航太印刷电路板市场－全球产业规模、份额、趋势、机会及预测，依平台类型、产品类型、层压材料类型、地区及竞争格局划分，2020-2030年预测

2024年全球航太印刷电路板市场规模为48.5亿美元，预计2030年将以7.54%的复合年增长率成长至75亿美元。航太印刷电路板（PCB）是专用的电子电路板，对关键的航空航天应用至关重要，用于互连航空电子设备、导航、通讯和控制系统的组件。 PCB的设计旨在应对严苛环境（包括极端温度和振动）下的极高可靠性。市场成长的驱动因素包括：航空电子系统复杂性的不断提高、对轻量化、高性能电子产品的需求（以提高燃油效率）以及全球商用和军用飞机生产的扩张。此外，卫星星座和无人机的普及也进一步推动了市场成长。

主要市场驱动因素

全球航太印刷电路板市场深受航空电子设备和航太电子系统进步的影响，这些进步不断要求电子元件具有更高的性能和更小的尺寸。这种发展趋势促使人们开发出日益复杂且坚固耐用的印刷电路板，使其能够在高温、振动和辐射等极端条件下可靠运作。

主要市场挑战

限制全球航太印刷电路板市场成长的一大挑战因素是严格的监管合规要求及其带来的高昂製造成本。航太印刷电路板是关键航空和太空船应用不可或缺的一部分，需要在严苛环境下具备卓越的可靠性。

主要市场趋势

自主飞行技术日益增长的需求是全球航太印刷电路板市场的重要趋势，这需要性能卓越且坚固耐用的电子元件。专为无人机和新兴先进空中交通平台独立运作而设计的系统，需要优异讯号完整性、先进散热管理和固有冗余的印刷电路板，以确保运作可靠性和安全性。

目录

第一章：产品概述

第二章：研究方法

第三章：执行概要

第四章：客户之声

第五章：全球航太印刷电路板市场展望

• 市场规模及预测
  • 按价值
• 市占率及预测
  • 依平台类型（商用飞机、支线飞机、通用航空飞机、军用飞机、直升机、无人机）
  • 依产品类型（刚性单面、双面、标准多层、柔性、刚柔结合、高密度互连/微孔/堆迭/IC基板、其他）
  • 依层压板材料类型（FR4、聚酰亚胺、其他）
  • 按地区
  • 按公司（2024 年）
• 市场地图

第六章：北美航太印刷电路板市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 美国
  • 加拿大
  • 墨西哥

第七章：欧洲航太印刷电路板市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太地区航太印刷电路板市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲航太印刷电路板市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非

第十章：南美洲航太印刷电路板市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章：市场动态

• 司机
• 挑战

第十二章：市场趋势与发展

• 併购
• 产品发布
• 最新进展

第十三章：全球航太印刷电路板市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商议价能力
• 顾客的力量
• 替代产品的威胁

第十五章：竞争格局

• TTM Technologies
• Sanmina
• Benchmark Electronics
• Flex
• Celestica
• Jabil
• IEC Electronics
• ACI
• EPIC
• Calumet

第十六章：策略建议

第17章调查会社について・免责事项

The Global Aerospace Printed Circuit Board Market, valued at USD 4.85 Billion in 2024, is projected to experience a CAGR of 7.54% to reach USD 7.50 Billion by 2030. Aerospace Printed Circuit Boards (PCBs) are specialized electronic circuit boards crucial for critical air and spacecraft applications, interconnecting components for avionics, navigation, communication, and control systems. Designed for extreme reliability in harsh environments, including severe temperatures and vibrations, market growth is driven by increasing avionic system complexity, demand for lightweight, high-performance electronics enhancing fuel efficiency, and the global expansion of commercial and military aircraft production. Further impetus comes from the proliferation of satellite constellations and unmanned aerial vehicles.

Key Market Drivers

The global aerospace printed circuit board market is significantly influenced by advancements in avionics and aerospace electronic systems, which continually demand higher performance and miniaturization in electronic components. This progression necessitates the development of increasingly complex and robust PCBs capable of operating reliably in extreme conditions, such as high temperatures, vibrations, and radiation environments.

Key Market Challenges

A significant challenging factor impeding the growth of the Global Aerospace Printed Circuit Board Market is the necessity for stringent regulatory compliance and the associated high manufacturing costs. Aerospace PCBs are integral to critical air and spacecraft applications, demanding exceptional reliability in harsh environments. This demand translates into extensive and rigorous certification and testing processes that notably extend development timelines and substantially increase overall project expenditure. The inherent complexity of meeting stringent safety and performance standards for every component, including PCBs, directly escalates production costs.

Key Market Trends

The increasing demands of autonomous flight technology represent a significant trend for the Global Aerospace Printed Circuit Board Market, necessitating robust and high-performance electronic components. Systems designed for independent operation in unmanned aerial vehicles and emerging advanced air mobility platforms require printed circuit boards with superior signal integrity, advanced thermal management, and inherent redundancy to ensure operational reliability and safety. These requirements push for new advancements in PCB materials and design.

Key Market Players

• TTM Technologies
• Sanmina
• Benchmark Electronics
• Flex
• Celestica
• Jabil
• IEC Electronics
• ACI
• EPIC
• Calumet

Report Scope:

In this report, the Global Aerospace Printed Circuit Board Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Aerospace Printed Circuit Board Market, By Platform Type:

• Commercial Aircraft
• Regional Aircraft
• General Aviation
• Military Aircraft
• Helicopter
• Unmanned Aerial Vehicle

Aerospace Printed Circuit Board Market, By Product Type:

• Rigid 1,2-Sided
• Standard Multilayer
• Flexible
• Rigid-Flex
• High-Density Interconnect/Microvia/Build-Up/IC Substrate
• Others

Aerospace Printed Circuit Board Market, By Laminate Material Type:

• FR4
• Polyimide
• Others

Aerospace Printed Circuit Board Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Aerospace Printed Circuit Board Market.

Available Customizations:

Global Aerospace Printed Circuit Board Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Aerospace Printed Circuit Board Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Platform Type (Commercial Aircraft, Regional Aircraft, General Aviation, Military Aircraft, Helicopter, Unmanned Aerial Vehicle)
  • 5.2.2. By Product Type (Rigid 1,2-Sided, Standard Multilayer, Flexible, Rigid-Flex, High-Density Interconnect/Microvia/Build-Up/IC Substrate, Others)
  • 5.2.3. By Laminate Material Type (FR4, Polyimide, Others)
  • 5.2.4. By Region
  • 5.2.5. By Company (2024)
• 5.3. Market Map

6. North America Aerospace Printed Circuit Board Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Platform Type
  • 6.2.2. By Product Type
  • 6.2.3. By Laminate Material Type
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Aerospace Printed Circuit Board Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Platform Type
      • 6.3.1.2.2. By Product Type
      • 6.3.1.2.3. By Laminate Material Type
  • 6.3.2. Canada Aerospace Printed Circuit Board Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Platform Type
      • 6.3.2.2.2. By Product Type
      • 6.3.2.2.3. By Laminate Material Type
  • 6.3.3. Mexico Aerospace Printed Circuit Board Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Platform Type
      • 6.3.3.2.2. By Product Type
      • 6.3.3.2.3. By Laminate Material Type

7. Europe Aerospace Printed Circuit Board Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Platform Type
  • 7.2.2. By Product Type
  • 7.2.3. By Laminate Material Type
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Aerospace Printed Circuit Board Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Platform Type
      • 7.3.1.2.2. By Product Type
      • 7.3.1.2.3. By Laminate Material Type
  • 7.3.2. France Aerospace Printed Circuit Board Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Platform Type
      • 7.3.2.2.2. By Product Type
      • 7.3.2.2.3. By Laminate Material Type
  • 7.3.3. United Kingdom Aerospace Printed Circuit Board Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Platform Type
      • 7.3.3.2.2. By Product Type
      • 7.3.3.2.3. By Laminate Material Type
  • 7.3.4. Italy Aerospace Printed Circuit Board Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Platform Type
      • 7.3.4.2.2. By Product Type
      • 7.3.4.2.3. By Laminate Material Type
  • 7.3.5. Spain Aerospace Printed Circuit Board Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Platform Type
      • 7.3.5.2.2. By Product Type
      • 7.3.5.2.3. By Laminate Material Type

8. Asia Pacific Aerospace Printed Circuit Board Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Platform Type
  • 8.2.2. By Product Type
  • 8.2.3. By Laminate Material Type
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Aerospace Printed Circuit Board Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Platform Type
      • 8.3.1.2.2. By Product Type
      • 8.3.1.2.3. By Laminate Material Type
  • 8.3.2. India Aerospace Printed Circuit Board Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Platform Type
      • 8.3.2.2.2. By Product Type
      • 8.3.2.2.3. By Laminate Material Type
  • 8.3.3. Japan Aerospace Printed Circuit Board Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Platform Type
      • 8.3.3.2.2. By Product Type
      • 8.3.3.2.3. By Laminate Material Type
  • 8.3.4. South Korea Aerospace Printed Circuit Board Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Platform Type
      • 8.3.4.2.2. By Product Type
      • 8.3.4.2.3. By Laminate Material Type
  • 8.3.5. Australia Aerospace Printed Circuit Board Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Platform Type
      • 8.3.5.2.2. By Product Type
      • 8.3.5.2.3. By Laminate Material Type

9. Middle East & Africa Aerospace Printed Circuit Board Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Platform Type
  • 9.2.2. By Product Type
  • 9.2.3. By Laminate Material Type
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Aerospace Printed Circuit Board Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Platform Type
      • 9.3.1.2.2. By Product Type
      • 9.3.1.2.3. By Laminate Material Type
  • 9.3.2. UAE Aerospace Printed Circuit Board Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Platform Type
      • 9.3.2.2.2. By Product Type
      • 9.3.2.2.3. By Laminate Material Type
  • 9.3.3. South Africa Aerospace Printed Circuit Board Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Platform Type
      • 9.3.3.2.2. By Product Type
      • 9.3.3.2.3. By Laminate Material Type

10. South America Aerospace Printed Circuit Board Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Platform Type
  • 10.2.2. By Product Type
  • 10.2.3. By Laminate Material Type
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Aerospace Printed Circuit Board Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Platform Type
      • 10.3.1.2.2. By Product Type
      • 10.3.1.2.3. By Laminate Material Type
  • 10.3.2. Colombia Aerospace Printed Circuit Board Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Platform Type
      • 10.3.2.2.2. By Product Type
      • 10.3.2.2.3. By Laminate Material Type
  • 10.3.3. Argentina Aerospace Printed Circuit Board Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Platform Type
      • 10.3.3.2.2. By Product Type
      • 10.3.3.2.3. By Laminate Material Type

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Aerospace Printed Circuit Board Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. TTM Technologies
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Sanmina
• 15.3. Benchmark Electronics
• 15.4. Flex
• 15.5. Celestica
• 15.6. Jabil
• 15.7. IEC Electronics
• 15.8. ACI
• 15.9. EPIC
• 15.10. Calumet

16. Strategic Recommendations

17. About Us & Disclaimer