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市场调查报告书
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1812261

导热箔黏合剂市场－全球产业规模、份额、趋势、机会和预测（按类型、应用、地区和竞争细分，2020-2030 年）

Thermally Conductive Foil Adhesive Market-Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented by Type, By Application, By Region and Competition, 2020-2030F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

2024年，导热箔黏合剂市值为7.7386亿美元，预计到2030年将达到9.3533亿美元，复合年增长率为3.39%。全球黏合剂产业是一个充满活力且不断发展的产业，也是各行各业各种应用的关键组成部分。在专用黏合剂产品中，导热箔黏合剂因其独特的高效导热能力和强大的黏合性能而备受瞩目。电子产业的快速发展，以设备尺寸不断缩小和功率密度不断提高为特征，催生了对高效散热的需求。导热箔黏合剂能够有效地将电子元件的热传导出去。

市场概况
预测期 2026-2030
2024年市场规模 7.7386亿美元
2030年市场规模 9.3533亿美元
2025-2030年复合年增长率 3.39%
成长最快的领域 医疗保健
最大的市场 亚太地区

随着电子设备变得越来越小、越来越紧凑，管理密集组件产生的热量成为一项重大挑战。导热箔黏合剂在散热方面发挥着至关重要的作用，确保了小型化电子产品的可靠性和性能。汽车和航太等行业面临着提高能源效率同时保持高性能标准的压力。在这些领域，导热箔黏合剂用于增强热管理并有助于节能。实现对包括金属、陶瓷和塑胶在内的各种基材的有效黏合，对导热箔黏合剂提出了挑战。客製化黏合配方以确保与特定材料的兼容性至关重要。随着电子设备变得越来越小、越来越复杂，确保导热箔黏合剂的精确应用和均匀厚度在技术上可能具有挑战性。

预计市场对可持续环保的导热箔黏合剂的需求将持续增长。黏合剂製造商将继续探索减少环境影响的配方。随着电子设备的不断发展，导热箔黏合剂将在先进的热管理解决方案中发挥关键作用。这些黏合剂需要提供更高的导热性和更强的耐用性。电动车的日益普及预计将推动汽车产业对导热箔黏合剂的需求，尤其是在电池热管理方面，以确保安全且有效率的运作。

全球导热箔黏合剂市场是各行各业的重要贡献者，确保电子设备、汽车应用等领域的高效热管理和散热。随着各行各业持续重视能源效率、小型化和热性能，导热箔黏合剂仍将是提昇技术能力的关键要素。为了在这个充满活力的市场中脱颖而出，黏合剂製造商应优先考虑创新，重点关注永续性、先进的导热性和材料相容性。随着技术的不断发展以及各行各业对高效热管理解决方案的追求，导热箔黏合剂在塑造电子设备和热应用的未来方面预计将继续发挥关键作用。

关键市场驱动因素

电子产业的不断发展是导热箔黏合剂市场成长的主要因素

主要市场挑战

小型化复杂性

主要市场趋势

先进的热管理

目录

第 1 章：产品概述

第二章：研究方法

第三章：执行摘要

第四章：干扰：衝突、流行病与贸易壁垒

第五章：全球导热箔黏合剂市场展望

  • 市场规模和预测
    • 按价值和数量
  • 市场占有率和预测
    • 按类型（单面、双面、其他）
    • 按应用（电脑、通讯、工业、医疗保健和其他）
    • 按地区
    • 按公司分类（2024 年）
  • 市场地图

第六章：亚太导热箔黏合剂市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 亚太地区：国家分析
    • 中国
    • 印度
    • 澳洲
    • 日本
    • 韩国

第七章：欧洲导热箔黏合剂市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 欧洲：国家分析
    • 法国
    • 德国
    • 西班牙
    • 义大利
    • 英国

第八章：北美导热箔黏合剂市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 北美：国家分析
    • 美国
    • 墨西哥
    • 加拿大

第九章：南美洲导热箔黏合剂市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • 南美洲：国家分析
    • 巴西
    • 阿根廷
    • 哥伦比亚

第十章：中东和非洲导热箔黏合剂市场展望

  • 市场规模和预测
  • 市场占有率和预测
  • MEA：国家分析
    • 南非
    • 沙乌地阿拉伯
    • 阿联酋
    • 科威特
    • 土耳其
    • 埃及

第 11 章：市场动态

  • 驱动程式
  • 挑战

第 12 章：市场趋势与发展

  • 最新动态
  • 产品发布
  • 併购

第十三章：全球导热箔黏合剂市场：SWOT分析

第 14 章：定价分析

第 15 章：波特五力分析

  • 产业竞争
  • 新进入者的潜力
  • 供应商的力量
  • 顾客的力量
  • 替代产品的威胁

第 16 章： 大环境分析

第 17 章：竞争格局

  • Fischer Elektronik
  • AMEC Thermasol
  • Katecho Inc
  • 3M Company
  • Teraoka Seisakusho Co Ltd
  • Can-Do National Tape (Tape Holding Co Inc)
  • Dexerials Corporation
  • Nitto Denko Corp
  • T-Global Technology

第 18 章：策略建议

第 19 章：关于我们与免责声明

简介目录
Product Code: 17669

Thermally Conductive Foil Adhesive Market was valued at USD 773.86 Million in 2024 and is expected to reach USD 935.33 Million by 2030 with a CAGR of 3.39%. The global adhesive industry is a dynamic and evolving sector that serves as a critical component in various applications across industries. Among the specialized adhesive products, thermally conductive foil adhesives have gained prominence due to their unique ability to transfer heat efficiently while providing strong bonding properties. The rapid evolution of the electronics industry, characterized by shrinking device sizes and increasing power densities, has created a need for efficient heat dissipation. Thermally conductive foil adhesives enable the effective transfer of heat away from electronic components.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 773.86 Million
Market Size 2030USD 935.33 Million
CAGR 2025-20303.39%
Fastest Growing SegmentMedical Care
Largest MarketAsia Pacific

As electronic devices become smaller and more compact, managing heat generated by densely packed components becomes a significant challenge. Thermally conductive foil adhesives play a vital role in dissipating heat, ensuring the reliability and performance of miniaturized electronics. Industries such as automotive and aerospace are under pressure to improve energy efficiency while maintaining high-performance standards. Thermally conductive foil adhesives are utilized in these sectors to enhance thermal management and contribute to energy savings. Achieving effective adhesion to a wide range of substrates, including metals, ceramics, and plastics, poses a challenge for thermally conductive foil adhesives. Tailoring adhesive formulations to ensure compatibility with specific materials is essential. As electronic devices become smaller and more intricate, ensuring precise application and uniform thickness of thermally conductive foil adhesives can be technically challenging.

The market is expected to witness a growing demand for sustainable and environmentally friendly thermally conductive foil adhesives. Adhesive manufacturers will continue to explore formulations that reduce environmental impact. As electronic devices continue to evolve, thermally conductive foil adhesives will play a pivotal role in advanced thermal management solutions. These adhesives will need to deliver higher thermal conductivity and improved durability. The growing adoption of electric vehicles is expected to drive demand for thermally conductive foil adhesives in the automotive sector, particularly for battery thermal management to ensure safe and efficient operation.

The global thermally conductive foil adhesive market is positioned as an essential contributor to various industries, ensuring efficient heat management and thermal dissipation in electronic devices, automotive applications, and more. As industries continue to prioritize energy efficiency, miniaturization, and thermal performance, thermally conductive foil adhesives will remain a critical element in advancing technological capabilities. To excel in this dynamic market, adhesive manufacturers should prioritize innovation, with a focus on sustainability, advanced thermal conductivity, and material compatibility. As technology continues to evolve and industries seek solutions for efficient thermal management, the role of thermally conductive foil adhesives in shaping the future of electronic devices and thermal applications is expected to remain pivotal.

Key Market Drivers

Growing Advancement in Electronic Industry is Major Factor for Thermally Conductive Foil Adhesive Market Growth

The global thermally conductive foil adhesive market is experiencing significant growth, primarily driven by the continuous advancement in the electronic industry. The electronic industry is characterized by rapid innovation, with manufacturers constantly seeking ways to enhance the performance and reliability of electronic components and devices. Efficient heat dissipation is a critical concern in electronics manufacturing. As electronic devices become more powerful and compact, managing heat generation is essential to ensure their longevity and reliability. The rapid expansion of the consumer electronics industry, with global demand for electronic products projected to double by 2050, is driving the need for advanced thermal management solutions. This surge in electronic device production directly supports the growing adoption of thermally conductive foil adhesives, which are essential for efficient heat dissipation and maintaining the performance and reliability of increasingly compact and high-powered electronic components.

Thermally conductive foil adhesives play a vital role in electronic applications by providing both thermal conductivity and adhesive properties. They facilitate the efficient transfer of heat away from electronic components to ensure proper functioning. With the increasing demand for smaller and more powerful electronic devices, there is a growing need for effective heat management solutions to prevent overheating and component failure. Thermally conductive foil adhesives are designed to bond various electronic components, including heat sinks, LEDs, integrated circuits (ICs), and power modules, to heat-spreading substrates such as metal, ceramic, or printed circuit boards (PCBs).

The electronic industry requires precise and reliable thermal solutions. Thermally conductive foil adhesives provide consistent and efficient heat transfer while ensuring the structural integrity of electronic assemblies. Ongoing research and development efforts in the adhesive industry have led to advanced formulations of thermally conductive foil adhesives. These formulations offer improved thermal conductivity, adhesion strength, and resistance to environmental factors. The growing advancement in the electronic industry's demand for efficient heat management solutions is driving the need for specialized thermally conductive foil adhesives. Electronics manufacturers seek adhesives that can dissipate heat in allowing for the development of more powerful and compact electronic devices.

The global thermally conductive foil adhesive market is experiencing robust growth, primarily driven by the continuous advancement in the electronic industry. These adhesives have become indispensable in the electronic manufacturing process, ensuring efficient heat management and the reliability of electronic components and devices. As the electronic industry continues to innovate and evolve, the market for thermally conductive foil adhesives is expected to thrive. Manufacturers and suppliers in this market must continue to innovate and provide high-quality solutions to meet the evolving demands of the electronic industry, ensuring continued growth and the development of cutting-edge electronic devices worldwide.

Key Market Challenges

Miniaturization Complexity

The global thermally conductive foil adhesive market faces a significant impediment in the form of miniaturization complexity. As electronic devices continue to shrink in size while simultaneously increasing in complexity and power, the demand for efficient heat management solutions has surged. Thermally conductive foil adhesives play a vital role in dissipating heat from electronic components to prevent overheating and ensure optimal performance.

However, miniaturization introduces complexities in the design and application of these adhesives. Smaller components mean tighter spaces, making it challenging to apply and secure thermally conductive foils effectively. Ensuring precise alignment and uniform adhesive coverage in these confined areas becomes a technical challenge.

To address this, manufacturers in the thermally conductive foil adhesive market must invest in research and development to create adhesive solutions that are compatible with miniaturized electronics. This includes formulations that offer exceptional thermal conductivity while also being flexible, easy to handle, and resistant to environmental factors. By meeting the demands of miniaturization complexity, the market can provide reliable solutions for the evolving electronics industry and drive its growth.

Key Market Trends

Advanced Thermal Management

Advanced thermal management techniques have emerged as a key trend driving the growth of the global thermally conductive foil adhesive market. In today's technology-driven world, electronic components are becoming increasingly powerful and compact, generating higher levels of heat. Efficient heat dissipation is crucial to ensure the reliability and longevity of these components.

Thermally conductive foil adhesive plays a vital role in thermal management solutions. These adhesives are designed to bond heat sinks, thermal interface materials, and foil tapes to electronic components, effectively conducting and dissipating heat away from sensitive areas. This enables better temperature control, preventing overheating and potential damage to electronics.

As industries like electronics, telecommunications, and automotive continue to demand smaller, more powerful devices, the need for advanced thermal management solutions grows. Thermally conductive foil adhesives that offer excellent thermal conductivity and adhesive properties are in high demand. Companies that innovate and provide these advanced adhesive solutions are poised to benefit from this trend, contributing to the development of more efficient and reliable electronic systems.

Key Market Players

  • Fischer Elektronik
  • AMEC Thermasol
  • Katecho Inc
  • 3M Company
  • Teraoka Seisakusho Co Ltd
  • Can-Do National Tape (Tape Holding Co Inc)
  • Dexerials Corporation
  • Nitto Denko Corp
  • T-Global Technology

Report Scope:

In this report, the Global Thermally Conductive Foil Adhesive Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Thermally Conductive Foil Adhesive Market, By Type:

  • One Side
  • Two Side
  • Other

Thermally Conductive Foil Adhesive Market, By Application:

  • Computer
  • Communication
  • Industry
  • Medical Care
  • Others

Thermally Conductive Foil Adhesive Market, By Region:

  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE
    • Kuwait
    • Turkey
    • Egypt

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Thermally Conductive Foil Adhesive Market.

Available Customizations:

Global Thermally Conductive Foil Adhesive market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Disruptions: Conflicts, Pandemics, and Trade Barriers

5. Global Thermally Conductive Foil Adhesive Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value & Volume
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (One Side, Two Side, and Other)
    • 5.2.2. By Application (Computer, Communication, Industry, Medical Care, and Other)
    • 5.2.3. By Region
    • 5.2.4. By Company (2024)
  • 5.3. Market Map

6. Asia Pacific Thermally Conductive Foil Adhesive Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value & Volume
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. Asia Pacific: Country Analysis
    • 6.3.1. China Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value & Volume
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Application
    • 6.3.2. India Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value & Volume
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Application
    • 6.3.3. Australia Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value & Volume
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Application
    • 6.3.4. Japan Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.4.1. Market Size & Forecast
        • 6.3.4.1.1. By Value & Volume
      • 6.3.4.2. Market Share & Forecast
        • 6.3.4.2.1. By Type
        • 6.3.4.2.2. By Application
    • 6.3.5. South Korea Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.5.1. Market Size & Forecast
        • 6.3.5.1.1. By Value & Volume
      • 6.3.5.2. Market Share & Forecast
        • 6.3.5.2.1. By Type
        • 6.3.5.2.2. By Application

7. Europe Thermally Conductive Foil Adhesive Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value & Volume
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. France Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value & Volume
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Application
    • 7.3.2. Germany Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value & Volume
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Application
    • 7.3.3. Spain Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value & Volume
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value & Volume
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Application
    • 7.3.5. United Kingdom Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value & Volume
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Application

8. North America Thermally Conductive Foil Adhesive Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value & Volume
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. North America: Country Analysis
    • 8.3.1. United States Thermally Conductive Foil Adhesive Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value & Volume
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Application
    • 8.3.2. Mexico Thermally Conductive Foil Adhesive Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value & Volume
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Application
    • 8.3.3. Canada Thermally Conductive Foil Adhesive Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value & Volume
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Application

9. South America Thermally Conductive Foil Adhesive Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value & Volume
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Thermally Conductive Foil Adhesive Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value & Volume
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Application
    • 9.3.2. Argentina Thermally Conductive Foil Adhesive Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value & Volume
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Application
    • 9.3.3. Colombia Thermally Conductive Foil Adhesive Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value & Volume
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Application

10. Middle East and Africa Thermally Conductive Foil Adhesive Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1.By Value & Volume
  • 10.2. Market Share & Forecast
    • 10.2.1.By Type
    • 10.2.2.By Application
    • 10.2.3.By Country
  • 10.3. MEA: Country Analysis
    • 10.3.1.South Africa Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value & Volume
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Application
    • 10.3.2.Saudi Arabia Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value & Volume
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Application
    • 10.3.3.UAE Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value & Volume
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Application
    • 10.3.4.Kuwait Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value & Volume
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Type
        • 10.3.4.2.2. By Application
    • 10.3.5.Turkey Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value & Volume
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Type
        • 10.3.5.2.2. By Application
    • 10.3.6.Egypt Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.6.1. Market Size & Forecast
        • 10.3.6.1.1. By Value & Volume
      • 10.3.6.2. Market Share & Forecast
        • 10.3.6.2.1. By Type
        • 10.3.6.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Recent Developments
  • 12.2. Product Launches
  • 12.3. Mergers & Acquisitions

13. Global Thermally Conductive Foil Adhesive Market: SWOT Analysis

14. Pricing Analysis

15. Porter's Five Forces Analysis

  • 15.1. Competition in the Industry
  • 15.2. Potential of New Entrants
  • 15.3. Power of Suppliers
  • 15.4. Power of Customers
  • 15.5. Threat of Substitute Products

16. PESTLE Analysis

17. Competitive Landscape

  • 17.1. Fischer Elektronik
    • 17.1.1.Business Overview
    • 17.1.2.Company Snapshot
    • 17.1.3.Products & Services
    • 17.1.4.Financials (In case of listed companies)
    • 17.1.5.Recent Developments
    • 17.1.6.SWOT Analysis
  • 17.2. AMEC Thermasol
  • 17.3. Katecho Inc
  • 17.4. 3M Company
  • 17.5. Teraoka Seisakusho Co Ltd
  • 17.6. Can-Do National Tape (Tape Holding Co Inc)
  • 17.7. Dexerials Corporation
  • 17.8. Nitto Denko Corp
  • 17.9. T-Global Technology

18. Strategic Recommendations

19. About us and Disclaimer