封装内电源晶片市场－全球产业规模、份额、趋势、机会及预测，依产品、应用、地区及竞争格局划分，2020-2030年预测

2024年全球电源封装晶片市场规模为30.6亿美元，预计2030年将以7.86%的复合年增长率成长至48.2亿美元。电源封装（PSiP）晶片将电源管理功能（例如DC-DC转换器和电压调节器）与其他半导体元件整合到单一紧凑的封装中。这种设计优化了电源传输，提高了效率，并缩小了电子系统的尺寸。

主要市场驱动因素

主要市场挑战

主要市场趋势

目录

第一章：产品概述

第二章：研究方法

第三章：执行概要

第四章：顾客之声

第五章：全球封装内电源晶片市场展望

• 市场规模及预测
  • 按价值
• 市占率及预测
  • 按产品（PSiP、PwrSoC）
  • 按应用领域（电信和IT、汽车、消费性电子、医疗器材、军事和国防）
  • 按地区
  • 按公司（2024 年）
• 市场地图

第六章：北美封装内电源晶片市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 美国
  • 加拿大
  • 墨西哥

第七章：欧洲封装内供电晶片市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太地区封装内电源供应晶片市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲封装晶片电源供应市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非

第十章：南美洲电源封装晶片市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章：市场动态

• 司机
• 挑战

第十二章：市场趋势与发展

• 併购（如有）
• 产品发布（如有）
• 最新进展

第十三章：全球封装内供电晶片市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商议价能力
• 顾客的力量
• 替代产品的威胁

第十五章：竞争格局

• Infineon Technologies AG
• Texas Instruments Incorporated
• Semiconductor Components Industries, LLC
• STMicroelectronics International NV
• Analog Devices, Inc.
• NXP Semiconductors NV
• Renesas Electronics Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• Lextar Electronics Corporation

第十六章：策略建议

第17章调查会社について・免责事项

The Global Power Supply In Package Chip Market, valued at USD 3.06 Billion in 2024, is projected to experience a CAGR of 7.86% to reach USD 4.82 Billion by 2030. The Power Supply In Package (PSiP) chip integrates power management functions, such as DC-DC converters and voltage regulators, with other semiconductor components into a single compact package. This design optimizes power delivery, improves efficiency, and reduces the electronic system's footprint.

Key Market Drivers

The global Power Supply In Package chip market is significantly influenced by the continuous drive towards miniaturization and integration within electronic devices, alongside an escalating demand for energy-efficient power solutions. These twin imperatives directly impact the design and adoption of PSiP technologies, which are critical for optimizing power delivery and reducing system footprints across various applications. The broader semiconductor industry, which encompasses these power management solutions, demonstrated substantial growth, with Infineon Technologies AG reporting in November 2023 that its total revenue for fiscal year 2023 reached €16.309 billion, marking a 15 percent increase over the prior year.

Key Market Challenges

The complexity of thermal management presents a notable challenge directly hampering the growth of the Global Power Supply In Package Chip Market. The dense integration inherent in Power Supply In Package (PSiP) designs generates high power densities within a confined space. This necessitates robust heat dissipation mechanisms to prevent overheating, which is critical for ensuring stable operational performance and extending device longevity. Developing effective thermal solutions adds significant layers of complexity to the design and engineering processes for PSiP products.

Key Market Trends

The adoption of wide bandgap (WBG) semiconductor materials, such as silicon carbide and gallium nitride, represents a pivotal trend reshaping the Global Power Supply In Package Chip Market. These materials enable devices to operate at higher voltages, temperatures, and frequencies than traditional silicon, directly leading to greater power density and improved energy efficiency within compact PSiP designs. The superior electrical properties of WBG semiconductors facilitate faster switching speeds and reduced power losses, which are critical for the demanding performance requirements of modern electronics.

Key Market Players

• Infineon Technologies AG
• Texas Instruments Incorporated
• Semiconductor Components Industries, LLC
• STMicroelectronics International N.V.
• Analog Devices, Inc.
• NXP Semiconductors N.V.
• Renesas Electronics Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• Lextar Electronics Corporation

Report Scope:

In this report, the Global Power Supply In Package Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Power Supply In Package Chip Market, By Product:

• PSiP
• PwrSoC

Power Supply In Package Chip Market, By Application:

• Telecom and IT
• Automotive
• Consumer Electronics
• Medical Devices
• Military & Defense

Power Supply In Package Chip Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Power Supply In Package Chip Market.

Available Customizations:

Global Power Supply In Package Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Power Supply In Package Chip Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Product (PSiP, PwrSoC)
  • 5.2.2. By Application (Telecom and IT, Automotive, Consumer Electronics, Medical Devices, Military & Defense)
  • 5.2.3. By Region
  • 5.2.4. By Company (2024)
• 5.3. Market Map

6. North America Power Supply In Package Chip Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Product
  • 6.2.2. By Application
  • 6.2.3. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Power Supply In Package Chip Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Product
      • 6.3.1.2.2. By Application
  • 6.3.2. Canada Power Supply In Package Chip Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Product
      • 6.3.2.2.2. By Application
  • 6.3.3. Mexico Power Supply In Package Chip Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Product
      • 6.3.3.2.2. By Application

7. Europe Power Supply In Package Chip Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Product
  • 7.2.2. By Application
  • 7.2.3. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Power Supply In Package Chip Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Product
      • 7.3.1.2.2. By Application
  • 7.3.2. France Power Supply In Package Chip Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Product
      • 7.3.2.2.2. By Application
  • 7.3.3. United Kingdom Power Supply In Package Chip Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Product
      • 7.3.3.2.2. By Application
  • 7.3.4. Italy Power Supply In Package Chip Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Product
      • 7.3.4.2.2. By Application
  • 7.3.5. Spain Power Supply In Package Chip Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Product
      • 7.3.5.2.2. By Application

8. Asia Pacific Power Supply In Package Chip Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Product
  • 8.2.2. By Application
  • 8.2.3. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Power Supply In Package Chip Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Product
      • 8.3.1.2.2. By Application
  • 8.3.2. India Power Supply In Package Chip Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Product
      • 8.3.2.2.2. By Application
  • 8.3.3. Japan Power Supply In Package Chip Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Product
      • 8.3.3.2.2. By Application
  • 8.3.4. South Korea Power Supply In Package Chip Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Product
      • 8.3.4.2.2. By Application
  • 8.3.5. Australia Power Supply In Package Chip Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Product
      • 8.3.5.2.2. By Application

9. Middle East & Africa Power Supply In Package Chip Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Product
  • 9.2.2. By Application
  • 9.2.3. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Power Supply In Package Chip Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Product
      • 9.3.1.2.2. By Application
  • 9.3.2. UAE Power Supply In Package Chip Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Product
      • 9.3.2.2.2. By Application
  • 9.3.3. South Africa Power Supply In Package Chip Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Product
      • 9.3.3.2.2. By Application

10. South America Power Supply In Package Chip Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Product
  • 10.2.2. By Application
  • 10.2.3. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Power Supply In Package Chip Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Product
      • 10.3.1.2.2. By Application
  • 10.3.2. Colombia Power Supply In Package Chip Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Product
      • 10.3.2.2.2. By Application
  • 10.3.3. Argentina Power Supply In Package Chip Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Product
      • 10.3.3.2.2. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Power Supply In Package Chip Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Infineon Technologies AG
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Texas Instruments Incorporated
• 15.3. Semiconductor Components Industries, LLC
• 15.4. STMicroelectronics International N.V.
• 15.5. Analog Devices, Inc.
• 15.6. NXP Semiconductors N.V.
• 15.7. Renesas Electronics Corporation
• 15.8. Vishay Intertechnology, Inc.
• 15.9. Panasonic Corporation
• 15.10. Lextar Electronics Corporation

16. Strategic Recommendations

17. About Us & Disclaimer