type
        • 9.3.3.2.3. By Manufacturing Process

10. Middle East and Africa Copper Clad Laminates Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Application
    • 10.2.2. By Material Type
    • 10.2.3. By Manufacturing Process
    • 10.2.4. By Country
  • 10.3. Middle East and Africa: Country Analysis
    • 10.3.1. South Africa Copper Clad Laminates Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Application
        • 10.3.1.2.2. By Material Type
        • 10.3.1.2.3. By Manufacturing Process
    • 10.3.2. Saudi Arabia Copper Clad Laminates Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Application
        • 10.3.2.2.2. By Material Type
        • 10.3.2.2.3. By Manufacturing Process
    • 10.3.3. UAE Copper Clad Laminates Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Application
        • 10.3.3.2.2. By Material Type
        • 10.3.3.2.3. By Manufacturing Process
    • 10.3.4. Kuwait Copper Clad Laminates Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Application
        • 10.3.4.2.2. By Material Type
        • 10.3.4.2.3. By Manufacturing Process
    • 10.3.5. Turkey Copper Clad Laminates Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Application
        • 10.3.5.2.2. By Material Type
        • 10.3.5.2.3. By Manufacturing Process

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Company Profiles

  • 13.1. Kingboard Laminates Holdings Ltd.
    • 13.1.1. Business Overview
    • 13.1.2. Key Revenue and Financials
    • 13.1.3. Recent Developments
    • 13.1.4. Key Personnel/Key Contact Person
    • 13.1.5. Key Product/Services Offered
  • 13.2. Nan Ya Plastics Corporation
  • 13.3. Panasonic Corporation
  • 13.4. ITEQ Corporation
  • 13.5. Shengyi Technology Co., Ltd. (SYTECH)
  • 13.6. Isola Group
  • 13.7. Doosan Corporation Electro-Materials
  • 13.8. Nippon Mektron, Ltd.
  • 13.9. Ventec International Group
  • 13.10. Rogers Corporation

14. Strategic Recommendations

15. About Us & Disclaimer