切割胶带市场－全球产业规模、份额、趋势、机会和预测，按类型、材料、最终用途产业、地区和竞争细分，2020-2030 年预测

2024 年全球切割胶带市场价值为 13.4 亿美元，预计到 2030 年将达到 19.4 亿美元，预测期内的复合年增长率为 6.21%。切割胶带是半导体和电子製造中使用的专用黏合材料，可在高精度切割过程中牢固地固定晶圆、玻璃或陶瓷基板。这些胶带对于防止机械或雷射切割操作过程中出现碎裂、开裂或错位至关重要。这些胶带种类繁多，从紫外线固化和非紫外线到放热和压敏型，可满足各种应用需求。电子、汽车、电信和工业应用中对半导体日益增长的需求推动了市场的扩张。随着积体电路的复杂性和小型化程度的提高，对可靠、高性能切割胶带解决方案的需求也在不断增长，以确保准确、无损的组件分离。

关键市场驱动因素

半导体产业的扩张

主要市场挑战

高级切割胶带成本高昂

主要市场趋势

非紫外线切割胶带的采用率不断提高

目录

第 1 章：产品概述

第二章：研究方法

第三章：执行摘要

第四章：顾客之声

第五章：全球切割胶带市场展望

• 市场规模和预测
  • 按价值
• 市场占有率和预测
  • 依类型（UV 固化切割胶带、非 UV 切割胶带、热释放切割胶带、压敏切割胶带）
  • 依材质（聚乙烯、聚氯乙烯、聚对苯二甲酸乙二酯、聚烯烃）
  • 依最终用途产业（半导体、电子、光子学、汽车）
  • 按地区（北美、欧洲、南美、中东和非洲、亚太地区）
• 按公司分类（2024）
• 市场地图

第六章：北美切割胶带市场展望

• 市场规模和预测
• 市场占有率和预测
• 北美：国家分析
  • 美国
  • 加拿大
  • 墨西哥

第七章：欧洲切割胶带市场展望

• 市场规模和预测
• 市场占有率和预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太切割胶带市场展望

• 市场规模和预测
• 市场占有率和预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲切割胶带市场展望

• 市场规模和预测
• 市场占有率和预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非

第十章：南美洲切割胶带市场展望

• 市场规模和预测
• 市场占有率和预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第 11 章：市场动态

• 驱动程式
• 挑战

第 12 章：市场趋势与发展

• 合併与收购（如有）
• 产品发布（如有）
• 最新动态

第十三章：公司简介

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Shinto Paint Co., Ltd
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Lintec Corporation
• Samsung Fine Chemicals
• Avery Dennison Corporation

第 14 章：策略建议

第15章调查会社について・免责事项

The Global Dicing Tapes Market was valued at USD 1.34 Billion in 2024 and is projected to reach USD 1.94 Billion by 2030, growing at a CAGR of 6.21% during the forecast period. Dicing tapes are specialized adhesive materials used in semiconductor and electronics manufacturing to securely hold wafers, glass, or ceramic substrates during high-precision dicing processes. These tapes are essential for preventing chipping, cracking, or misalignment during mechanical or laser-based cutting operations. With types ranging from UV curable and non-UV to heat-release and pressure-sensitive variants, these tapes are tailored to meet diverse application needs. The market's expansion is being propelled by the growing demand for semiconductors in electronics, automotive, telecom, and industrial applications. As the complexity and miniaturization of integrated circuits increase, so does the need for reliable, high-performance dicing tape solutions that can ensure accurate and damage-free component separation.

Key Market Drivers

Expansion of the Semiconductor Industry

The rapid growth of the global semiconductor sector is a major driver of the Dicing Tapes market. With increasing adoption of electronic devices in areas such as consumer electronics, automotive systems, telecom infrastructure, and medical technology, there is a heightened need for precise semiconductor chip fabrication. Dicing tapes are vital to maintaining wafer integrity during dicing, especially as chip designs become more compact and intricate. Advanced adhesion and thermal resistance properties are essential in this context, prompting manufacturers to innovate and deliver next-generation tape solutions. Continued R&D in materials and adhesives ensures compatibility with evolving semiconductor manufacturing standards and supports the industry's demand for performance and reliability.

Key Market Challenges

High Cost of Advanced Dicing Tapes

One of the primary challenges in the Dicing Tapes market is the elevated cost of producing technologically advanced tapes. These specialized tapes are engineered to perform under stringent conditions-such as maintaining adhesion under thermal stress and enabling clean, precise wafer separation. However, the R&D, raw materials, and manufacturing processes required to produce such high-performance products significantly increase production expenses. For semiconductor manufacturers, particularly small and mid-sized firms, these higher costs can impact overall profitability. The financial burden of incorporating premium dicing tapes into production lines may limit adoption and create entry barriers, especially in cost-sensitive regions or for lower-volume applications.

Key Market Trends

Increased Adoption of Non-UV Dicing Tapes

A notable trend shaping the Dicing Tapes market is the growing shift toward non-UV dicing tapes. These tapes eliminate the need for ultraviolet exposure, offering enhanced protection for delicate wafers and components during the dicing process. With better adhesion and compatibility for high-precision applications, non-UV tapes are increasingly used in advanced semiconductor packaging. Their role is especially prominent in the fabrication of chips for 5G networks, artificial intelligence, and memory devices, where clean cuts and wafer stability are critical. These tapes also support high-temperature processing environments and fine-pitch designs, making them ideal for next-generation chip technologies. As manufacturers seek more robust and efficient solutions, non-UV dicing tapes are gaining favor across the semiconductor value chain.

Key Market Players

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Lintec Corporation
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Shinto Paint Co., Ltd
• Samsung Fine Chemicals
• Avery Dennison Corporation

Report Scope:

In this report, the Global Dicing Tapes Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Dicing Tapes Market, By Type:

• UV Curable Dicing Tapes
• Non-UV Dicing Tapes
• Heat Release Dicing Tapes
• Pressure Sensitive Dicing Tapes

Dicing Tapes Market, By Material:

• Polyethylene
• Polyvinyl Chloride
• Polyethylene Terephthalate
• Polyolefin

Dicing Tapes Market, By End-use Industry:

• Semiconductor
• Electronics
• Photonics
• Automotive

Dicing Tapes Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
• South America
  • Brazil
  • Argentina
  • Colombia
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Dicing Tapes Market.

Available Customizations:

Global Dicing Tapes Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Dicing Tapes Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (UV Curable Dicing Tapes, Non-UV Dicing Tapes, Heat Release Dicing Tapes, Pressure Sensitive Dicing Tapes)
  • 5.2.2. By Material (Polyethylene, Polyvinyl Chloride, Polyethylene Terephthalate, Polyolefin)
  • 5.2.3. By End-use Industry (Semiconductor, Electronics, Photonics, Automotive)
  • 5.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 5.3. By Company (2024)
• 5.4. Market Map

6. North America Dicing Tapes Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Material
  • 6.2.3. By End-use Industry
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Dicing Tapes Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Material
      • 6.3.1.2.3. By End-use Industry
  • 6.3.2. Canada Dicing Tapes Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Material
      • 6.3.2.2.3. By End-use Industry
  • 6.3.3. Mexico Dicing Tapes Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Material
      • 6.3.3.2.3. By End-use Industry

7. Europe Dicing Tapes Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Material
  • 7.2.3. By End-use Industry
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Dicing Tapes Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Material
      • 7.3.1.2.3. By End-use Industry
  • 7.3.2. France Dicing Tapes Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Material
      • 7.3.2.2.3. By End-use Industry
  • 7.3.3. United Kingdom Dicing Tapes Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Material
      • 7.3.3.2.3. By End-use Industry
  • 7.3.4. Italy Dicing Tapes Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Material
      • 7.3.4.2.3. By End-use Industry
  • 7.3.5. Spain Dicing Tapes Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Material
      • 7.3.5.2.3. By End-use Industry

8. Asia Pacific Dicing Tapes Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Material
  • 8.2.3. By End-use Industry
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Dicing Tapes Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Material
      • 8.3.1.2.3. By End-use Industry
  • 8.3.2. India Dicing Tapes Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Material
      • 8.3.2.2.3. By End-use Industry
  • 8.3.3. Japan Dicing Tapes Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Material
      • 8.3.3.2.3. By End-use Industry
  • 8.3.4. South Korea Dicing Tapes Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Material
      • 8.3.4.2.3. By End-use Industry
  • 8.3.5. Australia Dicing Tapes Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Material
      • 8.3.5.2.3. By End-use Industry

9. Middle East & Africa Dicing Tapes Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Material
  • 9.2.3. By End-use Industry
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Dicing Tapes Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Material
      • 9.3.1.2.3. By End-use Industry
  • 9.3.2. UAE Dicing Tapes Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Material
      • 9.3.2.2.3. By End-use Industry
  • 9.3.3. South Africa Dicing Tapes Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Material
      • 9.3.3.2.3. By End-use Industry

10. South America Dicing Tapes Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Material
  • 10.2.3. By End-use Industry
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Dicing Tapes Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Material
      • 10.3.1.2.3. By End-use Industry
  • 10.3.2. Colombia Dicing Tapes Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Material
      • 10.3.2.2.3. By End-use Industry
  • 10.3.3. Argentina Dicing Tapes Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Material
      • 10.3.3.2.3. By End-use Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends and Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Company Profiles

• 13.1. Nitto Denko Corporation
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel
  • 13.1.5. Key Product/Services Offered
• 13.2. 3M Company
• 13.3. Tesa SE
• 13.4. Shinto Paint Co., Ltd
• 13.5. Momentive Performance Materials Inc
• 13.6. Dai Nippon Printing Co., Ltd.
• 13.7. Mitsui Chemicals, Inc.
• 13.8. Lintec Corporation
• 13.9. Samsung Fine Chemicals
• 13.10. Avery Dennison Corporation

14. Strategic Recommendations

15. About Us & Disclaimer