3D半导体封装市场－全球产业规模、份额、趋势、机会和预测，依技术、材料、产业垂直领域、地区和竞争格局划分，2020-2030年预测

2024年全球3D半导体封装市场规模为128.8亿美元，预计2030年将以19.22%的复合年增长率成长至369.8亿美元。 3D半导体封装技术将多个积体电路垂直堆迭在单一封装内，通常采用硅通孔进行层间直接通讯。与传统封装相比，这种方法可以缩小装置尺寸，提高整合密度，并改善电气性能和电源效率。

主要市场驱动因素

主要市场挑战

主要市场趋势

目录

第一章：产品概述

第二章：研究方法

第三章：执行概要

第四章：顾客之声

第五章：全球3D半导体封装市场展望

• 市场规模及预测
  • 按价值
• 市占率及预测
  • 依技术分类（3D硅通孔、3D封装迭封装、3D扇出型封装、3D引线键结）
  • 依材料分类（有机基板、键合线、引线框架、封装树脂、陶瓷封装、晶片黏接材料）
  • 依产业垂直领域划分（电子、工业、汽车与交通、医疗保健、IT与电信、航太与国防）
  • 按地区
  • 按公司（2024 年）
• 市场地图

第六章：北美3D半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 美国
  • 加拿大
  • 墨西哥

第七章：欧洲3D半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太地区3D半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲3D半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非

第十章：南美洲3D半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章：市场动态

• 司机
• 挑战

第十二章：市场趋势与发展

• 併购（如有）
• 产品发布（如有）
• 最新进展

第十三章：全球3D半导体封装市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商议价能力
• 顾客的力量
• 替代产品的威胁

第十五章：竞争格局

• Taiwan Semiconductor Manufacturing Company Ltd
• ASE Technology Holding Co. Ltd
• Samsung Electronics Co., Ltd.
• United Microelectronics Corporation
• Amkor Technology, Inc.
• Powertech Technology Inc.
• Siliconware Precision Industries Ltd.
• Qualcomm Incorporated
• Micron Technology, Inc.
• STMicroelectronics International NV

第十六章：策略建议

第17章调查会社について・免责事项

The Global 3D Semiconductor Packaging Market, valued at USD 12.88 Billion in 2024, is projected to experience a CAGR of 19.22% to reach USD 36.98 Billion by 2030. 3D semiconductor packaging vertically stacks multiple integrated circuits within a single package, often utilizing through-silicon vias for direct inter-layer communication. This method reduces device footprint, enhances integration density, and improves electrical performance and power efficiency over traditional packaging.

Key Market Drivers

The proliferation of artificial intelligence and machine learning stands as a paramount driver for the Global 3D Semiconductor Packaging Market. These advanced computational paradigms demand unprecedented levels of processing power, memory bandwidth, and reduced latency, which conventional 2D packaging struggles to provide. 3D packaging technologies, through their ability to vertically integrate logic and memory dies with shorter interconnects, directly address these requirements, enabling the creation of high-performance computing units vital for training and inference in AI systems.

Key Market Challenges

The growth of the Global 3D Semiconductor Packaging Market faces a significant impediment due to the considerable manufacturing costs and technical complexities involved. Vertically stacking multiple integrated circuits, while offering benefits like reduced footprint and enhanced integration, demands advanced fabrication processes and specialized equipment. The intricacies of integrating diverse materials and components, alongside the critical need to effectively manage thermal dissipation within these densely configured packages, necessitate substantial research, development, and capital investment.

Key Market Trends

The global 3D semiconductor packaging market is significantly influenced by the widespread adoption of chiplet architectures, which represent a modular approach to semiconductor design. This paradigm shifts from monolithic system-on-chip designs to integrating multiple specialized chiplets into a single package. Such an approach enhances design flexibility, improves manufacturing yields by allowing smaller, optimized dies, and enables the integration of diverse functionalities onto a single platform. Three-dimensional packaging is essential for effectively connecting these disparate chiplets with high bandwidth and low latency, maximizing performance within a compact footprint.

Key Market Players

• Taiwan Semiconductor Manufacturing Company Ltd
• ASE Technology Holding Co. Ltd
• Samsung Electronics Co., Ltd.
• United Microelectronics Corporation
• Amkor Technology, Inc.
• Powertech Technology Inc.
• Siliconware Precision Industries Ltd.
• Qualcomm Incorporated
• Micron Technology, Inc.
• STMicroelectronics International N.V.

Report Scope:

In this report, the Global 3D Semiconductor Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

3D Semiconductor Packaging Market, By Technology:

• 3D Through silicon via
• 3D Package on Package
• 3D Fan Out Based
• 3D Wire Bonded

3D Semiconductor Packaging Market, By Material:

• Organic Substrate
• Bonding Wire
• Leadframe
• Encapsulation Resin
• Ceramic Package
• Die Attach Material

3D Semiconductor Packaging Market, By Industry Vertical:

• Electronics
• Industrial
• Automotive & Transport
• Healthcare
• IT & Telecommunication
• Aerospace & Defense

3D Semiconductor Packaging Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global 3D Semiconductor Packaging Market.

Available Customizations:

Global 3D Semiconductor Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global 3D Semiconductor Packaging Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded)
  • 5.2.2. By Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material)
  • 5.2.3. By Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense)
  • 5.2.4. By Region
  • 5.2.5. By Company (2024)
• 5.3. Market Map

6. North America 3D Semiconductor Packaging Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Technology
  • 6.2.2. By Material
  • 6.2.3. By Industry Vertical
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States 3D Semiconductor Packaging Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Technology
      • 6.3.1.2.2. By Material
      • 6.3.1.2.3. By Industry Vertical
  • 6.3.2. Canada 3D Semiconductor Packaging Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Technology
      • 6.3.2.2.2. By Material
      • 6.3.2.2.3. By Industry Vertical
  • 6.3.3. Mexico 3D Semiconductor Packaging Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Technology
      • 6.3.3.2.2. By Material
      • 6.3.3.2.3. By Industry Vertical

7. Europe 3D Semiconductor Packaging Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Technology
  • 7.2.2. By Material
  • 7.2.3. By Industry Vertical
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany 3D Semiconductor Packaging Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Technology
      • 7.3.1.2.2. By Material
      • 7.3.1.2.3. By Industry Vertical
  • 7.3.2. France 3D Semiconductor Packaging Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Technology
      • 7.3.2.2.2. By Material
      • 7.3.2.2.3. By Industry Vertical
  • 7.3.3. United Kingdom 3D Semiconductor Packaging Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Technology
      • 7.3.3.2.2. By Material
      • 7.3.3.2.3. By Industry Vertical
  • 7.3.4. Italy 3D Semiconductor Packaging Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Technology
      • 7.3.4.2.2. By Material
      • 7.3.4.2.3. By Industry Vertical
  • 7.3.5. Spain 3D Semiconductor Packaging Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Technology
      • 7.3.5.2.2. By Material
      • 7.3.5.2.3. By Industry Vertical

8. Asia Pacific 3D Semiconductor Packaging Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Technology
  • 8.2.2. By Material
  • 8.2.3. By Industry Vertical
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China 3D Semiconductor Packaging Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Technology
      • 8.3.1.2.2. By Material
      • 8.3.1.2.3. By Industry Vertical
  • 8.3.2. India 3D Semiconductor Packaging Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Technology
      • 8.3.2.2.2. By Material
      • 8.3.2.2.3. By Industry Vertical
  • 8.3.3. Japan 3D Semiconductor Packaging Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Technology
      • 8.3.3.2.2. By Material
      • 8.3.3.2.3. By Industry Vertical
  • 8.3.4. South Korea 3D Semiconductor Packaging Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Technology
      • 8.3.4.2.2. By Material
      • 8.3.4.2.3. By Industry Vertical
  • 8.3.5. Australia 3D Semiconductor Packaging Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Technology
      • 8.3.5.2.2. By Material
      • 8.3.5.2.3. By Industry Vertical

9. Middle East & Africa 3D Semiconductor Packaging Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Technology
  • 9.2.2. By Material
  • 9.2.3. By Industry Vertical
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia 3D Semiconductor Packaging Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Technology
      • 9.3.1.2.2. By Material
      • 9.3.1.2.3. By Industry Vertical
  • 9.3.2. UAE 3D Semiconductor Packaging Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Technology
      • 9.3.2.2.2. By Material
      • 9.3.2.2.3. By Industry Vertical
  • 9.3.3. South Africa 3D Semiconductor Packaging Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Technology
      • 9.3.3.2.2. By Material
      • 9.3.3.2.3. By Industry Vertical

10. South America 3D Semiconductor Packaging Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Technology
  • 10.2.2. By Material
  • 10.2.3. By Industry Vertical
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil 3D Semiconductor Packaging Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Technology
      • 10.3.1.2.2. By Material
      • 10.3.1.2.3. By Industry Vertical
  • 10.3.2. Colombia 3D Semiconductor Packaging Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Technology
      • 10.3.2.2.2. By Material
      • 10.3.2.2.3. By Industry Vertical
  • 10.3.3. Argentina 3D Semiconductor Packaging Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Technology
      • 10.3.3.2.2. By Material
      • 10.3.3.2.3. By Industry Vertical

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global 3D Semiconductor Packaging Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Taiwan Semiconductor Manufacturing Company Ltd
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. ASE Technology Holding Co. Ltd
• 15.3. Samsung Electronics Co., Ltd.
• 15.4. United Microelectronics Corporation
• 15.5. Amkor Technology, Inc.
• 15.6. Powertech Technology Inc.
• 15.7. Siliconware Precision Industries Ltd.
• 15.8. Qualcomm Incorporated
• 15.9. Micron Technology, Inc.
• 15.10. STMicroelectronics International N.V.

16. Strategic Recommendations

17. About Us & Disclaimer