高密度互连PCB市场－全球产业规模、份额、趋势、机会和预测，以互连层数（单层HDI、双层或多层HDI和全层HDI）、应用、区域和竞争格局划分，2020-2030年预测

2024年全球高密度互连PCB市场规模为78.2亿美元，预计2030年将以17.92%的复合年增长率成长至210.2亿美元。高密度互连（HDI）PCB是一种印刷电路板，其单位面积布线密度高于传统电路板，并采用微孔、更精细的线路和间距以及盲孔或埋孔等技术，以实现更高的电气性能和更小的尺寸。市场成长的主要驱动因素包括：对小型轻量电子设备的需求不断增长、先进消费性电子产品的普及以及汽车行业中用于自动驾驶和高级驾驶辅助系统的复杂系统的日益整合。

主要市场驱动因素

主要市场挑战

主要市场趋势

目录

第一章：产品概述

第二章：研究方法

第三章：执行概要

第四章：顾客之声

第五章：全球高密度互连PCB市场展望

• 市场规模及预测
  • 按价值
• 市占率及预测
  • 以互连层数划分（1 层 (1+N+1) HDI、2 层或更多层 (2+N+2) HDI、所有层均为 HD）
  • 按应用领域（消费性电子、汽车、军事和国防、医疗保健、工业/製造、其他）
  • 按地区
  • 按公司（2024 年）
• 市场地图

第六章：北美高密度互连PCB市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 美国
  • 加拿大
  • 墨西哥

第七章：欧洲高密度互连PCB市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太地区高密度互连PCB市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲高密度互连PCB市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非

第十章：南美高密度互连PCB市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章：市场动态

• 司机
• 挑战

第十二章：市场趋势与发展

• 併购（如有）
• 产品发布（如有）
• 最新进展

第十三章：全球高密度互连PCB市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商议价能力
• 顾客的力量
• 替代产品的威胁

第十五章：竞争格局

• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• Samsung Electronics Co., Ltd.
• GlobalFoundries Inc.
• United Microelectronics Corporation
• Applied Materials, Inc.
• Cadence Design Systems, Inc..
• Synopsys, Inc.
• Advanced Micro Devices Inc.
• Lam Research Corporation

第十六章：策略建议

第17章调查会社について・免责事项

The Global High Density Interconnect PCB Market, valued at USD 7.82 Billion in 2024, is projected to experience a CAGR of 17.92% to reach USD 21.02 Billion by 2030. High Density Interconnect (HDI) PCBs are printed circuit boards characterized by a higher wiring density per unit area than conventional boards, incorporating features such as microvias, finer lines and spaces, and blind or buried vias to achieve enhanced electrical performance and miniaturization. The market's growth is primarily driven by the escalating demand for compact and lightweight electronic devices, the proliferation of advanced consumer electronics, and the expanding integration of sophisticated systems in the automotive sector for autonomous driving and advanced driver-assistance systems.

Key Market Drivers

The global High Density Interconnect PCB Market experiences significant expansion driven by the continuous miniaturization of electronic devices. Demand for compact, lighter, and higher-performing electronics necessitates advanced printed circuit board solutions. HDI technology directly facilitates this trend by enabling finer lines, smaller vias, and greater connection densities, crucial for integrating advanced functionalities within reduced device dimensions. For example, according to Apple's announcement, in June 2023, the company planned to introduce resin-coated copper materials in its iPhone models in 2024, replacing some copper-clad laminates, a strategic shift underscoring commitment to space-efficient designs.

Key Market Challenges

The inherent manufacturing complexity and elevated production costs associated with High Density Interconnect (HDI) PCBs present a significant impediment to the growth of the global market. The intricate design requirements for HDI PCBs, including microvias and fine line technology, necessitate specialized equipment and highly precise processes. This directly contributes to higher unit costs, which can constrain broader adoption in various cost-sensitive applications. For instance, establishing a single high-end HDI PCB production line requires an investment exceeding $7 million, according to Revista Espanola de Electronica in 2025.

Key Market Trends

The Global High Density Interconnect PCB Market is significantly influenced by the proliferation of flexible and rigid-flex HDI form factors. This trend addresses the evolving demand for compact, lightweight, and highly adaptable electronic devices by integrating rigid and flexible substrates into a single, interconnected structure. Such designs minimize the need for traditional connectors, consequently reducing overall assembly size, weight, and potential points of failure, while simultaneously enhancing signal integrity. These advantages are crucial for modern applications such as wearables, medical devices, and advanced automotive systems that require complex circuitry in constrained spaces.

Key Market Players

• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• Samsung Electronics Co., Ltd.
• GlobalFoundries Inc.
• United Microelectronics Corporation
• Applied Materials, Inc.
• Cadence Design Systems, Inc..
• Synopsys, Inc.
• Advanced Micro Devices Inc.
• Lam Research Corporation

Report Scope:

In this report, the Global High Density Interconnect PCB Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

High Density Interconnect PCB Market, By Interconnection Layers:

• 1 Layer (1+N+1) HDI
• 2 or more layers (2+N+2) HDI
• All Layers HD

High Density Interconnect PCB Market, By Application:

• Consumer Electronics
• Automotive
• Military and Defense
• Healthcare
• Industrial/ Manufacturing
• Others

High Density Interconnect PCB Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global High Density Interconnect PCB Market.

Available Customizations:

Global High Density Interconnect PCB Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global High Density Interconnect PCB Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Interconnection Layers (1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, All Layers HD)
  • 5.2.2. By Application (Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, Others)
  • 5.2.3. By Region
  • 5.2.4. By Company (2024)
• 5.3. Market Map

6. North America High Density Interconnect PCB Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Interconnection Layers
  • 6.2.2. By Application
  • 6.2.3. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States High Density Interconnect PCB Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Interconnection Layers
      • 6.3.1.2.2. By Application
  • 6.3.2. Canada High Density Interconnect PCB Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Interconnection Layers
      • 6.3.2.2.2. By Application
  • 6.3.3. Mexico High Density Interconnect PCB Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Interconnection Layers
      • 6.3.3.2.2. By Application

7. Europe High Density Interconnect PCB Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Interconnection Layers
  • 7.2.2. By Application
  • 7.2.3. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany High Density Interconnect PCB Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Interconnection Layers
      • 7.3.1.2.2. By Application
  • 7.3.2. France High Density Interconnect PCB Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Interconnection Layers
      • 7.3.2.2.2. By Application
  • 7.3.3. United Kingdom High Density Interconnect PCB Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Interconnection Layers
      • 7.3.3.2.2. By Application
  • 7.3.4. Italy High Density Interconnect PCB Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Interconnection Layers
      • 7.3.4.2.2. By Application
  • 7.3.5. Spain High Density Interconnect PCB Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Interconnection Layers
      • 7.3.5.2.2. By Application

8. Asia Pacific High Density Interconnect PCB Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Interconnection Layers
  • 8.2.2. By Application
  • 8.2.3. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China High Density Interconnect PCB Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Interconnection Layers
      • 8.3.1.2.2. By Application
  • 8.3.2. India High Density Interconnect PCB Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Interconnection Layers
      • 8.3.2.2.2. By Application
  • 8.3.3. Japan High Density Interconnect PCB Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Interconnection Layers
      • 8.3.3.2.2. By Application
  • 8.3.4. South Korea High Density Interconnect PCB Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Interconnection Layers
      • 8.3.4.2.2. By Application
  • 8.3.5. Australia High Density Interconnect PCB Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Interconnection Layers
      • 8.3.5.2.2. By Application

9. Middle East & Africa High Density Interconnect PCB Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Interconnection Layers
  • 9.2.2. By Application
  • 9.2.3. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia High Density Interconnect PCB Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Interconnection Layers
      • 9.3.1.2.2. By Application
  • 9.3.2. UAE High Density Interconnect PCB Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Interconnection Layers
      • 9.3.2.2.2. By Application
  • 9.3.3. South Africa High Density Interconnect PCB Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Interconnection Layers
      • 9.3.3.2.2. By Application

10. South America High Density Interconnect PCB Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Interconnection Layers
  • 10.2.2. By Application
  • 10.2.3. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil High Density Interconnect PCB Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Interconnection Layers
      • 10.3.1.2.2. By Application
  • 10.3.2. Colombia High Density Interconnect PCB Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Interconnection Layers
      • 10.3.2.2.2. By Application
  • 10.3.3. Argentina High Density Interconnect PCB Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Interconnection Layers
      • 10.3.3.2.2. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global High Density Interconnect PCB Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Taiwan Semiconductor Manufacturing Company Limited
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Intel Corporation
• 15.3. Samsung Electronics Co., Ltd.
• 15.4. GlobalFoundries Inc.
• 15.5. United Microelectronics Corporation
• 15.6. Applied Materials, Inc.
• 15.7. Cadence Design Systems, Inc..
• 15.8. Synopsys, Inc.
• 15.9. Advanced Micro Devices Inc.
• 15.10. Lam Research Corporation

16. Strategic Recommendations

17. About Us & Disclaimer